EP1828305A4 - Preimpregne a faible perte, compositions utiles pour sa preparation et ses utilisations - Google Patents

Preimpregne a faible perte, compositions utiles pour sa preparation et ses utilisations

Info

Publication number
EP1828305A4
EP1828305A4 EP05852928A EP05852928A EP1828305A4 EP 1828305 A4 EP1828305 A4 EP 1828305A4 EP 05852928 A EP05852928 A EP 05852928A EP 05852928 A EP05852928 A EP 05852928A EP 1828305 A4 EP1828305 A4 EP 1828305A4
Authority
EP
European Patent Office
Prior art keywords
prepregs
preparation
low loss
compositions useful
uses therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP05852928A
Other languages
German (de)
English (en)
Other versions
EP1828305A1 (fr
Inventor
Thomas Allan Koes
Ousama Najjar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arlon LLC
Original Assignee
Arlon LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arlon LLC filed Critical Arlon LLC
Publication of EP1828305A1 publication Critical patent/EP1828305A1/fr
Publication of EP1828305A4 publication Critical patent/EP1828305A4/fr
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
EP05852928A 2004-12-06 2005-12-05 Preimpregne a faible perte, compositions utiles pour sa preparation et ses utilisations Ceased EP1828305A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/006,211 US7364672B2 (en) 2004-12-06 2004-12-06 Low loss prepregs, compositions useful for the preparation thereof and uses therefor
PCT/US2005/043864 WO2006062879A1 (fr) 2004-12-06 2005-12-05 Preimpregne a faible perte, compositions utiles pour sa preparation et ses utilisations

Publications (2)

Publication Number Publication Date
EP1828305A1 EP1828305A1 (fr) 2007-09-05
EP1828305A4 true EP1828305A4 (fr) 2009-10-21

Family

ID=36573167

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05852928A Ceased EP1828305A4 (fr) 2004-12-06 2005-12-05 Preimpregne a faible perte, compositions utiles pour sa preparation et ses utilisations

Country Status (4)

Country Link
US (1) US7364672B2 (fr)
EP (1) EP1828305A4 (fr)
CN (1) CN101111556B (fr)
WO (1) WO2006062879A1 (fr)

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US20060111459A9 (en) * 2003-08-29 2006-05-25 Bradford Larry L Flame retardant composition and polyurethane foam containing same
ATE373945T1 (de) * 2004-02-23 2007-10-15 Georgia Tech Res Inst Passive signalverarbeitungskomponenten auf flüssigkristallpolymer- und mehrschichtpolymerbasis für hf-/drahtlos-mehrband-anwendungen
KR100673778B1 (ko) * 2005-08-19 2007-01-24 제일모직주식회사 저온 속경화형 이방성 도전 필름용 조성물, 그로부터제조된 이방성 도전 필름 및 그 제조방법
US20080009211A1 (en) * 2006-07-07 2008-01-10 Matthew Raymond Himes Assemblies useful for the preparation of electronic components and methods for making same
US8142878B2 (en) * 2007-08-22 2012-03-27 Intel Corporation Heat resistant halogen free substrate core material
JP5181221B2 (ja) * 2008-01-15 2013-04-10 日立化成株式会社 低熱膨張性低誘電損失プリプレグ及びその応用品
GB2476115B8 (en) 2009-12-14 2014-07-23 Gurit Uk Ltd Prepregs for manufacturing composite materials
JPWO2011093079A1 (ja) * 2010-01-28 2013-05-30 三井化学株式会社 金属樹脂複合体
CN103772957B (zh) * 2012-10-24 2016-03-16 台光电子材料(昆山)有限公司 无卤素树脂组合物及其应用
CN106480735B (zh) * 2015-08-28 2019-06-14 广东生益科技股份有限公司 电路基板及其制备方法
CN109912908B (zh) 2017-12-13 2021-05-18 财团法人工业技术研究院 基板组合物及由其所制备的基板
CN108410167A (zh) * 2018-04-09 2018-08-17 贵州省材料产业技术研究院 一种玻纤增强低介电尼龙材料及其制备方法
CN113840726A (zh) * 2019-05-23 2021-12-24 罗杰斯公司 低损耗复合材料层和用于形成其的组合物

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US20140044950A1 (en) * 2011-04-21 2014-02-13 Daicel Corporation Crosslinked product of cyclic olefinic polymer and process for producing the same

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Patent Citations (3)

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Non-Patent Citations (2)

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Title
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See also references of WO2006062879A1 *

Also Published As

Publication number Publication date
CN101111556B (zh) 2015-11-25
CN101111556A (zh) 2008-01-23
EP1828305A1 (fr) 2007-09-05
US20060118766A1 (en) 2006-06-08
US7364672B2 (en) 2008-04-29
WO2006062879A1 (fr) 2006-06-15

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