CN103098563B - 连接触点 - Google Patents

连接触点 Download PDF

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Publication number
CN103098563B
CN103098563B CN201180032880.5A CN201180032880A CN103098563B CN 103098563 B CN103098563 B CN 103098563B CN 201180032880 A CN201180032880 A CN 201180032880A CN 103098563 B CN103098563 B CN 103098563B
Authority
CN
China
Prior art keywords
contact
region
edge
circuit board
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201180032880.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN103098563A (zh
Inventor
迪特尔·霍尔斯特
尤里奇·罗泽迈尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Phoenix Contact GmbH and Co KG
Original Assignee
Phoenix Contact GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Contact GmbH and Co KG filed Critical Phoenix Contact GmbH and Co KG
Publication of CN103098563A publication Critical patent/CN103098563A/zh
Application granted granted Critical
Publication of CN103098563B publication Critical patent/CN103098563B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Multi-Conductor Connections (AREA)
CN201180032880.5A 2010-07-06 2011-06-29 连接触点 Active CN103098563B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102010026312.5 2010-07-06
DE102010026312.5A DE102010026312B4 (de) 2010-07-06 2010-07-06 Anschlusskontakt und Verfahren zur Herstellung von Anschlusskontakten
PCT/EP2011/060973 WO2012004177A1 (de) 2010-07-06 2011-06-29 Anschlusskontakt

Publications (2)

Publication Number Publication Date
CN103098563A CN103098563A (zh) 2013-05-08
CN103098563B true CN103098563B (zh) 2016-03-02

Family

ID=44482073

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180032880.5A Active CN103098563B (zh) 2010-07-06 2011-06-29 连接触点

Country Status (6)

Country Link
US (1) US9065234B2 (enExample)
EP (1) EP2591644A1 (enExample)
JP (1) JP5725171B2 (enExample)
CN (1) CN103098563B (enExample)
DE (1) DE102010026312B4 (enExample)
WO (1) WO2012004177A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6098767B2 (ja) * 2014-09-11 2017-03-22 日本精工株式会社 多極リード部品及び基板の接続装置
US9668344B2 (en) * 2015-04-23 2017-05-30 SK Hynix Inc. Semiconductor packages having interconnection members

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1364293A (zh) * 2000-03-15 2002-08-14 株式会社东芝 用于光头设备的基片单元和其制造方法
US6462424B1 (en) * 1992-10-20 2002-10-08 Fujitsu Limited Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4777564A (en) * 1986-10-16 1988-10-11 Motorola, Inc. Leadform for use with surface mounted components
JPH02292807A (ja) * 1989-05-02 1990-12-04 Nippondenso Co Ltd 電子部品
JPH0371654U (enExample) * 1989-11-15 1991-07-19
JP2848682B2 (ja) * 1990-06-01 1999-01-20 株式会社東芝 高速動作用半導体装置及びこの半導体装置に用いるフィルムキャリア
JPH0518043U (ja) * 1991-08-09 1993-03-05 ケル株式会社 表面実装用電子部品のリード
JPH0555433A (ja) * 1991-08-27 1993-03-05 Nec Corp 半導体装置
KR940007757Y1 (ko) * 1991-11-14 1994-10-24 금성일렉트론 주식회사 반도체 패키지
JPH08222681A (ja) * 1995-02-14 1996-08-30 Toshiba Corp 樹脂封止型半導体装置
GB9513252D0 (en) 1995-06-29 1995-09-06 Rolls Royce Plc An abradable composition
JPH09130007A (ja) * 1995-10-30 1997-05-16 Murata Mfg Co Ltd 表面実装型電子部品
JPH09232499A (ja) * 1996-02-26 1997-09-05 Canon Inc 半導体装置
US5925927A (en) * 1996-12-18 1999-07-20 Texas Instruments Incoporated Reinforced thin lead frames and leads
JPH10284666A (ja) 1997-04-01 1998-10-23 Furukawa Electric Co Ltd:The 電子部品機器
US5986209A (en) * 1997-07-09 1999-11-16 Micron Technology, Inc. Package stack via bottom leaded plastic (BLP) packaging
JPH11145367A (ja) 1997-11-05 1999-05-28 Nec Ibaraki Ltd 表面実装部品のリード端子
US6529027B1 (en) * 2000-03-23 2003-03-04 Micron Technology, Inc. Interposer and methods for fabricating same
JP3969991B2 (ja) 2001-10-10 2007-09-05 三洋電機株式会社 面実装電子部品
US7920045B2 (en) * 2004-03-15 2011-04-05 Tyco Electronics Corporation Surface mountable PPTC device with integral weld plate
TWI255158B (en) * 2004-09-01 2006-05-11 Phoenix Prec Technology Corp Method for fabricating electrical connecting member of circuit board
FR2885739B1 (fr) * 2005-05-11 2012-07-20 Sonceboz Sa Procede de connexion sans soudure d'un actionneur electrique, notamment pour application aux tableaux de bord automobile, a un circuit imprime
WO2007110985A1 (ja) * 2006-03-29 2007-10-04 Murata Manufacturing Co., Ltd. 複合基板及び複合基板の製造方法
DE112007003268B4 (de) * 2007-01-16 2015-09-17 Infineon Technologies Ag Verfahren zum Halbleiterpacken und/oder Halbleiterpackung
DE102010010331A1 (de) * 2010-03-04 2011-09-08 Phoenix Contact Gmbh & Co. Kg Elektrische Kontaktanordnung

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6462424B1 (en) * 1992-10-20 2002-10-08 Fujitsu Limited Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure
CN1364293A (zh) * 2000-03-15 2002-08-14 株式会社东芝 用于光头设备的基片单元和其制造方法

Also Published As

Publication number Publication date
DE102010026312B4 (de) 2022-10-20
US9065234B2 (en) 2015-06-23
JP5725171B2 (ja) 2015-05-27
US20130192874A1 (en) 2013-08-01
WO2012004177A1 (de) 2012-01-12
JP2013535807A (ja) 2013-09-12
EP2591644A1 (de) 2013-05-15
CN103098563A (zh) 2013-05-08
DE102010026312A1 (de) 2012-01-12

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant