ATE373945T1 - Passive signalverarbeitungskomponenten auf flüssigkristallpolymer- und mehrschichtpolymerbasis für hf-/drahtlos-mehrband-anwendungen - Google Patents

Passive signalverarbeitungskomponenten auf flüssigkristallpolymer- und mehrschichtpolymerbasis für hf-/drahtlos-mehrband-anwendungen

Info

Publication number
ATE373945T1
ATE373945T1 AT05723744T AT05723744T ATE373945T1 AT E373945 T1 ATE373945 T1 AT E373945T1 AT 05723744 T AT05723744 T AT 05723744T AT 05723744 T AT05723744 T AT 05723744T AT E373945 T1 ATE373945 T1 AT E373945T1
Authority
AT
Austria
Prior art keywords
lcp
layers
liquid crystal
signal processing
processing components
Prior art date
Application number
AT05723744T
Other languages
English (en)
Inventor
George White
Madhavan Swaminathan
Venkatesh Sundaram
Sidharth Dalmia
Original Assignee
Georgia Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Georgia Tech Res Inst filed Critical Georgia Tech Res Inst
Application granted granted Critical
Publication of ATE373945T1 publication Critical patent/ATE373945T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/203—Strip line filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/203—Strip line filters
    • H01P1/20327—Electromagnetic interstage coupling
    • H01P1/20354—Non-comb or non-interdigital filters
    • H01P1/20381—Special shape resonators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/213—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies
    • H01P1/2135—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies using strip line filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/09—Filters comprising mutual inductance
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/17—Structural details of sub-circuits of frequency selective networks
    • H03H7/1708—Comprising bridging elements, i.e. elements in a series path without own reference to ground and spanning branching nodes of another series path
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/17—Structural details of sub-circuits of frequency selective networks
    • H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
    • H03H7/1758—Series LC in shunt or branch path
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/17—Structural details of sub-circuits of frequency selective networks
    • H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
    • H03H7/1766—Parallel LC in series path
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/17—Structural details of sub-circuits of frequency selective networks
    • H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
    • H03H7/1775—Parallel LC in shunt or branch path
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/42—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/46—Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
    • H03H7/463—Duplexers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H2001/0021—Constructional details
    • H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/075—Ladder networks, e.g. electric wave filters
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/38—Impedance-matching networks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Filters And Equalizers (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Liquid Crystal Substances (AREA)
  • Optical Integrated Circuits (AREA)
AT05723744T 2004-02-23 2005-02-23 Passive signalverarbeitungskomponenten auf flüssigkristallpolymer- und mehrschichtpolymerbasis für hf-/drahtlos-mehrband-anwendungen ATE373945T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US54699804P 2004-02-23 2004-02-23

Publications (1)

Publication Number Publication Date
ATE373945T1 true ATE373945T1 (de) 2007-10-15

Family

ID=34910836

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05723744T ATE373945T1 (de) 2004-02-23 2005-02-23 Passive signalverarbeitungskomponenten auf flüssigkristallpolymer- und mehrschichtpolymerbasis für hf-/drahtlos-mehrband-anwendungen

Country Status (7)

Country Link
US (2) US7795995B2 (de)
EP (1) EP1731006B1 (de)
JP (3) JP2007523574A (de)
KR (1) KR101183272B1 (de)
AT (1) ATE373945T1 (de)
DE (1) DE602005002547T2 (de)
WO (1) WO2005084090A1 (de)

Families Citing this family (112)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006004989A2 (en) * 2004-06-30 2006-01-12 University Of South Florida Methof for etching microchannel networks within liquid crystal polymer substrates
US7746276B2 (en) * 2005-02-07 2010-06-29 Sandbridge Technologies, Inc. Microstrip multi-band composite antenna
US20060217102A1 (en) * 2005-03-22 2006-09-28 Yinon Degani Cellular/Wi-Fi combination devices
KR100696205B1 (ko) * 2005-08-26 2007-03-20 한국전자통신연구원 광 모듈 및 광 모듈 패키지
JP4255959B2 (ja) 2006-05-22 2009-04-22 富士通メディアデバイス株式会社 バランスフィルタおよび分波器
US7340825B2 (en) 2006-07-06 2008-03-11 Harris Corporation Method of making a transformer
KR100783112B1 (ko) * 2006-07-27 2007-12-07 삼성전자주식회사 단일 안테나로 이동방송 수신과 블루투스 송수신이 가능한무선통신 장치
KR100802358B1 (ko) 2006-08-22 2008-02-13 주식회사 이엠따블유안테나 전송선로
KR100828948B1 (ko) 2006-10-30 2008-05-13 주식회사 이엠따블유안테나 인터디지털 커패시터, 인덕터, 및 이들을 이용한 전송 선로및 결합기
US8493744B2 (en) * 2007-04-03 2013-07-23 Tdk Corporation Surface mount devices with minimum lead inductance and methods of manufacturing the same
US7999638B2 (en) 2007-06-28 2011-08-16 Bae Systems Plc Microwave circuit assembly comprising a microwave component suspended in a gas or vacuum region
US20090186169A1 (en) * 2008-01-17 2009-07-23 Harris Corporation Three-dimensional liquid crystal polymer multilayer circuit board including battery and related methods
US9117602B2 (en) 2008-01-17 2015-08-25 Harris Corporation Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methods
US8778124B2 (en) 2008-01-17 2014-07-15 Harris Corporation Method for making three-dimensional liquid crystal polymer multilayer circuit boards
US8022861B2 (en) * 2008-04-04 2011-09-20 Toyota Motor Engineering & Manufacturing North America, Inc. Dual-band antenna array and RF front-end for mm-wave imager and radar
US7830301B2 (en) * 2008-04-04 2010-11-09 Toyota Motor Engineering & Manufacturing North America, Inc. Dual-band antenna array and RF front-end for automotive radars
US7733265B2 (en) * 2008-04-04 2010-06-08 Toyota Motor Engineering & Manufacturing North America, Inc. Three dimensional integrated automotive radars and methods of manufacturing the same
CN102027632B (zh) * 2008-05-12 2013-10-30 松下电器产业株式会社 左手系谐振器和使用其的左手系滤波器
US20100020518A1 (en) * 2008-07-28 2010-01-28 Anadigics, Inc. RF shielding arrangement for semiconductor packages
US7990237B2 (en) 2009-01-16 2011-08-02 Toyota Motor Engineering & Manufacturing North America, Inc. System and method for improving performance of coplanar waveguide bends at mm-wave frequencies
US20100197257A1 (en) * 2009-02-04 2010-08-05 Qualcomm Incorporated Adjustable receive filter responsive to frequency spectrum information
WO2010106839A1 (ja) 2009-03-19 2010-09-23 株式会社村田製作所 回路基板及びマザー積層体
US8179137B2 (en) * 2009-03-31 2012-05-15 General Electric Company Magnetic resonance compatible multichannel stripline balun
US8358179B2 (en) * 2009-09-10 2013-01-22 Stats Chippac, Ltd. Semiconductor device and method of forming directional RF coupler with IPD for additional RF signal processing
CN102823129B (zh) * 2010-01-15 2015-07-08 维斯普瑞公司 可调匹配网路电路拓扑装置及方法
US8786496B2 (en) 2010-07-28 2014-07-22 Toyota Motor Engineering & Manufacturing North America, Inc. Three-dimensional array antenna on a substrate with enhanced backlobe suppression for mm-wave automotive applications
KR101141381B1 (ko) * 2010-08-16 2012-07-13 삼성전기주식회사 크로스토크 저감을 위한 통신 회로
WO2012036134A1 (ja) * 2010-09-14 2012-03-22 日立金属株式会社 フィルタ及びバランを備えた積層体型電子部品
EP2622737A4 (de) 2010-09-29 2015-08-12 Aviat Networks Inc Systeme und verfahren zur erzeugung passiver wellenleiterbauelemente
WO2012060775A1 (en) * 2010-10-18 2012-05-10 Nanyang Technological University Miniaturized passive low pass filter
US8299371B2 (en) * 2010-12-20 2012-10-30 Endicott Interconnect Technologies, Inc. Circuitized substrate with dielectric interposer assembly and method
US8633781B2 (en) 2010-12-21 2014-01-21 Avago Technologies General Ip (Singapore) Pte. Ltd. Combined balun and impedance matching circuit
US8867219B2 (en) * 2011-01-14 2014-10-21 Harris Corporation Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices
US8742871B2 (en) * 2011-03-10 2014-06-03 Taiwan Semiconductor Manufacturing Co., Ltd. Devices and bandpass filters therein having at least three transmission zeroes
WO2012161676A1 (en) * 2011-05-20 2012-11-29 Trilithic, Inc. Voltage tunable filters
US9287844B2 (en) * 2011-07-07 2016-03-15 Kemet Electronics Corporation Surface mountable multi-layer ceramic filter
GB201113129D0 (en) * 2011-07-29 2011-09-14 Bae Systems Plc Radio frequency communication
US20140306793A1 (en) * 2011-08-17 2014-10-16 King Abdullah University Of Science And Technology High Q, Miniaturized LCP-Based Passive Components
US9118119B2 (en) * 2011-09-13 2015-08-25 Mediatek Inc. Wireless communication device and feed-in method thereof
KR101250665B1 (ko) * 2011-09-30 2013-04-03 삼성전기주식회사 반도체 패키지 및 그 제조방법
KR101271511B1 (ko) * 2012-01-09 2013-06-05 주식회사 이엠따블유 광대역 회로 및 이를 포함하는 통신 장치
JP5794218B2 (ja) * 2012-02-14 2015-10-14 株式会社村田製作所 高周波信号線路及びこれを備えた電子機器
US9013891B2 (en) * 2012-03-09 2015-04-21 Finisar Corporation 3-D integrated package
WO2013168761A1 (ja) * 2012-05-10 2013-11-14 日立化成株式会社 多層配線基板
US8704611B2 (en) * 2012-06-28 2014-04-22 Werlatone, Inc. Planar constant-resistance hybrid filter
US9083310B2 (en) 2012-07-03 2015-07-14 Tdk Corporation Laminated structural type balun
EP2683081A1 (de) * 2012-07-06 2014-01-08 TDK Corporation Laminierter Lattice-Balun
BR112015010157A2 (pt) * 2012-12-19 2017-07-11 Ericsson Telefon Ab L M transformador planar
CN205882136U (zh) * 2013-02-01 2017-01-11 株式会社村田制作所 高频滤波器、高频双工器以及电子设备
US8877558B2 (en) 2013-02-07 2014-11-04 Harris Corporation Method for making electronic device with liquid crystal polymer and related devices
EP2768072A1 (de) 2013-02-15 2014-08-20 Technische Universität Darmstadt Phasenschieber
US9780756B2 (en) 2013-08-01 2017-10-03 Qorvo Us, Inc. Calibration for a tunable RF filter structure
US9871499B2 (en) 2013-03-15 2018-01-16 Qorvo Us, Inc. Multi-band impedance tuners using weakly-coupled LC resonators
US9899133B2 (en) 2013-08-01 2018-02-20 Qorvo Us, Inc. Advanced 3D inductor structures with confined magnetic field
US9755671B2 (en) 2013-08-01 2017-09-05 Qorvo Us, Inc. VSWR detector for a tunable filter structure
US9685928B2 (en) 2013-08-01 2017-06-20 Qorvo Us, Inc. Interference rejection RF filters
US9628045B2 (en) 2013-08-01 2017-04-18 Qorvo Us, Inc. Cooperative tunable RF filters
US9859863B2 (en) 2013-03-15 2018-01-02 Qorvo Us, Inc. RF filter structure for antenna diversity and beam forming
US9705478B2 (en) 2013-08-01 2017-07-11 Qorvo Us, Inc. Weakly coupled tunable RF receiver architecture
US9825656B2 (en) 2013-08-01 2017-11-21 Qorvo Us, Inc. Weakly coupled tunable RF transmitter architecture
US9444417B2 (en) 2013-03-15 2016-09-13 Qorvo Us, Inc. Weakly coupled RF network based power amplifier architecture
US9484879B2 (en) 2013-06-06 2016-11-01 Qorvo Us, Inc. Nonlinear capacitance linearization
US9774311B2 (en) 2013-03-15 2017-09-26 Qorvo Us, Inc. Filtering characteristic adjustments of weakly coupled tunable RF filters
US9294045B2 (en) 2013-03-15 2016-03-22 Rf Micro Devices, Inc. Gain and phase calibration for closed loop feedback linearized amplifiers
CN205265992U (zh) * 2013-05-15 2016-05-25 株式会社村田制作所 信号传输电缆和通信设备模块
US9705542B2 (en) 2013-06-06 2017-07-11 Qorvo Us, Inc. Reconfigurable RF filter
US9780817B2 (en) 2013-06-06 2017-10-03 Qorvo Us, Inc. RX shunt switching element-based RF front-end circuit
US9966981B2 (en) 2013-06-06 2018-05-08 Qorvo Us, Inc. Passive acoustic resonator based RF receiver
US9800282B2 (en) 2013-06-06 2017-10-24 Qorvo Us, Inc. Passive voltage-gain network
US9293438B2 (en) 2013-07-03 2016-03-22 Harris Corporation Method for making electronic device with cover layer with openings and related devices
KR101704489B1 (ko) * 2013-07-29 2017-02-08 멀티-파인라인 일렉트로닉스, 인코포레이티드 대역 통과 신호를 위한 얇은 연성 전송 선로
DE102014003676A1 (de) * 2014-03-14 2015-09-17 Bock 1 Gmbh & Co. Kg Stuhl, insbesondere Bürostuhl
US20150295320A1 (en) * 2014-04-14 2015-10-15 New York University Modified folded dipole antenna arrangement
FR3020742B1 (fr) * 2014-05-05 2016-05-27 Valeo Systemes De Controle Moteur Systeme electrique avec blindage
JP6555682B2 (ja) * 2015-02-04 2019-08-07 国立大学法人信州大学 コモンモードフィルタ
US9666939B2 (en) * 2015-02-17 2017-05-30 Joinset Co., Ltd. Antenna bandwidth expander
US10796835B2 (en) 2015-08-24 2020-10-06 Qorvo Us, Inc. Stacked laminate inductors for high module volume utilization and performance-cost-size-processing-time tradeoff
US11469190B2 (en) * 2016-03-15 2022-10-11 Intel Corporation Parasitic-aware integrated substrate balanced filter and apparatus to achieve transmission zeros
US9876513B2 (en) 2016-03-31 2018-01-23 Qualcomm Incorporated LC filter layer stacking by layer transfer to make 3D multiplexer structures
WO2017169102A1 (ja) * 2016-03-31 2017-10-05 株式会社村田製作所 電子部品
DE102016107955A1 (de) 2016-04-28 2017-11-02 Tesat-Spacecom Gmbh & Co. Kg Resonator und Filter mit Resonator
JP6624026B2 (ja) 2016-05-20 2019-12-25 株式会社村田製作所 積層型電子部品
US10242792B2 (en) * 2016-05-20 2019-03-26 Murata Manufacturing Co., Ltd. Multilayer electronic component
US10141353B2 (en) * 2016-05-20 2018-11-27 Qualcomm Incorporated Passive components implemented on a plurality of stacked insulators
JP6607173B2 (ja) 2016-05-20 2019-11-20 株式会社村田製作所 積層型電子部品
US10242798B2 (en) * 2016-05-20 2019-03-26 Murata Manufacturing Co., Ltd. Multilayer electronic component
CN109314316B (zh) 2016-05-30 2020-10-23 夏普株式会社 扫描天线
US10666302B2 (en) * 2016-06-21 2020-05-26 Telefonaktiebolaget Lm Ericsson (Publ) Antenna feed in a wireless communication network node
CN106252181B (zh) * 2016-08-29 2017-11-10 电子科技大学 一种基于lcp工艺的小型化均衡器
US10109903B2 (en) 2016-10-06 2018-10-23 Invensas Corporation Flipped RF filters and components
US11139238B2 (en) 2016-12-07 2021-10-05 Qorvo Us, Inc. High Q factor inductor structure
RU2653084C1 (ru) * 2017-01-31 2018-05-07 Самсунг Электроникс Ко., Лтд. Высокочастотное устройство на основе жидких кристаллов
JP7155499B2 (ja) * 2017-04-26 2022-10-19 Tdk株式会社 積層型電子部品およびその製造方法
DE102017129473A1 (de) * 2017-12-11 2019-06-13 RF360 Europe GmbH Breitbandiges HF-Filter, Multiband-HF-Filter und HF-Filterbauelement
JP6965732B2 (ja) * 2017-12-26 2021-11-10 Tdk株式会社 バンドパスフィルタ
DE102018105349A1 (de) 2018-03-08 2019-09-12 Infineon Technologies Ag Vorrichtung mit mindestens einem Streifenleiter
CN109301404B (zh) * 2018-06-13 2020-02-18 华南理工大学 一种基于频率选择性耦合的ltcc宽阻带滤波巴伦
JP6800181B2 (ja) * 2018-06-20 2020-12-16 双信電機株式会社 共振器及びフィルタ
CN108490270B (zh) * 2018-07-02 2020-01-24 京东方科技集团股份有限公司 液晶介电常数的测量装置、测量系统、测量方法
DE112019004661T5 (de) * 2018-09-18 2021-08-26 Avx Corporation Oberflächenmontierter Hochleistungsfilter
JP6839692B2 (ja) * 2018-10-19 2021-03-10 双信電機株式会社 フィルタ
JP7288056B2 (ja) * 2018-12-20 2023-06-06 キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション 高精度インダクタを含む多層電子デバイス
JP7558171B2 (ja) * 2018-12-20 2024-09-30 キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション リターン信号を低減する突起部を備える多層フィルタ
WO2020132183A1 (en) * 2018-12-20 2020-06-25 Avx Corporation Multilayer electronic device including a capacitor having a precisely controlled capacitive area
CN113228410B (zh) 2018-12-20 2023-02-17 京瓷Avx元器件公司 包括低电感过孔组件的多层滤波器
US11114993B2 (en) * 2018-12-20 2021-09-07 Avx Corporation High frequency multilayer filter
JP7288055B2 (ja) * 2018-12-20 2023-06-06 キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション 少なくとも２つのビアと接続されたコンデンサを備える多層フィルタ
JP7119056B2 (ja) * 2020-12-07 2022-08-16 双信電機株式会社 フィルタ
EP4406373A1 (de) * 2021-09-22 2024-07-31 Jabil Inc. Verfahren zur verbesserung der leistungsintegrität für mmwave-phasenarray-antennen mit mikrovias
US11711894B1 (en) 2022-02-03 2023-07-25 Analog Devices International Unlimited Company Capacitively coupled resonators for high frequency galvanic isolators
CN114552155B (zh) * 2022-04-25 2022-07-05 电子科技大学成都学院 双模传输线
TWI831374B (zh) * 2022-09-15 2024-02-01 特崴光波導股份有限公司 多頻濾波器

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0537164A (ja) * 1991-07-31 1993-02-12 Toshiba Corp 配線基板および高周波フイルタ
JPH0637512A (ja) * 1992-07-15 1994-02-10 Hitachi Ltd 高周波増幅モジュール
JP3558696B2 (ja) * 1994-08-26 2004-08-25 日本無線株式会社 積層誘電体フィルタ
US5739193A (en) * 1996-05-07 1998-04-14 Hoechst Celanese Corp. Polymeric compositions having a temperature-stable dielectric constant
JPH10224108A (ja) * 1997-02-04 1998-08-21 Fuji Elelctrochem Co Ltd 積層誘電体フィルタ
JP3632597B2 (ja) * 2000-02-01 2005-03-23 株式会社村田製作所 フィルタ、デュプレクサおよび通信装置
SE520151C2 (sv) * 2000-06-07 2003-06-03 Shaofang Gong Modul för radiokommunikation
JP3546001B2 (ja) * 2000-08-09 2004-07-21 Ｔｄｋ株式会社 電子部品
JP4529262B2 (ja) * 2000-09-14 2010-08-25 ソニー株式会社 高周波モジュール装置及びその製造方法
US20020158305A1 (en) * 2001-01-05 2002-10-31 Sidharth Dalmia Organic substrate having integrated passive components
JP2002271109A (ja) * 2001-03-08 2002-09-20 Taiyo Yuden Co Ltd 積層デュプレクサ素子
JP2002353703A (ja) * 2001-03-19 2002-12-06 Tdk Corp バンドパスフィルタ
EP1263137B1 (de) * 2001-05-31 2017-07-26 Skyworks Filter Solutions Japan Co., Ltd. Akustisches Oberflächenwellenfilter, symmetrisches Filter und Kommunikationsgerät
JP2003087007A (ja) * 2001-09-13 2003-03-20 Sony Corp 高周波モジュール基板装置
JP4318417B2 (ja) * 2001-10-05 2009-08-26 ソニー株式会社 高周波モジュール基板装置
JP3649183B2 (ja) * 2001-12-27 2005-05-18 ソニー株式会社 フィルタ回路装置及びその製造方法
JP2003218272A (ja) * 2002-01-25 2003-07-31 Sony Corp 高周波モジュール及びその製造方法
US6900708B2 (en) * 2002-06-26 2005-05-31 Georgia Tech Research Corporation Integrated passive devices fabricated utilizing multi-layer, organic laminates
US7260890B2 (en) * 2002-06-26 2007-08-28 Georgia Tech Research Corporation Methods for fabricating three-dimensional all organic interconnect structures
JP2004087007A (ja) * 2002-08-27 2004-03-18 Fuji Electric Holdings Co Ltd 磁気ディスク用ガラス基板およびその製造方法、並びに磁気ディスク
US7012481B2 (en) * 2002-10-04 2006-03-14 Matsushita Electric Industrial Co., Ltd. Duplexer, and laminate-type high-frequency device and communication equipment using the same
US7364672B2 (en) * 2004-12-06 2008-04-29 Arlon, Inc. Low loss prepregs, compositions useful for the preparation thereof and uses therefor

Also Published As

Publication number Publication date
US7795995B2 (en) 2010-09-14
EP1731006B1 (de) 2007-09-19
WO2005084090A1 (en) 2005-09-09
KR101183272B1 (ko) 2012-09-14
JP5135320B2 (ja) 2013-02-06
JP2007523574A (ja) 2007-08-16
DE602005002547D1 (de) 2007-10-31
EP1731006A1 (de) 2006-12-13
JP2010114899A (ja) 2010-05-20
US20070085108A1 (en) 2007-04-19
DE602005002547T2 (de) 2008-06-12
KR20070009596A (ko) 2007-01-18
US20110006861A1 (en) 2011-01-13
US8013688B2 (en) 2011-09-06
JP5175260B2 (ja) 2013-04-03
JP2010093828A (ja) 2010-04-22

Similar Documents

Publication Publication Date Title
ATE373945T1 (de) Passive signalverarbeitungskomponenten auf flüssigkristallpolymer- und mehrschichtpolymerbasis für hf-/drahtlos-mehrband-anwendungen
Armendariz et al. Tunable SIW bandpass filters with PIN diodes
US20070103253A1 (en) 180 Degrees hybrid coupler
US20140306793A1 (en) High Q, Miniaturized LCP-Based Passive Components
US20050017821A1 (en) Directional coupler
WO2010003808A3 (en) Waveguides and transmission lines in gaps between parallel conducting surfaces
WO2009066629A1 (ja) アンテナ素子およびその製造方法
US20110094786A1 (en) Printed circuit board
US9716305B2 (en) Balun
CN103066367A (zh) 集成波导定向耦合器
US20170163235A1 (en) Quadrature hybrid with multi-layer structure
US9685686B2 (en) Power divider and method of fabricating the same
US20130285785A1 (en) Low temperature co-fired ceramic device and a method of manufacturing thereof
JP2001144451A (ja) 積層配線板
KR200465432Y1 (ko) 디씨 블록용 마이크로 스트립 전송선로
US20090295497A1 (en) Impedance transforming hybrid coupler
SE520792C2 (sv) Fyrports hybridmikrostripkrets av Langetyp
US8860533B2 (en) Low pass filter
JP2014003090A (ja) 回路基板
JP2003069239A (ja) 高周波回路用多層配線板
KR101166111B1 (ko) 적층형 고주파용 하이패스 필터
KR20110107086A (ko) 적층형 밴드패스필터, 다이플렉서 및 멀티플렉서
US20130229239A1 (en) Lange coupler and fabrication method
Schulz et al. A Low‐Loss Fully Embedded Stripline Parallel Coupled BPF for Applications using the 60 GH z Band
KR20150020389A (ko) 다층구조 윌킨슨 분배기

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties