JP2013535807A5 - - Google Patents

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Publication number
JP2013535807A5
JP2013535807A5 JP2013517288A JP2013517288A JP2013535807A5 JP 2013535807 A5 JP2013535807 A5 JP 2013535807A5 JP 2013517288 A JP2013517288 A JP 2013517288A JP 2013517288 A JP2013517288 A JP 2013517288A JP 2013535807 A5 JP2013535807 A5 JP 2013535807A5
Authority
JP
Japan
Prior art keywords
edge region
laminated
piece
connection
connection area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013517288A
Other languages
English (en)
Japanese (ja)
Other versions
JP5725171B2 (ja
JP2013535807A (ja
Filing date
Publication date
Priority claimed from DE102010026312.5A external-priority patent/DE102010026312B4/de
Application filed filed Critical
Publication of JP2013535807A publication Critical patent/JP2013535807A/ja
Publication of JP2013535807A5 publication Critical patent/JP2013535807A5/ja
Application granted granted Critical
Publication of JP5725171B2 publication Critical patent/JP5725171B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2013517288A 2010-07-06 2011-06-29 接続部材 Expired - Fee Related JP5725171B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102010026312.5 2010-07-06
DE102010026312.5A DE102010026312B4 (de) 2010-07-06 2010-07-06 Anschlusskontakt und Verfahren zur Herstellung von Anschlusskontakten
PCT/EP2011/060973 WO2012004177A1 (de) 2010-07-06 2011-06-29 Anschlusskontakt

Publications (3)

Publication Number Publication Date
JP2013535807A JP2013535807A (ja) 2013-09-12
JP2013535807A5 true JP2013535807A5 (enExample) 2014-07-10
JP5725171B2 JP5725171B2 (ja) 2015-05-27

Family

ID=44482073

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013517288A Expired - Fee Related JP5725171B2 (ja) 2010-07-06 2011-06-29 接続部材

Country Status (6)

Country Link
US (1) US9065234B2 (enExample)
EP (1) EP2591644A1 (enExample)
JP (1) JP5725171B2 (enExample)
CN (1) CN103098563B (enExample)
DE (1) DE102010026312B4 (enExample)
WO (1) WO2012004177A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6098767B2 (ja) * 2014-09-11 2017-03-22 日本精工株式会社 多極リード部品及び基板の接続装置
US9668344B2 (en) * 2015-04-23 2017-05-30 SK Hynix Inc. Semiconductor packages having interconnection members

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4777564A (en) * 1986-10-16 1988-10-11 Motorola, Inc. Leadform for use with surface mounted components
JPH02292807A (ja) * 1989-05-02 1990-12-04 Nippondenso Co Ltd 電子部品
JPH0371654U (enExample) * 1989-11-15 1991-07-19
JP2848682B2 (ja) * 1990-06-01 1999-01-20 株式会社東芝 高速動作用半導体装置及びこの半導体装置に用いるフィルムキャリア
JPH0518043U (ja) * 1991-08-09 1993-03-05 ケル株式会社 表面実装用電子部品のリード
JPH0555433A (ja) * 1991-08-27 1993-03-05 Nec Corp 半導体装置
KR940007757Y1 (ko) * 1991-11-14 1994-10-24 금성일렉트론 주식회사 반도체 패키지
US6165819A (en) * 1992-10-20 2000-12-26 Fujitsu Limited Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure
JPH08222681A (ja) * 1995-02-14 1996-08-30 Toshiba Corp 樹脂封止型半導体装置
GB9513252D0 (en) 1995-06-29 1995-09-06 Rolls Royce Plc An abradable composition
JPH09130007A (ja) * 1995-10-30 1997-05-16 Murata Mfg Co Ltd 表面実装型電子部品
JPH09232499A (ja) * 1996-02-26 1997-09-05 Canon Inc 半導体装置
US5925927A (en) * 1996-12-18 1999-07-20 Texas Instruments Incoporated Reinforced thin lead frames and leads
JPH10284666A (ja) 1997-04-01 1998-10-23 Furukawa Electric Co Ltd:The 電子部品機器
US5986209A (en) * 1997-07-09 1999-11-16 Micron Technology, Inc. Package stack via bottom leaded plastic (BLP) packaging
JPH11145367A (ja) 1997-11-05 1999-05-28 Nec Ibaraki Ltd 表面実装部品のリード端子
JP3866572B2 (ja) * 2000-03-15 2007-01-10 株式会社東芝 光ヘッド装置用基板ユニットとその製造方法
US6529027B1 (en) * 2000-03-23 2003-03-04 Micron Technology, Inc. Interposer and methods for fabricating same
JP3969991B2 (ja) 2001-10-10 2007-09-05 三洋電機株式会社 面実装電子部品
US7920045B2 (en) * 2004-03-15 2011-04-05 Tyco Electronics Corporation Surface mountable PPTC device with integral weld plate
TWI255158B (en) * 2004-09-01 2006-05-11 Phoenix Prec Technology Corp Method for fabricating electrical connecting member of circuit board
FR2885739B1 (fr) * 2005-05-11 2012-07-20 Sonceboz Sa Procede de connexion sans soudure d'un actionneur electrique, notamment pour application aux tableaux de bord automobile, a un circuit imprime
WO2007110985A1 (ja) * 2006-03-29 2007-10-04 Murata Manufacturing Co., Ltd. 複合基板及び複合基板の製造方法
DE112007003268B4 (de) * 2007-01-16 2015-09-17 Infineon Technologies Ag Verfahren zum Halbleiterpacken und/oder Halbleiterpackung
DE102010010331A1 (de) * 2010-03-04 2011-09-08 Phoenix Contact Gmbh & Co. Kg Elektrische Kontaktanordnung

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