EP1661206B1 - Substrat mit hoher impedanz - Google Patents

Substrat mit hoher impedanz Download PDF

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Publication number
EP1661206B1
EP1661206B1 EP04786396A EP04786396A EP1661206B1 EP 1661206 B1 EP1661206 B1 EP 1661206B1 EP 04786396 A EP04786396 A EP 04786396A EP 04786396 A EP04786396 A EP 04786396A EP 1661206 B1 EP1661206 B1 EP 1661206B1
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EP
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Prior art keywords
sheet
layer
substrate
magnetic
impedance
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Expired - Lifetime
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EP04786396A
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English (en)
French (fr)
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EP1661206A1 (de
Inventor
Olivier Reynet
Olivier Acher
Marc Ledieu
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Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
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Commissariat a lEnergie Atomique CEA
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
    • H01Q15/006—Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
    • H01Q15/0066—Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces said selective devices being reconfigurable, tunable or controllable, e.g. using switches

Definitions

  • the invention is in the field of high impedance substrates. Such substrates are particularly applicable in microwave devices.
  • the invention finds application particularly but not only in telecommunications, for example in the frequency band from about 50 MHz to about 4 GHz for the realization of antennas.
  • the surface is frequency selective because it comprises a network 102 of resonant loops also called artificial magnetic molecules 804. These resonant loops or artificial magnetic molecules 804 are strongly capacitively coupled to each other, thus forming a frequency-selective capacitive surface.
  • Such high impedance substrates are very useful in the field of antennas.
  • Such surfaces are intended to interact with an incident electromagnetic wave arriving on this high impedance surface. They make it possible to reduce the size of the devices used while improving the selectivity and directivity characteristics of the antennas produced.
  • the invention is directed to a high impedance surface having a small thickness in front of the wavelength in the vacuum of a wave at a center frequency of a frequency band for which the surface has a high impedance. It also targets a high impedance surface having a high bandwidth. It targets a high impedance surface using materials which is not limited by the properties of the material at the working frequencies of the surface. It aims a high impedance surface tunable, ie which can be varied on command the center frequency and bandwidth.
  • the invention relates to a high-impedance substrate comprising a first layer or sheet of insulating material, having a lower face and an upper face, the substrate comprising conductive patterns mechanically bonded to the substrate, characterized in that some of the conductive patterns mechanically bonded to the substrate are associated with a magnetic pad, and in that at least one electrical interconnection makes two points distinct from each other of a conductive pattern mechanically bonded to the substrate, this pattern conductor having an associated magnetic pad, passing above the magnetic pad associated with said conductive pattern mechanically bonded to the substrate.
  • block indicates the set of points of a metric space whose coordinates are taken in a bounded interval and whose rectangular parallelepiped is the simplest image. It is therefore a piece of matter.
  • conductive patterns consist of conductive tracks deposited on one and / or the other of the upper or lower faces of the first layer or sheet of insulating material.
  • the high impedance substrate comprises, in addition to a first layer or sheet of insulating material, a second layer or sheet having an upper face opposite the lower face of the first sheet or layer and a lower face, the conductive patterns being deposited at least partly of them, on one and / or the other of the upper or lower faces of this second layer or sheet.
  • the conductive patterns form electrical circuits possibly together with active or passive components.
  • these active or passive components are surface-mounted on one and / or the other of the upper or lower faces of said second layer or sheet.
  • the electronic components are elements having a resistance value and a capacitance value.
  • the high impedance substrate further comprises a ground plane constituted by a third layer or sheet having an upper face and a lower face, at least one of these faces being constituted by a conductive material.
  • This ground plane may be located above the upper face of the first layer or sheet and in this case the magnetic blocks will be mechanically linked to the upper face of this ground plane.
  • the ground plane may also be under the first sheet or layer, or if the embodiment has a second sheet or layer between the first sheet or layer and the second sheet or layer, or under the second sheet or layer. In these latter cases the magnetic blocks will be mechanically connected to the upper face of the first sheet or layer.
  • Figure 1 shows a perspective view of a first embodiment of the invention.
  • each block 5 has the shape of a parallelepiped for example rectangle.
  • Each electrically conductive pattern 3 forms together with active and / or passive components globally represented by a rectangle 7 in FIG. 1 an electrical circuit.
  • this circuit is completed by an electrical interconnection, for example in the form of a wire or a ribbon 13, connecting a first 9 and a second 11 distinct point of the first, the pattern 3.
  • the pattern 5 comprises several conductive tracks 10, parallel to one another, and for example perpendicular to the direction of rotation.
  • the lanes 10 each have two ends 9 and 11.
  • n and p are integers, and p is less than or equal to n.
  • references 9 0 , 9 n-1 do not appear.
  • the coil or turns formed by a portion of the conductive pattern 3 and the connections 13 are inserted in series or in parallel with other parts of the conductive pattern 3.
  • a high impedance substrate incorporating the invention has been produced according to the embodiment described with reference to FIGS. 1 and 2.
  • a Kapton (registered trademark) plate 1 having a surface of 500 ⁇ 500 mm 2 , initially coppered on its upper face 6 was used.
  • the conductive patterns 3 were made by etching techniques of the conductive copper layer, themselves known in the field of printed circuits. These patterns in the form of tracks have a width of about 1 mm.
  • a capacitance and resistance were reported at the locations marked 7 in FIG. 1. In one embodiment the capacitance was 21 picofarads and the resistance was 0.1 ohms.
  • the capacitance value of the component is a function of an electrical quantity, a voltage or a current, applied to said active component. It is possible, for example, to use the varactor ZC830B from the manufacturer Zeitel, which makes it possible to vary in a simple manner the capacitance of the RC circuit 7. In this case, it is preferable to interpose, as will be explained later in connection with FIG. 5, a ground plane between the blocks 5 and the conductive patterns 3, these being in this case partially or totally reported on a second sheet or layer 2 placed under the layer 1.
  • a magnetic layer consisting for example of an elastomer loaded with 50% iron powder is placed above the conductive patterns 5, for example glued by means of an insulating adhesive.
  • This material has a magnetic permeability ⁇ 'of 11 and magnetic losses ⁇ "weak, less than unity It is noted that the magnetic losses correspond to the imaginary value of the magnetic permeability.
  • a rubber or a plastic material loaded with a magnetic powder Preferably, the volume fraction of magnetic powder exceeds 30%. It is also possible to use stacks of magnetic and insulating layers, comprising at least 5% by volume of magnetic material.
  • the conductive direction of the stacks will preferably be parallel to the axis of the solenoid formed by the connections 13 and their complement of the pattern 3.
  • the layer of magnetic material is etched in two directions of the plane of the layer, for example, perpendicular to each other, to a depth of eg 5 mm, so as to obtain the magnetic blocks 5.
  • pavers 5 had dimensions of 5 ⁇ 3 ⁇ 30 mm.
  • the surface fraction occupied by the pavers is about 10%.
  • the solenoid will have between one and 50 turns.
  • the solenoid is in this example in series with the circuit RC, formed by resistance and capacitance symbolically represented by the square 7 in FIG.
  • the advantage of introducing a core-forming magnetic material into the solenoid thus formed is to significantly increase magnetic permeability levels compared to the "coreless" case.
  • the Applicant has carried out measurements of magnetic permeability and magnetic losses obtained with magnetic blocks 5 made of elastomer material loaded with 50% iron powder made as indicated above for three values 0.1, 2, and 10 ohms of the resistance. R of the RC circuit. The capacity C is during these measurements remained at a value of 50 picofarads.
  • the solenoid surrounding each pad 5 comprised 5 turns.
  • the magnetic permeability characteristics obtained as a function of the working frequency are represented by curves represented in FIG. 3 part A and B.
  • the magnetic permeability values ⁇ ' are represented in part A of FIG. 3.
  • Part B represents the values of the magnetic losses ⁇ "as a function of the frequency expressed in gigahertz, the peak values of ⁇ " decreasing when the value of the resistance believes.
  • the highest peak has a level of 5 and the narrowest is obtained for the 0.1 resistance value.
  • the curve corresponding to this resistance value is referenced a.
  • the other two curves, referenced c and b respectively have peaks whose height is decreasing and the Width increasing with increasing resistance value respectively for resistance values from 2 to 10 ohms.
  • the width of the peak of magnetic losses goes from 10 MHz for the resistance value 0.1 ohms to 35 MHz for the resistance value 10 ohms.
  • the levels of ⁇ 'and ⁇ are the essential values which condition the impedance seen by an electromagnetic wave arriving on the high impedance substrate thus obtained.
  • the source of said wave is located on the side of the face 6 of the plate 1 on which magnetic pavers 5.
  • High levels of magnetic permeability help to obtain high impedances over a wide frequency range, while the respective values of ⁇ 'and ⁇ "determine the level of loss associated with the frequency. being desired or not depending on the applications that are given to the high impedance substrate.
  • the height of the peak of magnetic losses can be adjusted or modified very easily by a simple variation of a resistance value.
  • the levels of permeability and magnetic losses by increasing the coverage density of the face 6, by the magnetic blocks 5.
  • the levels shown in FIG. 10% coverage as explained above. Switching to a coverage rate of 50% would increase the value of ⁇ "by a factor of 5.
  • the coverage rates of the face 6, by the magnetic blocks 5 will be greater than 10%, for example 50% or preferably greater than 50%.
  • the Applicant has also carried out measurements of magnetic permeability and magnetic losses obtained with the magnetic blocks of elastomer material loaded with 50% iron powder made as indicated above for seven values, 38, 32, 21, 9, 5, 2 , and 1 picofarad of the capacity of the RC circuit.
  • the resistance R is during these measurements remained at a value of 0.1 ohms.
  • the seven curves shown in part A of FIG. 4 each represent the value of the magnetic permeability ⁇ 'for the different values of the capacitance C.
  • the value of the losses ⁇ "as a function of the frequency in gigahertz carried on the abscissa is represented in part B of figure 4.
  • the frequency corresponding to the peak of loss decreases as the value of the capacitance C increases. is present for a value of about 0.13 gigahertz on the curve corresponding to a capacitance value of 38 picofarads.For the value of capacity 1 picofarad, the peak of loss is present for a value corresponding to about 0.37 gigahertz.
  • the loss peaks of the other 5 curves are at intermediate values between these two frequency values These peaks are at frequency values which increase when the value of the capacitance C decreases by the value 32 pF at the value 2 pF.
  • the conductive pattern 3 is disposed on a second sheet or layer 2.
  • This second sheet or layer 2 has two faces, a top face 12 facing the lower face 8 of the first sheet or layer 1 and a bottom face 14.
  • the upper face 12 of the sheet or layer 2 hosts 2 part 3 of the conductor pattern 3.
  • the part 3 2 of the conductive pattern 3 comprises all the active or passive components 7 forming a circuit with the conductive pattern 3.
  • a part 3 1 of the conductive pattern 3 remains present on the upper face 6 of the first sheet or layer 1, as shown Figure 5.
  • electrical connections between the conductive pattern portion 3 1 and the conductive pattern portion 3 2 are provided by plated through holes 18 joining the upper and lower faces of the layer or sheet 1.
  • the connections between the connections 13 passing above a magnetic tile 5 and the conductive pattern part 3 2 lying on the sheet or layer 2 are provided by such plated-through holes 18, when the conductive pattern part 3 2 comprises additional to said connections 13 to form a solenoid.
  • the underside of the sheet or layer 2 is metallized so that the sheet or layer 2 forms a ground plane.
  • the substrate according to the invention comprises a ground plane lying under the first layer or sheet 1 opposite the lower face of said first layer or sheet.
  • a conductive plane 4 forming ground plane is interposed between the sheets or layers 1 and 2.
  • the conductive plane may be in the form of for example a third layer or sheet 4. In FIG. 5, in order not to hinder the view of the layer 2, this plane has only been shown partially.
  • This third sheet or layer 4 then comprises metallized holes 18 each forming a connection passage. The outlet of these holes is so in itself known, electrically isolated to prevent grounding connections.
  • FIG. 6 A variant of the embodiment shown in FIG. 5, which also makes it possible to reduce the electromagnetic leakage upwards, is represented in FIG. 6.
  • the upper face of the sheet or layer 1 is entirely metallized, with the exception of locations surrounding metallized holes 18 electrically joining points of the sheet or layer 1 and points of the sheet or layer 2.
  • the metal blocks 5 are then glued to the top of the metal deposit by means of an electrically insulating glue. With the exception of the metallized holes 18 and their outlets, the entire conductive pattern 3 is transferred to the second sheet or layer 2.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Combinations Of Printed Boards (AREA)
  • Aerials With Secondary Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Finishing Walls (AREA)

Claims (23)

  1. Substrat mit hoher Impedanz, das eine erste Schicht oder Lage (1) aus Isoliermaterial, die eine erste und eine zweite Fläche in Form einer unteren Oberfläche und einer oberen Oberfläche (6) besitzt, umfasst, wobei das Substrat Leitermuster (3) aufweist, die mit dem Substrat mechanisch verbunden sind,
    dadurch gekennzeichnet, dass
    bestimmte der Leitermuster (3), die mit dem Substrat mechanisch verbunden sind, einem magnetischen Belag (5) zugeordnet sind, der auf oder über einer der zwei Flächen des Substrats angeordnet ist, und dass wenigstens eine elektrische Zwischenverbindung (13) zwei voneinander verschiedene Punkte (9, 11) eines Leitermusters (3), die mit dem Substrat mechanisch verbunden sind, elektrisch kontaktiert, wobei dieses Leitermuster (3), das einen zugeordneten magnetischen Belag (5) hat, über diesen dem Leitermuster (3) zugeordneten magnetischen Belag (5) hinweg mit dem Substrat mechanisch verbunden ist.
  2. Substrat mit hoher Impedanz nach Anspruch 1, dadurch gekennzeichnet, dass die Leitermuster (3) durch Leiterbahnen gebildet sind, die auf der einen und/oder der anderen der oberen Fläche (6) bzw. der unteren Fläche des Substrats abgelagert sind.
  3. Substrat mit hoher Impedanz nach Anspruch 1, dadurch gekennzeichnet, dass die Leitermuster (3) durch Leiterbahnen gebildet sind, die auf der einen und/oder der anderen der oberen Fläche (6) bzw. der unteren Fläche des Substrats abgelagert sind und zusammen mit elektronischen Komponenten (7) eine elektrische Schaltung bilden.
  4. Substrat mit hoher Impedanz nach Anspruch 3, dadurch gekennzeichnet, dass die elektronischen Komponenten (7) Elemente sind, die einen Widerstandswert und einen Kapazitätswert haben.
  5. Substrat mit hoher Impedanz nach Anspruch 4, dadurch gekennzeichnet, dass die elektronischen Komponenten (7) ein oder mehrere aktive Elemente aufweisen, die einen Kapazitätswert besitzen, der in Abhängigkeit vom Wert einer elektrischen Größe, die in dieses oder in diese aktive Elemente eingegeben wird, veränderlich sein kann.
  6. Substrat mit hoher Impedanz nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass es eine zweite Schicht oder Lage (2) umfasst, wobei diese zweite Schicht oder Lage (2) eine obere Fläche gegenüber der unteren Fläche der ersten Schicht oder Lage (1) und eine untere Fläche besitzt und dass wenigstens ein Teil (32) jedes der Muster (3) mit der einen und/oder der anderen der oberen bzw. der unteren Fläche der zweiten Lage oder Schicht (2) mechanisch verbunden ist.
  7. Substrat mit hoher Impedanz nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass es eine zweite Schicht oder Lage (2) umfasst, wobei diese zweite Schicht oder Lage (2) eine obere Fläche gegenüber der unteren Fläche der ersten Schicht oder Lage (1) und eine untere Fläche besitzt und dass die Gesamtheit der Muster (3) mit der einen und/oder der anderen der oberen Fläche bzw. der unteren Fläche der zweiten Lage oder Schicht mechanisch verbunden ist.
  8. Substrat mit hoher Impedanz nach einem der Ansprüche 3 bis 5, dadurch gekennzeichnet, dass es eine zweite Schicht oder Lage (2) umfasst, wobei diese zweite Schicht oder Lage (2) eine obere Fläche gegenüber der unteren Fläche der ersten Schicht oder Lage (1) und eine untere Fläche besitzt und dass die Gesamtheit der Leitermuster (3) sowie die Gesamtheit der elektronischen Komponenten, die mit diesen Mustern (3) eine elektrische Schattung bilden, mit der einen und/oder der anderen der oberen Fläche bzw. der unteren Fläche der zweiten Lage oder Schicht (2) mechanisch verbunden sind.
  9. Substrat mit hoher Impedanz nach einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, dass es außerdem eine Masseebene (4) umfasst, die sich unter der ersten Schicht oder Lage (1) gegenüber der unteren Fläche der ersten Schicht oder Lage (1) befindet.
  10. Substrat mit hoher Impedanz nach einem der Ansprüche 6 bis 8, dadurch gekennzeichnet, dass es außerdem eine Masseebene umfasst, die sich unter der zweiten Schicht oder Lage (2) gegenüber der unteren Fläche der zweiten Schicht oder Lage (2) beendet.
  11. Substrat mit hoher Impedanz nach einem der Ansprüche 6 bis 8, dadurch gekennzeichnet, dass es außerdem eine Masseebene umfasst, die sich zwischen der ersten (1) und der zweiten (2) Schicht oder Lage (1, 2) gegenüber der unteren Fläche der ersten Schicht oder Lage (1) befindet.
  12. Substrat mit hoher Impedanz nach Anspruch 9, dadurch gekennzeichnet, dass die Masseebene durch eine Metallisierung der unteren Fläche der ersten Schicht oder Lage (1) gebildet ist.
  13. Substrat mit hoher Impedanz nach Anspruch 10, dadurch gekennzeichnet, dass die Masseebene durch eine Metallisierung der unteren Fläche der zweiten Schicht oder Lage (2) gebildet ist.
  14. Substrat mit hoher Impedanz nach einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, dass es außerdem eine Masseebene (4) umfasst, die sich über der ersten Schicht oder Lage (1) gegenüber der oberen Fläche der ersten Schicht oder Lage (1) befindet
  15. Substrat mit hoher Impedanz nach Anspruch 14, dadurch gekennzeichnet, dass die Masseebene durch eine Metallisierung der oberen Fläche der ersten Schicht oder Lage (1) gebildet ist.
  16. Substrat mit hoher Impedanz nach einem der Ansprüche 1 bis 15, dadurch gekennzeichnet, dass die magnetischen Beläge (5) mit der oberen Oberfläche der ersten Schicht oder Lage (1) mechanisch verbunden sind.
  17. Substrat mit hoher Impedanz nach einem der Ansprüche 1 bis 16. dadurch gekennzeichnet, dass es mehrere elektrische Zwischenverbindungen (13) umfasst, wovon jede zwei voneinander verschiedene Punkte (90, 9n-1, 111, 11n) des Leitermusters (3), die mit dem Substrat mechanisch verbunden sind, über den dem Muster zugeordneten magnetischen Belag (5) hinweg elektrisch kontaktiert, wobei das Leitermuster (3) und die Zwischenverbindungen (13) gemeinsam einen Elektromagneten um den magnetischen Belag (5) bilden.
  18. Substrat mit hoher Impedanz nach einem der Ansprüche 1 bis 16, dadurch gekennzeichnet, dass die Muster (3), denen ein magnetischer Belag (5) zugeordnet ist, jeweils mehrere Zwischenverbindungen (13) umfassen, wovon jede zwei voneinander verschiedene Punkte (90, 9n-1, 111, 11n) des Leitermusters (3), die mit dem Substrat mechanisch verbunden sind, über den dem Muster (3) zugeordneten magnetischen Belag (5) hinweg elektrisch kontaktiert, wobei ein erster Teil des Leitermusters und die Zwischenverbindungen (13) gemeinsam einen Elektromagneten um den magnetischen Belag (5) bilden und wobei ein zweiter Teil des Musters mit kapazitiven und/oder resistiven Elementen eine Schaltung bildet, die die kapazitiven und/oder resistiven Elemente mit dem Elektromagneten parallel oder in Reihe schaltet.
  19. Substrat mit hoher Impedanz nach einem der Ansprüche 1 bis 18, dadurch gekennzeichnet dass die magnetischen Beläge aus Kautschuk oder aus einem Kunststoff bestehen, der mit einem Pulver aus einem leitenden Material beladen ist.
  20. Substrat mit hoher Impedanz nach Anspruch 19, dadurch gekennzeichnet. dass der Volumenanteil des Pulvers aus magnetischem Material des Kautschuks oder des Kunststoff, der die magnetischen Beläge bildet, größer als 30 % ist.
  21. Substrat mit hoher Impedanz nach einem der Ansprüche 1 bis 18, dadurch gekennzeichnet, dass die magnetischen Beläge aus einem Material bestehen, das durch einen Stapel aus magnetischen und Isolierenden Schichten gebildet ist.
  22. Substrat mit hoher Impedanz nach einem der Ansprüche 1 bis 19, dadurch gekennzeichnet, dass der Anteil der Abdeckung der die magnetischen Beläge tragenden Fläche durch die magnetischen Beläge größer als 10 % ist.
  23. Substrat mit hoher Impedanz nach einem der Ansprüche 1 bis 19, dadurch gekennzeichnet, dass der Anteil der Abdeckung der die magnetischen Beläge tragenden Fläche durch die magnetischen Beläge größer als 50 % ist.
EP04786396A 2003-09-02 2004-08-30 Substrat mit hoher impedanz Expired - Lifetime EP1661206B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0350492A FR2859309B1 (fr) 2003-09-02 2003-09-02 Substrat haute impedance
PCT/FR2004/050398 WO2005024999A1 (fr) 2003-09-02 2004-08-30 Substrat haute impedance

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Publication Number Publication Date
EP1661206A1 EP1661206A1 (de) 2006-05-31
EP1661206B1 true EP1661206B1 (de) 2006-12-13

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US (1) US7071876B2 (de)
EP (1) EP1661206B1 (de)
JP (1) JP4901473B2 (de)
AT (1) ATE348419T1 (de)
CA (1) CA2508073A1 (de)
DE (1) DE602004003717T2 (de)
FR (1) FR2859309B1 (de)
NO (1) NO20053835D0 (de)
WO (1) WO2005024999A1 (de)

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DE602004003717T2 (de) 2007-10-18
JP2007504643A (ja) 2007-03-01
FR2859309A1 (fr) 2005-03-04
FR2859309B1 (fr) 2005-12-16
NO20053835D0 (no) 2005-08-15
DE602004003717D1 (de) 2007-01-25
US20060044209A1 (en) 2006-03-02
CA2508073A1 (fr) 2005-03-17
JP4901473B2 (ja) 2012-03-21
EP1661206A1 (de) 2006-05-31
US7071876B2 (en) 2006-07-04
WO2005024999A1 (fr) 2005-03-17
ATE348419T1 (de) 2007-01-15

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