JP5217836B2 - 弾性表面波デバイス - Google Patents
弾性表面波デバイス Download PDFInfo
- Publication number
- JP5217836B2 JP5217836B2 JP2008243742A JP2008243742A JP5217836B2 JP 5217836 B2 JP5217836 B2 JP 5217836B2 JP 2008243742 A JP2008243742 A JP 2008243742A JP 2008243742 A JP2008243742 A JP 2008243742A JP 5217836 B2 JP5217836 B2 JP 5217836B2
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric substrate
- acoustic wave
- surface acoustic
- plating layer
- top plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000010897 surface acoustic wave method Methods 0.000 title claims description 27
- 238000007747 plating Methods 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 20
- 238000007789 sealing Methods 0.000 claims description 20
- 239000011888 foil Substances 0.000 claims description 19
- 239000000945 filler Substances 0.000 claims description 10
- 230000005284 excitation Effects 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 6
- 238000000926 separation method Methods 0.000 description 5
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010295 mobile communication Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Images
Description
2 櫛形電極
3 パッド電極
5 封止樹脂
6 励振空間
7 側壁
8 天板
8a 金属箔(銅箔)
8b メッキ層
9 接着層
10 接続電極
11 外部電極
Claims (2)
- 異方性を有する圧電基板と、この圧電基板の表面に設けられた櫛形電極およびパッド電極と、前記圧電基板上に設けられ前記櫛形電極を囲む側壁と、この側壁上に設けられ前記櫛形電極の励振空間を覆う天板と、前記天板および前記圧電基板表面を覆うフィラー入り封止樹脂と、この封止樹脂上に設けられ前記パッド電極と電気的に接続された外部電極とを備え、前記天板は前記側壁の開口部を覆う金属箔と、この金属箔上に設けられた前記金属箔よりも厚いメッキ層からなり、前記圧電基板と前記メッキ層で、線膨張率の差が大きくなる方向に前記メッキ層を分離させた弾性表面波デバイス。
- 櫛形電極により構成した共振子を複数個有し、側壁は個々の前記共振子を個別に囲むとともに、一つの天板で前記共振子全ての励振空間を覆っている請求項1記載の弾性表面波デバイス。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008243742A JP5217836B2 (ja) | 2008-09-24 | 2008-09-24 | 弾性表面波デバイス |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008243742A JP5217836B2 (ja) | 2008-09-24 | 2008-09-24 | 弾性表面波デバイス |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010081006A JP2010081006A (ja) | 2010-04-08 |
JP5217836B2 true JP5217836B2 (ja) | 2013-06-19 |
Family
ID=42211000
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008243742A Active JP5217836B2 (ja) | 2008-09-24 | 2008-09-24 | 弾性表面波デバイス |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5217836B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102762402B (zh) | 2010-03-31 | 2015-05-06 | 本田技研工业株式会社 | 混合动力车辆用驱动装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10270975A (ja) * | 1996-03-08 | 1998-10-09 | Matsushita Electric Ind Co Ltd | 電子部品とその製造方法 |
EP1768256B1 (en) * | 2004-07-14 | 2017-01-04 | Murata Manufacturing Co., Ltd. | Piezoelectric device |
JP4706907B2 (ja) * | 2005-06-15 | 2011-06-22 | 株式会社村田製作所 | 圧電デバイスとその製造方法 |
JP2007324162A (ja) * | 2006-05-30 | 2007-12-13 | Sony Corp | 半導体装置及びその製造方法 |
JP5135769B2 (ja) * | 2006-11-13 | 2013-02-06 | パナソニック株式会社 | 弾性表面波デバイスの製造方法 |
JP2008124785A (ja) * | 2006-11-13 | 2008-05-29 | Matsushita Electric Ind Co Ltd | 弾性表面波デバイス |
CN101573868B (zh) * | 2006-12-28 | 2012-05-30 | 京瓷株式会社 | 弹性表面波装置及其制造方法 |
-
2008
- 2008-09-24 JP JP2008243742A patent/JP5217836B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2010081006A (ja) | 2010-04-08 |
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