EP3325265A1 - Substrat pour circuits électriques et procédé de production d'un tel substrat - Google Patents

Substrat pour circuits électriques et procédé de production d'un tel substrat

Info

Publication number
EP3325265A1
EP3325265A1 EP16745646.6A EP16745646A EP3325265A1 EP 3325265 A1 EP3325265 A1 EP 3325265A1 EP 16745646 A EP16745646 A EP 16745646A EP 3325265 A1 EP3325265 A1 EP 3325265A1
Authority
EP
European Patent Office
Prior art keywords
layer
aluminum
composite
copper
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP16745646.6A
Other languages
German (de)
English (en)
Inventor
Andreas Meyer
Karsten Schmidt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rogers Germany GmbH
Original Assignee
Rogers Germany GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rogers Germany GmbH filed Critical Rogers Germany GmbH
Publication of EP3325265A1 publication Critical patent/EP3325265A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/017—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of aluminium or an aluminium alloy, another layer being formed of an alloy based on a non ferrous metal other than aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/12—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00—Layered products comprising a layer of paper or cardboard
    • B32B29/002—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00—Layered products comprising a layer of paper or cardboard
    • B32B29/08—Corrugated paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/12—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer characterised by the relative arrangement of fibres or filaments of different layers, e.g. the fibres or filaments being parallel or perpendicular to each other
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • B32B5/20—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material foamed in situ
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/06—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/005—Apparatus specially adapted for electrolytic conversion coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B32B2255/205—Metallic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/28—Multiple coating on one surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/107—Ceramic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2605/00—Vehicles
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
    • C25D11/08—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used containing inorganic acids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents

Definitions

  • Substrates The invention relates to a substrate for electrical circuits and to a method for producing such a substrate.
  • such substrates are of multilayer construction and have at least one insulating layer and at least one connected to this insulating layer
  • the metal layer or metallization is flat with the insulation layer either directly or possibly via additional metal or
  • Insulation layers connected and is structured to form interconnects, contacts, contact and / or pads in several Metalltechnisches vomabête.
  • Insulation resistance i. Have voltage and dielectric strength.
  • metal-ceramic substrates are often used whose insulation layer is characterized by at least one high
  • the ceramic layer is made of, for example, an oxide, nitride or carbide ceramic such as alumina (Al 2 O 3) or aluminum nitride (AlN) or silicon nitride (Si 3 N 4) or silicon carbide (SiC) or alumina with zirconia (Al 2 O 3 + ZrO 2).
  • oxide, nitride or carbide ceramic such as alumina (Al 2 O 3) or aluminum nitride (AlN) or silicon nitride (Si 3 N 4) or silicon carbide (SiC) or alumina with zirconia (Al 2 O 3 + ZrO 2).
  • the paper structure in the paper structure up to 85 wt .-% is enriched with functional fillers, for example with a sinterable ceramic powder, highly adsorptive powder or powder with good thermal conductivity.
  • a sinterable ceramic powder such as alumina powder preceramic paper is optionally after another
  • the present invention seeks to provide a substrate for electrical circuits and an associated method for producing such a substrate, which is simple and inexpensive compared to the known manufacturing processes.
  • the object is achieved by a substrate according to the patent claim 1 and a method according to the patent claim 1 5.
  • the essential aspect of the substrate according to the invention for electrical circuits is to be seen in that at least one first produced by roll-plating Composite layer is provided, which after the roll cladding at least one
  • Copper layer and an adjoining aluminum layer has. At least the side of the aluminum layer facing away from the copper layer is anodised to produce an anodization layer made of aluminum oxide, and the anodization layer or insulating layer made of aluminum oxide is at least one anodized
  • Adhesive layer is connected to a metal layer or at least a second composite layer or a paper ceramic layer.
  • the roll-laminated composite layer is fast, easy and inexpensive to produce and advantageous as a roll or
  • the layer thickness can be selected depending on the required insulation properties.
  • the metal layer can assume a cooling function and a corresponding material thickness and / or
  • Insulation resistance in particular the voltage and dielectric strength are further increased.
  • Insulation resistance in particular the voltage and dielectric strength are further increased.
  • the second composite layer also has an anodizing or
  • Insulation layer on and the anodization of the first and second composite layer are connected to each other via the at least one adhesive layer, i. There is a direct connection between the two composite layers via at least one adhesive layer.
  • first and second composite layers are connected to each other via at least one further intermediate layer by means of an adhesive layer in each case.
  • the intermediate layer is formed in one embodiment by an aluminum layer, which is used to produce two opposite Eloxal- or
  • Insulation layers of aluminum oxide at their opposite
  • the intermediate layer can be formed by a third composite layer comprising an aluminum layer, a copper layer and a further aluminum layer, wherein in each case the surface side of the aluminum layers facing away from the copper layer is used to produce two opposing anodized or
  • Insulating layers of aluminum oxide are anodized.
  • the anodization or insulating layers made of aluminum oxide of the first composite layer is preferably via an adhesive layer with the one anodization or insulating layers of aluminum oxide of the respective intermediate layer and the anodized or
  • Insulation layers of aluminum oxide of the second composite layer connected via a further adhesive layer with the other anodization or insulating layers of aluminum oxide of the respective intermediate layer. Due to the described construction of the intermediate layers, improved heat spreading and dissipation as well as improved insulation resistance can be achieved.
  • the respective aluminum layer is led to anodized over part of its layer thickness, or the layer thickness of the insulation layer produced from the at least partially converted aluminum layer is between 5 ⁇ m and 50 ⁇ m.
  • At least one aluminum layer of the substrate can be completely anodized and thus the aluminum layer can be completely converted into the anodized or insulating layer of aluminum oxide.
  • an anodic coating is advantageous since contamination of the etching bath for introducing structuring into the copper layer through the aluminum layers can be avoided.
  • the copper layer has a layer thickness of between 35 ⁇ m and 2 mm
  • the aluminum layer has a layer thickness of between 10 ⁇ m and 300 ⁇ m and the
  • Metal l stands a layer thickness between 300 vm and 50 mm.
  • At least one aluminum layer has a profiling introduced before the anodization process is carried out, which, for example, has a multiplicity of pyramid-shaped or prism-shaped recesses includes.
  • a profiling introduced before the anodization process is carried out which, for example, has a multiplicity of pyramid-shaped or prism-shaped recesses includes.
  • an adhesive layer which is made of an epoxy resin adhesive, acrylic adhesive or polyurethane adhesive.
  • the adhesive used to make the adhesive layer has an advantageous
  • At least one of the copper layers for forming printed conductors, contact surfaces and / or connection surfaces is structured in a plurality of metallization sections.
  • the copper layer of the composite layer is patterned and forms the layout side of the substrate.
  • structuring of the two metallizations of the substrate can also be carried out.
  • the invention likewise provides a process for producing a substrate for electrical circuits, in which at least one first composite layer is produced from a copper foil and at least one aluminum foil by means of roll cladding, the at least one copper layer and an adjoining one
  • An aluminum layer in which at least the copper layer facing away from the surface side of the aluminum layer is anodized and thereby an anodic or insulating layer of aluminum oxide is produced, wherein the produced anodization or insulating layer of aluminum oxide over at least one adhesive layer with a metal layer or at least a second composite layer is glued.
  • Fig. 1 is a simplified schematic sectional view through a
  • inventive substrate comprising a first composite layer and a metal layer
  • Fig. 2 is a simplified sectional view through an alternative
  • Embodiment of a substrate according to the invention comprising a first and second composite layer
  • Fig. 3 is a simplified sectional view through a further alternative
  • Embodiment of a substrate according to the invention comprising a first and second composite layer with an intermediate layer
  • Fig. 4 is a simplified sectional view through a turn alternative
  • Embodiment of a substrate according to the invention comprising a first to third composite layer
  • Fig. 5 is a simplified sectional view through a further alternative
  • Embodiment of a substrate according to the invention comprising a first and second composite layer, each having a profiled insulation layer, a simplified schematic sectional view through a
  • FIG. 7 is a simplified schematic sectional view through a substrate according to FIG. 6 with a differently constructed composite layer and a solder connection to the paper-ceramic layer and FIG
  • FIG. 8 is a schematic sectional view through an eloxal bath for anodising the aluminum layer or aluminum alloy layer of a roll-bonded composite layer.
  • Figure 1 shows in a simplified schematic representation a section through an inventively designed substrate 1 for electrical circuits, which has a plate-shaped and multilayer structure, i. in the form of a
  • Printed circuit board is formed.
  • the substrate 1 according to the invention consists in a first embodiment of at least one first composite layer 2, which is produced by roll-plating a Kupferfol with at least one aluminum foil. Accordingly, the first composite layer 2 has a copper layer 3 and an adjoining one
  • the aluminum layer 4 is made to produce an insulating layer 5
  • Anodized alumina namely, the insulating layer 5 extends
  • Aluminum layer 4, ie a part of the aluminum layer 4 of the first composite layer 2 is subjected to an anodization process known per se, namely an anodic oxidation, and thereby converted into an insulation layer 5 of aluminum oxide or anodized layer.
  • the insulating layer 5 of alumina has a high voltage and dielectric strength and a thermal conductivity between 8 W / mK and 30 W / mK.
  • the insulating layer 5 of the inventively embodied substrate 1 is connected via an adhesive layer 6, for example, with a metal ltik 7 or glued.
  • the adhesive layer 6 preferably extends completely over the surface of the insulating layer 5.
  • the metal layer 7 may be formed, for example, by a further aluminum layer or an aluminum plate for cooling purposes.
  • the metal ltik 7 forms in a preferred embodiment of a heat sink and can on the opposite side of the adhesive layer 6 have a profile ization for increasing the surface, the most varied shape, especially in H inblick on shape, arrangement and depth of existing
  • Recesses may be formed.
  • Adhesives or adhesives of low viscosity are preferably used in order to fill the porous surface of the produced anodized layer or insulation layer 5 made of aluminum oxide and thus to further increase the insulation resistance of the substrate 1.
  • the copper layer 3 has within the first composite layer 1 a layer thickness d 1 between 35 / vm and 2 mm and the aluminum layer 4 a layer thickness d2 between 1 0 ⁇ and 300 ⁇ , wherein the layer thickness d3 of the at least partially converted aluminum layer 4 hergestel Leten insulation layer 5 is between 5 ⁇ and 50 ⁇ .
  • the aluminum layer 4 may also be completely anodized, ie, the completely anodized aluminum layer 4 forms the insulating layer 5.
  • the adhesive layer 6 preferably has a layer thickness d4 between 1 ⁇ and 20 on.
  • the layer thickness d5 of the metal ltik 7 is between 300 ⁇ and 50 mm.
  • the substrate 1 serves as printed circuit boards for electrical or electronic circuits or circuit modules, in particular for electronic power circuits.
  • the copper layer 3 of the first composite layer 1 is structured by means of masking and etching technologies known per se into a plurality of metalization sections which form, for example, printed conductors, contact surfaces and / or terminal surfaces.
  • the structuring of the copper layer 3 of the first is preferably carried out Composite layer 1 after the manufacture ment of the substrate. 1 Due to the very thin anodized or insulating layer 5 is preferably only one of
  • Composite layer 2 structured in order to ensure sufficient stability of the substrate 1 administratzustel len. In a corresponding stability enhancing intermediate layer, however, is also a structuring of both metal lations of the substrate 1,
  • the metal ltik 7 I like.
  • the structuring of the copper layer 3 of the first composite layer 2 is preferably up to the anodized layer or
  • Insulation layer 5 made of aluminum oxide.
  • Fig. 2 shows an alternative embodiment of the substrate 1 according to Figure 1, in which instead of the metal layer 7, a second composite layer 2 'on the
  • Adhesive layer 6 is connected to the first composite layer 2.
  • the first and second composite layers 2, 2 ' have a similar, preferably identical construction, i. the second composite layer 2 'also comprises a copper layer 3', an adjoining aluminum layer 4 ', which is at least partially converted into an insulating layer 5' of aluminum oxide or anodized layer by means of anodizing on its surface opposite the copper layer 3 '.
  • the connected with each other is connected with each other
  • Insulating layers 5, 5 ' are, for example, directly connected to one another via the adhesive layer 6. By providing two insulation layers 5, 5 ', the insulation strength of the substrate 1 increases further.
  • first and second composite layers 2, 2 'are produced preferably from the same roll-plated composite material layer, and then an adhesive layer 6 is applied to at least one of the insulation layers 5, 5', preferably both insulation layers 5, 5 ', the composite layers thus prepared 2, 2 'are then brought together and glued or laminated together.
  • the adhesive or adhesive of the adhesive layer 6 is subsequently cured, for example by appropriate application of pressure and / or temperature.
  • structured substrate 1 can still be performed an edge seal, but this is not mandatory. Also, a preparation of the substrates 1 according to the invention in the form of
  • Metal layer 7 different from the prior art preferably also up to the edge of the cut edge of the respective substrate. 1
  • FIG. 3 shows a further alternative embodiment variant of a substrate 1 according to the invention, in which a further aluminum layer 4 "is arranged to further increase the stress and breakdown strength between the first and second composite layers 2, 2 'according to the embodiment of FIG Top and bottom to produce an insulating layer 5 "of alumina are each anodized.
  • a further aluminum layer 4 " is arranged to further increase the stress and breakdown strength between the first and second composite layers 2, 2 'according to the embodiment of FIG Top and bottom to produce an insulating layer 5 "of alumina are each anodized.
  • the insulation layer or insulation layers 5 '' are connected to the insulation layers 5, 5 'of the first and second composite layers 2, 2' via an adhesive layer 6, 6.
  • a third composite layer 2 "' consisting of a central copper layer 3" whose top and bottom is provided with an aluminum layer 4 ", 4" ', wherein the respective aluminum layer 4 ", 4" 'analogous to the aforementioned embodiments each have an insulating layer 5'.
  • the connection of the insulation layers 5, 5 ', 5 “of the first to third composite layer 2, 2', 2" takes place in turn via one in each case
  • Adhesive layer 6, 6 ' Adhesive layer 6, 6 '.
  • the copper layer 3 can also be used electrically and structured, for example, into a plurality of metallization sections be. It is understood that several central copper layers 3 "can be provided.
  • an aluminum layer 4, 4 'with an increased layer thickness d2 between 0.1 mm and 1 mm is used here.
  • Aluminum foil produced preferably in the form of a band.
  • the described composite layers 2, 2 ', 2 can be manufactured as plate goods, so that the plate-rolled, but not yet anodized composite layers 2, 2', 2" can advantageously be either as a strip on a roll or in sheet form be provided for the further manufacturing process.
  • Composite layer 2, 2 ', 2 " is preferably carried out in a continuous installation or in a corresponding immersion basin. 2 'connected by applying the adhesive layer 6, 6' either with each other or with the metal layer 7. Before or after complete curing of the
  • Adhesive layer 6, 6 ' takes place a cutting of the tape or plate goods and subsequent drying.
  • the dried individual layers or plates, which may each be formed as multiple substrates, are subsequently masked and etched by means of known masking and etching technologies and thereby a predetermined structuring of at least one of the copper layers 3, 3 'is carried out.
  • the insulation strength of the substrate 10 is further increased by the fact that instead of the metal layer 7, a paper-ceramic layer 11 is used.
  • the substrate 10 has a composite layer 12 with a metal layer 1 3 and at least one aluminum layer 14.
  • Composite layer 12 is therefore also at least partially anodized, so that an anodized layer 1 5 is formed, which in turn is connected via an adhesive layer 16 with the paper ceramic layer 1 1.
  • the anodizing layer 15 serves here
  • a paper-ceramic layer 1 1 is understood as meaning a paper structure enriched in papermaking with a sinterable ceramic powder, preferably alumina powder, from which a preceramic paper structure is produced.
  • the proportion of the sinterable ceramic powder in the total volume of the preceramic paper structure is preferably between 80 and 90% by weight.
  • the preceramic paper structure is subjected to a two-stage thermal conversion process and in the first stage from the preceramic
  • Paper structure ("Green ing") initially produces a “Braunl ing", in which the organic components of the preceramic paper structure, such as Zel material, starch and latex are oxidatively removed. Subsequently, in the second stage, the "browning" is fed to a sintering process, whereby a ceramic material, namely the paper ceramics with the typical material properties of a ceramic material is formed, such as a high bending and insulation strength
  • paper-ceramic layer 11 is compared to a conventional one
  • the paper-ceramic layer 1 1 used according to the invention has, for example, a layer thickness d6 of between 50 and 600 ⁇ m, preferably 80 ⁇ m and 1 50 ⁇ m, and has an E-modulus between 90 ⁇ Pa and 1 50 ⁇ Pa.
  • the structuring of the metal ltik 1 3 again takes place by means of per se known masking and etching technologies, preferably after manufacture ment of
  • a composite layer 12 ' is used, which in addition to the copper layer 1 3 and the aluminum layer 14 a thereto
  • aluminum-silicon layer 18, which is also manufactured by roll-plating, and that is preferably initially a composite of the
  • Aluminum layer 1 4 an adjoining aluminum-silicon layer 1 8 produced by roller cladding and this composite again with the copper layer 1 third
  • the aluminum-silicon layer 1 8 of the composite layer 1 2 ' is connected to the paper-ceramic layer 1 1 via a solder layer 1 9.
  • An appropriately designed substrate 10 is schematically illustrated, for example, in FIG. 7.
  • the soldering of the paper oxide layer 1 1 made of aluminum oxide is carried out under protective gas, for example N 2 or AR, and using the aluminum silicon eutectic.
  • cracks are also poured out in the insulating layers 5, 5 'when a low-viscosity adhesive is used, for example, by the composite layer 2, 2' being heated accordingly, but below that
  • Temperature increase can be done stepwise or continuously over a given period.
  • a step-like temperature increase can be done stepwise or continuously over a given period.
  • Binder The curing temperatures of common adhesives are included
  • Nanofibers be enriched.
  • the composite layers 2, 2 'produced by roll cladding have a significantly thinner aluminum layer 4, 4', 4 "compared to the copper layers 3, 3 ', and the layer thickness d2 of the aluminum layer 4, 4', 4" is less than half the layer thickness d1 of the copper layers 3, 3 ', preferably even less than one third of the layer thickness d1 of the copper layers 3, 3'.
  • the adhesive bond between the different composite layers or layers can be carried out after applying the adhesive in the composite by means of lamination or rolling in order to keep the thickness d4 of the adhesive layer 6 low.
  • the substrates 1 can be subjected to a vacuum after the application of the adhesive to any gas influences present in the anodization layer or insulation layer 5 made of aluminum oxide, which causes an increase and thus deterioration of the
  • Insulation resistance contribute to be able to remove.
  • the respective adhesive layer 6, 6 ', 6 has at least two different adhesives, which are preferably applied one behind the other in a layer-like manner
  • the epoxy can be processed at a higher temperature compared to the epoxy adhesive to reduce its viscosity. Also can excess
  • the hardener portion of the epoxy adhesive also diffuses into the pure, already processed epoxide in the filled defects and also hardens them with.
  • FIG. 8 shows, by way of a schematic drawing, a corresponding eloxal bath 20 with a cathode 22 and the anode formed by the copper layer or copper alloy layer 23, against which a DC voltage U is applied.
  • the inventors have recognized that the occurrence of such a short circuit can be counteracted by complete masking or covering of the surfaces of the copper layers 23 by a frame-shaped cover element, ie the contact of the electrolyte 21 with the copper layers 23 is effectively prevented, whereas that for the Anodizing required contact with the aluminum layer 24 is still given.
  • the masking can be done in an alternative embodiment by applying a protective film or a protective lacquer or a combination thereof. Common to each of these methods is the sealing effect against the electrolyte 1 1.
  • auxiliary electrodes 26 for example metallic sheets or components, which may be provided with a corresponding coating and which is resistant to the chemical components of the Eloxalbades 20 used and the present electric fields.
  • the auxiliary electrodes 26 are electrically connected to the anode, so that the Geleichschreib U or the resulting electric field between the auxiliary electrode 26 and the surface of the
  • Copper layer 23 of the composite layer 25 is zero. This is no
  • Aluminum alloy layer 24 of the composite layer 25 received therein is greater than 0mm but less than 10mm, preferably between 0 and 1mm.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

L'invention concerne un substrat (1) pour circuits électriques comprenant au moins une première couche composite (2) réalisée par plaquage par laminage, laquelle comprend, après le plaquage par laminage, au moins une couche de cuivre (3) et une couche d'aluminium (4) adjacente, au moins la face de la couche d'aluminium (4) qui est opposée à la couche de cuivre (3) étant anodisée pour la réalisation d'une couche anodisée ou isolante (5) en oxyde d'aluminium, et la couche anodisée ou isolante (5) en oxyde d'aluminium étant reliée à une couche métallique (7) ou au moins une deuxième couche composite (2') ou au moins une couche de céramique à papier (11) par l'intermédiaire d'au moins une couche d'adhésif (6, 6').
EP16745646.6A 2015-07-17 2016-07-18 Substrat pour circuits électriques et procédé de production d'un tel substrat Withdrawn EP3325265A1 (fr)

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DE102015111667.7A DE102015111667A1 (de) 2015-07-17 2015-07-17 Substrat für elektrische Schaltkreise und Verfahren zur Herstellung eines derartigen Substrates
PCT/EP2016/067069 WO2017013073A1 (fr) 2015-07-17 2016-07-18 Substrat pour circuits électriques et procédé de production d'un tel substrat

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KR102311944B1 (ko) 2021-10-13
WO2017013073A1 (fr) 2017-01-26
US20180200990A1 (en) 2018-07-19
WO2017013075A1 (fr) 2017-01-26
KR20180030150A (ko) 2018-03-21
US10821704B2 (en) 2020-11-03
EP3325264A1 (fr) 2018-05-30
JP6894425B2 (ja) 2021-06-30
CN107848246A (zh) 2018-03-27
US20180200989A1 (en) 2018-07-19
KR20180030151A (ko) 2018-03-21
US10940671B2 (en) 2021-03-09
JP2018523593A (ja) 2018-08-23
CN107848245A (zh) 2018-03-27
JP6803369B2 (ja) 2020-12-23
JP2018533197A (ja) 2018-11-08
KR102295797B1 (ko) 2021-08-31

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