JP2000049058A - Manufacture of laminated electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the kinds of formation patterns for conductive pattern as much as possible in the functional material sheet, which is provided to manufacture a laminated electronic part where internal conductors having three kinds or more of patterns are formed. SOLUTION: Conductive films 31 to 33 to give all internal conductors 23 to 27 having four kinds of patterns A to D for example are formed on a functional material sheet 28, and the functional material sheet 28 is laminated, while changing its plane position so that the main body of electronic component where the internal conductors 23 to 27 are arranged in the laminating direction in the specified order is formed, thereby obtaining a mother laminate. Then, the mother laminate is cut along the cutting lines 29 and 30 so as to take out the main body of electronic component for a laminated electronic component to be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer electronic component, and more particularly to a method for manufacturing a multilayer electronic component in which an internal conductor formed inside an electronic component body has three or more types of patterns. It relates to a manufacturing method.

[0002]

2. Description of the Related Art A laminated electronic component generally includes an electronic component main body and a plurality of terminal electrodes formed at different positions on the surface of the electronic component main body. The electronic component body includes a plurality of stacked functional material layers and a plurality of internal conductors formed along specific interfaces therebetween, and the internal conductors are electrically connected to the terminal electrodes described above. ing.

[0003] As such a laminated electronic component, there is typically a laminated ceramic electronic component in which a functional material layer is composed of ceramic.

Conventionally, electronic components such as multilayer capacitors, multilayer varistors, multilayer inductors and the like have been provided in the form of such multilayer electronic components.

When a multilayer electronic component is to be manufactured, usually, a functional material sheet on which a conductive film to be an internal conductor having a desired pattern is formed is prepared, and these functional material sheets are aligned with each other to a predetermined position. A mother laminate is produced by stacking according to the order, and the mother laminate is cut along a predetermined cut line, so that a plurality of electronic component bodies are taken out and then electrically connected to the internal conductor. Then, a terminal electrode is formed on the surface of the electronic component body. When the functional material sheet is provided by a ceramic green sheet, a firing step is performed after the above-described cutting step.

When the multilayer electronic component manufactured as described above is a normal multilayer capacitor, there are only two types of internal conductor patterns. Therefore, only two types of functional material sheets on which conductive films are formed are formed. It is enough to prepare In this case, although there are two types of internal conductor patterns, the two types of patterns are only shifted from each other in one direction. Therefore, when stacking a plurality of functional material sheets, it is difficult to cause this shift. For example, the functional material sheet may be prepared by simply preparing a sheet on which a conductive film is formed with one type of pattern.

[0007]

As described above, in the case of a normal multilayer capacitor, only two types of internal conductors are required. Therefore, two types of functional material sheets having a conductive film formed thereon are required. Depending on the stacking method or the stacking method, it is sufficient to prepare only one kind, but for example, a special structure such as having four terminal electrodes and having an inner conductor connected to each of these terminal electrodes is provided. In the case of a multilayer capacitor, at least four types of internal conductor patterns are required.

However, as described above, when there are four types of internal conductor patterns, four types of functional material sheets on which a conductive film capable of providing these internal conductors are formed are required, and the formation of the conductive film is performed by printing. In this case, the printing must be changed at least four times, which is one of the causes of the reduction in the efficiency of manufacturing the multilayer electronic component.

This is not limited to the case where the number of the internal conductor patterns is four, but at least when the number of the patterns is three or more. It is desired that the number of types of functional material sheets to be prepared is as small as possible.

An object of the present invention is to provide a method for manufacturing a laminated electronic component which can satisfy the above-mentioned demands.

[0011]

According to the present invention, there is provided an electronic component body having two main surfaces facing each other and a side surface connecting the two main surfaces, and formed at different positions on the side surface of the electronic component body. A plurality of terminal electrodes, the electronic component body extends in the direction in which the main surface extends, and is stacked with a plurality of functional material layers, and electrically connected to the plurality of terminal electrodes and between the plurality of functional material layers. Three or more internal conductors respectively formed along a plurality of specific interfaces, and each of the three or more internal conductors is arranged in a predetermined order in any one of three or more patterns in the stacking direction. The present invention is directed to a method for manufacturing such a multilayer electronic component, and has the following configuration in order to solve the above-described technical problem.

That is, a method of manufacturing a laminated electronic component according to the present invention comprises the steps of: preparing a plurality of functional material sheets;
Forming, on each of the functional material sheets, a conductive film capable of providing all of the internal conductors of three or more types of patterns in the same manner as each other; Stacking each functional material sheet while changing its planar position so as to form an electronic component body that is aligned in a row, thereby obtaining a mother laminate including a plurality of stacked functional material sheets. Cutting the mother laminate along a predetermined cut line, thereby taking out at least one electronic component main body from the mother laminate, and forming the electronic component main body so as to be electrically connected to the internal conductor. Forming a plurality of terminal electrodes at different positions on the side surface.

In the above-described method of manufacturing a multilayer electronic component according to the present invention, the conductive film is formed such that a plurality of sets of internal conductors of three or more types of patterns are periodically arranged, and the mother laminate is cut. Therefore, it is preferable to take out a plurality of electronic component bodies from the mother laminate.

In the above-described method of manufacturing a laminated electronic component, a plurality of functional material sheets are prepared, and in the step of stacking these functional material sheets, the planar position thereof is changed so that the obtained mother laminated body has By forming an electronic component body in which internal conductors of three or more types of patterns are aligned in a lamination direction in a predetermined order, and cutting the mother lamination along a predetermined cut line, a mother lamination is formed. However, in another aspect of the present invention, the functional material sheets are simply cut and then stacked.

That is, in the second aspect of the present invention, a step of preparing a functional material sheet,
A step of forming a conductive film capable of providing all internal conductors of more than one type of pattern, and a plurality of functional material layers for cutting a functional material sheet along a predetermined cut line, thereby forming an electronic component body And a step of stacking a plurality of functional material layers in a predetermined order, thereby obtaining an electronic component main body in which internal conductors of three or more types of patterns are arranged in a predetermined order in the stacking direction. And forming a plurality of terminal electrodes at different positions on the side surface of the electronic component body so as to be electrically connected to the internal conductor.

In the second aspect described above, a plurality of functional material sheets are prepared, and when the functional material sheet is cut, each of the plurality of functional material sheets is cut, whereby each of the plurality of functional material sheets is formed. The first embodiment, in which the functional material layer is taken out from each functional material sheet, and when the functional material sheet is cut, the functional material sheet is cut at a plurality of different positions, thereby forming the electronic component body. There is a second embodiment in which a plurality of functional material layers are removed from one functional material sheet.

According to both the first and second aspects of the present invention, the conductive film formed on the functional material sheet is preferably formed so as to extend across the cut line.

In the case described above, it is more preferable that the conductive film includes a material that provides internal conductors having different types of patterns on each side through cut lines.

The present invention is advantageously applied when manufacturing a laminated electronic component having the following structure. In other words, each set of those adjacent to each other in the stacking direction of the internal conductors provided in the electronic component main body has different types of patterns and constitutes one functional element by being opposed to each other via a specific functional material layer. And the number of terminal electrodes is 3
As described above, such a laminated electronic device in which the inner conductor is connected to the terminal electrodes so that each functional element is respectively taken out between the terminal electrodes of each set including two of the terminal electrodes as one set. Parts.

In the above-described laminated electronic component, when the functional material layer is a dielectric layer and the functional element is a capacitor element, according to the present invention, a capacitor having a laminated structure can be obtained.

Further, in the present invention, when the functional material sheet is a ceramic green sheet, a step of firing the electronic component body is further provided.

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a view for explaining the use of a multilayer electronic component obtained by applying a manufacturing method according to an embodiment of the present invention, and shows four diodes D1 to D4.
1 shows a bridge circuit 1 configured as follows. The four diodes D1 to D4 constitute a bridge circuit 1 by being connected via the respective terminals T1 to T4.

In connection with such a bridge circuit 1, for protection of the diodes D1 to D4, more specifically, for absorption of surge current, as shown by a broken line in FIG.
Capacitor elements C1 to C4 are connected to diodes D1 to D4, respectively.
4 may be used in parallel.

Therefore, if an electronic component providing an equivalent circuit as shown in FIG. 2 is provided, by using this in combination with the bridge circuit 1 shown in FIG. 1, the capacitor elements C1 to C1 shown in FIG. C4 can be given.

According to the present invention, it is possible to manufacture a so-called one-chip laminated electronic component 10 having an equivalent circuit as shown in FIG. FIG. 3 is a plan view showing the appearance of the multilayer electronic component 10, and FIG.
Material layers 11 to 1 provided in the laminated electronic component 10 shown in FIG.
FIG.

As shown in FIG. 3, the laminated electronic component 10
Two opposite main surfaces 16 and 17 and four side surfaces 18, 19 connecting between the two main surfaces 16 and 17;
The electronic component main body 22 includes 20 and 21, and four terminal electrodes TE <b> 1 to TE <b> 4 formed so as to be distributed one by one on each of the side surfaces 18 to 21 of the electronic component main body 22.

As shown in FIG. 4, the electronic component body 22 includes a plurality of functional material layers 11 to 15 extending in the direction in which the main surfaces 16 and 17 extend and stacked, for example, made of a ceramic dielectric. The internal conductors 23 to 27 are formed on these functional material layers 11 to 15, that is, along specific interfaces between a plurality of functional material layers including the functional material layers 11 to 15.

The inner conductors 23 to 27 are arranged in the stacking direction in the order shown in FIG. 4 so as to provide the capacitor elements C1 to C4 shown in FIG. They are in a state of being opposed to each other via a specific one of a plurality of functional material layers including 11 to 15. In a normal case, a functional material layer is further provided so as to cover the inner conductor 23 located at the upper end in FIG.

Referring to FIG. 4 in conjunction with FIG. 3, internal conductors 23 and 27 are connected to terminal electrode TE1, internal conductor 24 is connected to terminal electrode TE2, and internal conductor 25 is connected to terminal electrode TE3. , The internal conductor 26 is connected to the terminal electrode TE4.

Therefore, the capacitor element C1 is formed by opposing the internal conductors 23 and 24, and the capacitor element C1 is taken out between the adjacent terminal electrodes TE1 and TE2. Similarly, capacitor element C2 is formed by the opposition of internal conductors 24 and 25, and capacitor element C2 is extracted between terminal electrodes TE2 and TE3. Further, a capacitor element C3 is formed by facing the internal conductors 25 and 26, and the capacitor element C3 is extracted between the terminal electrodes TE3 and TE4. Capacitor element C4 is formed by opposing internal conductors 26 and 27, and capacitor element C4 is taken out between terminal electrodes TE4 and TE1.

As described above, the multilayer electronic component 10 realizes an equivalent circuit in which the four capacitor elements C1 to C4 are connected in the form of a bridge circuit, as shown in FIG.

The laminated electronic component 1 in this one-chip state
0 has terminal electrodes TE1 to TE4 respectively corresponding to the terminals T1 to T4 shown in FIG.
If E1 to TE4 are mounted so as to be connected to terminals T1 to T4, respectively, a state in which each of capacitor elements C1 to C4 is connected in parallel to each of diodes D1 to D4 can be obtained as shown by the broken line in FIG. .

As shown in FIG. 4, the internal conductors 23 to 27
Is formed with any of the four types of patterns A to D. That is, the internal conductors 23 and 27 are formed with the pattern A, and the internal conductor 24 is formed with the pattern B
The internal conductor 25 is formed with a pattern C, and the internal conductor 26 is formed with a pattern D.

FIG. 5 is a plan view showing a part of a functional material sheet 28 prepared for carrying out the first embodiment of the present invention.

In FIG. 5, "A", "B", "C", and "D" indicate the types of patterns, and "A", "B", "C" shown in FIG. And "D"
It corresponds to. FIG. 5 also shows a plurality of cut lines 29 and 30 for a cutting step performed later.

On the functional material sheet 28, conductive films 31, 32 and 33 capable of providing all the internal conductors 23 to 27 of the four types of patterns A to D are formed. More specifically, the conductive film 31 is formed so as to extend across the cut line 29, and the internal conductors 23 or 27 and 25 of different types of patterns A and C are provided on each side via the cut line 29. I have given each. Also, the conductive film 3
2 gives the internal conductor 24 of the pattern B. Also,
The conductive film 33 provides the internal conductor 26 of the pattern D.

The conductive films 31 to 33 are formed such that a plurality of sets of the internal conductors 23 or 27, 24, 25 and 26 of the four types of patterns A to D are periodically arranged. That is, referring to the pattern, in one row in the X direction, A, C, A, C, A,... Are arranged, and in another row, B, D, B, D, B,. It is arranged as follows. In the Y direction,
In one column, they are arranged as A, B, A, B, A,..., And in another column, they are arranged as C, D, C, D, C,.

A plurality of such functional material sheets 28 are prepared, and the conductive films 31 to 33 described above are formed on these functional material sheets 28 in the same manner as each other.

Next, these functional material sheets 28 are stacked to obtain a mother laminate including a plurality of stacked functional material sheets 28. At this time, as shown in FIG. 4, the electronic component body 22 in which the internal conductors 23 to 27 of the four types of patterns A to D are arranged in a predetermined order in the stacking direction.
Is formed in the mother laminate by shifting each functional material sheet 28 by a desired amount in a desired direction to change its planar position. This will be described more specifically below. As shown in FIG. 4, the inner conductors 23 to 27 are stacked in the order of (5) to (1) from the bottom in the laminating direction in the order of A, D, C, B, and A. I have. In the following description, the interval between adjacent ones of the regions defined by the cut lines 29 and 30 shown in FIG. 5 is expressed as one pitch. In order to obtain the order shown in FIG. 4 for the patterns A to D, the second functional material sheet 28 is placed on the first functional material sheet 28 by one pitch in the X direction and in the Y direction with respect to the original position. The third functional material sheet 28 is stacked with a shift of one pitch, then the first functional material sheet 28 is stacked with a shift of one pitch in the X direction with respect to the original position, and then the fourth functional material sheet 28 is stacked with respect to the original position. , Stacked one pitch in the Y direction, and then the fifth functional material sheet 2
8 are stacked in situ, and thereafter such stacking is repeated as desired.

It should be noted that the above-described manner of shifting during stacking is merely an example, and there are many other ways of shifting.

Focusing on one area defined by the cut lines 29 and 30 in the mother laminate obtained according to the above-described stacking, patterns A, D, C, B, and A are stacked in this order. One can find the inner conductors 23-27 aligned in the direction. In another area, the order of patterns B, C, D, A, B, C, B, A,
The inner conductors 23 to 27 stacked in the order of D and C or D, A, B, C and D can be found.

It should be noted that in any of the orders relating to the patterns A to D, it is possible to obtain an electronic component main body that is completely the same in function as the electronic component main body 22 obtained in the order of the patterns AD illustrated in FIG. .

Next, the mother laminate described above is cut along cut lines 29 and 30, whereby
The plurality of electronic component bodies 22 are taken out of the mother laminate.

Next, when the functional material sheet 28 is a ceramic green sheet, the electronic component body 2
2 is fired, and after this firing, on each of the side surfaces 18 to 21 of the electronic component body 22 so as to be electrically connected to the corresponding one of the internal conductors 23 to 27.
As shown in FIG. 3, terminal electrodes TE1 to TE4 are formed.

In the method of manufacturing the laminated electronic component 10 described above, the cutting step is performed after the step of stacking the functional material sheets 28. However, as described below, the stacking step is performed after the cutting step. It may be.

This alternative embodiment includes a first embodiment and a second embodiment described below.

In the first embodiment, in order to obtain the electronic component body 22 in which the internal conductors 23 to 27 of the patterns A to D are arranged in the laminating direction in a predetermined order, a plurality of functional materials stacked in a predetermined order are obtained. The layers 11 to 15 are respectively taken out from the different functional material sheets 28. For example, the internal conductors 23-2 of the patterns A to D shown in FIG.
In order to obtain the electronic component body 22 in which the layers 7 are aligned in the stacking direction, the area including the internal conductor 27 of the pattern A is cut from the first functional material sheet 28 according to the order from the bottom in FIG. Thus, the functional material layer 15 is taken out, and then the region including the internal conductor 26 of the pattern D is cut from the second functional material sheet 28 to take out the functional material layer 14. The functional material layer 13 including the inner conductor 25 of the pattern C is cut and stacked similarly, and the functional material layer 12 including the inner conductor 24 of the pattern B
And stacking of the functional material layer 11 including the inner conductor 23 of the pattern A are performed.

On the other hand, in the second embodiment, patterns A to D
In order to obtain the electronic component body 22 in which the internal conductors 23 to 27 are arranged in the stacking direction in a predetermined order, a plurality of functional material layers 11 to 15 stacked in a predetermined order are By cutting at different positions, removal from one functional material sheet 28 is performed. For example, according to the order from the bottom in FIG. 4, first, a region including the internal conductor 27 of the pattern A in the functional material sheet 28 is cut, thereby forming
5 is taken out, and the functional material layer 14 including the inner conductor 26 of the pattern D is similarly
8 and stacked on the functional material layer 15 described above, and thereafter, the functional material layer 13 including the internal conductor 25 of the pattern C, the internal conductor 2 of the pattern B
The extraction of the functional material layer 12 including 4 and the functional material layer 11 including the internal conductor 23 of the pattern A are sequentially performed from the same functional material sheet 28 and stacked.

FIG. 6 is a plan view showing a part of a functional material sheet 34 prepared for carrying out the second embodiment of the present invention. FIG. 6 is a view corresponding to FIG. 5 and illustrates the functional material sheet 34 by the same drawing method as in FIG. The functional material sheet 34 shown in FIG. 6 is also used to obtain the electronic component body 22 provided in the laminated electronic component 10 shown in FIGS.

On the functional material sheet 34, conductive films 35 and 36 capable of providing all the internal conductors 23 to 27 of the four types of patterns A to D are formed. More specifically,
The conductive film 35 is formed so as to extend across the cut line 37, and the internal conductors 23 or 27 and 25 of different types of patterns A and C are provided to each side via the cut line 37. In addition, the conductive film 36
Internal conductors 24 and 26 of different types of patterns B and D are provided on each side through the cut line 38 so as to extend over the cut line 38.

As described above, the conductive films 35 and 36
Each is formed so as to extend across the cut line 37 or 38. According to the respective forms of forming the conductive films 35 and 36, there is an advantage that the accuracy of the positions of the cuts along the cut lines 37 and 38 is not required to be very high. On the other hand, like the conductive film 32 or 33 shown in FIG.
When it is located above zero, high accuracy is required for the position of the cut along the cut line 30. Therefore,
As in the embodiment shown in FIG. 6, when the accuracy with respect to the position of each cut is not required to be very high, the allowable range of the error in the alignment in the subsequent stacking process can be relatively widened. .

Also on the functional material sheet 34, the conductive films 35 and 36 are formed such that a plurality of sets of the internal conductors 23 or 27, 24, 25 and 26 of the four types of patterns A to D are periodically arranged. Have been. That is, when referring to the pattern, in the X direction, A, D,
Are arranged as B, C, A,..., And also as A, D, B, C, A,.

A plurality of such functional material sheets 34 are prepared.

Next, these functional material sheets 34 are stacked to obtain a mother laminate including a plurality of stacked functional material sheets 34. At this time, as shown in FIG. 4, the electronic component body 22 in which the internal conductors 23 to 27 of the four types of patterns A to D are arranged in a predetermined order in the stacking direction.
Is formed by shifting each functional material sheet 34 in a desired direction by a desired amount so as to be formed in a mother laminate. This will be described more specifically below. As shown in FIG. 4, the internal conductors 23 to 27 are A, D, C, B, and A in order from the bottom.
Are stacked. In order to obtain the order for such patterns A to D, the second functional material sheet 3 is placed on the first functional material sheet 34.
4 are stacked with one pitch shifted in the X direction with respect to the original position, and then the third functional material sheet 34 is stacked with one pitch shifted in the-(minus) X direction with respect to the original position, Next, the fourth functional material sheet 34 is
The first functional material sheet 34 is stacked with the original position shifted by one pitch in the X direction and one pitch in the Y direction, and then stacked in the original position. Stacking is repeated.

It should be noted that the above-described manner of shifting during stacking is merely an example, and there are many other ways of shifting.

Focusing on one area defined by the cut lines 37 and 38 in the mother laminate obtained according to such stacking, patterns A, D, C, B, and A are arranged from the bottom in this order. Thus, the inner conductors 23 to 27 aligned in the stacking direction can be found. In another area, the order of patterns B, C, D, A, B, C,
The inner conductors 23 to 27 stacked in the order of A, B, D, and C, or D, B, A, C, and D can be found.

Next, the mother laminate described above is cut along cut lines 37 and 38, whereby
A plurality of electronic component bodies 22 are taken out of the mother laminate.

Next, after firing the electronic component main body 22 as necessary, the side surfaces 18 to 2 of the electronic component main body 22 are electrically connected to the corresponding ones of the internal conductors 23 to 27.
1 on each of the terminal electrodes TE1 to T2 as shown in FIG.
E4 is formed.

In the method of manufacturing the laminated electronic component 10 described above, the cutting process is performed after the stacking process of the functional material sheets 34. However, as in the case of the first embodiment, the stacking process is performed after the cutting process. The steps may be performed, and in this alternative embodiment,
There are a first embodiment and a second embodiment as described below.

In the first embodiment, in order to obtain the electronic component body 22 in which the internal conductors 23 to 27 of the patterns A to D are arranged in a predetermined order in the stacking direction, a plurality of functional materials stacked in a predetermined order are obtained. The layers 11 to 15 are respectively taken out of the different functional material sheets 34. For example, the internal conductors 23-2 of the patterns A to D shown in FIG.
When it is intended to obtain the electronic component body 22 in which the layers 7 are aligned in the stacking direction, the area including the internal conductor 27 of the pattern A is cut from the first functional material sheet 34 in accordance with the order from the bottom in FIG. Thus, the functional material layer 15 is taken out, and then the region including the internal conductor 26 of the pattern D is cut from the second functional material sheet 34 to take out the functional material layer 14. The functional material layer 13 including the inner conductor 25 of the pattern C is cut and stacked similarly, and the functional material layer 12 including the inner conductor 24 of the pattern B
And stacking of the functional material layer 11 including the inner conductor 23 of the pattern A are performed.

On the other hand, in the second embodiment, patterns A to D
In order to obtain the electronic component body 22 in which the internal conductors 23 to 27 are arranged in a predetermined order in the stacking direction, a plurality of functional material layers 11 to 15 stacked in a predetermined order are By cutting at different positions, removal from one functional material sheet 34 is performed. For example, according to the order from the bottom in FIG.
5 is taken out, and then the functional material layer 14 including the internal conductor 26 of the pattern D is similarly
4 and stacked on the functional material layer 15 described above, and thereafter, the functional material layer 13 including the internal conductor 25 of the pattern C and the internal conductor 2 of the pattern B
4 and the functional material layer 11 including the internal conductor 23 of the pattern A are sequentially taken out.
Performed from the same functional material sheet 34 and stacked.

FIG. 7 is a view corresponding to FIG. 5, showing a part of a functional material sheet 39 prepared for carrying out the third embodiment of the present invention.

In the functional material sheet 39 shown in FIG. 7, a conductive film capable of providing the internal conductor of the pattern D is not formed as compared with the functional material sheet 28 or 34 described above. By using the functional material sheet 39, an electronic component main body not having the internal conductor 26 and the functional material layer 14 shown in FIG. 4 is obtained. 2 and 3 are not formed, and this laminated electronic component gives an equivalent circuit in which the capacitor element C3 is short-circuited in the equivalent circuit diagram shown in FIG.

Referring to FIG. 7, on functional material sheet 39, all inner conductors 23 to
Conductive films 40 and 41 that can provide 25 and 27 are formed. More specifically, the conductive film 40 includes the cut line 4
2, and different types of patterns A and C are formed on each side through the cut line 42.
Of internal conductors 23 or 27 and 25, respectively. Further, the conductive film 41 is formed on the inner conductor 24 of the pattern B.
Is given.

The conductive films 40 and 41 are formed such that a plurality of sets of the internal conductors 23 or 27, 24 and 25 of the three types of patterns A to C are periodically arranged. That is, when referring to the pattern, in the X direction, they are arranged as A, B, C, A,.
In the direction, the same pattern of A, B or C is arranged along each column.

A plurality of such functional material sheets 39 are prepared, and then, these functional material sheets 39 are stacked to obtain a mother laminate including the plurality of stacked functional material sheets 39. At this time, the electronic component body in which the inner conductor 27 of the pattern A, the inner conductor 25 of the pattern C, the inner conductor 24 of the pattern B, and the inner conductor 23 of the pattern A are aligned in the stacking direction from the bottom is a mother laminated body. Is formed by shifting each functional material sheet 39 by a desired amount in a desired direction to change its planar position.

More specifically, the first functional material sheet 3
9, the second functional material sheet 39 is stacked on the original position while being shifted by one pitch in the − (minus) X direction with respect to the original position, and then the third functional material sheet 39 is The fourth functional material sheets 39 are stacked with the pitch shifted by one pitch in the X direction, and then stacked in the original position, and thereafter, such stacking is repeated as desired.

Focusing on one area defined by the cut lines 42 and 43 in the mother laminate obtained according to the above-described stacking, patterns A, C, B, and A are arranged in the stacking direction in this order. Internal conductors 27, 25, 24 and 23 can be found. In another area, the inner conductors 23 to 25 and 27 stacked in the order of patterns B, A, C, and B, or C, B, A, and C can be found.

Next, the mother laminate described above is cut along cut lines 42 and 43, whereby
A plurality of electronic component main bodies are taken out of the mother laminate, a firing step of the electronic component main body is performed as necessary, and then the electronic component main bodies are electrically connected to corresponding ones of the internal conductors 23 to 25 and 27. A terminal electrode is formed on the side surface of the electronic component body.

In the method for manufacturing a laminated electronic component using the functional material sheet 39, as described above, the cutting step is performed after the stacking of the functional material sheet 39, and the stacking step is performed after the cutting step. May be implemented. Further, when implementing the latter alternative embodiment, similarly to the above-described embodiment, the plurality of functional material layers 11 to 13 and 15 stacked in a predetermined order may be taken out from different functional material sheets 39, respectively. Alternatively, the same functional material sheet 39 may be taken out from a plurality of different positions.

FIGS. 8 to 11 illustrate a fourth embodiment of the present invention.

First, FIG. 8 shows an equivalent circuit diagram provided by the laminated electronic component 44 obtained by applying the manufacturing method according to this embodiment. The multilayer electronic component 44 includes four terminal electrodes TE5 to TE8, and the terminal electrodes TE5 and TE5.
6, the capacitor element C5 is connected, and the terminal electrode TE
5 and TE7, a capacitor element C6 is connected,
A capacitor element C is provided between the terminal electrodes TE7 and TE8.
7 is connected.

FIG. 9 is a plan view showing the appearance of the laminated electronic component 44, and FIG. 10 is a plan view showing functional material layers 45 to 48 provided in the laminated electronic component 44, respectively.

As shown in FIG. 9, the laminated electronic component 44
Two main surfaces 49 and 50 facing each other and four side surfaces 51 and 52 connecting between these two main surfaces 49 and 50,
An electronic component main body 55 having 53 and 54 is provided. The terminal electrodes TE5 to TE8 described above are formed so as to be distributed one by one on each of the side surfaces 51 to 54 of the electronic component body 55.

Referring to FIG. 10, the above-described electronic component body 5
5 is a functional material layer 45 shown in (1) and (2) in the left column.
And the functional material layers 47 and 4 shown in (1a) and (2a) in the right column.
8 is the second case. In any case, these functional material layers 45 to 48 extend in the direction in which main surfaces 49 and 50 of electronic component body 44 extend and are laminated, and are made of, for example, a ceramic dielectric.

On each of the functional material layers 45 to 48, any two of the internal conductors 56 to 63 are formed. More specifically, the inner conductor 5 is provided on the functional material layer 45.
6 and 57 are formed, the internal conductors 58 and 59 are formed on the functional material layer 46, the internal conductors 60 and 61 are formed on the functional material layer 47, and the functional material layer 4 is formed.
On 8, internal conductors 62 and 63 are formed.

These inner conductors 56 to 59 or 60 to 6
3 through a specific one of a plurality of functional material layers including the functional material layers 45 and 46 or 47 and 48 while being aligned in the stacking direction to provide the capacitor elements C5 to C7 shown in FIG. In a state of facing each other. In the normal case, the inner conductor 56 located at the upper end
Further, a functional material layer is provided so as to cover and 57 or 60 and 61.

Referring to FIG. 10 together with FIG. 9, the internal conductor 58 or 60 is connected to the terminal electrode TE5, and the internal conductor 57 or 6 is connected to the terminal electrode TE6.
1, the terminal electrode TE7 is connected to the internal conductor 56 or 62, and the terminal electrode TE8 is connected to the internal conductor 59 or 62.
Or 63 is connected.

Therefore, in the first case where the electronic component body 55 is composed of the functional material layers 45 and 46,
Capacitor element C5 is formed by the opposition of internal conductors 57 and 58, and capacitor element C5 is taken out between adjacent terminal electrodes TE5 and TE6. Similarly, a capacitor element C6 is formed by opposing the internal conductors 56 and 58, and the capacitor element C6 is extracted between the terminal electrodes TE5 and TE7 facing each other. Further, a capacitor element C7 is formed by opposing the internal conductors 56 and 59, and the capacitor element C7 is extracted between the adjacent terminal electrodes TE7 and TE8.

On the other hand, in the second case where the electronic component main body 55 is constituted by the functional material layers 47 and 48, the internal conductors 60 formed on the functional material layers 47 and 48, respectively.
10 to 63 are line-symmetric with respect to the lines extending in the vertical direction in FIG. 10 with respect to the internal conductors 56 to 59 formed on the above-described functional material layers 45 and 46, so that the terminal electrodes TE5 and The respective functions of TE7 are opposite to each other, and therefore, in the equivalent circuit diagram, the terminal electrodes TE5 and TE7 are switched to positions opposite to each other in FIG.

Therefore, capacitor element C5 is formed by opposing internal conductors 61 and 62, and capacitor element C5 is extracted between adjacent terminal electrodes TE6 and TE7. Similarly, a capacitor element C6 is formed by opposing the internal conductors 60 and 62, and the capacitor element C6 is extracted between the terminal electrodes TE5 and TE7 facing each other. Further, a capacitor element C7 is formed by opposing the internal conductors 60 and 63, and the capacitor element C7 is extracted between the adjacent terminal electrodes TE5 and TE8.

As shown in FIGS. 10 (1) and (2),
The internal conductors 56 to 59 are formed with any of the four types of patterns E to H. That is, the inner conductor 56
Is formed with a pattern E, the internal conductor 57 is formed with a pattern F, the internal conductor 58 is formed with a pattern G, and the internal conductor 59 is formed with a pattern H.

On the other hand, as shown in FIGS. 10 (1a) and (2a), the inner conductors 60 to 63 also have four types of pattern I
To L. That is, the internal conductor 60 is formed with the pattern I, the internal conductor 61 is formed with the pattern J, and the internal conductor 62 is formed.
Are formed with a pattern K, and the internal conductor 63 is formed with a pattern L.

FIG. 11 shows the functional material layer 45 shown in FIG.
It is a top view which shows a part of functional material sheet | seat 64 prepared in order to obtain -48.

In FIG. 11, “E”, “F”,
"G", "H", "I", "J", "K" and "L"
Indicates the type of the pattern described above.
“E”, “F”, “G”, “H”,
It corresponds to "I", "J", "K" and "L".

On the functional material sheet 64, conductive films 65 to 68 capable of providing all the internal conductors 56 to 63 of these eight types of patterns E to L are formed.

More specifically, the conductive film 65 is
9, and different types of patterns E and I are formed on each side through the cut line 69.
Of internal conductors 56 and 60, respectively. The conductive film 66 is formed so as to extend across the cut line 70, and the internal conductors 57 and 6 of the different types of patterns F and L are provided on each side through the cut line 70.
3 are given. The conductive film 67 is formed so as to extend over the cut line 69.
On the other hand, the internal conductors 62 and 58 of different types of patterns K and G are provided on each side via the reference numeral 9.
Further, the conductive film 68 is formed so as to extend across the cut line 70, and the internal conductors 61 and 59 of different types of patterns J and H are provided to each side via the cut line 70.

The conductive films 65 to 68 are formed such that a plurality of sets of the internal conductors 56 to 63 of the eight patterns E to L are periodically arranged. That is, referring to the pattern, in a certain row in the X direction, E /
F, I / J, E / F,..., And in another row, K / L, G / H, K / L,. In the Y direction, E /
F, K / L, E / F,..., And in another row, G / H, I / J, G / H,.

A plurality of such functional material sheets 64 are prepared, and then, these functional material sheets 64 are stacked to obtain a mother laminate including the plurality of stacked functional material sheets 64.

At this time, as shown in FIGS. 10 (1) and (2) or (1a) and (2a), the inner conductors 56 to 59 of the four types of patterns E to H or the four types of patterns I to L Each of the functional material sheets 64 is moved in a desired direction so that the electronic component body 55 in which the internal conductors 60 to 63 are aligned in the laminating direction in a predetermined order is formed in the mother laminate. The planar position is changed by shifting by a desired amount.

More specifically, as shown in FIGS. 10A and 10B, the pattern E is placed on the pattern G / H.
/ F are stacked, and FIGS. 10 (1a) and (2)
As shown in a), the pattern I /
The first functional material sheet 64 so that J is stacked
At the top, the second functional material sheet 64 is
The stacks are shifted by one pitch in the X direction and one pitch in the Y direction, and such stacking is repeated as desired.

Focusing on one area defined by the cut lines 69 and 70 in the mother laminate obtained according to such stacking, there is a pattern on the inner conductor 58/59 of the pattern G / H. The part where the inner conductor 56/57 of the E / F is located can be found. In another area, the internal conductors 60/61 of the pattern I / J are placed on the internal conductors 62/63 of the pattern K / L.
You can find the part where is located.

Next, the mother laminate described above is cut along cut lines 69 and 70, whereby
A plurality of electronic component bodies 55 are taken out of the mother laminate.

Next, these electronic component bodies 55 are fired, if necessary, and then the internal conductors 56 to 59 or 6
Terminal electrodes TE5 to TE8 are formed on each of the side surfaces 51 to 54 of the electronic component body 55 as shown in FIG. 9 so as to be electrically connected to the corresponding components 0 to 63.

The functional material sheet 64 shown in FIG.
Although the detailed description is omitted in the case where is used, it can be changed so that the stacking step is performed after the cutting step. Also, in this alternative embodiment, as described above, a plurality of functional material layers 45 and 46 or 47 and 48 stacked in a predetermined order to obtain the electronic component body 55 are formed by using different functional material sheets 6.
4 and a second example in which the same functional material sheet 64 is removed from one functional material sheet 64 by cutting the same functional material sheet 64 at a plurality of different positions.

FIGS. 12 and 13 are views corresponding to FIG. 3 described above, and show still another example of the laminated electronic component obtained by the manufacturing method according to the present invention.

The laminated electronic component 71 shown in FIG. 12 has an electronic component body 78 having two main surfaces 72 and 73 facing each other and four side surfaces 74 to 77 connecting the main surfaces 72 and 73 to each other. Four sides 74 of electronic component body 78
To 77 are provided with eight terminal electrodes TE11 to TE18 distributed two by two.

Although not shown, an electronic component body 78 provided in such a laminated electronic component 71 includes a plurality of functional material layers that extend in the direction in which the main surfaces 72 and 73 extend and are stacked,
A plurality of internal conductors respectively formed along a plurality of specific interfaces between these functional material layers. These internal conductors are electrically connected to any of the eight terminal electrodes TE11 to TE18, and are thus formed with any of eight types of patterns.

On the other hand, the laminated electronic component 79 shown in FIG.
Is an electronic component main body 86 having two main surfaces 80 and 81 facing each other, four side surfaces 82 to 85 connecting the main surfaces 80 and 81, and four side surfaces 82 to 85 of the electronic component main body 86. Are provided with twelve terminal electrodes TE21 to TE32 distributed three by three.

Although not shown, the electronic component main body 86 provided in such a laminated electronic component 79 includes a plurality of functional material layers extending in the direction in which the main surfaces 72 and 73 extend and stacked.
A plurality of internal conductors respectively formed along a plurality of specific interfaces between these functional material layers. And
These inner conductors are composed of twelve terminal electrodes TE21 to TE3.
1 so that it can be electrically connected to either
It is formed with one of two types of patterns.

In the case of manufacturing each of such laminated electronic components 71 and 79, a functional material sheet corresponding to the functional material sheets 28, 34, 39 or 64 described above is prepared, and 8 By forming a conductive film capable of providing all kinds of internal conductors of 12 types or more of patterns, the multilayer electronic components 71 and 79 can be manufactured by applying the manufacturing method according to the present invention.

Although the present invention has been described with reference to the illustrated embodiment, various other embodiments are possible within the scope of the present invention.

For example, in the laminated electronic component, the number of internal conductors formed, the pattern and connection mode, the number and positions of terminal electrodes, and the like can be appropriately changed. For example, the internal conductor formed on the functional material sheet does not necessarily need to be formed in each of the divided areas surrounded by the cut line, and may be formed in an appropriate necessary area to obtain the performance of a component selectively obtained. Separating is optional.

Accordingly, by appropriately changing the pattern and connection mode of the internal conductor as described above, in addition to the one that functions as a capacitor as in the illustrated embodiment, for example, a multilayer electronic component that functions as an inductor or the like can also be used. It can be manufactured by applying the manufacturing method according to the present invention.

In the illustrated embodiment, the functional material layer or the functional material sheet is made of a ceramic dielectric, but is made of a material other than the dielectric, for example, a magnetic material, a varistor material, or a simple electric insulating material. Or a material other than ceramic, for example, a resin. Also in this regard, in addition to those that function as capacitors, for example, multilayer electronic components that function as inductors, varistors, and the like can be manufactured by applying the manufacturing method according to the present invention.

[0106]

As described above, according to the present invention, there are provided three or more inner conductors formed along a plurality of specific interfaces between a plurality of functional material layers, respectively, and each of these inner conductors A function of forming a conductive film capable of providing all the internal conductors of three or more types of patterns in manufacturing such a multilayer electronic component, in which any one of the types or more of the patterns is arranged in a predetermined order in the stacking direction. Since the material sheet is used, all of the functional material layers on which the internal conductors are formed can be extracted from the functional material sheet.

Accordingly, it is possible to manufacture a laminated electronic component having three or more types of internal conductors by simply preparing one type of functional material sheet having a conductive film of the same formation mode. Therefore, a functional material sheet on which a conductive film having a desired formation mode is formed can be efficiently manufactured, and accordingly, even in the case of a laminated electronic component having three or more types of patterns of internal conductors, it is possible to manufacture the functional material sheet. Cost can be reduced.

Further, the structure relating to the internal conductor of the obtained laminated electronic component can be changed only by changing the type or order of the internal conductors taken out of the functional material sheet. Therefore, only by preparing one type of functional material sheet Thus, it is possible to quickly cope with the production of a plurality of types of laminated electronic components.

In the present invention, each functional material sheet is changed in its planar position so that an electronic component body in which three or more types of patterns of internal conductors are arranged in a predetermined order in the stacking direction is formed. Stack, thereby,
After obtaining a mother laminate including a plurality of stacked functional material sheets, the mother laminate is cut along a predetermined cut line, whereby at least one of the mother laminates is separated from the mother laminate.
If two electronic component bodies are taken out, a relatively large functional material sheet is handled in stacking, so that the stacking process can be easily performed.

In the case described above, if a conductive film is formed on a functional material sheet so that a plurality of sets of internal conductors of three or more patterns are periodically arranged, a single mother lamination is performed by a cutting process. A plurality of electronic component bodies can be taken out of the body, and the productivity of the laminated electronic component can be improved.

On the other hand, in the present invention, the functional material sheet is cut along a predetermined cut line, whereby a plurality of functional material layers for constituting the electronic component body are taken out from the functional material sheet, and then the plurality of functional material layers are removed. Are stacked in a predetermined order, thereby obtaining an electronic component body in which three or more types of internal conductors are arranged in a predetermined order in the stacking direction. Since the cutting process can proceed without bothering with variations and undesired deformation, the accuracy of the cutting position can be improved.

In the above-described case, when cutting the functional material sheet, a plurality of functional material sheets are cut, whereby the functional material layers for constituting the electronic component body are taken out from each functional material sheet. If so, steps for obtaining a plurality of electronic component bodies can be performed simultaneously, so that a manufacturing method suitable for mass production can be achieved.

On the other hand, in the case described above, when the functional material sheet is cut, the functional material sheet is cut at a plurality of different positions, whereby a plurality of functional material layers for forming the electronic component body are formed into one functional material layer. By taking out from the material sheet, it becomes possible to obtain a larger number of electronic component bodies from a smaller number of functional material sheets, and to take out a functional material layer for the electronic component body in the functional material sheet. A wasteful portion that is not provided can be reduced.

In the present invention, if the conductive film is formed so as to extend over the cut line, it is possible to prevent the accuracy of the cut position from being required to be too high.

In the above case, if the conductive film is provided with different types of internal conductors on the respective sides via the cut lines, the conductive films are provided on the respective sides via the cut lines. Each part of the conductive film can be used without waste.

Further, according to the present invention, each set of adjacent ones in the stacking direction of the internal conductors provided in the electronic component body has different types of patterns and faces each other via a specific one of the functional material layers. By doing so, one functional element is constituted, the number of terminal electrodes is three or more, and each functional element is taken out between each set of terminal electrodes in which two of the terminal electrodes constitute one set. Furthermore, such a laminated electronic component in which the internal conductor is connected to the terminal electrode can be efficiently manufactured.

In the laminated electronic component having the above-described structure, when the functional material layer is a dielectric layer and the functional element is a capacitor element, such a capacitor element is taken out between specific terminal electrodes. These terminal electrodes are
For example, by connecting each of the electric elements of the bridge circuit to each terminal, a capacitor element can be connected in parallel to each of the electric elements of the bridge circuit. While being easily handled in a chip state, it can be used for protection of the electric element such as surge current absorption.

In the present invention, when the functional material sheet is composed of ceramic green sheets, the multilayer electronic component according to the present invention is manufactured by basically utilizing a conventional manufacturing method of a multilayer ceramic electronic component. be able to.

[Brief description of the drawings]

FIG. 1 is a circuit diagram showing a bridge circuit 1 for explaining an application of a laminated electronic component obtained by applying a manufacturing method according to an embodiment of the present invention.

FIG. 2 is an equivalent circuit diagram provided by a laminated electronic component 10 which is advantageously used in combination with the bridge circuit 1 shown in FIG.

FIG. 3 is a plan view showing the appearance of the multilayer electronic component 10 shown in FIG.

FIG. 4 is a plan view showing a plurality of functional material layers 11 to 15 provided in the electronic component body 22 shown in FIG.

FIG. 5 is a plan view showing a part of a functional material sheet prepared for carrying out the first embodiment of the present invention.

FIG. 6 is a plan view showing a part of a functional material sheet prepared for carrying out a second embodiment of the present invention.

FIG. 7 is a plan view showing a part of a functional material sheet 39 prepared for carrying out a third embodiment of the present invention.

FIG. 8 is an equivalent circuit diagram provided by a laminated electronic component 44 obtained by implementing a fourth embodiment of the present invention.

FIG. 9 is a plan view showing an appearance of the multilayer electronic component 44 shown in FIG.

FIG. 10 is a plan view showing functional material layers 45 to 48 provided in the electronic component body 55 shown in FIG.

11 is a plan view showing a part of a functional material sheet 64 prepared for taking out the functional material layers 45 to 48 shown in FIG.

FIG. 12 is a plan view illustrating an appearance of a multilayer electronic component 71 obtained according to a fifth embodiment of the present invention.

FIG. 13 is a plan view illustrating an appearance of a multilayer electronic component 79 obtained according to a sixth embodiment of the present invention.

[Explanation of symbols]

10, 44, 71, 79 Multilayer electronic component 11 to 15, 45 to 48 Functional material layer 16, 17, 49, 50, 72, 73, 80, 81 Main surface 18 to 21, 51 to 54, 74 to 77, 82 -85 Side surface 22,55,78,86 Electronic component main body 23-27,56-63 Internal conductor 28,34,39,64 Functional material sheet 29,30,37,38,42,43,69,70 Cut line 31 ~ 33,35,36,40,41,65-68 Conductive film

Claims (10)

[Claims] An electronic component main body having two main surfaces facing each other and a side surface connecting the two main surfaces, and a plurality of terminal electrodes formed at different positions on the side surfaces of the electronic component main body. The electronic component body includes a plurality of functional material layers extending in the direction in which the main surface extends and stacked, and a specific one of the plurality of functional material layers electrically connected to the plurality of terminal electrodes and between the plurality of functional material layers. And three or more internal conductors formed along a plurality of interfaces, respectively, wherein the three or more internal conductors are arranged in the laminating direction in a predetermined order with any one of three or more patterns. A method for manufacturing such a laminated electronic component, comprising: preparing a plurality of functional material sheets; and forming the three or more types of patterns on each of the functional material sheets in the same manner as each other. All Forming a conductive film capable of providing an internal conductor of the electronic component main body, wherein the internal conductors of the three or more types of patterns are arranged in the predetermined order in the stacking direction. Stacking the material sheets while changing their planar position, thereby obtaining a mother laminate including a plurality of the stacked functional material sheets; and cutting the mother laminate along a predetermined cut line. ,
Removing the at least one electronic component main body from the mother laminate; and connecting the plurality of terminal electrodes at different positions on the side surface of the electronic component main body so as to be electrically connected to the internal conductor. Forming a laminated electronic component. 2. The method according to claim 1, wherein the conductive film is formed such that a plurality of sets of the internal conductors of the three or more types of patterns are periodically arranged. To take out the electronic component body,
The method for manufacturing a multilayer electronic component according to claim 1, further comprising a step of cutting the mother multilayer body. 3. An electronic component main body having two opposing main surfaces and a side surface connecting the two main surfaces, and a plurality of terminal electrodes formed at different positions on the side surface of the electronic component main body. The electronic component body includes a plurality of functional material layers extending in the direction in which the main surface extends and stacked, and a specific one of the plurality of functional material layers electrically connected to the plurality of terminal electrodes and between the plurality of functional material layers. And three or more internal conductors formed along a plurality of interfaces, respectively, wherein the three or more internal conductors are arranged in the laminating direction in a predetermined order with any one of three or more patterns. A method for manufacturing such a laminated electronic component, comprising: providing a functional material sheet; and a conductive film capable of providing all the internal conductors of the three or more types of patterns on the functional material sheet. Work to form Cutting the functional material sheet along a predetermined cut line, thereby taking out the plurality of functional material layers for forming the electronic component main body from the functional material sheet; and Stacking layers in a predetermined order, thereby obtaining the electronic component body in which the internal conductors of the three or more types of patterns are aligned in the stacking direction in the predetermined order; and electrically connecting to the internal conductors Forming the plurality of terminal electrodes at different positions on the side surface of the electronic component body. 4. The step of preparing the functional material sheet,
A step of preparing a plurality of the functional material sheets, wherein the step of cutting the functional material sheets includes cutting the plurality of the functional material sheets, thereby forming each of the functional materials for forming the electronic component body. The method for manufacturing a laminated electronic component according to claim 3, further comprising a step of extracting a layer from each of the functional material sheets. 5. The step of cutting the functional material sheet, wherein the functional material sheet is cut at a plurality of different positions, whereby a plurality of the functional material layers for constituting the electronic component main body are formed into one of the plurality of functional material layers. The method for manufacturing a laminated electronic component according to claim 3, further comprising a step of taking out from the functional material sheet. 6. The method for manufacturing a multilayer electronic component according to claim 1, wherein the conductive film includes one formed so as to extend over the cut line. 7. The method for manufacturing a laminated electronic component according to claim 6, wherein the conductive film includes a material that gives the internal conductors of different types to each other via the cut line. 8. A set of adjacent ones of the internal conductors provided in the electronic component body in the laminating direction having different types of patterns and facing each other via a specific one of the functional material layers. One functional element is constituted, the number of the terminal electrodes is three or more, and each of the functional elements is respectively taken out between each set of terminal electrodes including two of the terminal electrodes as one set. To
The method according to claim 1, wherein the internal conductor is connected to the terminal electrode. 9. The method according to claim 8, wherein the functional material layer is a dielectric layer, and the functional element is a capacitor element. 10. The method for manufacturing a multilayer electronic component according to claim 1, wherein the functional material sheet is a ceramic green sheet, and further comprising a step of firing the electronic component body.