JPH06224043A - Laminated chip transformer and manufacture thereof - Google Patents
Laminated chip transformer and manufacture thereofInfo
- Publication number
- JPH06224043A JPH06224043A JP3140193A JP3140193A JPH06224043A JP H06224043 A JPH06224043 A JP H06224043A JP 3140193 A JP3140193 A JP 3140193A JP 3140193 A JP3140193 A JP 3140193A JP H06224043 A JPH06224043 A JP H06224043A
- Authority
- JP
- Japan
- Prior art keywords
- coil
- sheet
- permeability
- coil conductor
- magnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Manufacturing Cores, Coils, And Magnets (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、積層チップトランスと
その製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated chip transformer and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】従来、磁性体中に複数のコイル導体を埋
設してトランスを構成した積層チップトランスは、例え
ばＮｉ−Ｚｎ系フェライトのようなフェライト原料から
調製した磁性体グリーンシートの表面に、ＡｇやＡｇ−
Ｐｄなどを主成分とする電極ペーストを印刷し、積層し
てスルーホール接続することによってらせん状のコイル
が構成されるコイル導体パターンを形成し、このコイル
導体パターンが形成された複数枚の磁性体グリーンシー
トを、それらの上下にそれぞれ配置したコイル導体パタ
ーンが形成されていないダミーシートとともに積層し、
加圧圧着した後、焼成して一体化し、外部端子電極を形
成することにより製造されてきた。2. Description of the Related Art Conventionally, a laminated chip transformer in which a plurality of coil conductors are embedded in a magnetic material to form a transformer is provided, for example, on a surface of a magnetic material green sheet prepared from a ferrite raw material such as Ni-Zn ferrite. Ag and Ag-
A plurality of magnetic bodies having a coil conductor pattern formed by printing an electrode paste containing Pd or the like as a main component, stacking them, and forming through-hole connections to form a coil conductor pattern are formed. Laminate the green sheets together with the dummy sheets on which the coil conductor patterns arranged above and below them are not formed,
It has been manufactured by pressing and pressure-bonding, then firing and integrating to form an external terminal electrode.
【０００３】上記のような方法で製造される従来の積層
チップトランスの構成の一例を、図２の積層体の断面図
を用いて以下に示す。図２に示す積層チップトランスを
構成する積層体は、磁性体内部に３個のコイルが埋設さ
れてなるものであって、１次側のコイル導体パターン３
を２層積層することによって構成された１次コイル６の
上下に、２次側のコイル導体パターン４を２層積層する
ことによって構成された２次コイル７が埋設されてい
る。An example of the structure of a conventional laminated chip transformer manufactured by the above method will be shown below with reference to the sectional view of the laminated body of FIG. The laminated body constituting the laminated chip transformer shown in FIG. 2 is formed by embedding three coils inside a magnetic body, and has a coil conductor pattern 3 on the primary side.
A secondary coil 7 formed by laminating two layers of the coil conductor pattern 4 on the secondary side is embedded above and below the primary coil 6 formed by laminating two layers.
【０００４】このような積層体からなる積層チップトラ
ンスは、図３の等価回路図に示すように、１次コイル６
と２次コイル７との間に電磁誘導結合を生じさせたもの
であり、このようなトランスにおいて、１次コイルと２
次コイルとの電磁誘導結合係数を大きくするためには、
１次コイル６を構成する１次側のコイル導体パターン３
と２次コイル７を構成する２次側のコイル導体パターン
４との間の距離ｄを小さくし、併せて各コイル導体パタ
ーン間の間隔ｔ1 （１次コイル）、ｔ2 （２次コイル）
をそれぞれ小さくすることが有効である。A laminated chip transformer made of such a laminated body has a primary coil 6 as shown in the equivalent circuit diagram of FIG.
Electromagnetic induction coupling between the primary coil and the secondary coil 7.
To increase the electromagnetic induction coupling coefficient with the secondary coil,
Primary-side coil conductor pattern 3 that constitutes the primary coil 6
The distance d between the coil conductor pattern 4 on the secondary side constituting the secondary coil 7 and the coil conductor pattern 4 on the secondary side, and the intervals t 1 (primary coil) and t 2 (secondary coil) between the coil conductor patterns.
It is effective to make each of them smaller.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、１次コ
イル６と２次コイル７との間の距離ｄを小さくすると該
コイル間の絶縁耐圧が低くなり、また結合浮遊容量Ｃｄ
も増大することになり、同様に各コイル導体パターン間
の間隔ｔ1 またはｔ2 を狭めれば、並列浮遊容量Ｃ1 ま
たはＣ2 を増大させることになり、これら結合浮遊容量
や並列浮遊容量が増大するとトランスの高周波特性が劣
化するという課題があった。However, when the distance d between the primary coil 6 and the secondary coil 7 is reduced, the dielectric strength voltage between the coils is reduced, and the coupling stray capacitance Cd is reduced.
Similarly, if the distance t 1 or t 2 between the coil conductor patterns is narrowed, the parallel stray capacitance C 1 or C 2 is increased, and these coupling stray capacitance and parallel stray capacitance are increased. There is a problem in that the high frequency characteristics of the transformer deteriorate when the number increases.
【０００６】このような課題を解決する手段として、磁
性体ペーストと導体ペーストとを交互に印刷して積み重
ね、コイルを積層体内に設けるいわゆるスラリービルド
法によれば、コイル導体の周囲を低透磁率の磁性体で覆
うことが可能となり、並列浮遊容量の低減を計ることが
できるという提案や、セラミックグリーンシートを予め
形成した後、そのセラミックグリーンシート上にコイル
導体を印刷して積層するいわゆるシート法においては、
１次コイルと２次コイルとの間にコイルと同形の低透磁
率層を形成することによって結合浮遊容量を小さくする
方法が提案されてはいるが、何れも未だに十分な周波数
特性を得るには至っていない。As a means for solving such a problem, according to a so-called slurry build method in which a magnetic paste and a conductor paste are alternately printed and stacked and a coil is provided in a laminated body, a low magnetic permeability is provided around the coil conductor. It is possible to cover with the magnetic substance of the above, and it is possible to reduce the parallel stray capacitance, and a so-called sheet method in which a ceramic green sheet is formed in advance and then a coil conductor is printed and laminated on the ceramic green sheet. In
Although a method of reducing the coupling stray capacitance by forming a low-permeability layer having the same shape as that of the coil between the primary coil and the secondary coil has been proposed, both methods still require sufficient frequency characteristics. I haven't arrived.
【０００７】したがって本発明の目的は、１次コイルと
２次コイルとの電磁誘導結合係数を大きくしながら、両
コイル間の絶縁耐圧を高くし、かつ結合浮遊容量を小さ
くでき、コイルを形成するコイル導体パターン間に発生
する並列浮遊容量をも低減して高周波特性を良好にした
積層チップトランスおよびその製造方法を提供すること
にある。Therefore, an object of the present invention is to form a coil by increasing the electromagnetic induction coupling coefficient between the primary coil and the secondary coil, increasing the withstand voltage between both coils, and reducing the coupling stray capacitance. It is an object of the present invention to provide a multilayer chip transformer in which parallel stray capacitance generated between coil conductor patterns is also reduced and good high frequency characteristics are provided, and a manufacturing method thereof.
【０００８】[0008]
【課題を解決するための手段】本発明者等は上記目的を
達成すべく鋭意研究した結果、低透磁率磁性体シートを
用いて、その上にそれぞれ１次コイルおよび２次コイル
用のコイル導体パターンを印刷するとともに、コイル導
体パターン以外の部分には高透磁率磁性体ペーストを印
刷し、さらに１次コイルと２次コイルとの間、ならびに
コイル導体パターンを印刷した最上層部の上と同じく最
下層部の下に低透磁率磁性体シートを配し、前記コイル
導体パターンを印刷したシートと同様に高透磁率磁性体
ペーストを印刷し、これら印刷部の上下には複数枚の高
透磁率磁性体シートをダミーシートとして積層するよう
にして積層チップ素体を形成すれば、前記課題を解決し
た積層チップトランスが得られることを見い出し、本発
明に到達した。Means for Solving the Problems As a result of intensive studies to achieve the above object, the present inventors have used a low-permeability magnetic sheet on which a coil conductor for a primary coil and a coil conductor for a secondary coil, respectively. Along with printing the pattern, the high-permeability magnetic paste is printed on the parts other than the coil conductor pattern, and between the primary coil and the secondary coil, as well as on the uppermost layer part where the coil conductor pattern is printed. A low-permeability magnetic material sheet is arranged below the lowermost layer portion, and a high-permeability magnetic material paste is printed in the same manner as the sheet on which the coil conductor pattern is printed. It has been found that a laminated chip transformer that solves the above problems can be obtained by forming a laminated chip element body by laminating magnetic sheets as dummy sheets, and arrived at the present invention.
【０００９】すなわち、本発明は、磁性体からなるチッ
プ素体の内部に、該磁性体の一部を薄層状に介在させて
積層的に埋設された複数のコイル導体が含まれてなり、
これらコイル導体の端末が、該チップ素体の端面に導出
され、素体の端面に形成された外部端子電極に接続され
ている積層チップトランスであって、前記コイル導体の
周囲部分と、前記薄層状介在部分が低透磁率磁性体で構
成されていることを特徴とする積層チップトランス；お
よび複数枚重ねたカバーシートの上に、コイル導体パタ
ーンを上面に形成した複数の磁性体グリーンシートを所
定の構成で積層してスルーホール接続し、この上にコイ
ル導体パターンが形成されていないダミーシートを介在
させた後、上記同様にコイル導体パターンを上面に形成
した複数の磁性体グリーンシートを積層およびスルーホ
ール接続するという操作を所定回数繰り返した後、最上
層に複数枚重ねたカバーシートを積層して圧着し、得ら
れた圧着体をチップサイズに裁断して積層方向に複数個
のコイルが埋設されたチップ素体を得、これを焼成した
後、外部端子電極を形成することからなる積層チップト
ランスの製造方法において、積層体の上下部分にそれぞ
れ配置するカバーシートとして高透磁率磁性体グリーン
シートを用い、前記コイル導体パターンを上面に保持す
る磁性体グリーンシートとして、低透磁率グリーンシー
トの上面をなす一方の主面に、コイル周回パターン形状
に該主面を露出せしめて高透磁率磁性体ペーストを印刷
し、かつ該露出部分に、周囲の高透磁率磁性体ペースト
と接触せしめずにコイル導体パターンを印刷したシート
を用い（なお、コイル導体パターンにおける外部端子電
極との接続用引き出し部は高透磁率の磁性体ペーストと
接触しても良い）、前記介在ダミーシートとしては低透
磁率グリーンシートの上面をなす一方の主面に、コイル
周回パターン形状に主面を露出せしめて高透磁率磁性体
ペーストを印刷したシートを用いるとともに、該シート
と同様構成の低透磁率磁性体シートを、前記上部配置カ
バーシートと最上部配置のコイル導体パターン保持シー
トとの間に配置することを特徴とする積層チップトラン
スの製造方法を提供するものである。That is, according to the present invention, a plurality of coil conductors embedded in a laminated manner are provided inside a chip element body made of a magnetic material, with a part of the magnetic material being interposed in a thin layer.
A multilayer chip transformer in which terminals of these coil conductors are led out to an end surface of the chip element body and connected to external terminal electrodes formed on the end surface of the element body, wherein a peripheral portion of the coil conductor and the thin film A laminated chip transformer characterized in that the layered intervening portion is composed of a low-permeability magnetic material; and a plurality of magnetic green sheets each having a coil conductor pattern formed on the upper surface of a plurality of cover sheets stacked on top of each other. After stacking in the above-mentioned configuration to perform through-hole connection and interposing a dummy sheet on which no coil conductor pattern is formed, a plurality of magnetic green sheets having coil conductor patterns formed on the upper surface are laminated in the same manner as above. After repeating the operation of connecting through holes a predetermined number of times, stacking multiple cover sheets on the top layer and crimping them, and then crimping the resulting crimped body. In a method of manufacturing a laminated chip transformer, which comprises cutting a chip to obtain a chip element body in which a plurality of coils are embedded in a laminating direction, firing the same, and then forming external terminal electrodes, the upper and lower parts of the laminated body. A high-permeability magnetic green sheet is used as the cover sheet to be respectively placed on the upper surface, and as the magnetic green sheet holding the coil conductor pattern on the upper surface, the coil winding pattern is formed on one main surface forming the upper surface of the low-permeability green sheet. Using a sheet on which the main surface is exposed to form a high-permeability magnetic paste and printed, and a coil conductor pattern is printed on the exposed portion without being brought into contact with the surrounding high-permeability magnetic paste (note that The lead portion for connection to the external terminal electrode in the coil conductor pattern may be in contact with the magnetic paste of high magnetic permeability), the interposition dummy As the sheet, on one main surface forming the upper surface of the low-permeability green sheet, a sheet in which a main surface is exposed in a coil winding pattern shape and a high-permeability magnetic paste is printed is used. A method of manufacturing a laminated chip transformer, characterized in that a low-permeability magnetic sheet is arranged between the upper cover sheet and the uppermost coil conductor pattern holding sheet.
【００１０】[0010]
【作用】本発明の方法によれば、低透磁率の磁性体グリ
ーンシートの一方の主面に、積層してスルーホール接続
することによってコイルが構成されるコイル導体パター
ンを印刷するとともに、該導体パターン以外の前記主面
に高透磁率の磁性体ペーストを塗布した後、積層圧着さ
れるので、コイル導体パターンと高透磁率磁性体ペース
トとの間は、圧着によって隣接する低透磁率の磁性体グ
リーンシートによって埋められ、該導体パターンの周囲
が低透磁率層で覆われるようになる。そのため、並列浮
遊容量が小さくなり、また１次と２次の両コイル間は低
透磁率層が介在するので結合浮遊容量も小さくなる。According to the method of the present invention, a coil conductor pattern which constitutes a coil is printed on one main surface of a magnetic material green sheet having a low magnetic permeability by stacking through-hole connections, and at the same time, the conductor is formed. Since a magnetic paste having a high magnetic permeability is applied to the main surface other than the pattern and then laminated and pressure-bonded, a magnetic substance having a low magnetic permeability which is adjacent to the coil conductor pattern and the high-permeability magnetic substance paste by pressure bonding. It is filled with the green sheet, and the periphery of the conductor pattern is covered with the low magnetic permeability layer. Therefore, the parallel stray capacitance becomes small, and since the low magnetic permeability layer is interposed between the primary coil and the secondary coil, the coupling stray capacitance also becomes small.
【００１１】したがって、本発明の積層チップトランス
は、上記のように１次コイルおよび２次コイルを構成す
るコイル導体パターンのまわりが低透磁率磁性体領域と
なるため、１次コイルもしくは２次コイルで発生した磁
束が１次コイルおよび２次コイル自身、あるいは１次コ
イルと２次コイル間の間隙部から外部へ漏出しにくくな
る。すなわち、磁束が１次コイルの端から２次コイルの
端まで両コイル内を貫通するようになるため、両コイル
間の電磁誘導係数を大きくすることができるようになる
のである。Therefore, in the laminated chip transformer of the present invention, as described above, the area around the coil conductor pattern forming the primary coil and the secondary coil is the low magnetic permeability magnetic material region, so that the primary coil or the secondary coil is formed. It becomes difficult for the magnetic flux generated in step 2 to leak to the outside through the primary coil and the secondary coil itself or the gap between the primary coil and the secondary coil. That is, since the magnetic flux penetrates through both coils from the end of the primary coil to the end of the secondary coil, the electromagnetic induction coefficient between both coils can be increased.
【００１２】[0012]
【実施例】本発明の一例を、図１および図４を用いて以
下に説明する。なお、図１は本実施例において製造され
た積層チップトランスを構成する積層体の断面図、図４
は図１に示した積層体を構成する各種シートの積層態様
を示す積層体の分解斜視図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS An example of the present invention will be described below with reference to FIGS. 1 is a cross-sectional view of a laminated body that constitutes the laminated chip transformer manufactured in this embodiment, and FIG.
[Fig. 2] is an exploded perspective view of a laminated body showing a laminated manner of various sheets constituting the laminated body shown in Fig. 1.
【００１３】まず、Ｎｉ−Ｚｎ系フェライト粉末にバイ
ンダーを混合して調製したスラリーを用い、ドクターブ
レード法によって厚さ約50μｍのシートを形成し、これ
を一定寸法に打ち抜き、高透磁率磁性体グリーンシート
１および低透磁率磁性体グリーンシート２を得た。First, using a slurry prepared by mixing Ni-Zn ferrite powder with a binder, a sheet having a thickness of about 50 μm is formed by a doctor blade method, and this sheet is punched into a certain size to obtain a high magnetic permeability green. A sheet 1 and a low-permeability magnetic substance green sheet 2 were obtained.
【００１４】次に、上記低透磁率磁性体グリーンシート
２における一方の主面に、コイルの周回パターン形状に
該主面が露出するように高透磁率磁性体ペースト５を塗
布した。次いで、このシートにおける低透磁率磁性体グ
リーンシートの露出部分に、ＡｇもしくはＡｇ−Ｐｄを
主成分とする電極ペーストを用いて、１次側のコイル導
体パターン３および２次側のコイル導体パターン４を、
高透磁率導電ペーストと接触しないように約0.5mm の距
離を置いて線幅１mmで15〜20μｍの厚さに印刷した。な
お、コイル導体パターンにおける外部端子電極との接続
用引き出し部は、高透磁率導電ペースト上に重ねて印刷
した。Next, a high-permeability magnetic paste 5 was applied to one main surface of the low-permeability magnetic green sheet 2 so that the main surface was exposed in a coil winding pattern shape. Then, the primary side coil conductor pattern 3 and the secondary side coil conductor pattern 4 were formed on the exposed portion of the low-permeability magnetic green sheet of this sheet by using an electrode paste containing Ag or Ag-Pd as a main component. To
Printing was performed with a line width of 1 mm and a thickness of 15 to 20 μm at a distance of about 0.5 mm so as not to come into contact with the high-permeability conductive paste. The lead portion for connection with the external terminal electrode in the coil conductor pattern was printed on the high-permeability conductive paste in an overlapping manner.
【００１５】次に、高透磁率磁性体グリーンシート１、
高透磁率磁性体ペースト５およびコイル導体パターンが
印刷された低透磁率磁性体グリーンシート２、ならびに
高透磁率磁性体ペースト５のみが印刷された低透磁率磁
性体グリーンシート２を、図４に示すような態様、すな
わち中央部に配置されスルーホール８によって接続され
てなる１次コイル、および１次コイルの上下に分割配置
され、スルーホール８によって接続されてなる２次コイ
ルが構成される態様で積層および圧着して一体化した
後、焼成した。Next, the high permeability magnetic material green sheet 1,
FIG. 4 shows the low-permeability magnetic material green sheet 2 on which the high-permeability magnetic material paste 5 and the coil conductor pattern are printed, and the low-permeability magnetic material green sheet 2 on which only the high-permeability magnetic material paste 5 is printed. As shown, that is, a primary coil arranged in the central portion and connected by a through hole 8 and a secondary coil dividedly arranged above and below the primary coil and connected by the through hole 8 are configured. After being laminated and pressure-bonded with each other to integrate them, they were fired.
【００１６】なお、積層圧着の際には、各コイル導体パ
ターンと高透磁率磁性体ペーストとの間は圧着によって
隣接する低透磁率磁性体グリーンシートが埋めて、該導
体パターンの周囲が低透磁率層で覆われる状態となる。In the laminated pressure-bonding, adjacent low-permeability magnetic material green sheets are buried between the coil conductor patterns and the high-permeability magnetic material paste by pressure bonding so that the periphery of the conductor patterns has low permeability. It will be covered with the magnetic susceptibility layer.
【００１７】次いで、焼成された積層チップ素体の表面
をバレル研磨した後、該素体におけるコイル導体末端部
が導出している端面に電極ペーストを塗布し、これを焼
き付けることにより外部電極を形成し、本発明の積層チ
ップトランスを得た。Next, after barrel-polishing the surface of the fired laminated chip element body, an electrode paste is applied to the end surface of the element body from which the terminal end of the coil conductor is extended, and this is baked to form an external electrode. Then, a laminated chip transformer of the present invention was obtained.
【００１８】上記方法で製造された積層チップトランス
は、図１の断面図に示すように、中央部の２層からなる
１次コイル６に対して、その上下には２分割して２層づ
つの２次コイル７が配置されており、しかも各コイル導
体パターンの回りはすべて低透磁率層であるため、１次
コイルおよび２次コイル部での漏れ磁束は低減される。As shown in the cross-sectional view of FIG. 1, the laminated chip transformer manufactured by the above method is divided into two layers above and below the primary coil 6 consisting of two layers in the central portion. The secondary coil 7 is disposed, and since the coil conductor patterns are all surrounded by the low magnetic permeability layer, the leakage flux in the primary coil and the secondary coil portion is reduced.
【００１９】[0019]
【発明の効果】以上説明したように、本発明の積層チッ
プトランスは、コイル導体のまわりが低透磁率領域で占
められているので、１次コイル部および２次コイル部に
おける漏れ磁束を低減させ、コイル間の電磁誘導結合係
数を大きくすることができる上、各コイル部での並列浮
遊容量を小さくすることができる。As described above, in the laminated chip transformer of the present invention, since the area around the coil conductor is occupied by the low magnetic permeability region, the leakage magnetic flux in the primary coil portion and the secondary coil portion is reduced. The electromagnetic induction coupling coefficient between the coils can be increased, and the parallel stray capacitance in each coil can be reduced.
【００２０】また、該電磁誘導結合係数を大きくしなが
ら絶縁耐圧を高く、かつ両コイル間の結合浮遊容量も小
さくでき、良好な高周波特性が得られる。Also, the dielectric strength can be increased while increasing the electromagnetic induction coupling coefficient, and the coupling stray capacitance between both coils can be reduced, so that good high frequency characteristics can be obtained.
【図１】本発明の積層チップトランスの一例を構成する
積層体の断面図である。FIG. 1 is a cross-sectional view of a laminated body that constitutes an example of the laminated chip transformer of the present invention.
【図２】従来の積層チップトランスの一例を構成する積
層体の模式断面図である。FIG. 2 is a schematic cross-sectional view of a laminated body that constitutes an example of a conventional laminated chip transformer.
【図３】図２に示した積層体からなる積層チップトラン
スの等価回路図である。3 is an equivalent circuit diagram of a laminated chip transformer including the laminated body shown in FIG.
【図４】本発明の積層チップトランスの製造工程におけ
る積層工程を説明するための図であって、本発明の積層
チップトランスを構成する積層体の一例の分解斜視図で
ある。FIG. 4 is a diagram for explaining a stacking step in a manufacturing process of the multilayer chip transformer of the present invention, and an exploded perspective view of an example of a stacked body forming the multilayer chip transformer of the present invention.
１ 高透磁率磁性体グリーンシート ２ 低透磁率磁性体グリーンシート ３ １次側のコイル導体パターン ４ ２次側のコイル導体パターン ５ 高透磁率磁性体ペースト ６ １次コイル ７ ２次コイル ８ スルーホール Ｃ1 １次側並列浮遊容量 Ｃ2 ２次側並列浮遊容量 Ｃd 結合浮遊容量 ｔ1 １次コイルにおけるコイル導体パターン間の距離 ｔ2 ２次コイルにおけるコイル導体パターン間の距離 ｄ １次側と２次側のコイル導体パターン間の距離1 High Permeability Magnetic Green Sheet 2 Low Permeability Magnetic Green Sheet 3 Primary Side Coil Conductor Pattern 4 Secondary Side Coil Conductor Pattern 5 High Permeability Magnetic Material Paste 6 Primary Coil 7 Secondary Coil 8 Through Hole C 1 Primary side parallel stray capacitance C 2 Secondary side parallel stray capacitance Cd Coupling stray capacitance t 1 Distance between coil conductor patterns in primary coil t 2 Distance between coil conductor patterns in secondary coil d Primary side and 2 Distance between coil conductor patterns on the secondary side
Claims (2)
磁性体の一部を薄層状に介在させて積層的に埋設された
複数のコイル導体が含まれてなり、これらコイル導体の
端末が、該チップ素体の端面に導出され、素体の端面に
形成された外部端子電極に接続されている積層チップト
ランスであって、前記コイル導体の周囲部分と、前記薄
層状介在部分が低透磁率磁性体で構成されていることを
特徴とする積層チップトランス。1. A chip element body made of a magnetic material includes a plurality of coil conductors embedded in a laminated manner with a part of the magnetic material interposed in a thin layer, and ends of the coil conductors. Is a multilayer chip transformer that is led out to the end surface of the chip element body and connected to an external terminal electrode formed on the end surface of the element body, wherein the peripheral portion of the coil conductor and the thin layered interposing portion are low. A laminated chip transformer characterized by being composed of a magnetic permeability material.
ル導体パターンを上面に形成した複数の磁性体グリーン
シートを所定の構成で積層してスルーホール接続し、こ
の上にコイル導体パターンが形成されていないダミーシ
ートを介在させた後、上記同様にコイル導体パターンを
上面に形成した複数の磁性体グリーンシートを積層およ
びスルーホール接続するという操作を所定回数繰り返し
た後、最上層に複数枚重ねたカバーシートを積層して圧
着し、得られた圧着体を裁断してチップ素体とし、これ
を焼成した後、外部端子電極を形成することからなる積
層チップトランスの製造方法において、積層体の上下部
分にそれぞれ配置するカバーシートとして高透磁率磁性
体グリーンシートを用い、前記コイル導体パターンを上
面に保持する磁性体グリーンシートとして、低透磁率グ
リーンシートの上面をなす一方の主面に、コイル周回パ
ターン形状に該主面を露出せしめて高透磁率磁性体ペー
ストを印刷し、かつ該露出部分に、周囲の高透磁率磁性
体ペーストと接触せしめずにコイル導体パターンを印刷
したシートを用い、前記介在ダミーシートとしては低透
磁率グリーンシートの上面をなす一方の主面に、コイル
周回パターン形状に主面を露出せしめて高透磁率磁性体
ペーストを印刷したシートを用いるとともに、該シート
と同様構成の低透磁率磁性体シートを、前記上部配置カ
バーシートと最上部配置のコイル導体パターン保持シー
トとの間に配置することを特徴とする積層チップトラン
スの製造方法。2. A plurality of magnetic green sheets, each having a coil conductor pattern formed on the upper surface thereof, are laminated in a predetermined structure on a cover sheet having a plurality of layers and are through-hole connected, and a coil conductor pattern is formed thereon. After interposing a dummy sheet that has not been formed, repeat the operation of stacking multiple magnetic green sheets with coil conductor patterns formed on the top surface and connecting through holes in the same manner as above, and then stack multiple sheets on the top layer. In the manufacturing method of the laminated chip transformer, the cover sheet is laminated and pressure-bonded, the obtained pressure-bonded body is cut to obtain a chip element body, and the external terminal electrodes are formed after firing the chip element body. A magnetic material that uses a high-permeability magnetic material green sheet as a cover sheet disposed in each of the upper and lower parts and holds the coil conductor pattern on the top As a green sheet, one main surface forming the upper surface of the low-permeability green sheet is printed with a high-permeability magnetic paste by exposing the main surface in a coil winding pattern shape, and at the exposed portion, the surrounding high A sheet on which a coil conductor pattern is printed without making contact with the magnetic permeability paste is used.As the intervening dummy sheet, one of the main surfaces forming the upper surface of the low-permeability green sheet has its main surface exposed in the coil winding pattern shape. At the very least, a sheet printed with a high-permeability magnetic material paste is used, and a low-permeability magnetic material sheet having the same structure as the sheet is arranged between the upper cover sheet and the uppermost coil conductor pattern holding sheet. A method of manufacturing a layered chip transformer, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3140193A JPH06224043A (en) | 1993-01-27 | 1993-01-27 | Laminated chip transformer and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3140193A JPH06224043A (en) | 1993-01-27 | 1993-01-27 | Laminated chip transformer and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06224043A true JPH06224043A (en) | 1994-08-12 |
Family
ID=12330242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3140193A Withdrawn JPH06224043A (en) | 1993-01-27 | 1993-01-27 | Laminated chip transformer and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06224043A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000060619A1 (en) * | 1999-04-01 | 2000-10-12 | Midcom, Inc. | Multi-layer transformer apparatus and method |
| EP1290703A1 (en) * | 1998-07-06 | 2003-03-12 | Midcom, Inc. | Multi-layer transformer having electrical connection in a magnetic core |
| JP2005142793A (en) * | 2003-11-06 | 2005-06-02 | Sumida Corporation | Stacked common mode filter |
| WO2007088914A1 (en) * | 2006-01-31 | 2007-08-09 | Hitachi Metals, Ltd. | Laminated component and module using same |
| JP2007250832A (en) * | 2006-03-16 | 2007-09-27 | Matsushita Electric Ind Co Ltd | Common mode noise filter |
| WO2008004633A1 (en) * | 2006-07-05 | 2008-01-10 | Hitachi Metals, Ltd. | Laminated component |
| WO2008007705A1 (en) * | 2006-07-12 | 2008-01-17 | Fdk Corporation | Layered inductor |
| JP2008130736A (en) * | 2006-11-20 | 2008-06-05 | Hitachi Metals Ltd | Electronic component and its manufacturing method |
| JP2008258525A (en) * | 2007-04-09 | 2008-10-23 | Matsushita Electric Ind Co Ltd | Common-mode noise filter |
| JPWO2008018203A1 (en) * | 2006-08-07 | 2009-12-24 | 株式会社村田製作所 | Multilayer coil component and manufacturing method thereof |
| US7864017B2 (en) * | 2007-02-20 | 2011-01-04 | Tdk Corporation | Thin-film magnetic device, and electronic component module having same |
| US20120161914A1 (en) * | 2010-12-24 | 2012-06-28 | Samsung Electro-Mechanics Co., Ltd. | Transformer |
| KR101408628B1 (en) * | 2012-08-29 | 2014-06-17 | 삼성전기주식회사 | Coil component |
| US10153666B2 (en) | 2011-11-04 | 2018-12-11 | Lg Innotek Co., Ltd. | Wireless power receiver and control method thereof |
| JP2019114582A (en) * | 2017-12-20 | 2019-07-11 | 太陽誘電株式会社 | Magnetic coupling type coil component |
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-
1993
- 1993-01-27 JP JP3140193A patent/JPH06224043A/en not_active Withdrawn
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|---|---|---|---|---|
| EP1290703A1 (en) * | 1998-07-06 | 2003-03-12 | Midcom, Inc. | Multi-layer transformer having electrical connection in a magnetic core |
| EP1290703A4 (en) * | 1998-07-06 | 2009-06-17 | Nascentechnology Inc | Multi-layer transformer having electrical connection in a magnetic core |
| WO2000060619A1 (en) * | 1999-04-01 | 2000-10-12 | Midcom, Inc. | Multi-layer transformer apparatus and method |
| US6198374B1 (en) | 1999-04-01 | 2001-03-06 | Midcom, Inc. | Multi-layer transformer apparatus and method |
| JP2005142793A (en) * | 2003-11-06 | 2005-06-02 | Sumida Corporation | Stacked common mode filter |
| JP4598384B2 (en) * | 2003-11-06 | 2010-12-15 | スミダコーポレーション株式会社 | Multilayer common mode filter |
| US8018313B2 (en) | 2006-01-31 | 2011-09-13 | Hitachi Metals, Ltd. | Laminate device and module comprising same |
| WO2007088914A1 (en) * | 2006-01-31 | 2007-08-09 | Hitachi Metals, Ltd. | Laminated component and module using same |
| JPWO2007088914A1 (en) * | 2006-01-31 | 2009-06-25 | 日立金属株式会社 | Laminated component and module using the same |
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| JP2007250832A (en) * | 2006-03-16 | 2007-09-27 | Matsushita Electric Ind Co Ltd | Common mode noise filter |
| WO2008004633A1 (en) * | 2006-07-05 | 2008-01-10 | Hitachi Metals, Ltd. | Laminated component |
| JP5446262B2 (en) * | 2006-07-05 | 2014-03-19 | 日立金属株式会社 | Laminated parts |
| US8004381B2 (en) | 2006-07-05 | 2011-08-23 | Hitachi Metals, Ltd. | Laminated device |
| WO2008007705A1 (en) * | 2006-07-12 | 2008-01-17 | Fdk Corporation | Layered inductor |
| KR101373243B1 (en) * | 2006-07-12 | 2014-03-12 | 에프디케이 가부시키가이샤 | Layered inductor |
| JP2008021788A (en) * | 2006-07-12 | 2008-01-31 | Fdk Corp | Multilayer inductor |
| JPWO2008018203A1 (en) * | 2006-08-07 | 2009-12-24 | 株式会社村田製作所 | Multilayer coil component and manufacturing method thereof |
| JP4737199B2 (en) * | 2006-08-07 | 2011-07-27 | 株式会社村田製作所 | Multilayer coil parts |
| JP2008130736A (en) * | 2006-11-20 | 2008-06-05 | Hitachi Metals Ltd | Electronic component and its manufacturing method |
| US7864017B2 (en) * | 2007-02-20 | 2011-01-04 | Tdk Corporation | Thin-film magnetic device, and electronic component module having same |
| JP2008258525A (en) * | 2007-04-09 | 2008-10-23 | Matsushita Electric Ind Co Ltd | Common-mode noise filter |
| US20120161914A1 (en) * | 2010-12-24 | 2012-06-28 | Samsung Electro-Mechanics Co., Ltd. | Transformer |
| US10153666B2 (en) | 2011-11-04 | 2018-12-11 | Lg Innotek Co., Ltd. | Wireless power receiver and control method thereof |
| US10622842B2 (en) | 2011-11-04 | 2020-04-14 | Lg Innotek Co., Ltd. | Wireless power receiver and control method thereof |
| US10938247B2 (en) | 2011-11-04 | 2021-03-02 | Lg Innotek Co., Ltd. | Wireless power receiver and control method thereof |
| KR101408628B1 (en) * | 2012-08-29 | 2014-06-17 | 삼성전기주식회사 | Coil component |
| JP2020530253A (en) * | 2017-08-07 | 2020-10-15 | レイセオン カンパニー | Heterogeneous integrated power converter assembly |
| US11205953B2 (en) | 2017-08-07 | 2021-12-21 | Raytheon Company | Heterogeneously integrated power converter assembly |
| JP2019114582A (en) * | 2017-12-20 | 2019-07-11 | 太陽誘電株式会社 | Magnetic coupling type coil component |
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Legal Events
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| A300 | Withdrawal of application because of no request for examination |
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