EP2003568B1 - Memory device, control method for the same, control program for the same, memory card, circuit board and electronic equipment - Google Patents

Memory device, control method for the same, control program for the same, memory card, circuit board and electronic equipment Download PDF

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Publication number
EP2003568B1
EP2003568B1 EP06730840A EP06730840A EP2003568B1 EP 2003568 B1 EP2003568 B1 EP 2003568B1 EP 06730840 A EP06730840 A EP 06730840A EP 06730840 A EP06730840 A EP 06730840A EP 2003568 B1 EP2003568 B1 EP 2003568B1
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EP
European Patent Office
Prior art keywords
memory
control
chip
data
memory device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
EP06730840A
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German (de)
English (en)
French (fr)
Other versions
EP2003568A4 (en
EP2003568A1 (en
Inventor
Toshihiro Miyamoto
Akio Takigami
Masaya Inoko
Takayoshi Suzuki
Hiroyuki Ono
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Fujitsu Ltd
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Fujitsu Ltd
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Publication of EP2003568A4 publication Critical patent/EP2003568A4/en
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Expired - Fee Related legal-status Critical Current
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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1078—Data input circuits, e.g. write amplifiers, data input buffers, data input registers, data input level conversion circuits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F12/00—Accessing, addressing or allocating within memory systems or architectures
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/06—Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/409—Read-write [R-W] circuits 
    • G11C11/4096—Input/output [I/O] data management or control circuits, e.g. reading or writing circuits, I/O drivers or bit-line switches 
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1078—Data input circuits, e.g. write amplifiers, data input buffers, data input registers, data input level conversion circuits
    • G11C7/109—Control signal input circuits
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/408—Address circuits

Definitions

  • the present invention relates to a memory that is used for data storage in an electronic apparatus such as a personal computer (PC), and, more particularly, to a memory device having an interface function, a control method for the memory device, a control program for the memory device, a memory card, a circuit board and electronic equipment.
  • PC personal computer
  • a PC is provided with such JEDEC (Joint Electron Device Engineering Council) standard memories as a SDRAM (Synchronous Dynamic Random Access Memory) and DDR-SDRAM (Double Data Rate-SDRAM).
  • JEDEC Joint Electron Device Engineering Council
  • SDRAM Serial Dynamic Random Access Memory
  • DDR-SDRAM Double Data Rate-SDRAM
  • patent document 1 discloses a memory controller that includes a plurality of programmable timing registers that can be programmed to store timing data fit to a memory device.
  • Patent Document 2 discloses a memory card that incorporates therein a microprocessor chip and a nonvolatile memory chip that are connected to each other via an internal card bus, the microprocessor chip containing key data, usage data and program command data.
  • Patent Document 3 discloses a computer system having an input/output processor provided as a built-in processor connected to a local memory.
  • Patent Document 4 discloses a memory having an SPI driver and a memory means that are arranged inside the memory.
  • Patent Document 5 discloses a data processing system including a CPU that is linked to a data memory via a single-direction readout bus, a single-direction writing-in bus and an address bus.
  • Patent Document 6 discloses a memory system in which a memory controller is connected to a memory via a writing-in data transfer bus and a readout data transfer bus that are separately disposed.
  • Patent Document 7 discloses a random-access memory configured in such a way that data transfer to random-access memories is controlled in response to first translation of a period signal and data transfer from an array of random-access memories is controlled in response to second translation of the period signal.
  • Patent Document 8 discloses a semiconductor memory device that includes a DRAM, and a CDRAM having a DRAM control and cache/refresh control unit.
  • Patent Document 9 discloses a synchronous DRAM that has a memory array and a control unit and that allows setting of a mode register only when the data contents of a data bus is equal to operation status check data.
  • Patent Document 10 discloses a mode register control circuit provided as an SDRAM and so on.
  • US 5, 812,491 A shows a mode register control circuit for controlling read and write operations of a mode register of a semiconductor device.
  • US 6,691,204 B1 shows a memory device having memory banks as well as a non-volatile mode register and a volatile mode register. When power is turned on, data are tranferred from the non-volatile mode register to the volatile mode register.
  • US 6,594,167 B1 shows a memory board carrying a plurality of memory chips each having a mode register and memory banks.
  • the SPD memory unit 6 stores memory-related control data, which includes memory-related various parameters such as CAS (Column Array Strobe) latency, burst length, and additive latency. These control data are the data for setting different values depending on a chip set and a CPU (Central Processing Unit) that control memories.
  • the SPD memory unit 6 is comprised of such a nonvolatile memory as EEPROM (Electrically Erasable Programmable Read-Only Memory). Keeping control parameters necessary for memories in a component separated from the memories requires handling and control corresponding to the separate parameter storage, leading to an increase in various costs including product cost and writing-in cost.
  • the memory module 2 has a number of memory chips 41, 42, ... and 4N, the specification of each of the memory chips 41, 42, ... and 4N is regulated by the SPD memory unit 6. This makes impossible separate use of each of the memory chips 41, 42, ... and 4N as a memory chip having a different specification. In other words, such a memory module 2 lacks flexibility in practical use.
  • Patent Documents 1 to 10 suggest or disclose nothing about the above problems, and disclose nothing about a solution to the problems, either.
  • An object of the present invention is to improve flexibility of a memory device having a plurality of memory chips to enable the memory device to give each of the memory chips separate control data.
  • Another object of the present invention is to separately control each of memory chips to optimize a memory and improve its compatibility.
  • a memory device of the present invention is defined in claim 1, wherein a plurality of memory chips includes a memory unit inside each memory chip, which memory part stores control data on the memory chip.
  • the memory device enables writing-in or readout of the control data stored on the memory part to be able to set any desired control data for each memory chip, and, when the memory device has the plurality of memory chips, enables separate use of each of the memory chips.
  • a first aspect of the present invention provides a memory device of claim 1 including a plurality of memory chips, comprising each memory chip that has a memory part, which stores control data concerning the memory chip, inside thereof, wherein the control data stored in the memory part is allowed to be written in and read out.
  • the memory chips are memory component units making up the memory device provided as a memory module and so on.
  • Each memory chip includes a plurality of memory matrixes. In this configuration, control data on the memory chip is stored on the control memory part, and the control data stored on the memory part is rewritable.
  • the memory part should not be provided as an independent EEPROM or mask ROM but may be provided as a control register. Such a configuration also achieves the above objects.
  • the memory chip has plurality of memory matrixes. Such a configuration also achieves the above objects.
  • the memory chip has a fixed data memory part inside thereof, the fixed data memory part storing fixed data out of the control data concerning the memory chip.
  • the fixed data stored in the fixed data memory part is allowed to be transferred to the memory part inside the memory chip.
  • Such a configuration also achieves the above objects.
  • a second aspect of the present invention provides a control method of claim 4 with a step of writing in or reading out control data concerning each memory chip to or from a memory part storing the control data.
  • a memory chip is identified by using address data on the memory chip, and rewriting control data stored on the memory part of the identified memory chip allows the memory chip to operate in correspondence to a change in a service environment and so on. This improves compatibility of the memory device and optimizes the memory device.
  • a third aspect of the present invention provides a control program of claim 5 for a memory device executed by a computer, the control program driving the computer to execute a step of writing in or reading out control data to or from a memory part of a memory chip.
  • the control program is executed by a computer apparatus at electronic equipment, such as a computer equipped with the memory device.
  • a memory chip is identified by using address data on the memory chip.
  • the computer apparatus rewrites control data stored on the memory part of the identified memory chip to allow the memory chip to deal with a change in a service environment and so on. This improves compatibility of the memory device and optimizes the memory device, thus achieves the above objects.
  • the present invention also provides a memory of claim 6 as a card including a plurality of memory chips, comprising each memory chip that has a memory part, which stores control data concerning the memory chip, inside thereof, wherein the control data stored in the memory part is allowed to be written in or read out.
  • the memory part may be comprised of a control register. Such a configuration also achieves the above objects.
  • the memory chip may have a single or a plurality of memory matrixes. Such a configuration also achieves the above objects.
  • the memory chip has a fixed data memory part inside thereof, the fixed data memory part storing fixed data out of the control data concerning the memory chip.
  • the fixed data stored on the fixed data memory part is allowed to be transferred to the memory part.
  • Such a configuration also achieves the above objects.
  • the present invention also provides a circuit board provided with the memory device described above comprising each memory chip that has a memory part, which stores control data concerning the memory chip, inside thereof, wherein the control data stored in the memory part is allowed to be written in or read out.
  • a circuit board provided with the memory device described above comprising each memory chip that has a memory part, which stores control data concerning the memory chip, inside thereof, wherein the control data stored in the memory part is allowed to be written in or read out.
  • a circuit board may comprise a slot into which the memory card is fitted. Such a configuration also achieves the above objects.
  • the present invention also provides electronic equipment comprising the memory device.
  • This electronic equipment may be provided as any form of equipment such as a computer, as long as it carries out data storage using the memory device.
  • Such a configuration also achieves the above objects.
  • the present invention also provides electronic equipment comprising the memory card.
  • the electronic equipment may be also provided as any form of equipment such as a computer, as long as it carries out data storage using the memory device.
  • Such a configuration also achieves the above objects.
  • the present invention offers the following effects.
  • Fig. 2 depicts an exemplary configuration of a memory module.
  • Fig. 2 depicts an example of a memory device. The configuration of the memory device therefore, is not limited to the configuration shown in Fig. 2 .
  • the memory module 100 is an example of the memory device.
  • the memory module 100 includes a circuit board that carries a plurality of memory chips 201, 202, ... and 20N.
  • the memory chips 201, 202, ... and 20N are memory component units, and need not to be the minimum component units but may be configured to be different from the memory component units.
  • the memory module 100 is comprised of the plurality of memory chips 201, 202, ... and 20N.
  • the memory module 100 may be constructed as a single memory module.
  • Each of the memory chips 201, 202, ... and 20N has, for example, four memory matrixes 211, 212, 213 and 214 serving as a plurality of banks, and a control register 220 serving as a memory part storing control data.
  • Each control register 220 stores individual control data on each of the memory chips 201, 202, ... and 20N.
  • This control data includes various memory-related parameters such as CAS (Column Array Strobe) latency, burst length and additive latency.
  • the control data therefore, may vary for each of the memory chips 201, 202, ... and 20N, or may be the same for every memory chip.
  • the memory chips 201, 202, ... and 20N are connected to buses 231, 232, ... and 23N, respectively. This enables data reading/writing from/to any one of the memory chips 201 to 20N that is identified by address data, and also enables writing in and rewriting of such control data as specification data and/or function data stored on the control register 220, based on address data identifying any one of the memory chips 201 to 20N.
  • control data stored on the control register 220 functions as identification data or function data that identifies each of the memory chips 201 to 20N or the memory module 100 as a whole.
  • each of the memory chips 201 to 20N is identified by the control data, which enables separate data reading/writing.
  • each of the memory chips 201 to 20N can be separately used as a memory chip having a different standard, that is, a different specification and function.
  • the memory module 100 thus constitutes the memory device that is highly flexible.
  • each of the memory chips 201 to 20N can be controlled separately based on control data stored on the control register 220, the parameters of each of the memory chips 201 to 20N or of the memory module 100 may be changed for operation corresponding to a given service environment. This optimizes the memory device and improves compatibility of the memory device.
  • Fig. 3 is a block diagram of an exemplary configuration of a memory chip.
  • the same components as described in Fig. 2 are denoted by the same reference numerals.
  • an N bit address signal passes through an N bit row buffer, and, in response to a row address selection signal RAS, comes into the row decoders 241 to 244, where a row of memory cells are selected.
  • a column address selection signal CAS the N bit address signal then comes into sense/column decoders 251 to 254, where a column of memory cells are selected, which enables data reading and writing.
  • Each of the memory matrixes 211 to 214 is capable of such an operation.
  • control register 220 stores CAS (column Address Strobe) latency and so on, as control data, which is read and written based on address data from an address bus AB.
  • Ao to An denote writing-in addresses
  • Bo to Bm denote bank addresses.
  • the control register 220 is connected to an input/output circuit 280, which is connected to a data bus DB, through which control data and so on are exchanged with an external device.
  • DQo to DQp denote data.
  • the control register 220 receives input of a clock signal CLK (denoted by A in Fig. 4 ), a chip select signal CS (denoted by B in Fig. 4 ), the row address selection signal RAS (denoted by C in Fig. 4 ), the column address selection signal CAS (denoted by D in Fig. 4 ), a write enable signal WE (denoted by E in Fig. 4 ), and address data Ao to An and Bo to Bm (denoted by F in Fig. 4 ) as read commands, as shown in Fig. 4 .
  • the control register 220 sends output data DQo to DQp (denoted by G in Fig. 4 ) through the input/output circuit 280 into the data bus DB.
  • FIG. 5 depicts an exemplary configuration of a memory module of the first embodiment
  • Fig. 6 is a block diagram of an exemplary configuration of a memory chip.
  • the same components as described in Fig. 2 and 3 are denoted by the same reference numerals.
  • Figs. 5 and 6 depict an example of a memory device of the present invention. The configuration of the memory device of the present invention, therefore, is not limited to the configuration shown in Figs. 5 and 6 .
  • each of the memory chips 201 to 20N has the control register 220 serving as a fluctuation data memory part and an SPD memory unit 222 serving as a fixed data memory part.
  • the SPD memory unit 222 stores fixed control data, which is, for example, memory-related various parameters such as CAS latency, burst length and additive latency.
  • the control register 220 has stores fixed control data read out from the SPD memory unit 222, which is, for example, such a parameter as CAS latency.
  • control register 220 and the SPD memory unit 222 are juxtaposed with each other, and are each connected to the input/output circuit 280, so that fixed control data read out from the SPD memory unit 222 is output through the input/output circuit 280 to the outside, or to the control register 220 on which the fixed control data is stored.
  • This control data stored on the control register 220 determines the functions and operation of the memory matrixes 211 to 214.
  • FIG. 7 depicts an exemplary configuration of a personal computer (PC) of the second embodiment
  • Fig. 8 is a flowchart of a procedure of a process of writing in or reading out storage data to and from a memory part.
  • the same components as described in Fig. 2 or 5 are denoted by the same reference numerals.
  • the PC 300 is an example of electronic equipment having the memory module 100, and is capable of reading and writing storage data stored on each of the control register 220 of the memory chips 201 to 20N of the memory module 100, based on address data.
  • the PC 300 includes a CPU (Central Processing Unit) 302, which is connected to a north bridge (chip set) 306 via a bus 304.
  • the north bridge 306 is connected to the memory module 100, and is also connected to an input/output (I/O) interface 310 via a south bridge 308.
  • the north bridge 306 is a means that carries out data exchange between the CPU 302 and the memory module 100
  • the south bridge 308 is a means that carries out data exchange between the CPU 302 and the I/O interface 310.
  • the memory module 100 has the above configuration (shown in Figs. 5 and 6 ), in which the same components as described above are denoted by the same reference numerals for saving further description.
  • a memory unit 314 composed of a nonvolatile memory and so on is connected.
  • the memory unit 314 stores a BIOS (Basic Input/Output System) 316 and a memory module processing program 318 for writing in or rewriting such control data as specification data and/or function data stored on each control register 220 of the memory module 100.
  • the memory module processing program 318 can be executed by an operation system (OS) that is stored on a memory device 320 composed of such a nonvolatile memory as a hard disc drive (HDD).
  • OS operation system
  • the I/O interface 310 is connected to input/output devices such as a keyboard 322 and a display device not shown.
  • Fig. 8 is a flowchart of a procedure of a process of writing in or rewriting control data.
  • step S1 writing of a command (for reading parameter data) is carried out first (step S1). Subsequently, reading of parameter data is carried out (step S2). Then, writing of a command (for writing parameter data) is carried out (step S3), and the procedure is ended.
  • control data representing a specification and function is written to the control register 220 of the memory module 100, or control data stored on the control register 220 can be updated.
  • FIG. 9 depicts an exemplary configuration of a memory card of the fourth embodiment.
  • the same components as described in Fig. 2 or 3 are denoted by the same reference numerals.
  • the memory card 400 is a specific embodiment of the above described memory module 100.
  • the memory card 400 includes a circuit board 402 having connectors 404 and 406 that are inserted into a socket on a motherboard side to provide electrical connection.
  • the connector 404 carries four memory chips 411, 412, 413 and 414, and the connector 406 carries four memory chips 421, 422, 423 and 424.
  • Each of the memory chips 411 to 414 and 421 to 424 has the above mentioned memory matrixes 211 to 214 and the control register 220.
  • Each memory chip also has the SPD memory unit 222 juxtaposed with the control register 220.
  • this memory card 400 can be used separately as a memory card having a different specification and function, thus serving as a memory device having extremely high flexibility.
  • the memory card 400 allows a change in specification and function and is able to operate in correspondence to a given service environment, thus enables optimization and improvement in compatibility of the memory.
  • FIG. 10 depicts an exemplary configuration of a circuit board of the fifth embodiment.
  • the same components as described in Fig. 7 or 9 will be denoted by the same reference numerals.
  • the circuit board 500 includes a memory slot 502 in which the memory card 400 equipped with the above described memory module 100 is fitted, and a north bridge 306.
  • the north bride 306 and the memory slot 502 are connected to each other via a bus to be able to exchange data with each other.
  • control data is written in on each of the control registers 220 incorporated in the memory card 400 to achieve highly flexible memory access.
  • each memory chip has an internal memory part such as a control register, which stores control data on the memory chip.
  • a control register which stores control data on the memory chip.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Databases & Information Systems (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Dram (AREA)
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EP06730840A 2006-03-31 2006-03-31 Memory device, control method for the same, control program for the same, memory card, circuit board and electronic equipment Expired - Fee Related EP2003568B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/306892 WO2007116486A1 (ja) 2006-03-31 2006-03-31 メモリ装置、その制御方法、その制御プログラム、メモリ・カード、回路基板及び電子機器

Publications (3)

Publication Number Publication Date
EP2003568A1 EP2003568A1 (en) 2008-12-17
EP2003568A4 EP2003568A4 (en) 2009-05-20
EP2003568B1 true EP2003568B1 (en) 2012-02-22

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US (1) US8159886B2 (ja)
EP (1) EP2003568B1 (ja)
JP (1) JPWO2007116486A1 (ja)
KR (1) KR101006410B1 (ja)
CN (1) CN101401078B (ja)
WO (1) WO2007116486A1 (ja)

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JP5467134B1 (ja) * 2012-09-27 2014-04-09 華邦電子股▲ふん▼有限公司 フラッシュメモリ装置およびメモリ装置の操作方法
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CN113051199A (zh) 2019-12-26 2021-06-29 阿里巴巴集团控股有限公司 数据传输方法及装置

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EP2003568A1 (en) 2008-12-17
KR101006410B1 (ko) 2011-01-10
US8159886B2 (en) 2012-04-17
JPWO2007116486A1 (ja) 2009-08-20
WO2007116486A1 (ja) 2007-10-18
CN101401078A (zh) 2009-04-01
US20090021991A1 (en) 2009-01-22
KR20080095301A (ko) 2008-10-28
CN101401078B (zh) 2012-07-04

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