EP3669195A4 - Testsondenanordnung und testsockel - Google Patents

Testsondenanordnung und testsockel Download PDF

Info

Publication number
EP3669195A4
EP3669195A4 EP18875791.8A EP18875791A EP3669195A4 EP 3669195 A4 EP3669195 A4 EP 3669195A4 EP 18875791 A EP18875791 A EP 18875791A EP 3669195 A4 EP3669195 A4 EP 3669195A4
Authority
EP
European Patent Office
Prior art keywords
test
probe assembly
socket
test probe
test socket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP18875791.8A
Other languages
English (en)
French (fr)
Other versions
EP3669195B1 (de
EP3669195C0 (de
EP3669195A1 (de
Inventor
Jae-Hwan Jeong
Geun-su KIM
Jung-Chul Shin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leeno Industiral Inc
Original Assignee
Leeno Industiral Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leeno Industiral Inc filed Critical Leeno Industiral Inc
Priority claimed from PCT/KR2018/007343 external-priority patent/WO2019093614A1/en
Publication of EP3669195A1 publication Critical patent/EP3669195A1/de
Publication of EP3669195A4 publication Critical patent/EP3669195A4/de
Application granted granted Critical
Publication of EP3669195B1 publication Critical patent/EP3669195B1/de
Publication of EP3669195C0 publication Critical patent/EP3669195C0/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/18—Screening arrangements against electric or magnetic fields, e.g. against earth's field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/045—Sockets or component fixtures for RF or HF testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
EP18875791.8A 2017-11-07 2018-06-28 Testsondenanordnung und testsockel Active EP3669195B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR20170147488 2017-11-07
KR1020180067907A KR102092674B1 (ko) 2017-11-07 2018-06-14 검사 프로브 조립체 및 검사 소켓
PCT/KR2018/007343 WO2019093614A1 (en) 2017-11-07 2018-06-28 A test probe assembly and test socket

Publications (4)

Publication Number Publication Date
EP3669195A1 EP3669195A1 (de) 2020-06-24
EP3669195A4 true EP3669195A4 (de) 2020-11-18
EP3669195B1 EP3669195B1 (de) 2023-08-02
EP3669195C0 EP3669195C0 (de) 2023-08-02

Family

ID=65760895

Family Applications (1)

Application Number Title Priority Date Filing Date
EP18875791.8A Active EP3669195B1 (de) 2017-11-07 2018-06-28 Testsondenanordnung und testsockel

Country Status (6)

Country Link
US (1) US11639945B2 (de)
EP (1) EP3669195B1 (de)
JP (1) JP7453146B2 (de)
KR (2) KR101954086B1 (de)
CN (1) CN111247438A (de)
TW (1) TWI676803B (de)

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US11973301B2 (en) 2018-09-26 2024-04-30 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US12000865B2 (en) 2019-02-14 2024-06-04 Microfabrica Inc. Multi-beam vertical probes with independent arms formed of a high conductivity metal for enhancing current carrying capacity and methods for making such probes
JP6923821B2 (ja) * 2019-09-06 2021-08-25 山一電機株式会社 コンタクトプローブ及びこれを備えた検査用ソケット
CN111121949A (zh) * 2019-11-20 2020-05-08 中国电力科学研究院有限公司 一种强磁场中对噪声测量探头的抗干扰装置
US11761982B1 (en) 2019-12-31 2023-09-19 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact and methods for making such probes
US11867721B1 (en) 2019-12-31 2024-01-09 Microfabrica Inc. Probes with multiple springs, methods for making, and methods for using
KR102455150B1 (ko) * 2020-02-10 2022-10-18 주식회사 아이에스시 피검사 디바이스 검사용 테스트 소켓
KR102570428B1 (ko) * 2020-05-22 2023-08-25 리노공업주식회사 검사소켓 및 그의 제조방법
KR102456469B1 (ko) * 2020-08-11 2022-10-21 리노공업주식회사 검사 프로브의 제조 방법 및 장치
KR102456449B1 (ko) * 2020-08-11 2022-10-20 리노공업주식회사 검사 프로브
US11774467B1 (en) 2020-09-01 2023-10-03 Microfabrica Inc. Method of in situ modulation of structural material properties and/or template shape
CN112083200A (zh) * 2020-09-11 2020-12-15 苏州韬盛电子科技有限公司 一种新型高频测试插座
CN112240947B (zh) * 2020-12-18 2021-04-30 苏州和林微纳科技股份有限公司 一种超高频弹簧探针测试组件的装配方法
KR102645620B1 (ko) 2021-08-30 2024-03-08 주식회사 오킨스전자 포고 핀 및 이의 제조 방법
CN113687150A (zh) * 2021-09-22 2021-11-23 维沃移动通信有限公司 射频测试座、探针、射频电路以及电子设备
WO2023084888A1 (ja) * 2021-11-12 2023-05-19 株式会社村田製作所 測定用プローブ
JP1716912S (ja) * 2021-11-15 2022-06-08 電気的特性測定用プローブ
TWI806575B (zh) * 2022-04-27 2023-06-21 中華精測科技股份有限公司 探針插座結構的製作方法
WO2024101475A1 (ko) * 2022-11-10 2024-05-16 주식회사 오킨스전자 포고 핀 및 이의 제조 방법

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JPH06216205A (ja) * 1993-01-13 1994-08-05 Tokyo Electron Yamanashi Kk プローブカードインターフェース装置
EP1060398A1 (de) * 1998-03-04 2000-12-20 Teradyne, Inc. Koaxialsonden-schnittstelle für automatische testeinrichtungen
JP2001033482A (ja) * 1999-07-26 2001-02-09 Rohm Co Ltd 接触型プローブ装置
JP2004053343A (ja) * 2002-07-18 2004-02-19 Fujitsu Ltd コンタクトプローブ
EP1471358A2 (de) * 2003-04-25 2004-10-27 YOKOWO Co., Ltd Koaxialsonden-Schnittstelle
EP1607749A2 (de) * 2004-06-17 2005-12-21 Aries Electronics, Inc Anordnung einer Testprobe für ein IC-Plättchen
US20110050261A1 (en) * 2009-09-01 2011-03-03 Hon Hai Precision Industry Co., Ltd. Test probe
US20140058243A1 (en) * 2012-08-23 2014-02-27 National Chiao Tung University Biosensor electrode device and method for fabricating the same
US20140203831A1 (en) * 2011-08-30 2014-07-24 Leeno Industiral Inc. Coaxial probe
WO2017064927A1 (ja) * 2015-10-16 2017-04-20 山一電機株式会社 Ｉｃソケット
WO2017082510A1 (ko) * 2015-11-12 2017-05-18 주식회사 오킨스전자 도전 실리콘 고무 안에 도전 와이어를 포함하는 테스트 소켓, 및 그 제조 방법

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Publication number Priority date Publication date Assignee Title
JPS60207343A (ja) * 1984-03-31 1985-10-18 Yokowo Mfg Co Ltd 回路基板等の検査装置
JPH06216205A (ja) * 1993-01-13 1994-08-05 Tokyo Electron Yamanashi Kk プローブカードインターフェース装置
EP1060398A1 (de) * 1998-03-04 2000-12-20 Teradyne, Inc. Koaxialsonden-schnittstelle für automatische testeinrichtungen
JP2001033482A (ja) * 1999-07-26 2001-02-09 Rohm Co Ltd 接触型プローブ装置
JP2004053343A (ja) * 2002-07-18 2004-02-19 Fujitsu Ltd コンタクトプローブ
EP1471358A2 (de) * 2003-04-25 2004-10-27 YOKOWO Co., Ltd Koaxialsonden-Schnittstelle
EP1607749A2 (de) * 2004-06-17 2005-12-21 Aries Electronics, Inc Anordnung einer Testprobe für ein IC-Plättchen
US20110050261A1 (en) * 2009-09-01 2011-03-03 Hon Hai Precision Industry Co., Ltd. Test probe
US20140203831A1 (en) * 2011-08-30 2014-07-24 Leeno Industiral Inc. Coaxial probe
US20140058243A1 (en) * 2012-08-23 2014-02-27 National Chiao Tung University Biosensor electrode device and method for fabricating the same
WO2017064927A1 (ja) * 2015-10-16 2017-04-20 山一電機株式会社 Ｉｃソケット
WO2017082510A1 (ko) * 2015-11-12 2017-05-18 주식회사 오킨스전자 도전 실리콘 고무 안에 도전 와이어를 포함하는 테스트 소켓, 및 그 제조 방법

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Title
See also references of WO2019093614A1 *

Also Published As

Publication number Publication date
KR102092674B1 (ko) 2020-03-24
JP2020537160A (ja) 2020-12-17
EP3669195B1 (de) 2023-08-02
TWI676803B (zh) 2019-11-11
CN111247438A (zh) 2020-06-05
TW201918712A (zh) 2019-05-16
EP3669195C0 (de) 2023-08-02
EP3669195A1 (de) 2020-06-24
JP7453146B2 (ja) 2024-03-19
KR101954086B1 (ko) 2019-03-06
KR20190051764A (ko) 2019-05-15
US20200241042A1 (en) 2020-07-30
US11639945B2 (en) 2023-05-02

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