NO20053835D0 - Hoyimpedanssubstrat. - Google Patents

Hoyimpedanssubstrat.

Info

Publication number
NO20053835D0
NO20053835D0 NO20053835A NO20053835A NO20053835D0 NO 20053835 D0 NO20053835 D0 NO 20053835D0 NO 20053835 A NO20053835 A NO 20053835A NO 20053835 A NO20053835 A NO 20053835A NO 20053835 D0 NO20053835 D0 NO 20053835D0
Authority
NO
Norway
Prior art keywords
substrate
mechanically linked
conductor pattern
magnetic tile
conductor
Prior art date
Application number
NO20053835A
Other languages
English (en)
Inventor
Olivier Acher
Olivier Reynet
Marc Ledieu
Original Assignee
Commissariat Energie Atomique
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat Energie Atomique filed Critical Commissariat Energie Atomique
Publication of NO20053835D0 publication Critical patent/NO20053835D0/no

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H01Q7/06Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/0006Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
    • H01Q15/006Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
    • H01Q15/0066Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces said selective devices being reconfigurable, tunable or controllable, e.g. using switches

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Combinations Of Printed Boards (AREA)
  • Aerials With Secondary Devices (AREA)
  • Finishing Walls (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
NO20053835A 2003-09-02 2005-08-15 Hoyimpedanssubstrat. NO20053835D0 (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0350492A FR2859309B1 (fr) 2003-09-02 2003-09-02 Substrat haute impedance
PCT/FR2004/050398 WO2005024999A1 (fr) 2003-09-02 2004-08-30 Substrat haute impedance

Publications (1)

Publication Number Publication Date
NO20053835D0 true NO20053835D0 (no) 2005-08-15

Family

ID=34130848

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20053835A NO20053835D0 (no) 2003-09-02 2005-08-15 Hoyimpedanssubstrat.

Country Status (9)

Country Link
US (1) US7071876B2 (no)
EP (1) EP1661206B1 (no)
JP (1) JP4901473B2 (no)
AT (1) ATE348419T1 (no)
CA (1) CA2508073A1 (no)
DE (1) DE602004003717T2 (no)
FR (1) FR2859309B1 (no)
NO (1) NO20053835D0 (no)
WO (1) WO2005024999A1 (no)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8840918B2 (en) 2001-05-01 2014-09-23 A. V. Topchiev Institute of Petrochemical Synthesis, Russian Academy of Sciences Hydrogel compositions for tooth whitening
JP2005039608A (ja) * 2003-07-16 2005-02-10 Citizen Watch Co Ltd アンテナおよび受信装置
JP4372118B2 (ja) * 2006-05-18 2009-11-25 株式会社東芝 高周波磁性材料
US8514147B2 (en) * 2006-11-22 2013-08-20 Nec Tokin Corporation EBG structure, antenna device, RFID tag, noise filter, noise absorptive sheet and wiring board with noise absorption function
US8884834B1 (en) 2012-09-21 2014-11-11 First Rf Corporation Antenna system with an antenna and a high-impedance backing

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58137206A (ja) * 1982-02-09 1983-08-15 Sony Corp インダクタンス素子
JPH062904B2 (ja) * 1984-12-04 1994-01-12 新日本製鐵株式会社 高強度低合金鋼極厚鋼材の製造方法
JPH02296306A (ja) * 1989-05-10 1990-12-06 Mitsubishi Electric Corp インダクタ
KR910004079A (ko) * 1989-07-21 1991-02-28 빈센트 조렙 로너 개선된 하이브리드 마이크로 전자 회로 및 그 제조방법
JP2980629B2 (ja) * 1990-01-10 1999-11-22 ティーディーケイ株式会社 混成集積回路部品の構造
JPH05218726A (ja) * 1991-11-13 1993-08-27 Seiko Epson Corp フェライトアンテナ
JPH06224618A (ja) * 1993-01-28 1994-08-12 Hitachi Ltd 自己インピーダンス可変アクティブアンテナ
JPH07326516A (ja) * 1994-05-31 1995-12-12 Kyocera Corp 積層コイル基板
JPH08273936A (ja) * 1995-04-03 1996-10-18 Murata Mfg Co Ltd コイル部品及びコイル内蔵基板
JP3472430B2 (ja) * 1997-03-21 2003-12-02 シャープ株式会社 アンテナ一体化高周波回路
JP3491670B2 (ja) * 1998-04-08 2004-01-26 三菱マテリアル株式会社 盗難防止用タグ及びその製造方法
JP3527105B2 (ja) * 1998-09-28 2004-05-17 富士通アクセス株式会社 プリント基板
JP2000183634A (ja) * 1998-12-15 2000-06-30 Murata Mfg Co Ltd アンテナ装置及びそれを搭載した無線機器
JP2000196282A (ja) * 1998-12-24 2000-07-14 Tokin Corp 電子回路装置、およびこれを搭載した携帯電話機、簡易携帯電話機
JP2001274020A (ja) * 2000-03-23 2001-10-05 Sanyo Electric Co Ltd コイルユニット、コイル、変圧器および昇圧回路
US6384797B1 (en) * 2000-08-01 2002-05-07 Hrl Laboratories, Llc Reconfigurable antenna for multiple band, beam-switching operation
AU762267B2 (en) * 2000-10-04 2003-06-19 E-Tenna Corporation Multi-resonant, high-impedance surfaces containing loaded-loop frequency selective surfaces
GB2373102A (en) * 2001-03-06 2002-09-11 Marconi Caswell Ltd Structures with magnetic properties
JP2002290186A (ja) * 2001-03-26 2002-10-04 Tama Electric Co Ltd 低域通過フィルタ
US6853350B2 (en) * 2001-08-23 2005-02-08 Broadcom Corporation Antenna with a magnetic interface
JP2003078197A (ja) * 2001-08-30 2003-03-14 Kyocera Corp 配線基板
US7420524B2 (en) * 2003-04-11 2008-09-02 The Penn State Research Foundation Pixelized frequency selective surfaces for reconfigurable artificial magnetically conducting ground planes
US7411565B2 (en) * 2003-06-20 2008-08-12 Titan Systems Corporation/Aerospace Electronic Division Artificial magnetic conductor surfaces loaded with ferrite-based artificial magnetic materials

Also Published As

Publication number Publication date
DE602004003717D1 (de) 2007-01-25
EP1661206A1 (fr) 2006-05-31
JP2007504643A (ja) 2007-03-01
FR2859309B1 (fr) 2005-12-16
DE602004003717T2 (de) 2007-10-18
EP1661206B1 (fr) 2006-12-13
FR2859309A1 (fr) 2005-03-04
JP4901473B2 (ja) 2012-03-21
ATE348419T1 (de) 2007-01-15
CA2508073A1 (fr) 2005-03-17
US20060044209A1 (en) 2006-03-02
WO2005024999A1 (fr) 2005-03-17
US7071876B2 (en) 2006-07-04

Similar Documents

Publication Publication Date Title
ATE490555T1 (de) Elektrisch programmierbare schmelzverbindung
TW200731512A (en) Phase changeable memory cell array region and method of forming the same
ATE532209T1 (de) Halbleiterverarbeitungsverfahren zur bildung elektrischer kontakte und halbleiterstruktur
MX2010004059A (es) Patrones electricos para biosensor y metodo para producirlos.
EP1737039A3 (en) Semiconductor Package
WO2009051411A3 (en) Electronic fabric and preparing thereof
GB2441921A (en) Building structures having electrically functional architectural surfaces
FI20020190A (fi) Menetelmä komponentin upottamiseksi alustaan ja kontaktin muodostamiseksi
ATE443861T1 (de) Diamant-mikroelektroden
TW200717772A (en) Semiconductor device
TW200519979A (en) Inductive and capacitive elements for semiconductor technologies with minimum pattern density requirements
NO20053835D0 (no) Hoyimpedanssubstrat.
SG136020A1 (en) Organic electroluminescence device and method for manufacturing same
DE502004004748D1 (de) Sicherheitselement zur rf-identifikation
TW200718299A (en) Wiring board, wiring material, copper-clad laminate, and wiring board fabrication method
TW200723422A (en) Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor device
EP1784065A4 (en) ELECTRODE SUBSTRATE
ATE541312T1 (de) Chip mit zwei gruppen von chipkontakten
GB2432409B (en) Radar altering structure using specular patterns of conductive material
SG130983A1 (en) Bond pad structure
GB2466163A (en) Semiconductor structure comprising an electrically conductive feature and method of forming a semiconductor structure
ATE341799T1 (de) Datenträger mit transponderspule
TW200739769A (en) Method of manufacturing wiring board
TW200729320A (en) Method for manufacturing a semiconductor component
DE50213452D1 (de) Sicherheitskontaktmatte

Legal Events

Date Code Title Description
FC2A Withdrawal, rejection or dismissal of laid open patent application