JP2008258525A - Common-mode noise filter - Google Patents

Common-mode noise filter Download PDF

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JP2008258525A
JP2008258525A JP2007101510A JP2007101510A JP2008258525A JP 2008258525 A JP2008258525 A JP 2008258525A JP 2007101510 A JP2007101510 A JP 2007101510A JP 2007101510 A JP2007101510 A JP 2007101510A JP 2008258525 A JP2008258525 A JP 2008258525A
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insulating layer
conductor
magnetic
coil
mode noise
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JP5092508B2 (en
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Kobo Motomitsu
弘法 元▲満▼
Atsushi Inuzuka
敦 犬塚
Shogo Nakayama
祥吾 中山
Kenji Ueno
兼司 植野
Takeki Morimoto
雄樹 森本
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a common-mode noise filter capable of suppressing occurrence of cracks. <P>SOLUTION: A common-mode noise filter has a magnetic body 18 provided on an upper surface of a fifth insulating layer 11e and on an undersurface of a first insulating layer 11a, and a main body 19 configured by unifying first to fifth insulating layers 11a to 11e and first to fourth conducting bodies 12, 14, 15 and 17. At least the third insulating layer 11c among the first to fifth insulating layers 11a to 11e is configured by a non-magnetic body. In an insulating layer configured by the non-magnetic body, a magnetic part 20 made of a magnetic material, and a buffer 21 having a magnetic permeability lower than that of the magnetic part 20 are provided at any one of or both inner and outer sides of each of a first coil 22 and a second coil 23 as viewed from above. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、各種電子機器に使用される小型で積層型のコモンモードノイズフィルタに関するものである。   The present invention relates to a small and stacked common mode noise filter used in various electronic devices.

従来のコモンモードノイズフィルタは、図5に示すように、第1〜第4の絶縁層1a〜1dの上面にそれぞれ第1〜第4の導体2a、2b、3a、3bを設け、そして第1の導体2aと渦巻き状の第2の導体2bとをビア4aを介して接続することにより第1のコイル2を形成するとともに、渦巻き状の第3の導体3aと第4の導体3bとをビア4bを介して接続することにより第2のコイル3を形成し、さらに前記第4の導体3bの上面に磁性体からなる第5の絶縁層1eを設けていた。   As shown in FIG. 5, the conventional common mode noise filter is provided with first to fourth conductors 2a, 2b, 3a, and 3b on the top surfaces of the first to fourth insulating layers 1a to 1d, respectively. The first coil 2 is formed by connecting the conductor 2a and the spiral second conductor 2b via the via 4a, and the spiral third conductor 3a and the fourth conductor 3b are connected to the via. The second coil 3 was formed by connecting via 4b, and the fifth insulating layer 1e made of a magnetic material was further provided on the upper surface of the fourth conductor 3b.

また、前記第2の絶縁層1b〜第4の絶縁層1dは非磁性体で構成するとともに、この非磁性体で構成された第2の絶縁層1b〜第4の絶縁層1dに、渦巻き状の第2の導体2bおよび第3の導体3aの渦巻きの内側に位置する磁性部5をそれぞれ1つ設け、さらに前記第1の絶縁層1aを磁性体で構成し、そして前記磁性部5を第1の絶縁層1aと第5の絶縁層1eに接続していた。   The second insulating layer 1b to the fourth insulating layer 1d are made of a non-magnetic material, and the second insulating layer 1b to the fourth insulating layer 1d made of the non-magnetic material are spirally formed. One magnetic part 5 located inside the spiral of each of the second conductor 2b and the third conductor 3a is provided, the first insulating layer 1a is made of a magnetic material, and the magnetic part 5 is The first insulating layer 1a and the fifth insulating layer 1e are connected.

なお、この出願の発明に関する先行技術文献情報としては、例えば、特許文献1が知られている。
特開2001−76930号公報
As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.
JP 2001-76930 A

上記した従来のコモンモードノイズフィルタにおいては、第2〜第4の絶縁層1b〜1dと、磁性部5、第1の絶縁層1a、第5の絶縁層1eとが異なる材料で構成されているため、これらの界面で応力が生じ、これにより、クラックが発生してしまうという課題を有していた。   In the above-described conventional common mode noise filter, the second to fourth insulating layers 1b to 1d and the magnetic part 5, the first insulating layer 1a, and the fifth insulating layer 1e are made of different materials. For this reason, stress is generated at these interfaces, which causes a problem that cracks are generated.

本発明は上記従来の課題を解決するもので、クラックの発生を抑制できるコモンモードノイズフィルタを提供することを目的とするものである。   The present invention solves the above-described conventional problems, and an object thereof is to provide a common mode noise filter capable of suppressing the occurrence of cracks.

上記目的を達成するために、本発明は以下の構成を有するものである。   In order to achieve the above object, the present invention has the following configuration.

本発明の請求項1に記載の発明は、第1の絶縁層の上面に設けられた第1の導体と、前記第1の導体の上面に設けられかつ第1のビアを有する第2の絶縁層と、前記第2の絶縁層の上面に設けられかつ前記第1のビアを介して前記第1の導体と接続されることにより第1のコイルを構成する渦巻き状の第2の導体と、前記第2の導体の上面に設けられた第3の絶縁層と、前記第3の絶縁層の上面に設けられた渦巻き状の第3の導体と、前記第3の導体の上面に設けられかつ第2のビアを有する第4の絶縁層と、前記第4の絶縁層の上面に設けられかつ前記第2のビアを介して前記第3の導体と接続されることにより第2のコイルを構成する第4の導体と、前記第4の導体の上面に設けられた第5の絶縁層と、前記第5の絶縁層の上面および前記第1の絶縁層の下面に設けられた磁性体と、これらを一体化して構成した本体部とを備え、前記第1〜第5の絶縁層のうち少なくとも第3の絶縁層を非磁性体で構成し、かつ前記非磁性体で構成された絶縁層において、上面視にて前記第1のコイルと第2のコイルのそれぞれの内側と外側のいずれか一方もしくは両方に、磁性材料からなる磁性部と、この磁性部より透磁率の低い緩衝部とを設けたもので、この構成によれば、第1のコイルと第2のコイルのそれぞれの内側と外側のいずれか一方もしくは両方に磁性部と、磁性部より透磁率の低い緩衝部とを設けているため、非磁性体で構成された絶縁層と、磁性部および磁性体で構成された部分との間で生じる応力を、緩衝部で緩和させることができ、これにより、クラックの発生を抑制できるという作用効果が得られるものである。   According to a first aspect of the present invention, a first conductor provided on the upper surface of the first insulating layer, and a second insulation provided on the upper surface of the first conductor and having a first via. And a spiral second conductor that is provided on the upper surface of the second insulating layer and is connected to the first conductor via the first via to form a first coil; A third insulating layer provided on the upper surface of the second conductor, a spiral third conductor provided on the upper surface of the third insulating layer, and provided on the upper surface of the third conductor; A fourth coil is configured by a fourth insulating layer having a second via, and a second coil provided on the upper surface of the fourth insulating layer and connected to the third conductor via the second via. A fourth conductor, a fifth insulating layer provided on an upper surface of the fourth conductor, an upper surface of the fifth insulating layer, and a front surface A magnetic body provided on a lower surface of the first insulating layer; and a main body unit configured by integrating them; and at least a third insulating layer of the first to fifth insulating layers is made of a nonmagnetic material. A magnetic part made of a magnetic material on the inner side and / or the outer side of each of the first coil and the second coil in a top view in the insulating layer made of the non-magnetic material. And a buffer part having a lower magnetic permeability than the magnetic part. According to this configuration, the magnetic part is provided on either or both of the inner side and the outer side of the first coil and the second coil. Since the buffer part having lower permeability than the magnetic part is provided, the buffer part relieves stress generated between the insulating layer made of non-magnetic material and the magnetic part and the magnetic material part. This suppresses the generation of cracks Effect that wear are those that can be obtained.

本発明の請求項2に記載の発明は、特に、第1〜第5の絶縁層を非磁性体で構成するとともに、前記第1の絶縁層と第3の絶縁層および第5の絶縁層のみに磁性部を設け、かつ第2の絶縁層と第4の絶縁層には前記磁性部は設けないようにしたもので、この構成によれば、第1の絶縁層と第3の絶縁層および第5の絶縁層のみに磁性材料からなる磁性部を設け、かつ第1のビアを有する第2の絶縁層と、第2のビアを有する第4の絶縁層には前記磁性部は設けないようにしているため、第2の絶縁層と第4の絶縁層にはビアをそれぞれ設けるだけでよく、その結果、第2の絶縁層と第4の絶縁層を容易に構成することができるという作用効果が得られるものである。   According to the second aspect of the present invention, in particular, the first to fifth insulating layers are made of a nonmagnetic material, and only the first insulating layer, the third insulating layer, and the fifth insulating layer are included. In which the magnetic part is not provided in the second insulating layer and the fourth insulating layer. According to this configuration, the first insulating layer, the third insulating layer, A magnetic part made of a magnetic material is provided only in the fifth insulating layer, and the magnetic part is not provided in the second insulating layer having the first via and the fourth insulating layer having the second via. Therefore, it is only necessary to provide vias in the second insulating layer and the fourth insulating layer, respectively. As a result, the second insulating layer and the fourth insulating layer can be easily configured. An effect is obtained.

本発明の請求項3に記載の発明は、特に、第1〜第5の絶縁層の誘電率を磁性体の誘電率より小さくしたもので、この構成によれば、第1の導体と第2の導体とで構成される第1のコイルと、第3の導体と第4の導体とで構成される第2のコイルとの間で発生する浮遊容量を低減できるため、高周波帯域での差動信号の挿入損失を少なくすることができ、これにより、高周波帯域でも使用することができるという作用効果が得られるものである。   According to the third aspect of the present invention, in particular, the dielectric constant of the first to fifth insulating layers is made smaller than that of the magnetic substance. According to this configuration, the first conductor and the second conductor Since the stray capacitance generated between the first coil composed of the first conductor and the second coil composed of the third conductor and the fourth conductor can be reduced, the differential in the high frequency band can be reduced. The insertion loss of the signal can be reduced, thereby obtaining the effect that it can be used even in a high frequency band.

本発明の請求項4に記載の発明は、特に、第2の導体と第3の導体の形状を略円形状に構成したもので、この構成によれば、第1のコイルと第2のコイルの中心部を介して対向する第2の導体同士と第3の導体同士の中心部からの距離を略同一にすることができるため、磁気効率は高くなり、これにより、コモンモードノイズの除去効果が大きくなるという作用効果が得られるものである。   In the invention according to claim 4 of the present invention, in particular, the second conductor and the third conductor are formed in a substantially circular shape. According to this configuration, the first coil and the second coil are formed. Since the distances from the central portions of the second conductors and the third conductors facing each other through the central portion of each other can be made substantially the same, the magnetic efficiency is increased, thereby removing the common mode noise. As a result, the effect of increasing is obtained.

以上のように本発明のコモンモードノイズフィルタは、第1〜第5の絶縁層のうち少なくとも第3の絶縁層を非磁性体で構成し、かつ非磁性体で構成された絶縁層において、上面視にて第1のコイルと第2のコイルのそれぞれの内側と外側のいずれか一方もしくは両方に、磁性材料からなる磁性部と、この磁性部より透磁率の低い緩衝部とを設けているため、非磁性体で構成された絶縁層と、磁性部および磁性体で構成された部分との間で生じる応力を、緩衝部で緩和させることができ、これにより、クラックの発生を抑制できるという優れた効果を奏するものである。   As described above, the common mode noise filter of the present invention is configured such that at least the third insulating layer of the first to fifth insulating layers is made of a nonmagnetic material, and the upper surface of the insulating layer is made of a nonmagnetic material. Since a magnetic part made of a magnetic material and a buffer part having a lower magnetic permeability than the magnetic part are provided on one or both of the inside and / or the outside of each of the first coil and the second coil as viewed. The stress generated between the insulating layer made of a non-magnetic material and the magnetic portion and the portion made of the magnetic material can be relieved by the buffering portion, which can suppress the generation of cracks. It is effective.

以下、本発明の一実施の形態におけるコモンモードノイズフィルタについて、図面を参照しながら説明する。   Hereinafter, a common mode noise filter according to an embodiment of the present invention will be described with reference to the drawings.

図1は本発明の一実施の形態におけるコモンモードノイズフィルタの分解斜視図、図2は図1のA−A線断面図、図3は同コモンモードノイズフィルタの斜視図である。   1 is an exploded perspective view of a common mode noise filter according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line AA of FIG. 1, and FIG. 3 is a perspective view of the common mode noise filter.

本発明の一実施の形態におけるコモンモードノイズフィルタは、図1〜図3に示すように、第1の絶縁層11aの上面に設けられた第1の導体12と、前記第1の導体12の上面に設けられかつ第1のビア13を有する第2の絶縁層11bと、前記第2の絶縁層11bの上面に設けられかつ前記第1のビア13を介して前記第1の導体12と接続された渦巻き状の第2の導体14と、前記第2の導体14の上面に設けられた第3の絶縁層11cと、前記第3の絶縁層11cの上面に設けられた渦巻き状の第3の導体15と、前記第3の導体15の上面に設けられかつ第2のビア16を有する第4の絶縁層11dと、前記第4の絶縁層11dの上面に設けられかつ前記第2のビア16を介して前記第3の導体15と接続された第4の導体17と、前記第4の導体17の上面に設けられた第5の絶縁層11eと、前記第5の絶縁層11eの上面および前記第1の絶縁層11aの下面に設けられた磁性体18と、これらを一体化して構成した本体部19とを備えているものである。   As shown in FIGS. 1 to 3, the common mode noise filter according to one embodiment of the present invention includes a first conductor 12 provided on the upper surface of the first insulating layer 11 a and the first conductor 12. A second insulating layer 11b provided on the upper surface and having a first via 13 and a first insulating layer 11b provided on the upper surface of the second insulating layer 11b and connected to the first conductor 12 via the first via 13 The spiral second conductor 14 formed, the third insulating layer 11c provided on the top surface of the second conductor 14, and the spiral third conductor provided on the top surface of the third insulating layer 11c. Conductor 15, a fourth insulating layer 11 d provided on the upper surface of the third conductor 15 and having the second via 16, and a second insulating layer provided on the upper surface of the fourth insulating layer 11 d and the second via A fourth conductor 17 connected to the third conductor 15 via 16; A fifth insulating layer 11e provided on the upper surface of the fourth conductor 17, a magnetic body 18 provided on the upper surface of the fifth insulating layer 11e and the lower surface of the first insulating layer 11a, and And a main body 19 constructed integrally.

また、前記第1〜第5の絶縁層11a〜11eを非磁性体で構成し、そして前記第1の絶縁層11aと第3の絶縁層11cおよび第5の絶縁層11eにおける前記第2の導体14と第3の導体15の内側および外側の両方に位置する部分にはそれぞれ磁性材料からなる磁性部20を設け、さらに前記第2の絶縁層11bと第4の絶縁層11dの磁性部20と対応する位置に、貫通孔を形成して磁性部20より透磁率の低い緩衝部21を設けているものである。   The first to fifth insulating layers 11a to 11e are made of a nonmagnetic material, and the second conductors in the first insulating layer 11a, the third insulating layer 11c, and the fifth insulating layer 11e are used. 14 and the third conductor 15 are provided with magnetic portions 20 made of a magnetic material at portions located inside and outside the third conductor 15, respectively, and the magnetic portions 20 of the second insulating layer 11b and the fourth insulating layer 11d A buffer part 21 having a lower permeability than the magnetic part 20 is formed by forming a through hole at a corresponding position.

上記構成において、前記第1〜第5の絶縁層11a〜11eは、絶縁性を有する材料からなり、そして第1の絶縁層11aの上面には第1の導体12が、第2の絶縁層11bの上面には第2の導体14が、第3の絶縁層11cの上面には第3の導体15が、第4の絶縁層11dの上面には第4の導体17がそれぞれ形成されている。   The said structure WHEREIN: The said 1st-5th insulating layers 11a-11e consist of an insulating material, and the 1st conductor 12 is on the upper surface of the 1st insulating layer 11a, and the 2nd insulating layer 11b. The second conductor 14 is formed on the upper surface of the first insulating layer, the third conductor 15 is formed on the upper surface of the third insulating layer 11c, and the fourth conductor 17 is formed on the upper surface of the fourth insulating layer 11d.

また、前記第1〜第5の絶縁層11a〜11eは、ガラスセラミック等のガラスを含有した非磁性体で構成されているもので、これらは、第5の絶縁層11eの上面および第1の絶縁層11aの下面に設けられた磁性体18よりも透磁率の低い材料で構成されている。   The first to fifth insulating layers 11a to 11e are made of a nonmagnetic material containing glass such as glass ceramic, and these include the upper surface of the fifth insulating layer 11e and the first insulating layer 11e. It is made of a material having a lower magnetic permeability than the magnetic body 18 provided on the lower surface of the insulating layer 11a.

なお、第2の絶縁層11bと第4の絶縁層11dには、磁性材料からなる磁性部20は設けずに、磁性部20と対応する部分に貫通孔で構成された緩衝部21を設けているものである。   The second insulating layer 11b and the fourth insulating layer 11d are not provided with the magnetic part 20 made of a magnetic material, but are provided with a buffer part 21 constituted by a through hole in a part corresponding to the magnetic part 20. It is what.

さらに、前記第1〜第5の絶縁層11a〜11eの誘電率は磁性体18の誘電率より小さくしているもので、このような構成にした場合は、第1の導体12と第2の導体14とで構成される第1のコイル22と、第3の導体15と第4の導体17とで構成される第2のコイル23との間で発生する浮遊容量を低減できるため、高周波帯域での差動信号の挿入損失を少なくすることができ、これにより、高周波帯域でも使用することができるという効果が得られるものである。   Furthermore, the dielectric constants of the first to fifth insulating layers 11a to 11e are smaller than the dielectric constant of the magnetic body 18. In such a configuration, the first conductor 12 and the second conductor 12 Since the stray capacitance generated between the first coil 22 composed of the conductor 14 and the second coil 23 composed of the third conductor 15 and the fourth conductor 17 can be reduced, the high frequency band Thus, the insertion loss of the differential signal can be reduced, thereby obtaining the effect that it can be used even in a high frequency band.

そしてまた、前記第1〜第4の導体12,14,15,17は銀などの導電材料をめっきすることにより形成され、そして第1の導体12と第2の導体14は第2の絶縁層11bに形成された第1のビア13を介して接続することにより第1のコイル22を構成している。さらに、第3の導体15と第4の導体17は第4の絶縁層11dに形成された第2のビア16を介して接続することにより第2のコイル23を構成している。   The first to fourth conductors 12, 14, 15, and 17 are formed by plating a conductive material such as silver, and the first conductor 12 and the second conductor 14 are a second insulating layer. The first coil 22 is configured by connecting via the first via 13 formed in 11b. Further, the third conductor 15 and the fourth conductor 17 are connected via a second via 16 formed in the fourth insulating layer 11d to constitute a second coil 23.

なお、前記第2の導体14と第3の導体15は渦巻状に構成され、上面視にて略重なるようになっている。そして、この第2の導体14と第3の導体15の形状は、略円形状に構成されているものであり、このような構成にすれば、第1のコイル22と第2のコイル23の中心部を介して対向する第2の導体14同士と第3の導体15同士の中心部からの距離を略同一にすることができるため、磁気効率は高くなり、これにより、コモンモードノイズフィルタの除去効果が大きくなるものである。   The second conductor 14 and the third conductor 15 are formed in a spiral shape, and are substantially overlapped when viewed from above. And the shape of this 2nd conductor 14 and the 3rd conductor 15 is comprised by the substantially circular shape, and if it is such a structure, the 1st coil 22 and the 2nd coil 23 will be shown. Since the distances from the central portions of the second conductors 14 and the third conductors 15 facing each other through the central portion can be made substantially the same, the magnetic efficiency is increased. The removal effect is increased.

また、前記磁性体18はNi−Znフェライト等の磁性材料により構成されているもので、第5の絶縁層11eの上面および第1の絶縁層11aの下面に設けられている。そして、この磁性体18は複数の磁性体層18aを積層することによって形成されている。   The magnetic body 18 is made of a magnetic material such as Ni—Zn ferrite and is provided on the upper surface of the fifth insulating layer 11e and the lower surface of the first insulating layer 11a. The magnetic body 18 is formed by laminating a plurality of magnetic layers 18a.

そしてまた、前記磁性部20は、非磁性体で構成された第1〜第5の絶縁層11a〜11eのうち、第1、第3、第5の絶縁層11a,11c,11eにおける第2の導体14と第3の導体15の内側と外側の両方、すなわち上面視にて第1のコイル22、第2のコイル23の内側と外側の両方に位置する箇所にそれぞれ設けられ、かつNi−Znフェライト等の磁性材料により構成されているものである。この磁性部20を形成することにより、第1のコイル22と第2のコイル23の間を交差する磁界を強めることができるため、第1のコイル22と第2のコイル23のコモンモード成分のインピーダンスが大きくなり、これにより、より多くのコモンモードノイズを除去できるものである。   In addition, the magnetic unit 20 includes the second of the first, third, and fifth insulating layers 11a, 11c, and 11e among the first to fifth insulating layers 11a to 11e made of a nonmagnetic material. Ni—Zn is provided at both the inside and outside of the conductor 14 and the third conductor 15, that is, at positions located on both the inside and outside of the first coil 22 and the second coil 23 in a top view. It is made of a magnetic material such as ferrite. By forming the magnetic part 20, the magnetic field intersecting between the first coil 22 and the second coil 23 can be strengthened, so that the common mode component of the first coil 22 and the second coil 23 can be reduced. Impedance is increased, and thus more common mode noise can be removed.

なお、前記磁性部20は、上記本発明の一実施の形態においては、第2の導体14と第3の導体の内側および外側の両方に位置する部分にそれぞれ設けているが、第2の導体14と第3の導体15の内側および外側のいずれか一方のみに設けてもよいものである。   In the embodiment of the present invention described above, the magnetic part 20 is provided in each of the portions located on both the inside and outside of the second conductor 14 and the third conductor. 14 and the third conductor 15 may be provided only on either the inner side or the outer side.

前記緩衝部21は、図1、図2に示すように、第1の絶縁層11aと第3の絶縁層11cおよび第5の絶縁層11eのみに設けられた磁性部20と対応する位置、すなわち、上面視にて磁性部20と重なる位置における第2の絶縁層11bと第4の絶縁層11dに形成された貫通孔で構成され、この貫通孔の中は磁性部20より透磁率が低い大気となっている。   As shown in FIGS. 1 and 2, the buffer portion 21 corresponds to the magnetic portion 20 provided only in the first insulating layer 11a, the third insulating layer 11c, and the fifth insulating layer 11e, that is, The through hole is formed in the second insulating layer 11b and the fourth insulating layer 11d at a position overlapping the magnetic part 20 in a top view, and the inside of the through hole has an air permeability lower than that of the magnetic part 20 It has become.

また、貫通孔は第2の絶縁層11b、第4の絶縁層11dの上面視にて磁性部20と重なる位置において磁性部20の断面積より小さい断面積のものであってもよい。この場合も、第2の絶縁層11b、第4の絶縁層11dの上面視にて磁性部20と重なる部分の透磁率は、磁性部20より透磁率が低くなる。   Further, the through hole may have a cross-sectional area smaller than the cross-sectional area of the magnetic part 20 at a position overlapping the magnetic part 20 in a top view of the second insulating layer 11b and the fourth insulating layer 11d. Also in this case, the permeability of the portion overlapping the magnetic part 20 in the top view of the second insulating layer 11b and the fourth insulating layer 11d is lower than that of the magnetic part 20.

なお、この緩衝部21は、図4に示すように貫通孔に磁性部20より透磁率が低い非磁性材料や非磁性のガラスセラミックス材料等を充填して構成してもよいものである。さらに、この緩衝部21を構成する貫通孔に充填される材料としては、磁性部20より透磁率が低く、第1〜第5の絶縁層11a〜11eを構成する非磁性材料と同じものを用いるのが好ましい。また、前記緩衝部21は貫通孔ではなく、絶縁層を貫通しない窪みであってもよい。   As shown in FIG. 4, the buffer portion 21 may be configured by filling a through hole with a nonmagnetic material having a lower magnetic permeability than the magnetic portion 20, a nonmagnetic glass ceramic material, or the like. Further, as a material filled in the through hole constituting the buffer portion 21, the same magnetic material as the nonmagnetic material constituting the first to fifth insulating layers 11a to 11e is used, which has a lower magnetic permeability than the magnetic portion 20. Is preferred. Further, the buffer portion 21 may not be a through hole but a recess that does not penetrate the insulating layer.

そしてまた、上記本発明の一実施の形態においては、第2の絶縁層11bと第4の絶縁層11d自体が非磁性体で構成されているため、第2の絶縁層11bと第4の絶縁層11dの上面視にて磁性部20に重なる箇所が、磁性部20より透磁率が低い緩衝部21となり、これにより、貫通孔で緩衝部21を新たに設ける必要はなくなる。この場合、第2の絶縁層11bと第4の絶縁層11dには第1のビア13と第2のビア16をそれぞれ設けるだけでよく、これにより、第2の絶縁層11bと第4の絶縁層11dを容易に構成することができるものである。   In the embodiment of the present invention, since the second insulating layer 11b and the fourth insulating layer 11d themselves are made of a nonmagnetic material, the second insulating layer 11b and the fourth insulating layer A portion overlapping the magnetic part 20 in the top view of the layer 11d becomes a buffer part 21 having a lower magnetic permeability than the magnetic part 20, and thus it is not necessary to newly provide the buffer part 21 in the through hole. In this case, it is only necessary to provide the first via 13 and the second via 16 in the second insulating layer 11b and the fourth insulating layer 11d, respectively, and thereby the second insulating layer 11b and the fourth insulating layer 11d. The layer 11d can be easily configured.

なお、第1、第2、第4、第5の絶縁層11a,11b,11d,11eのうち少なくとも1枚を磁性体で構成してもよいが、この場合は、磁性体で構成されていない絶縁層に、磁性部20、緩衝部21を形成すればよい。   Note that at least one of the first, second, fourth, and fifth insulating layers 11a, 11b, 11d, and 11e may be made of a magnetic material, but in this case, it is not made of a magnetic material. What is necessary is just to form the magnetic part 20 and the buffer part 21 in an insulating layer.

また、上面視にて第1のコイル22、第2のコイル23の内側には緩衝部21を形成しないが、外側には緩衝部21を形成するようにしてもよく、逆に第1のコイル22、第2のコイル23の外側には緩衝部21を形成しないが、内側には緩衝部21を形成するようにしてもよい。なお、第1のコイル22、第2のコイル23の内側と外側の両方に位置する箇所に緩衝部21を形成するときは、同じ絶縁層に緩衝部21を形成すれば、焼成時の収縮による応力をバランスよく逃がすことができる。   Further, the buffer portion 21 is not formed inside the first coil 22 and the second coil 23 in a top view, but the buffer portion 21 may be formed outside, and conversely the first coil. 22. Although the buffer part 21 is not formed outside the second coil 23, the buffer part 21 may be formed inside. In addition, when forming the buffer part 21 in the location located in both the inside and the outside of the first coil 22 and the second coil 23, if the buffer part 21 is formed in the same insulating layer, it is caused by shrinkage during firing. Stress can be released in a well-balanced manner.

したがって、第1〜第5の絶縁層11a〜11eの上面視にて第1のコイル22、第2のコイル23の内側と外側の両方に位置する箇所に、磁性部20、緩衝部21のいずれかが形成されることになる。すなわち、第1のコイル22、第2のコイル23の内側と外側の両方に位置する箇所において、第1〜第5の絶縁層11a〜11eを一直線状に貫く磁性部20の一部を緩衝部21に換えたような構成になる。   Therefore, any one of the magnetic part 20 and the buffer part 21 is located at both the inside and the outside of the first coil 22 and the second coil 23 in the top view of the first to fifth insulating layers 11a to 11e. Will be formed. That is, a part of the magnetic part 20 that penetrates the first to fifth insulating layers 11a to 11e in a straight line at a position located on both the inside and the outside of the first coil 22 and the second coil 23 is a buffer part. The configuration is changed to 21.

そして、上記した構成部品を積層することにより、図3に示すようなコモンモードノイズフィルタの本体部19が形成される。また、この本体部19の両側部には、第1〜第4の外部電極24〜27が設けられており、かつこの第1〜第4の外部電極24〜27は、第1〜第4の導体12,14,15,17とそれぞれ接続されるように銀を印刷することによって形成されている。そしてまた、前記第1〜第4の外部電極24〜27の表面には、ニッケルめっき層、すずめっき層がそれぞれ施されている。   And the main-body part 19 of a common mode noise filter as shown in FIG. 3 is formed by laminating | stacking the above-mentioned component. Further, first to fourth external electrodes 24 to 27 are provided on both sides of the main body 19, and the first to fourth external electrodes 24 to 27 are provided to the first to fourth electrodes. It is formed by printing silver so as to be connected to the conductors 12, 14, 15, and 17, respectively. Further, a nickel plating layer and a tin plating layer are respectively provided on the surfaces of the first to fourth external electrodes 24 to 27.

なお、前記第1〜第4の導体12,14,15,17は、めっきで形成するのではなく、その他の印刷や蒸着等の方法で形成してもよいものである。   The first to fourth conductors 12, 14, 15, and 17 may be formed by other methods such as printing or vapor deposition instead of being formed by plating.

次に、本発明の一実施の形態におけるコモンモードノイズフィルタの製造方法について、図面を参照しながら説明する。   Next, a method for manufacturing a common mode noise filter according to an embodiment of the present invention will be described with reference to the drawings.

図1〜図3において、まず、それぞれの原材料である磁性材料、ガラス、非磁性材料の粉体および樹脂からなる混合物により、方形の第1〜第5の絶縁層11a〜11e、磁性体層18aをそれぞれ所定枚数作製する。このとき、第2の絶縁層11b、第4の絶縁層11dの所定箇所に、レーザ、パンチングなどで孔あけ加工をし、この孔に銀を充填して、第1、第2のビア13,16を形成する。そして、第1、第3、第5の絶縁層11a,11c,11eにおける第2の導体14、第3の導体15の内側に対応する部分に1箇所、および外側に対応する部分に4箇所、レーザ、パンチングなどで貫通孔を設ける。   1 to 3, first, rectangular first to fifth insulating layers 11 a to 11 e and a magnetic layer 18 a are made of a mixture of magnetic material, glass, nonmagnetic material powder and resin as raw materials. A predetermined number of each is prepared. At this time, a predetermined portion of the second insulating layer 11b and the fourth insulating layer 11d is drilled with a laser, punching, or the like, and this hole is filled with silver, and the first and second vias 13, 16 is formed. The first, third, and fifth insulating layers 11a, 11c, and 11e have a second conductor 14, a portion corresponding to the inside of the third conductor 15, and four portions corresponding to the outside. A through hole is provided by laser, punching or the like.

次に、所定枚数の磁性体層18aを積層して磁性体18を形成し、その後、磁性体18の上面に貫通孔を有する第1の絶縁層11aを載置する。   Next, a predetermined number of magnetic layers 18 a are stacked to form the magnetic body 18, and then the first insulating layer 11 a having a through hole is placed on the upper surface of the magnetic body 18.

次に、第1の絶縁層11aの貫通孔にNi−Znフェライト等からなるペーストを埋め込んだ後、乾燥させて磁性部20を構成する。   Next, a paste made of Ni—Zn ferrite or the like is embedded in the through hole of the first insulating layer 11 a and then dried to form the magnetic part 20.

次に、第1の絶縁層11aの上面に第1の導体12をめっきによって形成し、その後、第1の導体12の上面に第1のビア13を有する第2の絶縁層11bを載置する。このとき、第1の導体12の一端部と第1のビア13を接続する。   Next, the first conductor 12 is formed by plating on the upper surface of the first insulating layer 11a, and then the second insulating layer 11b having the first via 13 is placed on the upper surface of the first conductor 12. . At this time, one end of the first conductor 12 and the first via 13 are connected.

次に、第2の絶縁層11bの上面に第2の導体14をめっきによって渦巻状に形成し、その後、第2の導体14の上面に貫通孔を有する第3の絶縁層11cを載置する。このとき、第2の導体14の一端部と第1のビア13を接続する。   Next, the second conductor 14 is spirally formed on the upper surface of the second insulating layer 11b by plating, and then the third insulating layer 11c having a through hole is placed on the upper surface of the second conductor 14. . At this time, one end of the second conductor 14 and the first via 13 are connected.

次に、第3の絶縁層11cの貫通孔にNi−Znフェライト等からなるペーストを埋め込んだ後、乾燥させて磁性部20を構成する。   Next, a paste made of Ni—Zn ferrite or the like is embedded in the through hole of the third insulating layer 11 c and then dried to form the magnetic part 20.

次に、第3の絶縁層11cの上面に第3の導体15をめっきによって渦巻状に形成し、その後、第3の導体15の上面に第2のビア16を有する第4の絶縁層11dを載置する。このとき、第3の導体15の一端部と第2のビア16を接続する。   Next, the third conductor 15 is formed in a spiral shape by plating on the upper surface of the third insulating layer 11c, and then the fourth insulating layer 11d having the second via 16 on the upper surface of the third conductor 15 is formed. Place. At this time, one end of the third conductor 15 and the second via 16 are connected.

次に、第4の絶縁層11dの上面に第4の導体17をめっきによって形成し、その後、第4の導体17の上面に貫通孔を有する第5の絶縁層11eを載置する。このとき、第4の導体17の一端部と第2のビア16を接続する。   Next, the fourth conductor 17 is formed on the upper surface of the fourth insulating layer 11d by plating, and then the fifth insulating layer 11e having a through hole is placed on the upper surface of the fourth conductor 17. At this time, one end of the fourth conductor 17 and the second via 16 are connected.

なお、前記第1〜第4の導体12,14,15,17の形成方法は、別途用意したベース板(図示せず)に所定パターン形状の導体をめっきによって形成し、その後、この導体を各絶縁層に転写することにより形成する。   The first to fourth conductors 12, 14, 15, and 17 are formed by plating a conductor having a predetermined pattern shape on a separately prepared base plate (not shown). It is formed by transferring to an insulating layer.

次に、第5の絶縁層11eの貫通孔にNi−Znフェライト等からなるペーストを埋め込んだ後、乾燥させて磁性部20を形成する。   Next, a paste made of Ni—Zn ferrite or the like is embedded in the through hole of the fifth insulating layer 11 e and then dried to form the magnetic part 20.

次に、第5の絶縁層11eの上面に、所定枚数の磁性体層18aを積層して磁性体18を形成し、コモンモードノイズフィルタの本体部19を形成する。   Next, the magnetic body 18 is formed by laminating a predetermined number of magnetic layers 18a on the upper surface of the fifth insulating layer 11e, and the main body 19 of the common mode noise filter is formed.

次に、前記本体部19を所定の温度、時間で焼成し、さらに、前記本体部19の両側面に、第1〜第4の導体12,14,15,17とそれぞれ接続されるように銀を印刷することにより、第1〜第4の外部電極24〜27を形成する。   Next, the main body 19 is fired at a predetermined temperature and time, and further, silver is connected to the first and fourth conductors 12, 14, 15, and 17 on both side surfaces of the main body 19. The first to fourth external electrodes 24 to 27 are formed by printing.

最後に第1〜第4の外部電極24〜27の表面にめっきによってニッケルめっき層、すずめっき層を形成する。   Finally, a nickel plating layer and a tin plating layer are formed on the surfaces of the first to fourth external electrodes 24 to 27 by plating.

上記したように本発明の一実施の形態においては、非磁性体で構成された第1〜第5の絶縁層11a〜11eにおいて、上面視にて第1のコイル22と第2のコイル23のそれぞれの内側と外側の両方に、磁性材料からなる磁性部20と、この磁性部20より透磁率の低い緩衝部21とを設けているため、非磁性体で構成された第1〜第5の絶縁層11a〜11eと、磁性部20および磁性体18で構成された部分との間で生じる応力を、緩衝部で緩和させることができ、これにより、クラックの発生を抑制できるという効果が得られるものである。   As described above, in one embodiment of the present invention, in the first to fifth insulating layers 11a to 11e made of a non-magnetic material, the first coil 22 and the second coil 23 are viewed from above. Since the magnetic part 20 made of a magnetic material and the buffer part 21 having a lower magnetic permeability than the magnetic part 20 are provided on both the inner side and the outer side, the first to fifth parts made of a non-magnetic material are provided. The stress generated between the insulating layers 11a to 11e and the portion composed of the magnetic portion 20 and the magnetic body 18 can be relaxed by the buffer portion, thereby obtaining the effect of suppressing the occurrence of cracks. Is.

すなわち、磁性材料からなる磁性部20および磁性体18と、非磁性材料からなる第1〜第5の絶縁層11a〜11eとは異種材料で構成されているため、磁性部20と対応する部分に緩衝部21が設けられていない場合は、焼成する際に、磁性材料からなる磁性部20および磁性体18と、非磁性材料からなる第1〜第5の絶縁層11a〜11eとの間の界面に応力が生じるため、クラックが発生してしまうが、本発明の一実施の形態のように、磁性部20と対応するように第2の絶縁層11bと第4の絶縁層11dに緩衝部21を設けた場合は、磁性材料からなる磁性部20および磁性体18と、非磁性材料からなる第1〜第5の絶縁層11a〜11eとの間の界面の応力を低減させることができるため、クラックの発生を抑制させることができる。さらに、磁性部20を形成しているため、第1のコイル22と第2のコイル23の間を交差する磁界を強めることができるため、第1のコイル22と第2のコイル23のコモンモード成分のインピーダンスが大きくなり、これにより、より多くのコモンモードノイズを除去できる。この結果、クラックの発生の抑制とより多くのコモンモードノイズの除去という2つの効果を同時に実現できるものである。   That is, since the magnetic part 20 and the magnetic body 18 made of a magnetic material and the first to fifth insulating layers 11a to 11e made of a non-magnetic material are made of different materials, the magnetic part 20 is formed in a portion corresponding to the magnetic part 20. When the buffer part 21 is not provided, the interface between the magnetic part 20 and the magnetic body 18 made of a magnetic material and the first to fifth insulating layers 11a to 11e made of a non-magnetic material when firing is performed. However, as in the embodiment of the present invention, the buffer portion 21 is provided in the second insulating layer 11b and the fourth insulating layer 11d so as to correspond to the magnetic portion 20 as in the embodiment of the present invention. Since the stress at the interface between the magnetic part 20 and the magnetic body 18 made of a magnetic material and the first to fifth insulating layers 11a to 11e made of a nonmagnetic material can be reduced, Suppress the generation of cracks Can. Furthermore, since the magnetic part 20 is formed, the magnetic field intersecting between the first coil 22 and the second coil 23 can be strengthened, so that the common mode of the first coil 22 and the second coil 23 can be increased. The impedance of the component becomes large, so that more common mode noise can be removed. As a result, two effects of suppressing the occurrence of cracks and removing more common mode noise can be realized simultaneously.

なお、上記本発明の一実施の形態におけるコモンモードノイズフィルタにおいては、コイルを一対設けたものについて説明したが、コイルを二対以上形成して、アレイタイプとしてもよいものである。   In the common mode noise filter according to the embodiment of the present invention, a pair of coils has been described. However, two or more pairs of coils may be formed to form an array type.

本発明に係るコモンモードノイズフィルタは、非磁性体で構成された絶縁層において、上面視にて第1のコイルと第2のコイルのそれぞれの内側と外側のいずれか一方もしくは両方に、磁性材料からなる磁性部と、この磁性部より透磁率の低い緩衝部とを設けることにより、クラックの発生を抑制できるという効果を有するものであり、特にデジタル機器やAV機器、情報通信端末等の各種電子機器のノイズ対策として使用されるコモンモードノイズフィルタ等において有用となるものである。   A common mode noise filter according to the present invention includes a magnetic material on an inner layer and / or an outer side of each of a first coil and a second coil in an insulating layer made of a nonmagnetic material. By providing a magnetic part made of the above and a buffer part having a lower magnetic permeability than this magnetic part, it is possible to suppress the occurrence of cracks, and in particular, various electronic devices such as digital equipment, AV equipment, information communication terminals, etc. This is useful in a common mode noise filter or the like used as a noise countermeasure for equipment.

本発明の一実施の形態におけるコモンモードノイズフィルタの分解斜視図The disassembled perspective view of the common mode noise filter in one embodiment of this invention 図1のA−A線断面図AA line sectional view of FIG. 同コモンモードノイズフィルタの斜視図Perspective view of the common mode noise filter 同コモンモードノイズフィルタの主要部を示す断面図Sectional view showing the main part of the common mode noise filter 従来のコモンモードノイズフィルタの分解斜視図Exploded perspective view of a conventional common mode noise filter

符号の説明Explanation of symbols

11a〜11e 第1〜第5の絶縁層
12 第1の導体
13 第1のビア
14 第2の導体
15 第3の導体
16 第2のビア
17 第4の導体
18 磁性体
19 本体部
20 磁性部
21 緩衝部
22 第1のコイル
23 第2のコイル
11a to 11e First to fifth insulating layers 12 First conductor 13 First via 14 Second conductor 15 Third conductor 16 Second via 17 Fourth conductor 18 Magnetic body 19 Body portion 20 Magnetic portion 21 Buffer 22 First coil 23 Second coil

Claims (4)

第1の絶縁層の上面に設けられた第1の導体と、前記第1の導体の上面に設けられかつ第1のビアを有する第2の絶縁層と、前記第2の絶縁層の上面に設けられかつ前記第1のビアを介して前記第1の導体と接続されることにより第1のコイルを構成する渦巻き状の第2の導体と、前記第2の導体の上面に設けられた第3の絶縁層と、前記第3の絶縁層の上面に設けられた渦巻き状の第3の導体と、前記第3の導体の上面に設けられかつ第2のビアを有する第4の絶縁層と、前記第4の絶縁層の上面に設けられかつ前記第2のビアを介して前記第3の導体と接続されることにより第2のコイルを構成する第4の導体と、前記第4の導体の上面に設けられた第5の絶縁層と、前記第5の絶縁層の上面および前記第1の絶縁層の下面に設けられた磁性体と、これらを一体化して構成した本体部とを備え、前記第1〜第5の絶縁層のうち少なくとも第3の絶縁層を非磁性体で構成し、かつ前記非磁性体で構成された絶縁層において、上面視にて前記第1のコイルと第2のコイルのそれぞれの内側と外側のいずれか一方もしくは両方に、磁性材料からなる磁性部と、この磁性部より透磁率の低い緩衝部とを設けたコモンモードノイズフィルタ。 A first conductor provided on an upper surface of the first insulating layer; a second insulating layer provided on an upper surface of the first conductor and having a first via; and an upper surface of the second insulating layer. A spiral second conductor constituting the first coil by being connected to the first conductor via the first via, and a second conductor provided on the upper surface of the second conductor. 3 insulating layers, a spiral third conductor provided on the top surface of the third insulating layer, and a fourth insulating layer provided on the top surface of the third conductor and having a second via A fourth conductor provided on an upper surface of the fourth insulating layer and connected to the third conductor via the second via to constitute a second coil; and the fourth conductor A fifth insulating layer provided on the upper surface of the first insulating layer; and an upper surface of the fifth insulating layer and a lower surface of the first insulating layer. And a main body unit formed by integrating them, and at least the third insulating layer of the first to fifth insulating layers is made of a nonmagnetic material, and is made of the nonmagnetic material. In the insulating layer, a magnetic part made of a magnetic material and a buffer having a lower magnetic permeability than the magnetic part on one or both of the inner side and the outer side of each of the first coil and the second coil in a top view. Common mode noise filter with 第1〜第5の絶縁層を非磁性体で構成するとともに、前記第1の絶縁層と第3の絶縁層および第5の絶縁層のみに磁性部を設け、かつ第2の絶縁層と第4の絶縁層には前記磁性部は設けないようにした請求項1記載のコモンモードノイズフィルタ。 The first to fifth insulating layers are made of a non-magnetic material, and a magnetic part is provided only in the first insulating layer, the third insulating layer, and the fifth insulating layer, and the second insulating layer and the second insulating layer The common mode noise filter according to claim 1, wherein the magnetic part is not provided in the insulating layer 4. 第1〜第5の絶縁層の誘電率を磁性体の誘電率より小さくした請求項1記載のコモンモードノイズフィルタ。 2. The common mode noise filter according to claim 1, wherein the dielectric constant of the first to fifth insulating layers is smaller than the dielectric constant of the magnetic material. 第2の導体と第3の導体の形状を略円形状に構成した請求項1記載のコモンモードノイズフィルタ。 The common mode noise filter according to claim 1, wherein the second conductor and the third conductor are formed in a substantially circular shape.
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