Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
  • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
  • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
  • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
  • H01L23/495—Lead-frames or other flat leads
  • H01L23/49541—Geometry of the lead-frame
  • H01L23/49548—Cross section geometry
  • H01L23/49551—Cross section geometry characterised by bent parts
  • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
  • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
  • H01L23/495—Lead-frames or other flat leads
  • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
  • H01L23/49582—Metallic layers on lead frames
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
  • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
  • H05K3/341—Surface mounted components
  • H05K3/3421—Leaded components
  • H05K3/3426—Leaded components characterised by the leads
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10227—Other objects, e.g. metallic pieces
  • H05K2201/1031—Surface mounted metallic connector elements
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
  • H05K2201/10954—Other details of electrical connections
  • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
  • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
  • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49117—Conductor or circuit manufacturing
  • Y10T29/49204—Contact or terminal manufacturing

Definitions

• the invention relates to a connection contact for SMD components.
• SMD components for short, are used in numerous products because they are easy to mount on circuit boards and easy to solder.
• connection contacts which are intended for surface soldering.
• connection contacts In order to be able to produce these connection contacts in economically meaningful frame, these were manufactured in the past as a rule from pre-tinned steel strips or wires.
• a disadvantage of this approach is that at least in sections no pre-tinning is at the cutting edges due to the cutting, so that in order to achieve a stable soldering, the cut edges had to be reworked.
• electroplated layers typically require a nickel underlayer to prevent whisker formation.
• the SMD connector can only absorb low tensile forces (a few Newtons). Such tensile forces arise on the one hand on the component itself by thermal influences, vibrations, etc. and lead to a peel stress and thus to damage the solder joint.
• connection contact for SMD components for solderable contacting with a circuit board.
• the terminal contact has a metallic material and the metallic material at least partially has a coating with another metallic material.
• the terminal contact has a substantially planar contact area for solderable contacting with a platinum, and the area of contact area has edge areas. At least a portion of the edge region is so from the areal contact area so that forms a solder hollows in a soldered contacting with a board.
• the terminal contact has a lead, wherein the lead contact is arranged in the planar contact area in the lead portion of the lead terminal.
• the edge region protrudes up to twenty material thicknesses above the planar contact region.
• the edge region only protrudes up to two material thicknesses over the planar contact region.
• the edge region piecewise an angle of about 45 ° to about 90 ° to the planar contact area.
• connection contact has an edge region which is arranged substantially perpendicular to the line section on the planar contact region.
• the invention is further solved by a method.
• the method of fabricating leads for SMD components for solderable bonding to a circuit board includes the step of stamping metal strips, the step of bending the metal strips to form a lead region and a planar contact region, and forming edge regions on the lead planar contact region, that at least a portion of the edge region of the planar contact area protrudes so that forms a solder hollow groove in a soldered contact with a circuit board.
• the step of forming edge regions comprises bending.
• the molding step and the bending step are one step.
• the steps of forming and bending and punching are realized in a common step.
• FIG. 1 shows a manufacturing method for SMD connections
• FIG. 2 shows a soldering process together with the result of a conventionally designed connection contact
• FIG. 6 shows a schematic flow diagram of a production method according to the invention.
• FIG. 1 shows a connection contact made in accordance with conventional technology. This is typically punched from a sheet 2, which is provided with a coating 1, in the direction of the arrow S from a large sheet out. It can be clearly seen that substantially no coating 1 is present at the cutting edge.
• a terminal contact according to the invention at least a portion of the edge region of the planar contact area, which protrudes so that when a soldered contact with a circuit board 3, a Löthohlkehle am Edge area 4,5,6 forms. Likewise, a Löthohlkehle also forms on the unspecified back of the bent edge.
• the terminal contact is applied to a board 3 and suitably heated, a good solder joint can be formed, since the trough-shaped design favors the formation of a high soldering hollow throat.
• solder fillets and their size is critical to the stability of the solder joint.
• the invention therefore makes it possible to provide more stable compounds than heretofore.
• the invention saves an otherwise necessary and faulty post-finishing step, so that the method leads to exceedingly cost-effective connection contacts.
• connection contact has at least one cutoff of the edge area from the contact area which protrudes so that when soldered in contact with a circuit board 3 a soldering hollow groove is formed at the edge area 4, 6 formed.
• edge region 4 and 6 is deformed in such a way, so that based on the planar contact region 7 forms a U-shape.
• a connection contact according to the invention has at least one section of the edge region of the planar contact region which protrudes such that a soldering hollow groove forms on the edge region 4, 6 in the case of soldered contacting with a circuit board 3.
• edge area 4 and 6 such deformed, so that with respect to the areal contact area 7 forms a U-shape.
• connection contact furthermore has a line section 8.
• the edge regions 4 and 6 are arranged substantially parallel to the line section 8 on the planar contact region 7. At least I think of other shapes of the contact area and the peripheral areas to be covered, but a substantially parallel arrangement of individual edge areas proves to be expedient if a large number of connection contacts are arranged side by side on an SMD component should be.
• connection contact can take into account different needs.
• the dimensioning can essentially be operated from a soldering expert's point of view, which rather leads to a dimensioning on the order of magnitude, so that the soldering hollow throat has substantially a height which also corresponds to its depth. Then, the edge region protrudes approximately in the order of magnitude of 0.25 to 2 material thicknesses of the metal sheet 2 over the areal contact region 7.
• the dimensioning can be operated on the basis of a tool expert's point of view, which leads rather to a dimensioning on the order of magnitude which leads to a considerably greater distance, since this can be achieved by simpler bending. If the distance becomes smaller, then a pre-bending and subsequent finish bending may be necessary. Nevertheless, even in this case a Nachvergütung the cut surfaces 4,5,6 is not necessary.
• the edge region projects approximately in the order of magnitude of 0.25 to 20 material thicknesses of the metal sheet 2 over the areal contact region 7.
• the edge region 4 and 6 has an angle of approximately 90 ° in sections to the planar contact region 7.
• the area 5 has a radius of about 90 ° with respect to surface contact area 7.
• the edge region 4 and 6 has an angle of approximately 45 ° to the planar contact region 7 in pieces. It goes without saying that this angle refers to the end region of the edge and that of course also arcuate embodiments of the edge region are encompassed by the invention and its claims.
• the edge region 5 can also be designed such that it protrudes from the planar contact region 7 in such a way that when a soldered contact with a circuit board 3 forms a soldering hollow throat.
• This edge region 5 is arranged substantially perpendicular to the line section 8 on the planar contact region 7.
• the metal strips 1, 2 are bent so that a line region 8 and a planar contact region 7 are formed.
• edge regions 4, 5, 6 are formed on the planar contact region 7 in such a way that at least a section of the edge region 4, 5, 6 projects from the planar contact region 7 so that when soldered in contact with a circuit board 3 Soldering throat forms.
• the step of forming 300 edge regions 4, 5, 6 comprises bending.
• the molding step 300 and the bending step 200 are accomplished in a single step.
• the molding step 300 and the bending step 200 and the stamping step 100 are implemented in a single step.

Landscapes

• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Computer Hardware Design (AREA)
• General Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Manufacturing & Machinery (AREA)
• Geometry (AREA)
• Coupling Device And Connection With Printed Circuit (AREA)
• Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
• Lead Frames For Integrated Circuits (AREA)
• Multi-Conductor Connections (AREA)

Applications Claiming Priority (2)

Publications (1)

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Family Applications (1)

Country Status (6)

Families Citing this family (2)

Citations (2)

Family Cites Families (23)

• 2010
  • 2010-07-06 DE DE102010026312.5A patent/DE102010026312B4/de active Active
• 2011
  • 2011-06-29 WO PCT/EP2011/060973 patent/WO2012004177A1/de not_active Ceased
  • 2011-06-29 JP JP2013517288A patent/JP5725171B2/ja not_active Expired - Fee Related
  • 2011-06-29 US US13/808,429 patent/US9065234B2/en not_active Expired - Fee Related
  • 2011-06-29 CN CN201180032880.5A patent/CN103098563B/zh active Active
  • 2011-06-29 EP EP11735824.2A patent/EP2591644A1/de not_active Withdrawn

Patent Citations (2)

Non-Patent Citations (1)

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