JP6098767B2 - 多極リード部品及び基板の接続装置 - Google Patents
多極リード部品及び基板の接続装置 Download PDFInfo
- Publication number
- JP6098767B2 JP6098767B2 JP2016547499A JP2016547499A JP6098767B2 JP 6098767 B2 JP6098767 B2 JP 6098767B2 JP 2016547499 A JP2016547499 A JP 2016547499A JP 2016547499 A JP2016547499 A JP 2016547499A JP 6098767 B2 JP6098767 B2 JP 6098767B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- leads
- multipolar
- solder
- solder connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910000679 solder Inorganic materials 0.000 claims description 78
- 239000000758 substrate Substances 0.000 claims description 53
- 230000000630 rising effect Effects 0.000 claims description 33
- 238000005452 bending Methods 0.000 claims description 23
- 230000009471 action Effects 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 4
- 230000005405 multipole Effects 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 description 38
- 238000000034 method Methods 0.000 description 13
- 230000001681 protective effect Effects 0.000 description 13
- 230000004048 modification Effects 0.000 description 8
- 238000012986 modification Methods 0.000 description 8
- 238000000465 moulding Methods 0.000 description 8
- 238000005476 soldering Methods 0.000 description 8
- 230000007246 mechanism Effects 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000004080 punching Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
- H01R12/7011—Locking or fixing a connector to a PCB
- H01R12/707—Soldering or welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14322—Housings specially adapted for power drive units or power converters wherein the control and power circuits of a power converter are arranged within the same casing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
- H01L2224/37001—Core members of the connector
- H01L2224/3701—Shape
- H01L2224/37012—Cross-sectional shape
- H01L2224/37013—Cross-sectional shape being non uniform along the connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/41—Structure, shape, material or disposition of the strap connectors after the connecting process of a plurality of strap connectors
- H01L2224/4101—Structure
- H01L2224/4103—Connectors having different sizes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/26—Connectors or connections adapted for particular applications for vehicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/24—Assembling by moulding on contact members
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1031—Surface mounted metallic connector elements
- H05K2201/10318—Surface mounted metallic pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Description
また、上記コントロールユニット(ECU)30には、車両の各種情報を授受するCAN(Controller Area Network)60が接続されており、車速VelはCAN60から受信することも可能である。また、コントロールユニット(ECU)30には、CAN60以外の通信、アナログ/ディジタル信号、電波等を授受する非CAN61も接続されている。
また、半導体モジュール30Aは、パワー回路基板であり、前述したモータ駆動部105の回路構成を有し、図4に示すように、基板31に、6個のFET1〜6、電源に接続された正極端子81a、及び電流検出回路114を経て接地される負極端子82aが実装されている。なお、ここで各FET1〜6は、ベアチップFET(ベアチップトランジスタ)35で構成している。また、基板31には、上記3相モータ200の各相に出力するための3相出力部90の他、コンデンサを含むその他の表面実装部品37が実装されている。更に、半導体モジュール30Aの上記基板31には、半導体モジュール30Aをケース20に取り付けるための取付けねじ38が挿通する複数の貫通孔31aも設けられている。
2 コラム軸(ステアリングシャフト、ハンドル軸)
3 減速機構
4a 4b ユニバーサルジョイント
5 ピニオンラック機構
6a 6b タイロッド
7a 7b ハブユニット
8L 8R 操向車輪
9 トルクセンサ
11 イグニションキー
12 車速センサ
13 バッテリ
14 舵角センサ
30 コントロールユニット
101 多極リード部品
102 電源回路部
105 モータ駆動部
106 遮断装置
108 制御演算部
109 ゲート駆動部
110 リード
111 保持部
112 スルーホール接続部
112a 折り曲げ部
113 表面実装接続部
113a 前方延出部、113b 垂直部、113c 半田接続部、113d 立ち上がり部
120 保持部材
121 保持部
122 傾斜面
123 開口部
501 多極リード部品
503A,503B 保持部材
521 上側接続部
522、523 湾曲部
607 接続用導体
608 絶縁板
609 配線板用接続具
611 折り曲げ部
710A、710B 圧接端子
720 樹脂材
730 圧接端子体
810 リード
813 下側基板接続部
820 半田ペースト
830 下側基板
Claims (7)
- 接続方向に対して垂直な一方向に配列された複数のリードと、前記複数のリードを所定間隔で保持する保持部材とを備えた多極リードコネクタにおいて、
前記保持部材には前記複数のリードの一部又は全部に前記リードの外周を囲む基板方向を向いた円筒部を設け、
前記リードには一端側に上側基板接続部、他端側に下側基板接続部を設け、
前記下側基板接続部は、前記リードの他端側を前記リードの配列面とは垂直な方向に折り曲げた前方延出部と、前記前方延出部の前端から下方に延びる垂直部と、前記垂直部の下端から後方に延びる半田接続部と、前記半田接続部から上方に延びる立ち上がり部とからなり、
前記立ち上がり部の折り曲げ角度は、前記垂直部から前記半田接続部に対する折り曲げ角度に関わらず、前記半田接続部から緩やかに立ち上がる角度を有し、
前記立ち上がり部の幅は、前記半田接続部の部分から前記立ち上がり部の末端にかけて増加し、
前記立ち上がり部の前記折り曲げ角度と前記幅とは、前記立ち上がり部に対する溶解した半田による作用が、前記垂直部の下方から前記半田接続部に至る湾曲の外側部分に及ぼす前記溶解した半田による作用と同程度のものとなるようにするか、又は異なる大きさの作用であってもこれを打ち消して同程度のものとすることにより、半田が溶解した後に、前記リードが接続方向から傾くことを防止し、基板に対して実際上ほぼ垂直に立ち上がる構成となることを特徴とする多極リード部品。 - 前記円筒部は前記保持部材と一体成型される請求項1に記載の多極リード部品
- 前記円筒部は前記並列に配列された複数のリードのうち、最外列のリードに設けられた請求項1又は4に記載の多極リード部品。
- 前記円筒部の末端はテーパ形状となっている請求項1、4、5のいずれか1項に記載の多極リード部品。
- 前記円筒部の中央部にリードの変形を抑制するための押さえ治具用の開口部を設けた請求項1、4、5、6のいずれか1項に記載の多極リード部品。
- 前記リードの下側基板接続部を構成する半田接続部は、前記リードの配列方向に対して千鳥状に配置される請求項1、4、5、6、7のいずれか1項に記載の多極リード部品。
- 請求項5乃至8のいずれか1項に記載の多極リード部品を四角形状の基板の対辺上に当該対辺に沿って2つ配設し、前記リードの最外列に設けられた円筒部の末端で他の一の基板を支持することを特徴とする基板の接続装置。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014185119 | 2014-09-11 | ||
JP2014185119 | 2014-09-11 | ||
JP2015176880 | 2015-09-08 | ||
JP2015176880 | 2015-09-08 | ||
PCT/JP2015/075697 WO2016039413A1 (ja) | 2014-09-11 | 2015-09-10 | 多極リード部品及び基板の接続装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017031366A Division JP6281650B2 (ja) | 2014-09-11 | 2017-02-22 | 多極リード部品及び基板の接続装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6098767B2 true JP6098767B2 (ja) | 2017-03-22 |
JPWO2016039413A1 JPWO2016039413A1 (ja) | 2017-04-27 |
Family
ID=55459157
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016547499A Expired - Fee Related JP6098767B2 (ja) | 2014-09-11 | 2015-09-10 | 多極リード部品及び基板の接続装置 |
JP2017031366A Expired - Fee Related JP6281650B2 (ja) | 2014-09-11 | 2017-02-22 | 多極リード部品及び基板の接続装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017031366A Expired - Fee Related JP6281650B2 (ja) | 2014-09-11 | 2017-02-22 | 多極リード部品及び基板の接続装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9974178B2 (ja) |
EP (1) | EP3193406A4 (ja) |
JP (2) | JP6098767B2 (ja) |
CN (1) | CN106716723B (ja) |
WO (1) | WO2016039413A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6421601B2 (ja) * | 2015-01-08 | 2018-11-14 | 株式会社オートネットワーク技術研究所 | キャパシタモジュール |
DE102018101792B4 (de) * | 2018-01-26 | 2021-03-25 | Harting Electric Gmbh & Co. Kg | Leiterkartenverbinder und dazugehörige Leiterkartenanordnung zur Übertragung hoher Stromstärken |
CN112470555B (zh) * | 2018-08-02 | 2022-03-22 | 三菱电机株式会社 | 电子控制装置 |
US20200136281A1 (en) * | 2018-10-30 | 2020-04-30 | HKC Corporation Limited | Lead assembly and display device |
JP7203651B2 (ja) * | 2019-03-20 | 2023-01-13 | 日本電産モビリティ株式会社 | 接続端子、電子装置 |
JP7373931B2 (ja) * | 2019-07-01 | 2023-11-06 | 日本板硝子株式会社 | 接続端子 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63266787A (ja) * | 1987-04-10 | 1988-11-02 | アンプ インコ−ポレ−テツド | プリント基板用コネクタ |
JPH0491071U (ja) * | 1990-12-25 | 1992-08-07 | ||
JPH04237155A (ja) * | 1991-01-22 | 1992-08-25 | Matsushita Electric Ind Co Ltd | 電子部品 |
JPH0579870U (ja) * | 1992-03-30 | 1993-10-29 | 太陽誘電株式会社 | 混成集積回路装置のリード端子接続構造 |
JPH09115574A (ja) * | 1995-10-13 | 1997-05-02 | Smk Corp | 接続用端子 |
JP2006344458A (ja) * | 2005-06-08 | 2006-12-21 | Hirose Electric Co Ltd | 表面実装型電気コネクタ |
JP2007188697A (ja) * | 2006-01-12 | 2007-07-26 | Tyco Electronics Amp Kk | 固定具、この固定具を備える面実装型部品、及びこの固定具を用いる実装構造 |
WO2014122883A1 (ja) * | 2013-02-06 | 2014-08-14 | 日本精工株式会社 | 多極コネクタ |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1961042C3 (de) * | 1969-12-05 | 1981-01-15 | Robert Bosch Gmbh, 7000 Stuttgart | Halbleiterbauelement |
JPS517635A (ja) | 1974-07-11 | 1976-01-22 | Kayaba Industry Co Ltd | Ekiatsushikidoryokukajitorisochiniokeru ekiatsuhanryokusochi |
JPS58169948A (ja) * | 1982-03-30 | 1983-10-06 | Fujitsu Ltd | 樹脂封止型半導体装置 |
US4777564A (en) * | 1986-10-16 | 1988-10-11 | Motorola, Inc. | Leadform for use with surface mounted components |
JPH0214558A (ja) * | 1988-06-30 | 1990-01-18 | Mitsubishi Electric Corp | 半導体集積回路装置 |
JPH0633366U (ja) * | 1992-09-29 | 1994-04-28 | エヌオーケー株式会社 | ターミナルピン |
DE9413494U1 (de) * | 1994-08-22 | 1995-09-21 | Siemens AG, 80333 München | Anordnung zur Verbindung elektrischer Anschlüsse sowie Vorrichtung zur Vorbehandlung drahtförmiger elektrischer Anschlüsse für eine derartige Anordnung |
US5490788A (en) * | 1994-11-01 | 1996-02-13 | Emc Technology, Inc. | Surface mount terminal for electrical component |
DE19533299A1 (de) * | 1995-09-08 | 1997-03-13 | Siemens Ag | Mehrpolige, variable SMD-Anschlußanordnung und Verfahren zu ihrer Montage auf einem Schaltungssubstrat |
US5925927A (en) * | 1996-12-18 | 1999-07-20 | Texas Instruments Incoporated | Reinforced thin lead frames and leads |
SE508139C2 (sv) * | 1996-12-20 | 1998-08-31 | Ericsson Telefon Ab L M | Metod och anordning för anslutning av elektrisk komponent till kretskort |
JPH11154578A (ja) | 1997-11-21 | 1999-06-08 | Yazaki Corp | 圧接端子の製造方法 |
JPH11204171A (ja) * | 1998-01-16 | 1999-07-30 | Kyoshin Kogyo Kk | チップ部品 |
DE10057460C1 (de) * | 2000-11-20 | 2002-08-08 | Tyco Electronics Amp Gmbh | Halteelement mit einer Halteklammer, Anordnung mit einer Trägerplatte und einem Halteelement und Anordnung mit Halteelement und Trägerstreifen |
JP4799227B2 (ja) * | 2006-03-09 | 2011-10-26 | オムロンオートモーティブエレクトロニクス株式会社 | 多極コネクタおよび多極コネクタの製造方法、実装方法 |
CN101626116B (zh) * | 2008-07-10 | 2011-02-02 | 鸿富锦精密工业(深圳)有限公司 | 弹片 |
DE102010026312B4 (de) * | 2010-07-06 | 2022-10-20 | Phoenix Contact Gmbh & Co. Kg | Anschlusskontakt und Verfahren zur Herstellung von Anschlusskontakten |
BR112016001171A2 (pt) * | 2013-10-21 | 2017-12-12 | Nsk Ltd | módulo semicondutor. |
US9419354B2 (en) * | 2014-02-26 | 2016-08-16 | Samtec, Inc. | Electrical contacts, fusible members, and methods of attaching electrical contacts to substrates |
FR3020508B1 (fr) * | 2014-04-29 | 2017-12-22 | Valeo Systemes De Controle Moteur | Organe de connexion electrique entre deux cartes electroniques |
US9647363B2 (en) * | 2014-09-19 | 2017-05-09 | Intel Corporation | Techniques and configurations to control movement and position of surface mounted electrical devices |
-
2015
- 2015-09-10 US US15/321,253 patent/US9974178B2/en not_active Expired - Fee Related
- 2015-09-10 WO PCT/JP2015/075697 patent/WO2016039413A1/ja active Application Filing
- 2015-09-10 EP EP15839537.6A patent/EP3193406A4/en not_active Withdrawn
- 2015-09-10 JP JP2016547499A patent/JP6098767B2/ja not_active Expired - Fee Related
- 2015-09-10 CN CN201580049199.XA patent/CN106716723B/zh not_active Expired - Fee Related
-
2017
- 2017-02-22 JP JP2017031366A patent/JP6281650B2/ja not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63266787A (ja) * | 1987-04-10 | 1988-11-02 | アンプ インコ−ポレ−テツド | プリント基板用コネクタ |
JPH0491071U (ja) * | 1990-12-25 | 1992-08-07 | ||
JPH04237155A (ja) * | 1991-01-22 | 1992-08-25 | Matsushita Electric Ind Co Ltd | 電子部品 |
JPH0579870U (ja) * | 1992-03-30 | 1993-10-29 | 太陽誘電株式会社 | 混成集積回路装置のリード端子接続構造 |
JPH09115574A (ja) * | 1995-10-13 | 1997-05-02 | Smk Corp | 接続用端子 |
JP2006344458A (ja) * | 2005-06-08 | 2006-12-21 | Hirose Electric Co Ltd | 表面実装型電気コネクタ |
JP2007188697A (ja) * | 2006-01-12 | 2007-07-26 | Tyco Electronics Amp Kk | 固定具、この固定具を備える面実装型部品、及びこの固定具を用いる実装構造 |
WO2014122883A1 (ja) * | 2013-02-06 | 2014-08-14 | 日本精工株式会社 | 多極コネクタ |
Also Published As
Publication number | Publication date |
---|---|
WO2016039413A1 (ja) | 2016-03-17 |
US20170208687A1 (en) | 2017-07-20 |
CN106716723A (zh) | 2017-05-24 |
CN106716723B (zh) | 2018-04-10 |
JPWO2016039413A1 (ja) | 2017-04-27 |
EP3193406A4 (en) | 2018-08-15 |
JP6281650B2 (ja) | 2018-02-21 |
JP2017118137A (ja) | 2017-06-29 |
US9974178B2 (en) | 2018-05-15 |
EP3193406A1 (en) | 2017-07-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6281650B2 (ja) | 多極リード部品及び基板の接続装置 | |
JP5943098B2 (ja) | 多極コネクタ | |
US9397030B2 (en) | Semiconductor module | |
US9402311B2 (en) | Semiconductor module | |
US9633967B2 (en) | Semiconductor module | |
EP2916349B1 (en) | Semiconductor module | |
US9312234B2 (en) | Semiconductor module and method for manufacturing the same | |
JP2009044126A (ja) | テープキャリア基板および半導体装置 | |
US10770812B2 (en) | Connection terminal assembled body and circuit board using same connection terminal assembled body | |
JP6737221B2 (ja) | 電動パワーステアリング制御装置および電子ユニット。 | |
JP2021048245A (ja) | 電気部品、及び電気部品の製造方法 | |
JP2015080383A (ja) | 半導体モジュール | |
JP2009027043A (ja) | 電子部品とその組立方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A529 | Written submission of copy of amendment under article 34 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A5211 Effective date: 20161118 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20161118 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20161118 |
|
TRDD | Decision of grant or rejection written | ||
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20170117 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170124 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170206 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6098767 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |