JPS58137206A - Inductance element - Google Patents

Inductance element

Info

Publication number
JPS58137206A
JPS58137206A JP57019320A JP1932082A JPS58137206A JP S58137206 A JPS58137206 A JP S58137206A JP 57019320 A JP57019320 A JP 57019320A JP 1932082 A JP1932082 A JP 1932082A JP S58137206 A JPS58137206 A JP S58137206A
Authority
JP
Japan
Prior art keywords
inductance element
core
pattern
zigzag
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57019320A
Other languages
Japanese (ja)
Inventor
Mitsuo Hoshino
星野 光雄
Teruhiko Terasawa
寺沢 「はる」彦
Hiroshi Hirakawa
平川 博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soshin Electric Co Ltd
Sony Corp
Original Assignee
Soshin Electric Co Ltd
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soshin Electric Co Ltd, Sony Corp filed Critical Soshin Electric Co Ltd
Priority to JP57019320A priority Critical patent/JPS58137206A/en
Publication of JPS58137206A publication Critical patent/JPS58137206A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/0006Printed inductances
    • H01F17/0033Printed inductances with the coil helically wound around a magnetic core
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/0006Printed inductances
    • H01F2017/0066Printed inductances with a magnetic layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

PURPOSE:To eliminate the winding process and to greatly reduce a thickness by a construction wherein a zig-zag conductive pattern is separated by cut-outs into plural parts which are arranged on the upper and lower sides alternately with respect to a plane. CONSTITUTION:A zig-zag pattern 27 is formed with a copper foil 26 on a flexible board 25. Terminals 28, 29 are led out from both ends of the pattern 27. Then, the board 25 is separated by plural cut-outs into upper and lower parts alternately. A flat core 31 formed of ferrite, etc. is inserted to a space defined by those alternate upper and lower parts. Thus, the core 31 assumes such a state that conductive wires are wound around it.

Description

【発明の詳細な説明】 この発明は配線基板上に配されるインダクタンス素子と
してtr属なもの!提供せんとするものである。
[Detailed Description of the Invention] This invention is an inductance element arranged on a wiring board! This is what we intend to provide.

従来回路配線用のインダクタンス素子としては。As an inductance element for conventional circuit wiring.

一般には511図に示す15K例えばIIJiiI性で
7ランジ【有するボビン(1)に導11(2)がamさ
れたものが用いられる。
In general, a bobbin (1) with 7 lunges of 15K, for example, IIJIII, as shown in Fig. 511, is provided with a lead 11 (2).

そして例えば菖2図の等価回路に示すようなインダクタ
ンス素子(3)及び(4)とコンデンサ(5)とからな
るフィルタな構成する場合には第3図のよ5に構成され
る。
For example, in the case of a filter configuration consisting of inductance elements (3) and (4) and a capacitor (5) as shown in the equivalent circuit of Diagram 2, it is configured as 5 in FIG.

すなわち誘電体絶縁基II (9)の表両及び裏面に調
整軸が被着形成されることKよりコンデンサが形成され
る。そして、この基板(9)上KIIK示すようにボビ
ンに導線が巻回された=イルミυ及びalが貼着され、
そのコイルのαυ及びnのそれぞれの端子がコンデンサ
に対して接続されるとともKjlll子(6)(75<
8’+がそれぞれ導出されるようKなされている。
That is, a capacitor is formed by forming adjustment shafts on both front and back surfaces of the dielectric insulating base II (9). Then, as shown in KIIK on this board (9), conductor wires are wound around the bobbin = illuminance υ and al are pasted,
When the αυ and n terminals of the coil are connected to the capacitor,
8'+ are respectively derived.

端子<4)<4> <ti)は第2図の等価回路の端子
(6)(7) (8)に対応するものである。
Terminals <4) <4><ti) correspond to terminals (6), (7), and (8) of the equivalent circuit in FIG.

この15なLCフィルタな多数接続して例えばはしご形
回路な構成する場合、鴎路構成の実装としては第4図の
ようになる。すなわちそれぞれ鋼limeが表裏に被着
されてフンテン11−形成する複数の基板(1:I (
14) (is−が図に示すように平行に積み重ねられ
るように並べられるものである。この場合に、積み重ね
られるように並べられるときの基板と基板の距@dは、
各基板昧s Q41 ui a・上にコイル昧η舖、a
9ci!Ij、 (2m)fJ、(2)(至)がそれぞ
れ設けられているため限定されており、かなりのスペー
スな余分に必要としていたのである。
When a large number of these 15 LC filters are connected to form, for example, a ladder circuit, the implementation of the Oshiro configuration is as shown in FIG. 4. That is, a plurality of substrates (1:I (
14) (is- are arranged so that they are stacked in parallel as shown in the figure. In this case, the distance between the substrates when they are arranged so that they are stacked is @d
There is a coil on each board Q41 ui a.
9ci! Since Ij, (2m)fJ, and (2) (to) are provided respectively, it is limited and requires a considerable amount of extra space.

しかも実緻上ポビンに導liIを巻回して構成するコイ
ルは、その4I−に非常に手間がかかるものとなるとい
う欠点もあった。
Moreover, in practice, a coil constructed by winding lead wire around a pobbin has the disadvantage that it requires a lot of effort.

この尭明は以上のような従来の、線材tボビンに巻回す
ること虻19構成するコイルの欠点t’簡単に除去でき
るよ5Kした新規なインダクタンス累子七*@L工うと
するものである。
This project aims to create a new inductance 7*@L that can easily eliminate the drawbacks of the conventional coils that are wound around the wire rod bobbin. .

以下この尭−によるインダクタンス素子の一例を:、1
IIs図以下な参照しながら説明しよう。
Below is an example of an inductance element using this method: 1
Let's explain with reference to Figure IIs below.

図の例にνいてはインダクタンス素子としてフレキシブ
ル基41を用いて次のよ5に構成する。すなわち先f1
g5wJrc不すように、フレキシブル基板(ハ)の上
K11lliv4に1つジグザグ状のパターン替わt形
成する。そしてこのジグザグ状のパターン(2)の一端
、4i!41工り端子@@ゼ導出しておく。さらにこの
ジグザグ状のパターン(Iloの4N14fk@鄭分は
切断しないように−の砿−で示すようにこのフレキシブ
ル基板(2)に僅値の切り込み翰を入れる・そして第6
rIAK示すようKこの1数の切り込み&)を境にして
フレキシブル基板@【交互に上と下に分ける。つまりジ
グザグ状の鋼箔(ハ)が一本俸に交互に一面に対して上
下になるようにされる。そしてこの交互に上下されて空
いた空間に例えばフェライトからなる偏平コア6υを挿
入する。こうして、フェライトコアGυに導電−が巻か
れたのと同様の状態となり、簡単にインダクタンス素子
が形成できる。しかもこの場合、フェライトコアc11
の厚みの分が若干あるもののインダクタンス素子として
非常に偏平で薄渥のものができる。したがって纂2図の
等価回路に示すよ5なLCフィルタを作る場合にはg7
taK示すように#述のように表面及び裏面に銅箔が被
着されてコンデンサか帝壷が形成される一電体基板(9
)に、以上述べたインダクタンス素子u3(至)を絶縁
材を介して被着することにより、非常に薄層のものが実
現で愈ることになる。
In the example shown in the figure, a flexible base 41 is used as an inductance element, and the structure is as shown in 5 below. That is, the first f1
Form one zigzag pattern on K11lliv4 on the flexible substrate (c) so that g5wJrc is not removed. And one end of this zigzag pattern (2), 4i! Lead out the 41 machined terminal @@ze. Furthermore, this zigzag-like pattern (Ilo's 4N14fk @ Zheng-bun is not cut, as shown by -), a slight incision is made in this flexible board (2), and the 6th
rIAK As shown, the flexible substrate is divided alternately into upper and lower parts with this number of notches &) as the border. In other words, zigzag-shaped steel foils (c) are placed alternately above and below one surface. Then, a flat core 6υ made of ferrite, for example, is inserted into the space left after being raised and lowered alternately. In this way, a state similar to that in which a conductive wire is wound around the ferrite core Gυ is obtained, and an inductance element can be easily formed. Moreover, in this case, ferrite core c11
Although it has some thickness, it can be used as an inductance element that is extremely flat and thin. Therefore, when making a 5 LC filter as shown in the equivalent circuit of Figure 2, g7
As shown in taK, a single electric board (9
) by applying the above-mentioned inductance element u3 (to) through an insulating material, a very thin layer can be realized.

以上の例はフレキシブル基*c251上に鋼箔(ハ)を
ジグザグなパターンに配置するようにした場合であるが
、このようにジグザグパターンとすることなく、菖81
11において斜*1−付して示すように銅箔−を−面上
に被着しておきこの鋼箔(至)に切り込み灸な入れ、こ
れKよって一面のfI!4箔(2)をジグザグにするよ
うkしてもよい。
The above example is a case where the steel foil (C) is arranged in a zigzag pattern on the flexible base *c251.
At 11, a copper foil is applied on the - side as indicated by the diagonal *1, and a cut is made into this steel foil (towards) to make a moxibustion. 4 foils (2) may be zigzag.

以上のような例のインダクタンス素子はQは高いが、比
験的インダクタンス値は小さめ。インダクタンス値を上
げるには次のようにすればよい。
Although the inductance element in the above example has a high Q, the comparative inductance value is small. To increase the inductance value, do the following:

すなわち、5119図がその例で基板(至)の銅箔(2
)によるジグザグの導電パターンに挿入されたフェライ
トコア61を挟み、かつ、図のようにフェライトコア輛
及び(至)をコア、6υとはそれぞれ空I!IC!@及
び6Dを形成するように設ける。この場合、コア6υの
ジグダグの導電パターンへの挿入方向の端部において、
コア(至)(至)とこのコア61が接合される。
In other words, Figure 5119 is an example of this, and the copper foil (2) on the board (to)
), sandwiching the ferrite core 61 inserted into the zigzag conductive pattern, and as shown in the figure, the ferrite cores and (to) are the cores, and 6υ is the empty I! IC! Provided to form @ and 6D. In this case, at the end of the core 6υ in the direction of insertion into the jig-dag conductive pattern,
The core (to) (to) and this core 61 are joined.

このようなサンドインチ構造とすれば、インダクタンス
値が大きくなるだけでなく、−東の外部との1弊にもな
る。
Such a sand inch structure not only increases the inductance value, but also causes a problem with the outside on the east side.

なお、纂sgの例はコアGυの両面に、フェライトコア
ー(至)を設けてサンドインチ構造にした場合であるが
、コア431の一面IIIKのみフェライトコアv9け
るようにしてもインダクタンス値の上昇という目的はi
A現できる。
Note that the example of 纅sg is a case where ferrite cores (to) are provided on both sides of the core Gυ to form a sandwich structure, but even if the ferrite core v9 is placed only on one side of the core 431, the inductance value will increase. The purpose is i
A: I can express it.

以上の例は偏平;アロ0なジグザグパター7111人し
た一億のインダクタンス素子の場合であるが、次の15
にすれば他憾のインダクタンス素子4h実現が可能であ
る。
The above example is a case of a flattened zigzag putter with 100 million inductance elements made by 7111 people, but the following 15
By doing so, it is possible to realize an inductance element 4h, which is unlike any other.

すなわち、! 10 aiIはその一例を示すもので、
菖5vAのフレキシブル基板(ハ)のそれぞれジグザグ
の部分ψ)t1図に示すように、なみ形にするとともに
そのなみ形が切れl−を介した−りの南泊部分とは交互
になるように成形する。そして、このなみ形の部分に図
の例ではE形のコア@を切れ目01Jr介して隣り合う
ジグザグの411E体部分が互いに上下になるとともに
各一本の鋼箔部分においてE形コア■の′?!r4の脚
(318A)(38B)(380) K交互に上下にな
4ように挿入するものである。そしてこの場合、E形コ
ア關の他貴は1mj図に示すように■形コア關と接合さ
れ、日の字形のインダクタンス素子が構成されるもので
ある。
In other words! 10 aiI shows one example,
Each zigzag part ψ) of the 5vA flexible board (C) is shown in the figure ψ)t1, so that it is shaped in a straight line, and the shape is alternated with the south corner part of the line through the cut l-. Shape. Then, in the example shown in the figure, the zigzag 411E body parts of the E-shaped core @ which are adjacent to each other through the cut 01Jr are placed above and below each other, and each steel foil part has the E-shaped core ■'? ! Legs of r4 (318A) (38B) (380) K are to be inserted alternately up and down in 4 ways. In this case, the other end of the E-shaped core is connected to the ■-shaped core, as shown in Figure 1mj, to form a Japanese-shaped inductance element.

このE形=アeavジグザグ導電パターンに挿入したと
きは3憾となる。つまり、嬉11111aC示すよ5に
、E形コア(至)の3本の脚(38人)(38B)(3
8C)を過る磁路の方向は、鋼箔部分t−流れる電流の
向自が図の実線で示すようなものであるときは、脚(3
8A)(38B)(38C)忙おいて互いに対向する向
暑となるものである。
When inserted into this E-shaped = A-eav zigzag conductive pattern, it becomes 3. In other words, the 3 legs (38 people) (38B) (3
The direction of the magnetic path passing through the steel foil section t is as shown by the solid line in the figure.
8A) (38B) (38C) They are opposite to each other when busy.

さらK、次のようにしてトランスも容易に構成すること
ができる。
Furthermore, the transformer can be easily constructed as follows.

すなわち、第5図に示したような7レキシプル轟1[1
4G(41)12枚用意し、11112図に示すように
基1[■軸υのそれぞれの端子部分が互いに別方向とな
るよ5に重ねる。そして両者のジグずグの導電パターン
部分を同じ位置となし、篤12図、總1311に示すよ
うに両方のジグザグの導電パターンが、それぞれが破巌
で示す切り込み(ロ)を境にして交互に上下になるよう
にして、これらに4偏平のフェライトコア(41v1備
挿入する。つまり、2秋のフレキシブル基板WJ@υの
切り込み(6)が互いに同じ位置となるように重ね会わ
せる。このようにするとジグザダバターンの部分におい
て互−の3枚のフレキシブル基板−ml)上の鋼箔@4
−は夏−に重なり會5よさになり、その重なり合った状
態のものをそれぞれ2枚ずつ切り込み一會介して隣り会
うものが上下になるように構成するものである。
In other words, the 7 lexical number 1 [1
Prepare 12 sheets of 4G (41) and stack them in a stack so that each terminal part of the base 1 [■ axis υ is in a different direction from each other, as shown in Figure 11112. Then, the zigzag conductive pattern parts of both are placed in the same position, and as shown in Figure 12 and Figure 1311, both zigzag conductive patterns are arranged alternately with the notch (b) shown by the broken line as the border. Insert 4 flat ferrite cores (41v1) into these so that they are vertically aligned. In other words, overlap so that the notches (6) of the flexible board WJ@υ of 2019 are at the same position. In this way. Then, in the zigzag pattern part, the steel foil @4
- is overlapping in summer - to form a 5-layer structure, and each of the overlapping pieces is cut into two pieces, and the adjacent pieces are placed one above the other.

このようにすれば一方の7レキシプklja龜−上の銅
lI−からなるインダクタンス素子と、他方の7し今シ
プル基板@珍上に設けられた銅i−からな番インダクI
ンス素子は亙いに=7【介して納会Lトランスが実現さ
れるわけである。
In this way, an inductance element made of copper lI- on one 7 lexical board and an inductance element made of copper i on the other 7 lexical board
The L transformer is realized through the transformer.

以上述べたようにこの発I!jによれば非常ec*s+
のインダクタンス素子が実現で亀、しかも4I龜−工1
が全く必要のなiものが実現で自るものであゐ、したが
って冒頭で述べたようなインメタタン1ス嵩子と;ンデ
ンナからなるフィル−七はしご影回路としてII成する
場合に、謳2閣の等−1路に示すようなものvIl歇重
ねて114−に示すように配列するとき、互いの基板間
の距#Iiを非常に近くする仁とができ、実懺*にをか
なり上けることがで龜る。そして、−のuI!素子−分
をそのQ−たスペースに配することがで自るから構成を
非常に小部にする仁とが可能になるものである。
As mentioned above, this release I! According to j, emergency ec*s+
The inductance element has been realized, and it requires only 4I screws.
The i which is not necessary at all is self-realized, so when it is formed as a Phil-Seven Ladder shadow circuit consisting of the inmetances 1st and 2ndenna as mentioned at the beginning, When arranging VIl as shown in 114-, the distance #Ii between the two substrates becomes very close, and the actual output * can be considerably increased. Things slow down. And uI of -! Since the elements can be arranged in the Q space, it is possible to make the structure into a very small part.

鵞た、巻−機が従来のよ5に必要ではないので鑑み立て
、製造が非常に容易になるという駒点もある。
Another advantage of this method is that it does not require a winding machine as much as the conventional method, making manufacturing very easy.

さらに、7レキシプル!I[t’用いることなく他の鋼
mst料を用いることもできる。すなわち、その場合に
は、予めコアに対して上下となるべき部分を裂押しなど
により*形しておく15にすればよい。なお、さらに空
石のインダクタンス素子も、もちろん構成することがで
きる。つまりフェライトコアの代わりに非導電物質tフ
レキシブル基板により構成されるインダクタンス素子に
挿入するよ5にすればよい。
Furthermore, 7 Lexiple! Other steel mst materials can also be used without using I[t'. That is, in that case, the portions that should be above and below the core may be shaped in advance by tearing or pressing 15. Note that, of course, a blank inductance element can also be constructed. That is, instead of the ferrite core, it may be inserted into an inductance element made of a non-conductive material t flexible substrate.

【図面の簡単な説明】[Brief explanation of drawings]

籐1図は従来のインダクタンス素子の一例の構成【示す
図 5112図はこのインダクタンス素子上用いた回路
の一例の等1IiVAII図、第3園は仁の等1ifl
i−路な実機した構成を示す図、菖4図は第2図の等*
−路なさらに発展させ、はしご形回路とした場合の実際
の構成を示す図、第5図及び第6図はこの発明によるイ
ンダクタンス素子の構成の一例な説明するための図、萬
7図はこの発@による素子によって第2図の等備回路を
実現した構成の一例を示す図、第8図はこの発明の他の
例の構成V説−するための図、第9図は仁の発−の改嵐
例を示す図、亀10図はこの発明のさらに他の例を説明
するための図、l511図は第10 Fgの説明に供す
る図、@12図及び第13図は仁の発明なトランスに応
用した場合の一例の構造を説明するための図である。 (ハ)は薄い7レキシプル基板、(2)は銅箔、匈はジ
グザグの導電パターン、(7)は1枦@に設けられる切
り込み、3υはコアである。 第8図
Figure 1 is a diagram showing the configuration of an example of a conventional inductance element. Figure 5112 is an example of a circuit used on this inductance element.
A diagram showing the configuration of an i-road actual machine.
Figures 5 and 6 are diagrams for explaining an example of the configuration of the inductance element according to the present invention. A diagram showing an example of a configuration in which the equivalent circuit of FIG. 2 is realized using elements based on the oscillator @, FIG. 8 is a diagram for explaining the configuration V theory of another example of the present invention, and FIG. Fig. 10 is a drawing for explaining still another example of this invention, Fig. 1511 is a drawing for explaining No. 10 Fg, and Fig. @12 and Fig. 13 are the inventions of Jin. FIG. 3 is a diagram for explaining an example structure when applied to a transformer. (c) is a thin 7 lexiple board, (2) is a copper foil, 匈 is a zigzag conductive pattern, (7) is a notch provided in 1 枦@, and 3υ is a core. Figure 8

Claims (1)

【特許請求の範囲】[Claims] 薄いj8縁板上m1lli体が形成されるとと−に上記
絶縁板に複数の#1ぼ平行な切り込みが設けられ、この
複数のほぼ平行な切り込みによって上記導電体からなる
ジグザグのパターンが形成され、上記切り込みにより分
離された上記ジグザグの導電体部分が一面に対して交互
に上、下になる15Kして構成されたインダクタンス素
子。
When the thin J8 edge plate m1lli body is formed, a plurality of #1 substantially parallel cuts are provided in the insulating plate, and a zigzag pattern made of the conductive material is formed by the plurality of substantially parallel cuts. , an inductance element configured such that the zigzag conductor portions separated by the notches are arranged alternately upward and downward with respect to one surface.
JP57019320A 1982-02-09 1982-02-09 Inductance element Pending JPS58137206A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57019320A JPS58137206A (en) 1982-02-09 1982-02-09 Inductance element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57019320A JPS58137206A (en) 1982-02-09 1982-02-09 Inductance element

Publications (1)

Publication Number Publication Date
JPS58137206A true JPS58137206A (en) 1983-08-15

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JP57019320A Pending JPS58137206A (en) 1982-02-09 1982-02-09 Inductance element

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Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5561438A (en) * 1991-11-13 1996-10-01 Seiko Epson Corporation Ferrite Antenna
US5638080A (en) * 1993-01-22 1997-06-10 Texas Instruments Incorporated Manufacture of a flexible antenna, with or without an inner permeable magnetic layer
JPH09232147A (en) * 1996-02-22 1997-09-05 Nec Corp Transmission line transformer
EP0893841A1 (en) * 1997-07-23 1999-01-27 Matsushita Electric Industrial Co., Ltd. Helical coil, method of producing same and helical antenna using same
EP1090437B1 (en) * 1999-04-21 2002-09-04 Siemens Aktiengesellschaft Antenna, use of an antenna of this type and method for producing the same
FR2859309A1 (en) * 2003-09-02 2005-03-04 Commissariat Energie Atomique HIGH IMPEDANCE SUBSTRATE
JP2006080367A (en) * 2004-09-10 2006-03-23 Brother Ind Ltd Inductance element, radio tag circuit element, tagged tape roll, and manufacturing method of inductance element
JP2006284169A (en) * 2005-03-31 2006-10-19 Babcock & Wilcox Canada Ltd Evaporation bank tapered tubing of co-extrusion molding
FR2884650A1 (en) * 2005-04-18 2006-10-20 Valeo Electronique Sys Liaison Antenna for e.g. receiving signal from e.g. motor vehicle door opening and closing control device, has band and magnetic bar engaged in slits so that passage is formed on both sides of bar and branches of waves extend on both sides of bar
EP1748451A1 (en) * 2005-07-26 2007-01-31 Sumida Corporation Magnetic element
EP1845538A2 (en) * 2006-04-14 2007-10-17 Sumida Corporation Magnetic element
US7423509B2 (en) * 2006-10-23 2008-09-09 Commissariat A L'energie Atomique Coil comprising several coil branches and micro-inductor comprising one of the coils
WO2012176475A1 (en) * 2011-06-24 2012-12-27 国立大学法人金沢大学 Magnetostrictive power-generating thin film strip, method for producing same, and magnetostrictive power-generating module
JP2013175577A (en) * 2012-02-24 2013-09-05 National Institute For Materials Science Annular line structure using high-temperature superconducting flat tape line material, and method of manufacturing the same
US20140232502A1 (en) * 2013-02-21 2014-08-21 Pulse Electronics, Inc. Flexible substrate inductive apparatus and methods
WO2018207447A1 (en) * 2017-05-08 2018-11-15 株式会社村田製作所 Resonant circuit element and circuit module

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5561438A (en) * 1991-11-13 1996-10-01 Seiko Epson Corporation Ferrite Antenna
US5638080A (en) * 1993-01-22 1997-06-10 Texas Instruments Incorporated Manufacture of a flexible antenna, with or without an inner permeable magnetic layer
JPH09232147A (en) * 1996-02-22 1997-09-05 Nec Corp Transmission line transformer
EP0893841A1 (en) * 1997-07-23 1999-01-27 Matsushita Electric Industrial Co., Ltd. Helical coil, method of producing same and helical antenna using same
JPH1141019A (en) * 1997-07-23 1999-02-12 Matsushita Electric Ind Co Ltd Helical antenna and its manufacture
US6147661A (en) * 1997-07-23 2000-11-14 Matsushita Electric Industrial Co., Ltd. Helical coil, method of producing same and helical antenna using same
EP1090437B1 (en) * 1999-04-21 2002-09-04 Siemens Aktiengesellschaft Antenna, use of an antenna of this type and method for producing the same
US6501438B2 (en) * 1999-04-21 2002-12-31 Siemens Aktiengesellschaft Multiband helical antenna
FR2859309A1 (en) * 2003-09-02 2005-03-04 Commissariat Energie Atomique HIGH IMPEDANCE SUBSTRATE
WO2005024999A1 (en) * 2003-09-02 2005-03-17 Commissariat A L'energie Atomique High impedance substrate
US7071876B2 (en) 2003-09-02 2006-07-04 Commissariat A L'energie Atomique High impedance substrate
JP2006080367A (en) * 2004-09-10 2006-03-23 Brother Ind Ltd Inductance element, radio tag circuit element, tagged tape roll, and manufacturing method of inductance element
JP2006284169A (en) * 2005-03-31 2006-10-19 Babcock & Wilcox Canada Ltd Evaporation bank tapered tubing of co-extrusion molding
FR2884650A1 (en) * 2005-04-18 2006-10-20 Valeo Electronique Sys Liaison Antenna for e.g. receiving signal from e.g. motor vehicle door opening and closing control device, has band and magnetic bar engaged in slits so that passage is formed on both sides of bar and branches of waves extend on both sides of bar
EP1748451A1 (en) * 2005-07-26 2007-01-31 Sumida Corporation Magnetic element
US7368908B2 (en) 2005-07-26 2008-05-06 Sumida Corporation Magnetic element
EP1845538A2 (en) * 2006-04-14 2007-10-17 Sumida Corporation Magnetic element
JP2007287830A (en) * 2006-04-14 2007-11-01 Sumida Corporation Magnetic element
EP1845538A3 (en) * 2006-04-14 2008-01-23 Sumida Corporation Magnetic element
US7423509B2 (en) * 2006-10-23 2008-09-09 Commissariat A L'energie Atomique Coil comprising several coil branches and micro-inductor comprising one of the coils
WO2012176475A1 (en) * 2011-06-24 2012-12-27 国立大学法人金沢大学 Magnetostrictive power-generating thin film strip, method for producing same, and magnetostrictive power-generating module
JPWO2012176475A1 (en) * 2011-06-24 2015-02-23 国立大学法人金沢大学 Magnetostrictive power generation thin film piece, manufacturing method thereof, and magnetostrictive power generation module
JP2013175577A (en) * 2012-02-24 2013-09-05 National Institute For Materials Science Annular line structure using high-temperature superconducting flat tape line material, and method of manufacturing the same
US20140232502A1 (en) * 2013-02-21 2014-08-21 Pulse Electronics, Inc. Flexible substrate inductive apparatus and methods
WO2018207447A1 (en) * 2017-05-08 2018-11-15 株式会社村田製作所 Resonant circuit element and circuit module
JPWO2018207447A1 (en) * 2017-05-08 2019-11-07 株式会社村田製作所 Resonant circuit element and circuit module
US11239813B2 (en) 2017-05-08 2022-02-01 Murata Manufacturing Co., Ltd. Resonant circuit element and circuit module

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