EP1526640A4 - Composant piezoelectrique et son procede de fabrication - Google Patents

Composant piezoelectrique et son procede de fabrication

Info

Publication number
EP1526640A4
EP1526640A4 EP03771283A EP03771283A EP1526640A4 EP 1526640 A4 EP1526640 A4 EP 1526640A4 EP 03771283 A EP03771283 A EP 03771283A EP 03771283 A EP03771283 A EP 03771283A EP 1526640 A4 EP1526640 A4 EP 1526640A4
Authority
EP
European Patent Office
Prior art keywords
manufacturing
same
piezoelectric component
piezoelectric
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03771283A
Other languages
German (de)
English (en)
Other versions
EP1526640A1 (fr
Inventor
Yoshihiro Koshido
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of EP1526640A1 publication Critical patent/EP1526640A1/fr
Publication of EP1526640A4 publication Critical patent/EP1526640A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/105—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the BAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H03H9/6423—Means for obtaining a particular transfer characteristic
    • H03H9/6433—Coupled resonator filters
    • H03H9/6483—Ladder SAW filters
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
EP03771283A 2002-07-31 2003-07-23 Composant piezoelectrique et son procede de fabrication Withdrawn EP1526640A4 (fr)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002222608 2002-07-31
JP2002222608 2002-07-31
JP2003198053 2003-07-16
JP2003198053A JP2004129223A (ja) 2002-07-31 2003-07-16 圧電部品およびその製造方法
PCT/JP2003/009309 WO2004012331A1 (fr) 2002-07-31 2003-07-23 Composant piezoelectrique et son procede de fabrication

Publications (2)

Publication Number Publication Date
EP1526640A1 EP1526640A1 (fr) 2005-04-27
EP1526640A4 true EP1526640A4 (fr) 2005-04-27

Family

ID=31190339

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03771283A Withdrawn EP1526640A4 (fr) 2002-07-31 2003-07-23 Composant piezoelectrique et son procede de fabrication

Country Status (7)

Country Link
US (1) US7042056B2 (fr)
EP (1) EP1526640A4 (fr)
JP (1) JP2004129223A (fr)
KR (1) KR100654054B1 (fr)
CN (1) CN1568570A (fr)
AU (1) AU2003252238A1 (fr)
WO (1) WO2004012331A1 (fr)

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DE602005025746D1 (de) * 2004-04-16 2011-02-17 Nxp Bv Integrierte schaltung, verfahren zur herstellung der integrierten schaltung und mobiltelefon mit der integrierten schaltung
JP4535778B2 (ja) * 2004-05-26 2010-09-01 京セラ株式会社 デバイス装置の製造方法
GB2431512B (en) * 2004-06-25 2008-05-21 Murata Manufacturing Co Piezoelectric device
WO2006008940A1 (fr) * 2004-07-20 2006-01-26 Murata Manufacturing Co., Ltd. Filtre piézoélectrique
KR100618343B1 (ko) * 2004-10-28 2006-08-31 삼성전자주식회사 패키징 기판의 제조방법 및 이를 이용한 패키징 방법.
KR100666693B1 (ko) 2004-11-23 2007-01-11 삼성전자주식회사 모놀리식 듀플렉서
JP2006238014A (ja) * 2005-02-24 2006-09-07 Kyocera Corp 弾性表面波素子実装基板及びそれを用いた高周波モジュール、通信機器
JP4715236B2 (ja) * 2005-03-01 2011-07-06 株式会社デンソー 超音波センサ装置
US7495462B2 (en) * 2005-03-24 2009-02-24 Memsic, Inc. Method of wafer-level packaging using low-aspect ratio through-wafer holes
US20060238274A1 (en) * 2005-04-22 2006-10-26 Ycl Electronics Co., Ltd. Surface acoustic wave device
WO2006126382A1 (fr) * 2005-05-24 2006-11-30 Murata Manufacturing Co., Ltd. Dispositif piezoelectrique
DE102005026243B4 (de) 2005-06-07 2018-04-05 Snaptrack, Inc. Elektrisches Bauelement und Herstellungsverfahren
JP4586852B2 (ja) * 2005-06-16 2010-11-24 株式会社村田製作所 圧電デバイス及びその製造方法
CN101091312B (zh) * 2005-11-02 2011-12-28 松下电器产业株式会社 电子部件组件
JP4681007B2 (ja) * 2005-12-15 2011-05-11 旭化成エレクトロニクス株式会社 電圧制御発振器
JP2007189501A (ja) * 2006-01-13 2007-07-26 Matsushita Electric Ind Co Ltd 電子部品
US20070164633A1 (en) * 2006-01-13 2007-07-19 Honeywell International Inc. Quartz SAW sensor based on direct quartz bonding
KR100731351B1 (ko) * 2006-02-01 2007-06-21 삼성전자주식회사 탄성 표면파 디바이스 웨이퍼 레벨 패키지 및 그 패키징방법
US20070188054A1 (en) * 2006-02-13 2007-08-16 Honeywell International Inc. Surface acoustic wave packages and methods of forming same
US8143681B2 (en) * 2006-04-20 2012-03-27 The George Washington University Saw devices, processes for making them, and methods of use
US20100007444A1 (en) * 2006-04-20 2010-01-14 Anis Nurashikin Nordin GHz Surface Acoustic Resonators in RF-CMOS
JP4878207B2 (ja) * 2006-04-28 2012-02-15 京セラキンセキ株式会社 圧電デバイス
JP4910500B2 (ja) * 2006-06-22 2012-04-04 株式会社村田製作所 フィルタ装置
KR100750741B1 (ko) * 2006-09-15 2007-08-22 삼성전기주식회사 캡 웨이퍼, 이를 구비한 반도체 칩, 및 그 제조방법
US20090124513A1 (en) * 2007-04-20 2009-05-14 Patricia Berg Multiplex Biosensor
US8018010B2 (en) 2007-04-20 2011-09-13 The George Washington University Circular surface acoustic wave (SAW) devices, processes for making them, and methods of use
JP5368299B2 (ja) * 2007-04-27 2013-12-18 パナソニック株式会社 電子部品実装体及びハンダバンプ付き電子部品の製造方法
JP2009010121A (ja) * 2007-06-27 2009-01-15 Hitachi Media Electoronics Co Ltd 中空封止素子、その製造方法ならびに中空封止素子を用いた移動通信機器
KR101411416B1 (ko) 2007-12-14 2014-06-26 삼성전자주식회사 마이크로 스피커 제조방법 및 이 방법에 의해 제조된마이크로 스피커
JP5251224B2 (ja) * 2008-04-18 2013-07-31 株式会社大真空 圧電振動デバイスの製造方法および圧電振動デバイス
JP4843012B2 (ja) * 2008-11-17 2011-12-21 日本電波工業株式会社 圧電デバイスとその製造方法
US9397633B2 (en) * 2010-01-12 2016-07-19 Kyocera Corporation Acoustic wave device
JP5213887B2 (ja) * 2010-02-22 2013-06-19 京セラ株式会社 弾性表面波素子
US8960004B2 (en) 2010-09-29 2015-02-24 The George Washington University Synchronous one-pole surface acoustic wave resonator
DE112012001150B4 (de) * 2011-03-09 2018-03-01 Murata Manufacturing Co., Ltd. Elektronische Komponente
JP5597583B2 (ja) * 2011-03-28 2014-10-01 太陽誘電株式会社 タッチパネル装置及び電子機器
DE102011016554B4 (de) * 2011-04-08 2018-11-22 Snaptrack, Inc. Waferlevel-Package und Verfahren zur Herstellung
JP2013046167A (ja) * 2011-08-23 2013-03-04 Seiko Epson Corp 振動デバイス、及び振動デバイスの製造方法
US9040837B2 (en) * 2011-12-14 2015-05-26 Ibiden Co., Ltd. Wiring board and method for manufacturing the same
CN103546111A (zh) * 2012-07-12 2014-01-29 湖南省福晶电子有限公司 一种凹盖封装石英晶体谐振器及其制造方法
JP6347091B2 (ja) * 2013-03-11 2018-06-27 セイコーエプソン株式会社 センサーユニット、電子機器および運動体
JP6385648B2 (ja) 2013-05-14 2018-09-05 太陽誘電株式会社 弾性波デバイス、及び弾性波デバイスの製造方法
JP5813177B2 (ja) * 2014-06-12 2015-11-17 京セラ株式会社 弾性波装置および回路基板
WO2016067924A1 (fr) 2014-10-27 2016-05-06 株式会社村田製作所 Dispositif piézoélectrique, et procédé de fabrication de celui-ci
WO2016068003A1 (fr) * 2014-10-29 2016-05-06 株式会社村田製作所 Module piézoélectrique
JP6669429B2 (ja) * 2014-12-25 2020-03-18 京セラ株式会社 弾性波素子および通信装置
JP6547848B2 (ja) * 2015-12-25 2019-07-24 株式会社村田製作所 高周波モジュール
US10778183B2 (en) 2016-07-18 2020-09-15 Skyworks Filter Solutions Japan Co., Ltd. Saw-based electronic elements and filter devices
JP6298120B2 (ja) * 2016-08-25 2018-03-20 京セラ株式会社 弾性波装置および回路基板
JP6766250B2 (ja) * 2017-03-22 2020-10-07 京セラ株式会社 弾性波装置、分波器および通信装置
US10483248B2 (en) * 2017-03-23 2019-11-19 Skyworks Solutions, Inc. Wafer level chip scale filter packaging using semiconductor wafers with through wafer vias
GB2578202B (en) * 2018-08-22 2022-11-02 Skyworks Solutions Inc Multilayer piezolelectric substrate
US11557710B2 (en) * 2018-10-31 2023-01-17 Taiwan Semiconductor Manufacturing Company, Ltd. Fully-wet via patterning method in piezoelectric sensor
KR102574417B1 (ko) * 2018-11-02 2023-09-04 삼성전기주식회사 박막형 패키지
DE102018132644B4 (de) * 2018-12-18 2020-08-06 RF360 Europe GmbH Mikroakustisches Gehäuse auf Waferebene und Herstellungsverfahren
WO2020203044A1 (fr) * 2019-03-29 2020-10-08 株式会社村田製作所 Oscillateur et son procédé de fabrication
JP2022525465A (ja) * 2019-04-05 2022-05-16 レゾナント インコーポレイテッド 横方向に励起されたフィルムバルク音響共振器パッケージ及び方法
CN110289825B (zh) * 2019-07-29 2024-03-12 苏州汉天下电子有限公司 一种薄膜体声波谐振器及其制造方法、滤波器以及双工器
CN115176415A (zh) * 2020-04-09 2022-10-11 株式会社村田制作所 集合基板的制造方法以及集合基板
CN111490743B (zh) * 2020-05-22 2023-06-06 北京超材信息科技有限公司 一种终端saw滤波器制作方法
CN114553182A (zh) 2020-11-24 2022-05-27 联华电子股份有限公司 表面音波组件结构及其制造方法
KR20230148243A (ko) * 2021-03-31 2023-10-24 가부시키가이샤 무라타 세이사쿠쇼 탄성파 장치
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JPH0486012A (ja) * 1990-07-27 1992-03-18 Seiko Electronic Components Ltd 水晶振動子とその支持台
JPH10303690A (ja) * 1997-04-25 1998-11-13 Mitsubishi Electric Corp 表面弾性波装置及びその製造方法
EP0939485A1 (fr) * 1998-02-27 1999-09-01 TDK Corporation Dispositif à puce et méthode de sa réalisation

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JPH08116227A (ja) 1994-10-18 1996-05-07 Kokusai Electric Co Ltd パッケージｓａｗデバイスの製造方法
JP3265889B2 (ja) 1995-02-03 2002-03-18 松下電器産業株式会社 表面弾性波装置及びその製造方法
JP3329175B2 (ja) 1996-03-11 2002-09-30 松下電器産業株式会社 弾性表面波デバイス及びその製造方法
JPH1093383A (ja) 1996-05-15 1998-04-10 Matsushita Electric Ind Co Ltd 弾性表面波デバイス及びその製造方法
JPH1032293A (ja) 1996-07-17 1998-02-03 Matsushita Electric Ind Co Ltd 電子部品の製造方法
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JP3772702B2 (ja) 2001-07-23 2006-05-10 松下電器産業株式会社 弾性表面波装置の製造方法

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Publication number Priority date Publication date Assignee Title
JPH0486012A (ja) * 1990-07-27 1992-03-18 Seiko Electronic Components Ltd 水晶振動子とその支持台
JPH10303690A (ja) * 1997-04-25 1998-11-13 Mitsubishi Electric Corp 表面弾性波装置及びその製造方法
EP0939485A1 (fr) * 1998-02-27 1999-09-01 TDK Corporation Dispositif à puce et méthode de sa réalisation

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PATENT ABSTRACTS OF JAPAN vol. 1999, no. 02 26 February 1999 (1999-02-26) *
See also references of WO2004012331A1 *

Also Published As

Publication number Publication date
KR20040079985A (ko) 2004-09-16
EP1526640A1 (fr) 2005-04-27
US20040232802A1 (en) 2004-11-25
CN1568570A (zh) 2005-01-19
KR100654054B1 (ko) 2006-12-05
AU2003252238A1 (en) 2004-02-16
US7042056B2 (en) 2006-05-09
JP2004129223A (ja) 2004-04-22
WO2004012331A1 (fr) 2004-02-05

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