JP2909122B2 - Laminated composite parts - Google Patents
Laminated composite partsInfo
- Publication number
- JP2909122B2 JP2909122B2 JP3067990A JP3067990A JP2909122B2 JP 2909122 B2 JP2909122 B2 JP 2909122B2 JP 3067990 A JP3067990 A JP 3067990A JP 3067990 A JP3067990 A JP 3067990A JP 2909122 B2 JP2909122 B2 JP 2909122B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- conductor
- laminated composite
- pattern
- composite component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、積層インダクタとコンデンサを一体に形成
した積層複合部品の構造に関するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a multilayer composite component in which a multilayer inductor and a capacitor are integrally formed.
電子部品の小型化、薄型化の要求に伴って、インダク
タの分野においても、線材を巻回せずに、絶縁性セラミ
ック層内に印刷によって周回する導体パターンを形成し
た積層インダクタが用いられるようになっている。ま
た、これとコンデンサを一体に形成したLC複合部品も利
用されている。その中に、分布乗数回路を実現するため
に、第3図で示したような積層複合部品が用いられてい
る。これは、磁性体の積層体50の内部に積層方向に重畳
して周回する導体パターン56と、導体パターン61を水平
方向に対向して配置したものである。導体パターン56と
導体パターン61間で容量を形成している。With the demand for smaller and thinner electronic components, multilayer inductors have been used in the field of inductors, in which a conductor pattern is formed by printing in an insulative ceramic layer instead of winding a wire. ing. In addition, LC composite parts in which this and a capacitor are integrally formed are also used. Among them, a laminated composite component as shown in FIG. 3 is used to realize a distributed multiplier circuit. In this example, a conductor pattern 56 and a conductor pattern 61, which are superposed in the lamination direction and circumnavigate in the laminated body 50 of the magnetic body, are arranged to face each other in the horizontal direction. A capacitance is formed between the conductor pattern 56 and the conductor pattern 61.
上記のような積層複合部品においては、導体パターン
は数十μmと薄く、水平方向の対向面積は小さいので、
十分な容量を得ることが難しい。In the multilayer composite component as described above, the conductor pattern is as thin as tens of μm, and the facing area in the horizontal direction is small.
It is difficult to obtain sufficient capacity.
本発明は、所望の容量を形成できる積層複合部品を提
供するものである。The present invention provides a laminated composite component capable of forming a desired capacity.
本発明は、導体パターンを積層方向に対向配置するこ
とによって、対向面積を大きくすることによって、上記
の課題を解決するものである。The present invention solves the above-described problem by arranging the conductor patterns to face each other in the stacking direction to increase the facing area.
すなわち、絶縁体層を挟んで形成された二組の複数本
の平行な導体パターンが、該絶縁体層に形成されたスル
ーホールに充填された導体で接続され、積層方向に垂直
な方向に重畳して周回する導体のコイルパターンを具え
た積層複合部品において、前記絶縁体層とは別の絶縁体
層に形成されたスルーホールを介して該平行な導体パタ
ーンと接続されるとともに該平行な導体パターンと対向
する第二の導体パターンおよび該第二の導体パターンと
対向して容量を形成する導体パターンを具えたことに特
徴を有する。That is, two sets of a plurality of parallel conductor patterns formed with the insulator layer interposed therebetween are connected by conductors filled in through holes formed in the insulator layer, and overlap in a direction perpendicular to the laminating direction. A laminated composite component provided with a coil pattern of a conductor that circulates around and is connected to the parallel conductor pattern via a through hole formed in an insulator layer different from the insulator layer, and is connected to the parallel conductor. It is characterized by comprising a second conductor pattern facing the pattern and a conductor pattern forming a capacitor facing the second conductor pattern.
積層方向に導体パターンが対向するので、コイル形成
用の導体パターンとの対向面積は大きくなり、容量も大
きな値が得られる。Since the conductor patterns face each other in the stacking direction, the area of the conductor patterns facing the coil-forming conductor patterns increases, and a large capacitance can be obtained.
これによって、フィルタ、遅延線等に適した三端子の
LC素子が得られる。This allows three terminals suitable for filters, delay lines, etc.
An LC element is obtained.
以下、図面を参照して、本発明の実施例について説明
する。Hereinafter, embodiments of the present invention will be described with reference to the drawings.
第1図は、本発明の実施例を示す斜視図である。フェ
ライト等の磁性体セラミックにバインダを加えてスラリ
ーとし、ドクターブレード法などによって所定の厚みと
したグリーンシート31の表面に、平行な同じ長さ導体パ
ターン36を銀等の導体ペーストの印刷によって形成す
る。なお、この導体パターンの始端と終端は、対向する
二つの端面にそれぞれ引き出して形成しておく。FIG. 1 is a perspective view showing an embodiment of the present invention. A slurry is formed by adding a binder to a magnetic ceramic such as ferrite, and a conductive pattern 36 of the same length is formed by printing a conductive paste of the same length in parallel on the surface of the green sheet 31 having a predetermined thickness by a doctor blade method or the like. . The starting end and the ending of the conductor pattern are drawn out and formed on two opposing end surfaces.
この上に磁性体シート32を載せるが、磁性体シート32
の上面には平行な導体パターン37を形成しておく。この
導体パターン37も平行で同じ長さとするが、形成する向
きを導体パターン36とずらして導体パターン37の一つが
ある導体パターン36と一端で接続し、別の導体パターン
37と他端で接続するように配置して形成する。それによ
って、導体パターン36と導体パターン37は一方の端部に
おいて、隣の導体パターンと接続されることになり、磁
性体シートの積層方向に垂直な方向に重畳して周回する
導体パターンを具えたコイルが得られる。The magnetic sheet 32 is placed on this, but the magnetic sheet 32
A parallel conductor pattern 37 is formed on the upper surface of the substrate. This conductor pattern 37 is also parallel and has the same length, but the direction of formation is shifted from the conductor pattern 36, and one end of the conductor pattern 37 is connected to one conductor pattern 36, and another conductor pattern 37 is formed.
It is arranged to be connected to 37 at the other end. As a result, the conductor pattern 36 and the conductor pattern 37 were connected to the adjacent conductor pattern at one end, and provided a conductor pattern that wrapped around in a direction perpendicular to the lamination direction of the magnetic sheets. A coil is obtained.
導体パターン36と導体パターン37の接続のために、導
体パターン37の端部にあたる部分の磁性体シートにはス
ルーホールが形成され、積層する前に導体38が充填され
る。この導体38によて上下の導体パターンが接続され
る。In order to connect the conductor pattern 36 and the conductor pattern 37, a through hole is formed in a portion of the magnetic material sheet corresponding to the end of the conductor pattern 37, and the conductor 38 is filled before lamination. The conductor patterns connect the upper and lower conductor patterns.
磁性体シート32の上面には絶縁体が積層されるが、絶
縁体シート33の上面にコンデンサ用の一方の導体パター
ン39を形成し、スルーホールに充填した導体40によっ
て、導体パターン37の一点と接続される。そして、この
導体パターン39がシート34の導体パターン41と対向して
容量を得るようにしたものである。An insulator is laminated on the upper surface of the magnetic sheet 32, but one conductor pattern 39 for a capacitor is formed on the upper surface of the insulator sheet 33, and the conductor 40 filled in the through hole is used as one point of the conductor pattern 37. Connected. The conductor pattern 39 opposes the conductor pattern 41 of the sheet 34 to obtain a capacitance.
積層、圧着、焼成の工程を経て積層複合部品が得られ
る。この場合、第2図に示したように、コイルからタッ
プが引き出され、これに容量が接続された三端子型のLC
回路が得られる。A laminated composite component is obtained through the steps of lamination, pressure bonding, and firing. In this case, as shown in FIG. 2, a tap is pulled out of the coil, and a capacitor is connected to the tap.
A circuit is obtained.
なお、シートの材料は磁性体に限られず、誘電体を用
いることもできる。高いインダクタンスを必要とすると
きには、透磁率の高い磁性材料を用いるとよいし、容量
を大きくするためにコンデンサ部分に誘電率の高い材料
を使ってもよい。そして、これらの材料を使い分けて、
一体化することも可能である。ただし、焼成時の収縮率
等を合せ込んでおくと、歩留まり、信頼性当の面で有利
となる。The material of the sheet is not limited to a magnetic material, and a dielectric material can be used. When a high inductance is required, a magnetic material having a high magnetic permeability may be used, or a material having a high dielectric constant may be used for the capacitor portion in order to increase the capacitance. And use these materials properly,
It is also possible to integrate them. However, if the shrinkage ratio during firing is adjusted, it is advantageous in terms of yield and reliability.
また、容量形成用の電極をコイルパターンの両面に形
成して、大きな容量を得ることもできる。あるいは、コ
イルから複数のタップを引き出す構造として、その上面
には複数の分割された導体パターンを設けた絶縁体シー
トを重ねて並列にコンデンサを形成して、一素子でフィ
ルタ、遅延線等を構成することも可能である。Also, a large capacitance can be obtained by forming capacitance forming electrodes on both sides of the coil pattern. Alternatively, as a structure in which a plurality of taps are pulled out from a coil, an insulator sheet provided with a plurality of divided conductor patterns is stacked on the upper surface to form a capacitor in parallel, and a filter, a delay line, and the like are configured with one element. It is also possible.
本発明によれば、LC複合部品において大きな容量を形
成することができる。また、シートの積層方法を変える
ことによって、任意の容量を得ることも可能となる。According to the present invention, a large capacitance can be formed in the LC composite component. Further, by changing the method of laminating the sheets, it is possible to obtain an arbitrary capacity.
さらに、スルーホールのパターンを変えることによっ
て、回路構成そのものを変えることもでき、広範な用途
のLC複合部品が得られる。Furthermore, by changing the pattern of the through hole, the circuit configuration itself can be changed, and LC composite parts for a wide range of applications can be obtained.
第1図は本発明の実施例を示す斜視図、第2図はその等
価回路図であり、第3図は従来の積層複合部品の平面図
である。 31−35:絶縁体シート 36、37、39、41:導体パターン 38、40:(スルーホールに充填された)導体FIG. 1 is a perspective view showing an embodiment of the present invention, FIG. 2 is an equivalent circuit diagram thereof, and FIG. 3 is a plan view of a conventional laminated composite component. 31-35: Insulator sheet 36, 37, 39, 41: Conductor pattern 38, 40: Conductor (filled in through hole)
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6,DB名) H01G 4/00 - 4/40 H01F 15/00 H01F 17/00 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 6 , DB name) H01G 4/00-4/40 H01F 15/00 H01F 17/00
Claims (2)
の平行な導体パターンが、該絶縁体層に形成されたスル
ーホールに充填された導体で接続され、積層方向に垂直
な方向に重畳して周回する導体のコイルパターンを具え
た積層複合部品において、前記絶縁体層とは別の絶縁体
層に形成されたスルーホールを介して該平行な導体パタ
ーンと接続されるとともに該平行な導体パターンと対向
する第二の導体パターンおよび該第二の導体パターンと
対向して容量を形成する導体パターンを具えたことを特
徴とする積層複合部品。1. A method according to claim 1, wherein two sets of a plurality of parallel conductor patterns formed with the insulator layer interposed therebetween are connected by conductors filled in through holes formed in the insulator layer, and are perpendicular to the laminating direction. A laminated composite component having a coil pattern of a conductor that circulates in a direction overlapping and connected to the parallel conductor pattern through a through hole formed in an insulator layer different from the insulator layer; A laminated composite component comprising: a second conductor pattern facing a parallel conductor pattern; and a conductor pattern facing a capacitance of the second conductor pattern.
の導体パターンとが、スルーホールに充填された導体に
よって接続された請求項1記載の積層複合部品。2. The laminated composite component according to claim 1, wherein the intermediate portion of the parallel conductor pattern and the second conductor pattern are connected by a conductor filled in a through hole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3067990A JP2909122B2 (en) | 1990-02-09 | 1990-02-09 | Laminated composite parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3067990A JP2909122B2 (en) | 1990-02-09 | 1990-02-09 | Laminated composite parts |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03263311A JPH03263311A (en) | 1991-11-22 |
JP2909122B2 true JP2909122B2 (en) | 1999-06-23 |
Family
ID=12310388
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3067990A Expired - Fee Related JP2909122B2 (en) | 1990-02-09 | 1990-02-09 | Laminated composite parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2909122B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109643597A (en) * | 2016-09-02 | 2019-04-16 | 株式会社村田制作所 | Inductor components and power module |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003100524A (en) * | 2001-09-27 | 2003-04-04 | Murata Mfg Co Ltd | Laminated lc part |
JP2005184343A (en) * | 2003-12-18 | 2005-07-07 | Murata Mfg Co Ltd | Laminated ceramic electronic part |
KR101514554B1 (en) * | 2013-10-18 | 2015-04-22 | 삼성전기주식회사 | Composite electronic component and board for mounting the same |
-
1990
- 1990-02-09 JP JP3067990A patent/JP2909122B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109643597A (en) * | 2016-09-02 | 2019-04-16 | 株式会社村田制作所 | Inductor components and power module |
EP3493227A4 (en) * | 2016-09-02 | 2020-01-22 | Murata Manufacturing Co., Ltd. | Inductor component and power supply module |
Also Published As
Publication number | Publication date |
---|---|
JPH03263311A (en) | 1991-11-22 |
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