EP1661206B1 - High impedance substrate - Google Patents

High impedance substrate Download PDF

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Publication number
EP1661206B1
EP1661206B1 EP04786396A EP04786396A EP1661206B1 EP 1661206 B1 EP1661206 B1 EP 1661206B1 EP 04786396 A EP04786396 A EP 04786396A EP 04786396 A EP04786396 A EP 04786396A EP 1661206 B1 EP1661206 B1 EP 1661206B1
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EP
European Patent Office
Prior art keywords
sheet
layer
substrate
magnetic
impedance
Prior art date
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EP04786396A
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German (de)
French (fr)
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EP1661206A1 (en
Inventor
Olivier Reynet
Olivier Acher
Marc Ledieu
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Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
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Commissariat a lEnergie Atomique CEA
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
    • H01Q15/006—Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
    • H01Q15/0066—Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces said selective devices being reconfigurable, tunable or controllable, e.g. using switches

Definitions

  • the invention is in the field of high impedance substrates. Such substrates are particularly applicable in microwave devices.
  • the invention finds application particularly but not only in telecommunications, for example in the frequency band from about 50 MHz to about 4 GHz for the realization of antennas.
  • the surface is frequency selective because it comprises a network 102 of resonant loops also called artificial magnetic molecules 804. These resonant loops or artificial magnetic molecules 804 are strongly capacitively coupled to each other, thus forming a frequency-selective capacitive surface.
  • Such high impedance substrates are very useful in the field of antennas.
  • Such surfaces are intended to interact with an incident electromagnetic wave arriving on this high impedance surface. They make it possible to reduce the size of the devices used while improving the selectivity and directivity characteristics of the antennas produced.
  • the invention is directed to a high impedance surface having a small thickness in front of the wavelength in the vacuum of a wave at a center frequency of a frequency band for which the surface has a high impedance. It also targets a high impedance surface having a high bandwidth. It targets a high impedance surface using materials which is not limited by the properties of the material at the working frequencies of the surface. It aims a high impedance surface tunable, ie which can be varied on command the center frequency and bandwidth.
  • the invention relates to a high-impedance substrate comprising a first layer or sheet of insulating material, having a lower face and an upper face, the substrate comprising conductive patterns mechanically bonded to the substrate, characterized in that some of the conductive patterns mechanically bonded to the substrate are associated with a magnetic pad, and in that at least one electrical interconnection makes two points distinct from each other of a conductive pattern mechanically bonded to the substrate, this pattern conductor having an associated magnetic pad, passing above the magnetic pad associated with said conductive pattern mechanically bonded to the substrate.
  • block indicates the set of points of a metric space whose coordinates are taken in a bounded interval and whose rectangular parallelepiped is the simplest image. It is therefore a piece of matter.
  • conductive patterns consist of conductive tracks deposited on one and / or the other of the upper or lower faces of the first layer or sheet of insulating material.
  • the high impedance substrate comprises, in addition to a first layer or sheet of insulating material, a second layer or sheet having an upper face opposite the lower face of the first sheet or layer and a lower face, the conductive patterns being deposited at least partly of them, on one and / or the other of the upper or lower faces of this second layer or sheet.
  • the conductive patterns form electrical circuits possibly together with active or passive components.
  • these active or passive components are surface-mounted on one and / or the other of the upper or lower faces of said second layer or sheet.
  • the electronic components are elements having a resistance value and a capacitance value.
  • the high impedance substrate further comprises a ground plane constituted by a third layer or sheet having an upper face and a lower face, at least one of these faces being constituted by a conductive material.
  • This ground plane may be located above the upper face of the first layer or sheet and in this case the magnetic blocks will be mechanically linked to the upper face of this ground plane.
  • the ground plane may also be under the first sheet or layer, or if the embodiment has a second sheet or layer between the first sheet or layer and the second sheet or layer, or under the second sheet or layer. In these latter cases the magnetic blocks will be mechanically connected to the upper face of the first sheet or layer.
  • Figure 1 shows a perspective view of a first embodiment of the invention.
  • each block 5 has the shape of a parallelepiped for example rectangle.
  • Each electrically conductive pattern 3 forms together with active and / or passive components globally represented by a rectangle 7 in FIG. 1 an electrical circuit.
  • this circuit is completed by an electrical interconnection, for example in the form of a wire or a ribbon 13, connecting a first 9 and a second 11 distinct point of the first, the pattern 3.
  • the pattern 5 comprises several conductive tracks 10, parallel to one another, and for example perpendicular to the direction of rotation.
  • the lanes 10 each have two ends 9 and 11.
  • n and p are integers, and p is less than or equal to n.
  • references 9 0 , 9 n-1 do not appear.
  • the coil or turns formed by a portion of the conductive pattern 3 and the connections 13 are inserted in series or in parallel with other parts of the conductive pattern 3.
  • a high impedance substrate incorporating the invention has been produced according to the embodiment described with reference to FIGS. 1 and 2.
  • a Kapton (registered trademark) plate 1 having a surface of 500 ⁇ 500 mm 2 , initially coppered on its upper face 6 was used.
  • the conductive patterns 3 were made by etching techniques of the conductive copper layer, themselves known in the field of printed circuits. These patterns in the form of tracks have a width of about 1 mm.
  • a capacitance and resistance were reported at the locations marked 7 in FIG. 1. In one embodiment the capacitance was 21 picofarads and the resistance was 0.1 ohms.
  • the capacitance value of the component is a function of an electrical quantity, a voltage or a current, applied to said active component. It is possible, for example, to use the varactor ZC830B from the manufacturer Zeitel, which makes it possible to vary in a simple manner the capacitance of the RC circuit 7. In this case, it is preferable to interpose, as will be explained later in connection with FIG. 5, a ground plane between the blocks 5 and the conductive patterns 3, these being in this case partially or totally reported on a second sheet or layer 2 placed under the layer 1.
  • a magnetic layer consisting for example of an elastomer loaded with 50% iron powder is placed above the conductive patterns 5, for example glued by means of an insulating adhesive.
  • This material has a magnetic permeability ⁇ 'of 11 and magnetic losses ⁇ "weak, less than unity It is noted that the magnetic losses correspond to the imaginary value of the magnetic permeability.
  • a rubber or a plastic material loaded with a magnetic powder Preferably, the volume fraction of magnetic powder exceeds 30%. It is also possible to use stacks of magnetic and insulating layers, comprising at least 5% by volume of magnetic material.
  • the conductive direction of the stacks will preferably be parallel to the axis of the solenoid formed by the connections 13 and their complement of the pattern 3.
  • the layer of magnetic material is etched in two directions of the plane of the layer, for example, perpendicular to each other, to a depth of eg 5 mm, so as to obtain the magnetic blocks 5.
  • pavers 5 had dimensions of 5 ⁇ 3 ⁇ 30 mm.
  • the surface fraction occupied by the pavers is about 10%.
  • the solenoid will have between one and 50 turns.
  • the solenoid is in this example in series with the circuit RC, formed by resistance and capacitance symbolically represented by the square 7 in FIG.
  • the advantage of introducing a core-forming magnetic material into the solenoid thus formed is to significantly increase magnetic permeability levels compared to the "coreless" case.
  • the Applicant has carried out measurements of magnetic permeability and magnetic losses obtained with magnetic blocks 5 made of elastomer material loaded with 50% iron powder made as indicated above for three values 0.1, 2, and 10 ohms of the resistance. R of the RC circuit. The capacity C is during these measurements remained at a value of 50 picofarads.
  • the solenoid surrounding each pad 5 comprised 5 turns.
  • the magnetic permeability characteristics obtained as a function of the working frequency are represented by curves represented in FIG. 3 part A and B.
  • the magnetic permeability values ⁇ ' are represented in part A of FIG. 3.
  • Part B represents the values of the magnetic losses ⁇ "as a function of the frequency expressed in gigahertz, the peak values of ⁇ " decreasing when the value of the resistance believes.
  • the highest peak has a level of 5 and the narrowest is obtained for the 0.1 resistance value.
  • the curve corresponding to this resistance value is referenced a.
  • the other two curves, referenced c and b respectively have peaks whose height is decreasing and the Width increasing with increasing resistance value respectively for resistance values from 2 to 10 ohms.
  • the width of the peak of magnetic losses goes from 10 MHz for the resistance value 0.1 ohms to 35 MHz for the resistance value 10 ohms.
  • the levels of ⁇ 'and ⁇ are the essential values which condition the impedance seen by an electromagnetic wave arriving on the high impedance substrate thus obtained.
  • the source of said wave is located on the side of the face 6 of the plate 1 on which magnetic pavers 5.
  • High levels of magnetic permeability help to obtain high impedances over a wide frequency range, while the respective values of ⁇ 'and ⁇ "determine the level of loss associated with the frequency. being desired or not depending on the applications that are given to the high impedance substrate.
  • the height of the peak of magnetic losses can be adjusted or modified very easily by a simple variation of a resistance value.
  • the levels of permeability and magnetic losses by increasing the coverage density of the face 6, by the magnetic blocks 5.
  • the levels shown in FIG. 10% coverage as explained above. Switching to a coverage rate of 50% would increase the value of ⁇ "by a factor of 5.
  • the coverage rates of the face 6, by the magnetic blocks 5 will be greater than 10%, for example 50% or preferably greater than 50%.
  • the Applicant has also carried out measurements of magnetic permeability and magnetic losses obtained with the magnetic blocks of elastomer material loaded with 50% iron powder made as indicated above for seven values, 38, 32, 21, 9, 5, 2 , and 1 picofarad of the capacity of the RC circuit.
  • the resistance R is during these measurements remained at a value of 0.1 ohms.
  • the seven curves shown in part A of FIG. 4 each represent the value of the magnetic permeability ⁇ 'for the different values of the capacitance C.
  • the value of the losses ⁇ "as a function of the frequency in gigahertz carried on the abscissa is represented in part B of figure 4.
  • the frequency corresponding to the peak of loss decreases as the value of the capacitance C increases. is present for a value of about 0.13 gigahertz on the curve corresponding to a capacitance value of 38 picofarads.For the value of capacity 1 picofarad, the peak of loss is present for a value corresponding to about 0.37 gigahertz.
  • the loss peaks of the other 5 curves are at intermediate values between these two frequency values These peaks are at frequency values which increase when the value of the capacitance C decreases by the value 32 pF at the value 2 pF.
  • the conductive pattern 3 is disposed on a second sheet or layer 2.
  • This second sheet or layer 2 has two faces, a top face 12 facing the lower face 8 of the first sheet or layer 1 and a bottom face 14.
  • the upper face 12 of the sheet or layer 2 hosts 2 part 3 of the conductor pattern 3.
  • the part 3 2 of the conductive pattern 3 comprises all the active or passive components 7 forming a circuit with the conductive pattern 3.
  • a part 3 1 of the conductive pattern 3 remains present on the upper face 6 of the first sheet or layer 1, as shown Figure 5.
  • electrical connections between the conductive pattern portion 3 1 and the conductive pattern portion 3 2 are provided by plated through holes 18 joining the upper and lower faces of the layer or sheet 1.
  • the connections between the connections 13 passing above a magnetic tile 5 and the conductive pattern part 3 2 lying on the sheet or layer 2 are provided by such plated-through holes 18, when the conductive pattern part 3 2 comprises additional to said connections 13 to form a solenoid.
  • the underside of the sheet or layer 2 is metallized so that the sheet or layer 2 forms a ground plane.
  • the substrate according to the invention comprises a ground plane lying under the first layer or sheet 1 opposite the lower face of said first layer or sheet.
  • a conductive plane 4 forming ground plane is interposed between the sheets or layers 1 and 2.
  • the conductive plane may be in the form of for example a third layer or sheet 4. In FIG. 5, in order not to hinder the view of the layer 2, this plane has only been shown partially.
  • This third sheet or layer 4 then comprises metallized holes 18 each forming a connection passage. The outlet of these holes is so in itself known, electrically isolated to prevent grounding connections.
  • FIG. 6 A variant of the embodiment shown in FIG. 5, which also makes it possible to reduce the electromagnetic leakage upwards, is represented in FIG. 6.
  • the upper face of the sheet or layer 1 is entirely metallized, with the exception of locations surrounding metallized holes 18 electrically joining points of the sheet or layer 1 and points of the sheet or layer 2.
  • the metal blocks 5 are then glued to the top of the metal deposit by means of an electrically insulating glue. With the exception of the metallized holes 18 and their outlets, the entire conductive pattern 3 is transferred to the second sheet or layer 2.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Combinations Of Printed Boards (AREA)
  • Aerials With Secondary Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Finishing Walls (AREA)

Abstract

A high-impedance substrate including a first layer made of insulating material, having a lower face and an upper face, the substrate including conductor patterns mechanically linked to the substrate. Some of the conductor patterns mechanically linked to the substrate are associated with a magnetic tile. At least one electrical interconnection puts two points distinct from one another of a conductor pattern mechanically linked to the substrate in electrical contact, this conductor pattern having an assigned magnetic tile, passing above the magnetic tile associated with the conductor pattern mechanically linked to the substrate.

Description

DOMAINE TECHNIQUETECHNICAL AREA

L'invention se situe dans le domaine des substrats haute impédance. De tels substrats trouvent en particulier à s'appliquer dans les dispositifs hyperfréquences. L'invention trouve une application notamment mais pas uniquement en télécommunications, par exemple dans la bande de fréquence allant d'environ 50 MHz à environ 4 GHz pour la réalisation d'antennes.The invention is in the field of high impedance substrates. Such substrates are particularly applicable in microwave devices. The invention finds application particularly but not only in telecommunications, for example in the frequency band from about 50 MHz to about 4 GHz for the realization of antennas.

ETAT DE LA TECHNIQUE ANTERIEURESTATE OF THE PRIOR ART

La demande de brevet US 2003/0048234 A1 publiée en mars 2003 décrit un substrat haute impédance selon le préambule de la revendication 1.US patent application 2003/0048234 A1 published in March 2003 describes a high impedance substrate according to the preamble of claim 1.

La demande de brevet EP 1 195 847 A2 publiée en avril 2002 rappelle en relation avec l'art antérieur cité dans cette demande différents mode connus de réalisation de substrats haute impédance. Cette demande décrit par exemple en relation avec les figures 9 et 10 de cette demande un conducteur 900 magnétique artificiel constituant une surface haute impédance incluant :

  • Une surface sélective en fréquence ayant une perméabilité dépendant de la fréquence dans une direction normale à la surface sélective en fréquence
  • Un plan de masse conducteur 806 parallèle à la surface sélective en fréquence et
  • Un milieu diélectrique entre le plan de masse et la surface sélective en fréquence dans lequel des parties métalliques conductrices sous forme de cloisons perpendiculaires au plan de masse relient la surface sélective en fréquence au plan de masse.
The patent application EP 1 195 847 A2 published in April 2002 recalls in connection with the prior art cited in this application different known embodiments of high impedance substrates. This application describes for example in connection with FIGS. 9 and 10 of this application an artificial magnetic conductor 900 constituting a high impedance surface including:
  • A frequency-selective surface having frequency-dependent permeability in a direction normal to the frequency-selective surface
  • A conductive ground plane 806 parallel to the frequency-selective surface and
  • A dielectric medium between the ground plane and the frequency selective surface in which conductive metal parts in the form of Partitions perpendicular to the ground plane connect the frequency-selective surface to the ground plane.

La surface est sélective en fréquence car elle comporte un réseau 102 de boucles résonnantes appelées aussi molécules magnétiques artificielles 804. Ces boucles résonnantes ou molécules magnétiques artificielles 804 sont fortement couplées entre elles de façon capacitive, formant ainsi une surface capacitive sélective en fréquence.The surface is frequency selective because it comprises a network 102 of resonant loops also called artificial magnetic molecules 804. These resonant loops or artificial magnetic molecules 804 are strongly capacitively coupled to each other, thus forming a frequency-selective capacitive surface.

Différents modes de réalisation incluant notamment des surfaces multi bandes constituées par des couches comportant respectivement des boucles résonnantes à différentes fréquences, et des usages d'une telle surface sont décrits, en particulier pour la réalisation d'antennes.Various embodiments including in particular multi-band surfaces constituted by layers respectively comprising resonant loops at different frequencies, and uses of such a surface are described, in particular for producing antennas.

Il est connu que de tels substrats haute impédance sont très utiles dans le domaine des antennes. De telles surfaces sont prévues pour interagir avec une onde électromagnétique incidente arrivant sur cette surface haute impédance. Ils permettent de diminuer la taille des dispositifs utilisés tout en améliorant les caractéristiques de sélectivité et de directivité des antennes réalisées.It is known that such high impedance substrates are very useful in the field of antennas. Such surfaces are intended to interact with an incident electromagnetic wave arriving on this high impedance surface. They make it possible to reduce the size of the devices used while improving the selectivity and directivity characteristics of the antennas produced.

EXPOSÉ DE L'INVENTIONSTATEMENT OF THE INVENTION

L'invention vise une surface à haute impédance ayant une épaisseur faible devant la longueur d'onde dans le vide d'une onde à une fréquence centrale d'une bande de fréquence pour laquelle la surface a une haute impédance. Elle vise aussi une surface à haute impédance ayant une largeur de bande élevée. Elle vise une surface à haute impédance utilisant des matériaux magnétiques qui ne soit pas limitée par les propriétés du matériau aux fréquences de travail de la surface. Elle vise une surface à haute impédance accordable, c'est à dire dont on peut faire varier sur commande la fréquence centrale et la largeur de bande.The invention is directed to a high impedance surface having a small thickness in front of the wavelength in the vacuum of a wave at a center frequency of a frequency band for which the surface has a high impedance. It also targets a high impedance surface having a high bandwidth. It targets a high impedance surface using materials which is not limited by the properties of the material at the working frequencies of the surface. It aims a high impedance surface tunable, ie which can be varied on command the center frequency and bandwidth.

A toutes ces fins l'invention est relative à un substrat haute impédance comportant une première couche ou feuille en matériau isolant, ayant une face inférieure et une face supérieure, le substrat comportant des motifs conducteurs mécaniquement liés au substrat,
caractérisé en ce que,
certains des motifs conducteurs mécaniquement liés au substrat sont associés à un pavé magnétique, et en ce que au moins une interconnexion électrique met en contact électrique deux points distincts l'un de l'autre d'un motif conducteur mécaniquement lié au substrat, ce motif conducteur ayant un pavé magnétique associé, en passant au dessus du pavé magnétique associé audit motif conducteur mécaniquement liés au substrat.For all these purposes, the invention relates to a high-impedance substrate comprising a first layer or sheet of insulating material, having a lower face and an upper face, the substrate comprising conductive patterns mechanically bonded to the substrate,
characterized in that
some of the conductive patterns mechanically bonded to the substrate are associated with a magnetic pad, and in that at least one electrical interconnection makes two points distinct from each other of a conductive pattern mechanically bonded to the substrate, this pattern conductor having an associated magnetic pad, passing above the magnetic pad associated with said conductive pattern mechanically bonded to the substrate.

Le terme « pavé » indique l'ensemble des points d'un espace métrique dont chacune des coordonnées est prise dans un intervalle borné et dont le parallélépipède rectangle est l'image la plus simple. Il s'agit donc d'un morceau de matière.The term "block" indicates the set of points of a metric space whose coordinates are taken in a bounded interval and whose rectangular parallelepiped is the simplest image. It is therefore a piece of matter.

Dans un mode de réalisation, des motifs conducteurs sont constitués par des pistes conductrices déposées sur l'une et/ou l'autre des faces supérieure ou inférieure de la première couche ou feuille en matériau isolant.In one embodiment, conductive patterns consist of conductive tracks deposited on one and / or the other of the upper or lower faces of the first layer or sheet of insulating material.

Dans un autre mode de réalisation, le substrat haute impédance comporte outre une première couche ou feuille en matériau isolant une seconde couche ou feuille ayant une face supérieure en vis à vis de la face inférieure de la première feuille ou couche et une face inférieure, les motifs conducteurs étant déposés au moins pour partie d'entre eux, sur l'une et/ou l'autre des faces supérieure ou inférieure de cette seconde couche ou feuille.In another embodiment, the high impedance substrate comprises, in addition to a first layer or sheet of insulating material, a second layer or sheet having an upper face opposite the lower face of the first sheet or layer and a lower face, the conductive patterns being deposited at least partly of them, on one and / or the other of the upper or lower faces of this second layer or sheet.

Dans un mode de réalisation les motifs conducteurs forment des circuits électriques éventuellement ensemble avec des composants actifs ou passifs. De préférence lorsque le substrat haute impédance comporte une seconde couche ou feuille ces composants actifs ou passifs sont montés en surface sur l'une et/ou l'autre des faces supérieure ou inférieure de ladite seconde couche ou feuille.In one embodiment the conductive patterns form electrical circuits possibly together with active or passive components. Preferably, when the high impedance substrate comprises a second layer or sheet, these active or passive components are surface-mounted on one and / or the other of the upper or lower faces of said second layer or sheet.

Dans un mode de réalisation les composants électroniques sont des éléments ayant une valeur de résistance et une valeur de capacité.In one embodiment, the electronic components are elements having a resistance value and a capacitance value.

Dans un mode de réalisation le substrat haute impédance comporte en outre un plan de masse, constitué par une troisième couche ou feuille ayant une face supérieure et une face inférieure l'une au moins de ces faces étant constituée par une matière conductrice.In one embodiment, the high impedance substrate further comprises a ground plane constituted by a third layer or sheet having an upper face and a lower face, at least one of these faces being constituted by a conductive material.

Ce plan de masse peut être situé au dessus de la face supérieure de la première couche ou feuille et dans ce cas les pavés magnétiques seront mécaniquement liés à la face supérieure de ce plan de masse.This ground plane may be located above the upper face of the first layer or sheet and in this case the magnetic blocks will be mechanically linked to the upper face of this ground plane.

Le plan de masse peut aussi se trouver sous la première feuille ou couche, ou si le mode de réalisation comporte une seconde feuille ou couche entre la première feuille ou couche et la seconde feuille ou couche, ou encore sous la seconde feuille ou couche. Dans ces derniers cas les pavés magnétiques seront mécaniquement liés à la face supérieure de la première feuille ou couche.The ground plane may also be under the first sheet or layer, or if the embodiment has a second sheet or layer between the first sheet or layer and the second sheet or layer, or under the second sheet or layer. In these latter cases the magnetic blocks will be mechanically connected to the upper face of the first sheet or layer.

BRÈVE DESCRIPTION DES DESSINSBRIEF DESCRIPTION OF THE DRAWINGS

Des exemples de réalisation de l'invention et d'autres avantages de l'invention seront maintenant décrits en référence aux dessins annexés dans lesquels :

  • La figure 1 représente une vue en perspective d'un premier mode de réalisation de l'invention,
  • La figure 2 représente un exemple de réalisation d'un motif conducteur permettant de constituer ensemble avec les connexions passant au dessus du pavé magnétique, un solénoïde,
  • La figure 3 comporte des parties A et B. il s'agit de courbes représentant respectivement, en fonction de la fréquence de travail exprimée en gigahertz, pour un substrat haute impédance selon l'invention, les valeurs réelles de la perméabilité magnétiques µ', en partie A et les valeurs des pertes magnétiques µ" en partie B pour différentes valeurs de résistances.
  • La figure 4 comporte des parties A et B. il s'agit de courbes représentant respectivement, en fonction de la fréquence de travail exprimée en gigahertz, pour un substrat haute impédance selon l'invention, les valeurs de la perméabilité magnétiques µ', en partie A et les valeurs des pertes magnétiques µ" en partie B pour différentes valeurs de capacités,
  • La figure 5 représente une vue en perspective d'un second mode de réalisation de l'invention,
  • La figure 6 représente une vue en perspective d'un troisième mode de réalisation de l'invention.
Embodiments of the invention and other advantages of the invention will now be described with reference to the accompanying drawings in which:
  • FIG. 1 represents a perspective view of a first embodiment of the invention,
  • FIG. 2 represents an exemplary embodiment of a conductive pattern making it possible to constitute, together with the connections passing above the magnetic pad, a solenoid,
  • FIG. 3 comprises parts A and B. These are curves respectively representing, as a function of the working frequency expressed in gigahertz, for a high impedance substrate according to the invention, the real values of the magnetic permeability μ ', in part A and the values of the magnetic losses μ "in part B for different resistance values.
  • FIG. 4 comprises parts A and B. These are curves respectively representing, in according to the working frequency expressed in gigahertz, for a high-impedance substrate according to the invention, the magnetic permeability values μ ', in part A and the magnetic loss values μ "in part B for different capacitance values,
  • FIG. 5 represents a perspective view of a second embodiment of the invention,
  • Figure 6 shows a perspective view of a third embodiment of the invention.

Dans tous les dessins les mêmes numéros de référence désignent des éléments similaires ayant même fonction, en sorte que la description d'un élément déjà commenté dans une figure ne sera pas nécessairement reprise dans des figures décrites par la suite.In all the drawings, the same reference numbers designate similar elements having the same function, so that the description of an element already commented on in a figure will not necessarily be repeated in the figures described below.

EXPOSÉ DÉTAILLÉ DE MODES DE RÉALISATION PARTICULIERSDETAILED PRESENTATION OF PARTICULAR EMBODIMENTS

La figure 1 représente une vue en perspective d'un premier mode de réalisation de l'invention.Figure 1 shows a perspective view of a first embodiment of the invention.

Sur une face supérieure 6 d'une plaque en matériau isolant 1, par exemple en Kapton sont disposées une pluralité de motifs électriquement conducteurs 3. Un pavé 5 en matériau magnétique est associé à chacun des motifs conducteurs 3. Dans le mode de réalisation représenté sur les figures 1, 5 et 6, chaque pavé 5 a la forme d'un parallélépipède par exemple rectangle. Chaque motif électriquement conducteur 3 forme ensemble avec des composants actifs et/ou passifs représentés globalement par un rectangle 7 sur la figure 1 un circuit électrique. Conformément à l'invention, ce circuit est complété par une interconnexion électrique, par exemple sous forme d'un fil ou d'un ruban 13, reliant un premier 9 et un second 11 point distinct du premier, du motif 3. Une partie du motif 3, et le fil ou ruban de connexion 13, forment ainsi ensemble une spire entourant le pavé magnétique 5. Dans le cas général, il y aura plusieurs spires entourant le pavé magnétique 5.On an upper face 6 of a plate of insulating material 1, for example Kapton are disposed a plurality of electrically conductive patterns 3. A block 5 of magnetic material is associated with each of the conductive patterns 3. In the embodiment shown on Figures 1, 5 and 6, each block 5 has the shape of a parallelepiped for example rectangle. Each electrically conductive pattern 3 forms together with active and / or passive components globally represented by a rectangle 7 in FIG. 1 an electrical circuit. In accordance with the invention, this circuit is completed by an electrical interconnection, for example in the form of a wire or a ribbon 13, connecting a first 9 and a second 11 distinct point of the first, the pattern 3. Part of the pattern 3 , and the connecting wire or ribbon 13, together form a turn surrounding the magnetic pad 5. In the general case, there will be several turns surrounding the magnetic pad 5.

Un exemple de motif 3, permettant une configuration à plusieurs spires formant ensemble un solénoïde entourant le pavé magnétique 5 a été représenté en perspective figure 2. Le motif 5 comprend plusieurs pistes conductrices 10, parallèles entre elles, et par exemple perpendiculaires à la direction de plus grande longueur du pavé parallélépipèdique 5. Les pistes 10 ont chacune deux extrémités 9 et 11. Il y a n pistes ayant chacune une première extrémité 90 à 9n-1 et une seconde extrémité 111 à 11n. Il y a n fils ou ruban 131 à 13n chaque fil ou ruban de connexion de rang p liant une première extrémité 9p-1 à une seconde extrémité 11p. n et p sont des nombres entiers, et p est inférieur ou égal à n. Afin de simplifier la figure 2, les références 90, 9n-1 n'apparaissent pas.An example of a pattern 3, allowing a configuration with several turns forming together a solenoid surrounding the magnetic pad 5 has been shown in perspective FIG. 2. The pattern 5 comprises several conductive tracks 10, parallel to one another, and for example perpendicular to the direction of rotation. The lanes 10 each have two ends 9 and 11. There are lanes each having a first end 9 0 to 9 n-1 and a second end 11 1 to 11 n . There are n son or ribbon 13 1 to 13 n each wire row or connection p ribbon bonding a first end 9 p-1 to a second end 11 p. n and p are integers, and p is less than or equal to n. In order to simplify FIG. 2, references 9 0 , 9 n-1 do not appear.

La ou les spires formées par une partie du motif conducteur 3 et les connexions 13 s'insèrent en série ou en parallèle avec d'autres parties du motif conducteur 3.The coil or turns formed by a portion of the conductive pattern 3 and the connections 13 are inserted in series or in parallel with other parts of the conductive pattern 3.

Un substrat haute impédance incorporant l'invention a été réalisé selon le mode de réalisation décrit en relation avec les figures 1 et 2. Une plaque de Kapton (marque déposée) 1 ayant une surface de 500 x 500 mm2, initialement cuivré sur sa face supérieure 6 a été utilisée. Les motifs conducteurs 3 ont été réalisés par des techniques de gravures de la couche conductrice en cuivre, en elles mêmes connues dans le domaine des circuits imprimés. Ces motifs sous forme de pistes ont une largeur d'environ 1 mm. Une capacité et une résistance ont été reportées aux emplacements marqués 7 sur la figure 1. Dans un exemple de réalisation la capacité était de 21 picofarads et la résistance de 0,1 ohms. Il est également possible d'adjoindre à une capacité ou une résistance de valeur fixe, ou de remplacer une telle capacité ou une telle résistance par un ou plusieurs composants actifs ayant une valeur de capacité et/ou de résistance variable, par exemple commandée de façon électronique. En règle générale la valeur de capacité du composant est une fonction d'une grandeur électrique, une tension ou un courant, appliquée audit composant actif. On pourra utiliser par exemple le varactor ZC830B du fabricant Zétex qui permet de faire varier de façon simple la capacité du circuit RC 7. Dans ce cas on interpose de préférence comme cela sera expliqué plus loin en liaison avec la figure 5 un plan de masse entre les pavés 5 et les motifs conducteurs 3, ceux-ci étant dans ce cas partiellement ou totalement reportés sur une seconde feuille ou couche 2 placée sous la couche 1.A high impedance substrate incorporating the invention has been produced according to the embodiment described with reference to FIGS. 1 and 2. A Kapton (registered trademark) plate 1 having a surface of 500 × 500 mm 2 , initially coppered on its upper face 6 was used. The conductive patterns 3 were made by etching techniques of the conductive copper layer, themselves known in the field of printed circuits. These patterns in the form of tracks have a width of about 1 mm. A capacitance and resistance were reported at the locations marked 7 in FIG. 1. In one embodiment the capacitance was 21 picofarads and the resistance was 0.1 ohms. It is also possible to add to a capacitance or a resistor of fixed value, or to replace such a capacitance or such resistance by one or more active components having a variable capacitance and / or resistance value, for example controlled in a controlled manner. electronic. In general, the capacitance value of the component is a function of an electrical quantity, a voltage or a current, applied to said active component. It is possible, for example, to use the varactor ZC830B from the manufacturer Zeitel, which makes it possible to vary in a simple manner the capacitance of the RC circuit 7. In this case, it is preferable to interpose, as will be explained later in connection with FIG. 5, a ground plane between the blocks 5 and the conductive patterns 3, these being in this case partially or totally reported on a second sheet or layer 2 placed under the layer 1.

Une couche magnétique constituée par exemple d'un élastomère chargé à 50% en poudre de fer est placée au dessus des motifs conducteurs 5, par exemple collée au moyen d'une colle isolante. Ce matériau présente une perméabilité magnétique µ' de 11 et des pertes magnétiques µ" faibles, inférieures à l'unité. On note que les pertes magnétiques correspondent à la valeur imaginaire de la perméabilité magnétique.A magnetic layer consisting for example of an elastomer loaded with 50% iron powder is placed above the conductive patterns 5, for example glued by means of an insulating adhesive. This material has a magnetic permeability μ 'of 11 and magnetic losses μ "weak, less than unity It is noted that the magnetic losses correspond to the imaginary value of the magnetic permeability.

Comme matériau il aurait été également possible de prendre, sans que les exemples cités ci-après constituent une liste exhaustive, un caoutchouc ou une matière plastique chargée par une poudre magnétique. De préférence, la fraction volumique de poudre magnétique excède 30%. Il est également possible d'utiliser des empilements de couches magnétiques et isolantes, comportant au moins 5% en volume de matière magnétique. La direction conductrice des empilements sera de préférence parallèle à l'axe du solénoïde formé par les connexions 13 et leur complément du motif 3.As a material it would also be possible to take, without the examples given below constitute an exhaustive list, a rubber or a plastic material loaded with a magnetic powder. Preferably, the volume fraction of magnetic powder exceeds 30%. It is also possible to use stacks of magnetic and insulating layers, comprising at least 5% by volume of magnetic material. The conductive direction of the stacks will preferably be parallel to the axis of the solenoid formed by the connections 13 and their complement of the pattern 3.

La couche en matériau magnétique est gravée dans deux directions du plan de la couche, par exemple, perpendiculaires entre elles, sur une profondeur par exemple de 5 mm, de façon à obtenir les pavés magnétiques 5. Dans les exemples ayant servi aux mesures dont il sera parlé plus loin les pavés 5 avaient des dimensions de 5×3×30 mm. Compte tenu de l'espacement entre les pavés, la fraction surfacique occupée par les pavés est de 10% environ. On reporte ensuite n fils conducteurs 13, par exemple n = 5 passant au dessus de chaque pavé 5, de façon à former avec chaque motif 3 un solénoïde à 5 spires entourant le pavé 5 associé à ce motif. En règle générale le solénoïde comportera entre une et 50 spires. Le solénoïde est dans cet exemple en série avec le circuit RC, formé par la résistance et la capacité représentés symboliquement par le carré 7 sur la figure 1.The layer of magnetic material is etched in two directions of the plane of the layer, for example, perpendicular to each other, to a depth of eg 5 mm, so as to obtain the magnetic blocks 5. In the examples used for measurements of which it will be discussed further pavers 5 had dimensions of 5 × 3 × 30 mm. Given the spacing between the pavers, the surface fraction occupied by the pavers is about 10%. N conductors son 13, for example n = 5 passing over each block 5, are then reported, so as to form with each pattern 3 a solenoid with 5 turns surrounding the block 5 associated with this pattern. As a rule the solenoid will have between one and 50 turns. The solenoid is in this example in series with the circuit RC, formed by resistance and capacitance symbolically represented by the square 7 in FIG.

L'avantage d'introduire un matériau magnétique formant un noyau dans le solénoïde ainsi formé est d'augmenter significativement les niveaux de perméabilité magnétique par rapport au cas "sans noyau".The advantage of introducing a core-forming magnetic material into the solenoid thus formed is to significantly increase magnetic permeability levels compared to the "coreless" case.

La demanderesse a effectué des mesures de perméabilité magnétique et de pertes magnétiques obtenues avec des pavés magnétiques 5 en matériau élastomère chargé à 50% en poudre de fer réalisés comme indiqué ci dessus pour trois valeurs 0,1, 2, et 10 ohms de la résistance R du circuit RC. La capacité C est pendant ces mesures restée à une valeur de 50 picofarads. Le solénoïde entourant chaque pavé 5 comportait 5 spires.The Applicant has carried out measurements of magnetic permeability and magnetic losses obtained with magnetic blocks 5 made of elastomer material loaded with 50% iron powder made as indicated above for three values 0.1, 2, and 10 ohms of the resistance. R of the RC circuit. The capacity C is during these measurements remained at a value of 50 picofarads. The solenoid surrounding each pad 5 comprised 5 turns.

Les caractéristiques de perméabilité magnétiques obtenues en fonction de la fréquence de travail sont représentées par des courbes représentées figure 3 partie A et B.The magnetic permeability characteristics obtained as a function of the working frequency are represented by curves represented in FIG. 3 part A and B.

Les valeurs de perméabilité magnétique µ' sont représentées en partie A de la figure 3. La partie B représente les valeurs des pertes magnétiques µ" en fonction de la fréquence exprimée en gigahertz. Les valeurs crête de µ" vont en décroissant lorsque la valeur de la résistance croit. Le pic le plus élevé a un niveau de 5 et le plus étroit est obtenu pour la valeur de résistance 0,1. La courbe correspondant à cette valeur de résistance est référencée a. Les deux autres courbes, référencées c et b ont respectivement des pics dont la hauteur va en décroissant et la largeur en augmentant avec l'accroissement de la valeur de la résistance respectivement pour des valeurs de résistance passant de 2 à 10 ohms. Ainsi dans l'exemple considéré, la largeur du pic de pertes magnétiques passe de 10 MHz pour la valeur de résistance 0,1 ohms à 35 MHz pour la valeur de résistance 10 ohms. Les niveaux de µ' et µ" sont les valeurs essentielles qui conditionnent l'impédance vue par une onde électromagnétique arrivant sur le substrat haute impédance ainsi obtenu. La source de ladite onde se trouve du côté de la face 6 de la plaque 1 sur laquelle se trouvent les pavés magnétiques 5. Des niveaux élevés de perméabilité magnétique favorisent l'obtention d'impédances élevées sur une large gamme de fréquence. Enfin les valeurs respectives de µ' et µ" conditionnent le niveau de perte associé à la fréquence, ces pertes étant désirées ou non selon les applications que l'on donne au substrat haute impédance. Avec le dispositif selon l'invention, la hauteur du pic de pertes magnétiques peut être réglé ou modifié très facilement par une simple variation d'une valeur de résistance. Selon l'invention il est également possible de régler les niveaux de perméabilité et de pertes magnétiques en augmentant la densité de couverture de la face 6, par les pavés magnétiques 5. Ainsi par exemple, les niveaux représentés sur la figure 3 correspondent à un taux de couverture de 10% comme expliqué plus haut. Le passage à un taux de couverture de 50% augmenterait la valeur de µ" d'un facteur 5. Ainsi pour obtenir des niveaux élevés de pertes magnétiques µ" les taux de couverture de la face 6, par les pavés magnétiques 5 seront supérieurs à 10%, par exemple 50% ou de préférence supérieurs à 50%. Par comparaison, la réalisation d'un substrat haute impédance présentant les mêmes impédances que celles résultant des valeurs de µ' et µ" représentées sur la figure 3, au moyen de matériaux nécessiterait la mise au point de trois matériaux présentant chacun des caractéristiques hyperfréquences, ce qui peut être un processus long coûteux au résultat incertain. Selon l'invention il suffit d'ajuster correctement la valeur de la résistance du circuit RC 7. On parvient ainsi à passer d'un état de forte perméabilité magnétique µ', à par exemple 200 MHz, favorable à une haute impédance, à un état à faible perméabilité, ce qui diminue l'impédance. Il est également possible de commander, à l'aide d'un circuit électronique présentant une résistance fonction d'une valeur de grandeur électrique de commande du circuit la hauteur du pic de pertes magnétique µ".The magnetic permeability values μ 'are represented in part A of FIG. 3. Part B represents the values of the magnetic losses μ "as a function of the frequency expressed in gigahertz, the peak values of μ" decreasing when the value of the resistance believes. The highest peak has a level of 5 and the narrowest is obtained for the 0.1 resistance value. The curve corresponding to this resistance value is referenced a. The other two curves, referenced c and b respectively have peaks whose height is decreasing and the Width increasing with increasing resistance value respectively for resistance values from 2 to 10 ohms. Thus, in the example under consideration, the width of the peak of magnetic losses goes from 10 MHz for the resistance value 0.1 ohms to 35 MHz for the resistance value 10 ohms. The levels of μ 'and μ "are the essential values which condition the impedance seen by an electromagnetic wave arriving on the high impedance substrate thus obtained.The source of said wave is located on the side of the face 6 of the plate 1 on which magnetic pavers 5. High levels of magnetic permeability help to obtain high impedances over a wide frequency range, while the respective values of μ 'and μ "determine the level of loss associated with the frequency. being desired or not depending on the applications that are given to the high impedance substrate. With the device according to the invention, the height of the peak of magnetic losses can be adjusted or modified very easily by a simple variation of a resistance value. According to the invention it is also possible to adjust the levels of permeability and magnetic losses by increasing the coverage density of the face 6, by the magnetic blocks 5. For example, the levels shown in FIG. 10% coverage as explained above. Switching to a coverage rate of 50% would increase the value of μ "by a factor of 5. Thus to obtain high levels of magnetic losses μ" the coverage rates of the face 6, by the magnetic blocks 5 will be greater than 10%, for example 50% or preferably greater than 50%. By comparison, the production of a high impedance substrate having the same impedances as those resulting from the values of μ 'and μ "represented in FIG. 3, by means of materials would require the development of three materials each having microwave characteristics, This can be a long costly process with an uncertain result According to the invention it is sufficient to correctly adjust the value of the resistance of the circuit RC 7. It is thus possible to go from a state of high magnetic permeability μ ', to example 200 MHz, favorable to a high impedance, a low permeability state, which reduces the impedance It is also possible to control, using an electronic circuit having a resistance depending on a magnitude value electrical circuit control the height of the peak of magnetic losses μ ".

La demanderesse a également effectué des mesures de perméabilité magnétique et de pertes magnétiques obtenues avec les pavés magnétiques en matériau élastomère chargé à 50% en poudre de fer réalisés comme indiqué ci dessus pour sept valeurs, 38, 32, 21, 9, 5, 2, et 1 picofarad de la capacité du circuit RC. La résistance R est pendant ces mesures restée à une valeur de 0,1 ohms.The Applicant has also carried out measurements of magnetic permeability and magnetic losses obtained with the magnetic blocks of elastomer material loaded with 50% iron powder made as indicated above for seven values, 38, 32, 21, 9, 5, 2 , and 1 picofarad of the capacity of the RC circuit. The resistance R is during these measurements remained at a value of 0.1 ohms.

Les sept courbes représentées en partie A de la figure 4, représentent chacune, la valeur de la perméabilité magnétique µ' pour les différentes valeurs de la capacité C.The seven curves shown in part A of FIG. 4 each represent the value of the magnetic permeability μ 'for the different values of the capacitance C.

La valeur des pertes µ" en fonction de la fréquence en gigahertz portée en abscisse est représentée en partie B de la figure 4. La fréquence correspondant au pic de perte va en décroissant lorsque la valeur de la capacité C croît. Ainsi un pic de perte est présent pour une valeur d'environ 0,13 gigahertz sur la courbe correspondant à une valeur de capacité de 38 picofarads. Pour la valeur de capacité 1 picofarad, le pic de perte est présent pour une valeur correspondant à environ 0,37 gigahertz. Les pics de perte des 5 autres courbes s'échelonnent à des valeurs intermédiaires entre ces deux valeurs de fréquence. Ces pics se situent à des valeurs de fréquence qui vont en croissant lorsque la valeur de la capacité C va en décroissant de la valeur 32 pF à la valeur 2 pF.The value of the losses μ "as a function of the frequency in gigahertz carried on the abscissa is represented in part B of figure 4. The frequency corresponding to the peak of loss decreases as the value of the capacitance C increases. is present for a value of about 0.13 gigahertz on the curve corresponding to a capacitance value of 38 picofarads.For the value of capacity 1 picofarad, the peak of loss is present for a value corresponding to about 0.37 gigahertz. The loss peaks of the other 5 curves are at intermediate values between these two frequency values These peaks are at frequency values which increase when the value of the capacitance C decreases by the value 32 pF at the value 2 pF.

Ces courbes illustrent que selon l'invention, par l'ajout ou le choix de quelques composants électroniques simples, on parvient à réaliser une surface haute impédance dont la réponse en fréquence présente un pic de pertes magnétiques qui atteint des valeurs de plusieurs unités, et ceci à partir d'une quantité très faible de pavés magnétiques munis chacun de leur solénoïde associé. La fréquence du pic de perte peut être ajustée de façon simple en réglant la valeur d'une capacité. Avec une capacité qui peut être commandée de façon électronique, par variation d'une grandeur électrique de commande, on peut obtenir une agilité en fréquence et faire varier de façon éventuellement rapide, la fréquence pour laquelle le pic de perte µ" est le plus élevé, et donc pour laquelle l'impédance vu par l'onde électromagnétique incidente est la plus élevée. De tels circuits sont connus dans l'art et ne seront pas plus avant commentés.These curves illustrate that according to the invention, by adding or choosing a few simple electronic components, it is possible to produce a high impedance surface whose frequency response exhibits a peak of magnetic losses which reaches values of several units, and this from a very small amount of magnetic blocks each provided with their associated solenoid. The frequency of the peak loss can be adjusted simply by adjusting the value of a capacitance. With a capacity that can be controlled electronically, by variation of an electrical control quantity, it is possible to obtain a frequency agility and to vary, possibly rapidly, the frequency for which the loss peak μ "is the highest , and therefore for which the impedance seen by the wave electromagnetic incident is the highest. Such circuits are known in the art and will not be further commented.

Un autre mode de réalisation sera maintenant commenté en liaison avec la figure 5. Dans ce mode de réalisation, une partie au moins ou la totalité du motif conducteur 3, est disposée sur une seconde feuille ou couche 2. Cette seconde feuille ou couche 2 a deux faces, une face supérieure 12 en regard de la face inférieure 8 de la première feuille ou couche 1 et une face inférieure 14. La face supérieure 12 de la feuille ou couche 2 accueille une partie 32 du motif conducteur 3. De préférence la partie 32 du motif conducteur 3 comporte tous les composants actifs ou passifs 7 formant un circuit avec le motif conducteur 3. Eventuellement une partie 31 du motif conducteur 3 reste présente sur la face supérieure 6 de la première feuille ou couche 1, comme représenté figure 5. Il en va de même pour les pavés magnétiques 5 qui sont liés mécaniquement, par exemple collés, sur la face supérieure 6 de la première couche ou feuille 1. De façon en elle-même connue les liaisons électriques entre la partie de motif conducteur 31 et la partie de motif conducteur 32 sont assurées par des trous métallisés 18 joignant les faces supérieure et inférieure de la couche ou feuille 1. En particulier les liaisons entre les connexions 13 passant au dessus d'un pavé magnétique 5 et la partie de motif conducteur 32 se trouvant sur la feuille ou couche 2 sont assurés par de tels trous métallisés 18, lorsque la partie de motif conducteur 32 comporte un complément aux dites connexions 13 pour former un solénoïde. Dans le mode de réalisation représenté sur la figure 5, la face inférieure de la feuille ou couche 2 est métallisée en sorte que cette feuille ou couche 2 forme plan de masse. Ainsi dans ce mode de réalisation le substrat selon l'invention comporte un plan de masse se situant sous la première couche ou feuille 1 en vis à vis de la face inférieure de ladite première couche ou feuille.Another embodiment will now be discussed in connection with FIG. 5. In this embodiment, at least a portion or all of the conductive pattern 3 is disposed on a second sheet or layer 2. This second sheet or layer 2 has two faces, a top face 12 facing the lower face 8 of the first sheet or layer 1 and a bottom face 14. the upper face 12 of the sheet or layer 2 hosts 2 part 3 of the conductor pattern 3. preferably the part 3 2 of the conductive pattern 3 comprises all the active or passive components 7 forming a circuit with the conductive pattern 3. Possibly a part 3 1 of the conductive pattern 3 remains present on the upper face 6 of the first sheet or layer 1, as shown Figure 5. The same goes for magnetic blocks 5 which are mechanically bonded, for example bonded, on the upper face 6 of the first layer or sheet 1. In a manner known per se, electrical connections between the conductive pattern portion 3 1 and the conductive pattern portion 3 2 are provided by plated through holes 18 joining the upper and lower faces of the layer or sheet 1. In particular the connections between the connections 13 passing above a magnetic tile 5 and the conductive pattern part 3 2 lying on the sheet or layer 2 are provided by such plated-through holes 18, when the conductive pattern part 3 2 comprises additional to said connections 13 to form a solenoid. In the embodiment shown in Figure 5, the underside of the sheet or layer 2 is metallized so that the sheet or layer 2 forms a ground plane. Thus, in this embodiment, the substrate according to the invention comprises a ground plane lying under the first layer or sheet 1 opposite the lower face of said first layer or sheet.

Dans des modes de réalisation alternatifs de ce mode de réalisation, destinés à réduire, vers le haut, les fuites électromagnétiques produites par les courants circulant dans la partie de motif 32, un plan conducteur 4 formant plan de masse, est interposé entre les feuilles ou couches 1 et 2. Le plan conducteur peut se présenter, sous forme par exemple d'une troisième couche ou feuille 4. Sur la figure 5, afin de ne pas gêner la vue de la couche 2 ce plan n'a été représenté que de façon partielle. Cette troisième feuille ou couche 4, comporte alors des trous métallisés 18 formant chacun un passage de connexion. Le débouché de ces trous est de façon en elle même connue, isolé électriquement pour éviter une mise à la masse des connexions.In alternative embodiments of this embodiment, for reducing upwardly, electromagnetic leakage produced by the currents flowing in the part pattern 3 2, a conductive plane 4 forming ground plane is interposed between the sheets or layers 1 and 2. The conductive plane may be in the form of for example a third layer or sheet 4. In FIG. 5, in order not to hinder the view of the layer 2, this plane has only been shown partially. This third sheet or layer 4, then comprises metallized holes 18 each forming a connection passage. The outlet of these holes is so in itself known, electrically isolated to prevent grounding connections.

Une variante du mode de réalisation représenté sur la figure 5, permettant aussi de réduire les fuites électromagnétiques vers le haut est représenté figure 6. Dans cette variante de réalisation la face supérieure de la feuille ou couche 1 est entièrement métallisée, à l'exception des emplacements entourant des trous métallisés 18 joignant électriquement des points de la feuille ou couche 1 et des points de la feuille ou couche 2. Les pavés métalliques 5 sont alors collés au dessus du dépôt métallique au moyen d'une colle électriquement isolante. A l'exception des trous métallisés 18 et de leurs débouchés la totalité du motif conducteur 3 est reporté sur la seconde feuille ou couche 2.A variant of the embodiment shown in FIG. 5, which also makes it possible to reduce the electromagnetic leakage upwards, is represented in FIG. 6. In this variant embodiment, the upper face of the sheet or layer 1 is entirely metallized, with the exception of locations surrounding metallized holes 18 electrically joining points of the sheet or layer 1 and points of the sheet or layer 2. The metal blocks 5 are then glued to the top of the metal deposit by means of an electrically insulating glue. With the exception of the metallized holes 18 and their outlets, the entire conductive pattern 3 is transferred to the second sheet or layer 2.

Claims (23)

  1. A high-impedance substrate comprising a first layer or sheet (1) made of insulating material, having a first and a second face in the form of a lower face and an upper face (6), the substrate comprising conductor patterns (3) mechanically linked to the substrate, characterised in that, some of the conductor patterns (3) mechanically linked to the substrate are associated with a magnetic tile (5) placed on or above one of the two faces of the substrate, and in that at least one electrical interconnection (13) puts two points (9, 11) in electrical contact distinct from one another of a conductor pattern (3) mechanically linked to the substrate, this conductor pattern (3) having an assigned magnetic tile (5), passing above said magnetic tile (5) associated with said conductor pattern (3) mechanically linked to the substrate.
  2. The high-impedance substrate as claimed in Claim 1 characterised in that conductor patterns (3) are constituted by conductive tracks deposited on one and/or the other of the upper (6) or lower faces of the substrate.
  3. The high-impedance substrate as claimed in Claim 1 characterised in that conductor patterns (3) are constituted by conductive tracks deposited on one and/or the other of the upper (6) or lower faces of the substrate and together forming an electrical circuit with electronic components (7).
  4. The high-impedance substrate as claimed in Claim 3 characterised in that the electronic components (7) are elements having a resistance value and a capacity value.
  5. The high-impedance substrate as claimed in Claim 4 characterised in that the electronic components (7) comprise one or more active elements having a capacity value which can vary as a function of the value of an electrical variable applied to this or to these active elements.
  6. The high-impedance substrate as claimed in any one of Claims 1 to 5, characterised in that it comprises a second layer or sheet (2), this second layer or sheet (2) having an upper face opposite the lower face of the first layer or sheet (1), and a lower face and in that a part (32) at least of each of the patterns (3) is mechanically linked to one and/or the other of the upper and lower faces of said second sheet or layer (2).
  7. The high-impedance substrate as claimed in any one of Claims 1 to 5, characterised in that it comprises a second layer or sheet (2), this second layer or sheet (2) having an upper face opposite the lower face of the first layer or sheet (1), and a lower face and in that the entirety of the patterns (3) is mechanically linked to one and/or the other of the upper and lower faces of said second sheet or layer (2).
  8. The high-impedance substrate as claimed in any one of claims 3 to 5, characterised in that it comprises a second layer or sheet (2), this second layer or sheet (2) having an upper face opposite the lower face of the first layer or sheet (1), and a lower face and in that the totality of the conductor patterns (3) as well as the totality of the electronic components forming an electrical circuit with these patterns (3) are mechanically linked to the one and/or the other of the upper and lower faces of said second sheet or layer (2).
  9. The high-impedance substrate as claimed in any one of Claims 1 to 8, characterised in that it further comprises an earth plane (4) situated underneath the first layer or sheet (1) opposite the lower face of said first layer or sheet (1).
  10. The high-impedance substrate as claimed in any one of claims 6 to 8, characterised in that it further comprises an earth plane situated underneath the second layer or sheet (2) opposite the lower face of said second layer or sheet (2).
  11. The high-impedance substrate as claimed in any one of claims 6 to 8, characterised in that it further comprises an earth plane situated between the first (1) and second (2) layers or sheets (1, 2) opposite the lower face of said first layer or sheet (1).
  12. The high-impedance substrate as claimed in Claim 9, characterised in that the earth plane is constituted by plating of the lower face of the first layer or sheet (1).
  13. The high-impedance substrate as claimed in Claim 10, characterised in that the earth plane is constituted by plating of the lower face of the second layer or sheet (2).
  14. The high-impedance substrate as claimed in any one of Claims 1 to 8, characterised in that it further comprises an earth plane (4) situated above the first layer or sheet (1) opposite the upper face of said first layer or sheet (1).
  15. The high-impedance substrate as claimed in Claim 14, characterised in that the earth plane is constituted by metallisation of the upper face of the first layer or sheet (1).
  16. The high-impedance substrate as claimed in any one of Claims 1 to 15, characterised in that the magnetic tiles (5) are mechanically linked to the upper face of the first layer or sheet (1).
  17. The high-impedance substrate as claimed in any one of Claims 1 to 16, characterised in that it comprises a plurality of electrical interconnections (13) each putting two distinct points (90, 9n-1, 111, 11n) in electrical contact with one or the other of the conductor pattern (3) mechanically linked to the substrate passing above said magnetic tile (5) associated with said pattern, the conductor pattern (3) and the interconnections (13) together forming a solenoid around the magnetic tile (5).
  18. The high-impedance substrate as claimed in any one of Claims 1 to 16, characterised in that patterns (3) with which a magnetic tile (5) is associated each comprise a plurality of electrical interconnections (13) each putting two distinct points (90, 9n-1, 111, 11n) in contact electrical with one another of the conductor pattern (3) mechanically linked to the substrate passing above said magnetic tile (5) associated with said pattern (3), a first part of the conductor pattern and the interconnections(13) together forming a solenoid around the magnetic tile (5), a second part of the pattern forming with capacitive and or resistive elements a circuit connecting said capacitive and/or resistive elements in parallel or in series on the solenoid.
  19. The high-impedance substrate as claimed in any one of Claims 1 to 18, characterised in that the magnetic tiles are made of rubber or plastic material loaded with a magnetic material powder.
  20. The high-impedance substrate as claimed in Claim 19, characterised in that the volume fraction of magnetic material powder of the rubber or of the plastic material forming the magnetic tiles is greater than 30%.
  21. The high-impedance substrate as claimed in any one of Claims 1 to 18, characterised in that the magnetic tiles are made of a material constituted by a stack of magnetic and insulating layers.
  22. The high-impedance substrate as claimed in any one of Claims 1 to 19, characterised in that the cover rate of the face carrying the magnetic tiles per said magnetic tiles is greater than 10%.
  23. The high-impedance substrate as claimed in any one of Claims 1 to 19, characterised in that the cover rate of the face carrying the magnetic tiles per said magnetic tiles is greater than 50%.
EP04786396A 2003-09-02 2004-08-30 High impedance substrate Expired - Lifetime EP1661206B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0350492A FR2859309B1 (en) 2003-09-02 2003-09-02 HIGH IMPEDANCE SUBSTRATE
PCT/FR2004/050398 WO2005024999A1 (en) 2003-09-02 2004-08-30 High impedance substrate

Publications (2)

Publication Number Publication Date
EP1661206A1 EP1661206A1 (en) 2006-05-31
EP1661206B1 true EP1661206B1 (en) 2006-12-13

Family

ID=34130848

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04786396A Expired - Lifetime EP1661206B1 (en) 2003-09-02 2004-08-30 High impedance substrate

Country Status (9)

Country Link
US (1) US7071876B2 (en)
EP (1) EP1661206B1 (en)
JP (1) JP4901473B2 (en)
AT (1) ATE348419T1 (en)
CA (1) CA2508073A1 (en)
DE (1) DE602004003717T2 (en)
FR (1) FR2859309B1 (en)
NO (1) NO20053835D0 (en)
WO (1) WO2005024999A1 (en)

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US8884834B1 (en) 2012-09-21 2014-11-11 First Rf Corporation Antenna system with an antenna and a high-impedance backing

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Also Published As

Publication number Publication date
DE602004003717T2 (en) 2007-10-18
JP2007504643A (en) 2007-03-01
FR2859309A1 (en) 2005-03-04
FR2859309B1 (en) 2005-12-16
NO20053835D0 (en) 2005-08-15
DE602004003717D1 (en) 2007-01-25
US20060044209A1 (en) 2006-03-02
CA2508073A1 (en) 2005-03-17
JP4901473B2 (en) 2012-03-21
EP1661206A1 (en) 2006-05-31
US7071876B2 (en) 2006-07-04
WO2005024999A1 (en) 2005-03-17
ATE348419T1 (en) 2007-01-15

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