WO2006126382A1 - Dispositif piezoelectrique - Google Patents

Dispositif piezoelectrique Download PDF

Info

Publication number
WO2006126382A1
WO2006126382A1 PCT/JP2006/309245 JP2006309245W WO2006126382A1 WO 2006126382 A1 WO2006126382 A1 WO 2006126382A1 JP 2006309245 W JP2006309245 W JP 2006309245W WO 2006126382 A1 WO2006126382 A1 WO 2006126382A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
resin
piezoelectric device
piezoelectric
resin layer
Prior art date
Application number
PCT/JP2006/309245
Other languages
English (en)
Japanese (ja)
Inventor
Hayami Kudo
Hajime Yamada
Original Assignee
Murata Manufacturing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co., Ltd. filed Critical Murata Manufacturing Co., Ltd.
Publication of WO2006126382A1 publication Critical patent/WO2006126382A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/105—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the BAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/54—Filters comprising resonators of piezo-electric or electrostrictive material
    • H03H9/56—Monolithic crystal filters
    • H03H9/564—Monolithic crystal filters implemented with thin-film techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Definitions

  • FIG. 1 is a cross-sectional view of a piezoelectric device. (Example)
  • FIG. 3 is a cross-sectional view of a cut portion. (Example)
  • FIG. 1 is a cross-sectional view of the piezoelectric device 10.
  • Piezoelectric device 10 is a BAW filter

Abstract

L’invention concerne un dispositif piézoélectrique qui peut être fabriqué efficacement. Un substrat de couverture (20) est fixé le long de la périphérie d’un substrat d’élément (12) sur lequel est formé un élément piézoélectrique, et ce dernier est scellé. Le plan principal du substrat de couverture (20) est doté d’une borne externe (26) composée principalement de soudure et d’une couche extérieure (25) composée de résine pour recouvrir les parties autres que la borne externe (26). Un premier substrat assemblé pour former le substrat d’élément (12) d’une pluralité de dispositifs piézoélectriques (10) et un second substrat assemblé pour former le substrat de couverture (20) des dispositifs (10) sont fixés de sorte à coller chaque substrat d’élément (12) et chaque substrat de couverture (20), puis les substrats ainsi assemblés sont découpés le long d’une ligne de taille en des dispositifs piézoélectriques indépendants (10). Avant la découpe, sur le second substrat assemblé, une couche en résine extérieure (25) est formée sur le plan opposé à celui sur lequel le premier substrat assemblé doit être fixé. Sur la couche en résine, une section de découpe sans résine est formée le long de la ligne de taille avant la découpe du second substrat assemblé.
PCT/JP2006/309245 2005-05-24 2006-05-08 Dispositif piezoelectrique WO2006126382A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005-150669 2005-05-24
JP2005150669 2005-05-24

Publications (1)

Publication Number Publication Date
WO2006126382A1 true WO2006126382A1 (fr) 2006-11-30

Family

ID=37451809

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/309245 WO2006126382A1 (fr) 2005-05-24 2006-05-08 Dispositif piezoelectrique

Country Status (1)

Country Link
WO (1) WO2006126382A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009032974A (ja) * 2007-07-27 2009-02-12 Seiko Epson Corp 薄膜デバイスの製造方法及び薄膜デバイス形成基板並びに液体噴射ヘッドの製造方法
JP2012114554A (ja) * 2010-11-22 2012-06-14 Seiko Epson Corp 圧電振動片の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004096456A (ja) * 2002-08-30 2004-03-25 Toyo Commun Equip Co Ltd 表面実装型ｓａｗデバイス、及びその製造方法
JP2004129223A (ja) * 2002-07-31 2004-04-22 Murata Mfg Co Ltd 圧電部品およびその製造方法
JP2005094257A (ja) * 2003-09-16 2005-04-07 Toyo Commun Equip Co Ltd 弾性表面波デバイスの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004129223A (ja) * 2002-07-31 2004-04-22 Murata Mfg Co Ltd 圧電部品およびその製造方法
JP2004096456A (ja) * 2002-08-30 2004-03-25 Toyo Commun Equip Co Ltd 表面実装型ｓａｗデバイス、及びその製造方法
JP2005094257A (ja) * 2003-09-16 2005-04-07 Toyo Commun Equip Co Ltd 弾性表面波デバイスの製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009032974A (ja) * 2007-07-27 2009-02-12 Seiko Epson Corp 薄膜デバイスの製造方法及び薄膜デバイス形成基板並びに液体噴射ヘッドの製造方法
JP2012114554A (ja) * 2010-11-22 2012-06-14 Seiko Epson Corp 圧電振動片の製造方法

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