EP1473329A4 - Resin composition - Google Patents
Resin compositionInfo
- Publication number
- EP1473329A4 EP1473329A4 EP03737474A EP03737474A EP1473329A4 EP 1473329 A4 EP1473329 A4 EP 1473329A4 EP 03737474 A EP03737474 A EP 03737474A EP 03737474 A EP03737474 A EP 03737474A EP 1473329 A4 EP1473329 A4 EP 1473329A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- resin composition
- temperature
- resin
- glass transition
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000011342 resin composition Substances 0.000 title abstract 4
- 230000009477 glass transition Effects 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000011889 copper foil Substances 0.000 abstract 1
- 150000002484 inorganic compounds Chemical class 0.000 abstract 1
- 229910010272 inorganic material Inorganic materials 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 229920001187 thermosetting polymer Polymers 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/346—Clay
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0358—Resin coated copper [RCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/254—Polymeric or resinous material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Dispersion Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002029783 | 2002-02-06 | ||
JP2002029783 | 2002-02-06 | ||
JP2002139090 | 2002-05-14 | ||
JP2002139090 | 2002-05-14 | ||
JP2002158211 | 2002-05-30 | ||
JP2002158210 | 2002-05-30 | ||
JP2002158211 | 2002-05-30 | ||
JP2002158210 | 2002-05-30 | ||
JP2002287005 | 2002-09-30 | ||
JP2002287005 | 2002-09-30 | ||
PCT/JP2003/001090 WO2003066741A1 (fr) | 2002-02-06 | 2003-02-04 | Composition de resine |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1473329A1 EP1473329A1 (en) | 2004-11-03 |
EP1473329A4 true EP1473329A4 (en) | 2006-05-31 |
Family
ID=27739415
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP03737474A Withdrawn EP1473329A4 (en) | 2002-02-06 | 2003-02-04 | Resin composition |
Country Status (8)
Country | Link |
---|---|
US (1) | US7682691B2 (ja) |
EP (1) | EP1473329A4 (ja) |
KR (1) | KR100704320B1 (ja) |
CN (1) | CN1333015C (ja) |
AU (1) | AU2003244466A1 (ja) |
CA (1) | CA2474694A1 (ja) |
TW (1) | TWI247027B (ja) |
WO (1) | WO2003066741A1 (ja) |
Families Citing this family (46)
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EP1633175A4 (en) * | 2003-09-29 | 2009-11-11 | Ibiden Co Ltd | INSULATION INTERIOR FOR PRINTED CONNECTION CARD, PRINTED CONNECTION CARD, AND METHOD OF MANUFACTURING THE SAME |
CN1890286B (zh) * | 2003-12-08 | 2010-05-26 | 积水化学工业株式会社 | 热固性树脂组合物、树脂片以及用于绝缘基板的树脂片 |
US20060194896A1 (en) * | 2004-05-26 | 2006-08-31 | Sun Benjamin J | Low shrinkage dental material and method |
SG119379A1 (en) * | 2004-08-06 | 2006-02-28 | Nippon Catalytic Chem Ind | Resin composition method of its composition and cured formulation |
US20090104429A1 (en) * | 2005-09-15 | 2009-04-23 | Sekisui Chemical Co., Ltd. | Resin composition, sheet-like formed body, prepreg, cured body, laminate, and multilayer laminate |
JP4881044B2 (ja) * | 2006-03-16 | 2012-02-22 | 株式会社東芝 | 積層型半導体装置の製造方法 |
KR101446811B1 (ko) * | 2006-03-30 | 2014-10-01 | 가부시키가이샤 도모에가와 세이시쇼 | 박막 및 그것을 이용한 박막 적층체 |
US8163830B2 (en) * | 2006-03-31 | 2012-04-24 | Intel Corporation | Nanoclays in polymer compositions, articles containing same, processes of making same, and systems containing same |
KR101374439B1 (ko) * | 2006-04-25 | 2014-03-17 | 요코하마 고무 가부시키가이샤 | 섬유 강화 복합 재료용 에폭시 수지 조성물 |
KR100761426B1 (ko) * | 2006-05-29 | 2007-10-04 | 주식회사 대하맨텍 | 광경화형 하드코팅 조성물 및 그 제조방법, 광경화형하드코팅 조성물이 코팅된 이동통신 단말기 윈도우,평판디스플레이용 전면판 및 필름 |
US8518524B2 (en) | 2006-07-21 | 2013-08-27 | Showa Denko K.K. | Transparent composite material |
CN101522318B (zh) * | 2006-08-08 | 2013-11-06 | 环球产权公司 | 粘合性提高的电路材料、其制造方法和由其制成的制品 |
JP4988531B2 (ja) * | 2006-12-18 | 2012-08-01 | 日東電工株式会社 | 半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法 |
JP4735529B2 (ja) * | 2006-12-21 | 2011-07-27 | トヨタ自動車株式会社 | モータの固定子 |
TW200925110A (en) * | 2007-08-09 | 2009-06-16 | Showa Denko Kk | Organized clay complex, method for producing the same, and resin complex containing organized clay complex |
KR101500791B1 (ko) * | 2007-12-14 | 2015-03-09 | 데쿠세리아루즈 가부시키가이샤 | 광 반도체 패키지 밀봉 수지 재료 |
WO2009107558A1 (ja) * | 2008-02-26 | 2009-09-03 | 電気化学工業株式会社 | プローブの検査方法及び硬化性樹脂組成物 |
WO2009117345A2 (en) * | 2008-03-17 | 2009-09-24 | Henkel Corporation | Adhesive compositions for use in die attach applications |
KR20100136544A (ko) * | 2008-04-10 | 2010-12-28 | 월드 프로퍼티즈 인코퍼레이티드 | 접합이 향상된 회로 재료, 그 회로 재료의 제조 방법 및 그 제조 방법으로부터 생성된 물품 |
EP2270059A4 (en) * | 2008-04-14 | 2011-06-29 | Showa Denko Kk | TRANSPARENT COMPOSITE MATERIAL AND METHOD FOR PRODUCING THE SAME |
US20100075118A1 (en) * | 2008-09-24 | 2010-03-25 | Fujifilm Corporation | Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate and method of producing the same |
TWI383950B (zh) * | 2009-04-22 | 2013-02-01 | Ind Tech Res Inst | 奈米點狀材料的形成方法 |
WO2010144792A1 (en) * | 2009-06-11 | 2010-12-16 | Rogers Corporation | Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith |
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US8698320B2 (en) * | 2009-12-07 | 2014-04-15 | Henkel IP & Holding GmbH | Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices |
CN102725802B (zh) * | 2010-02-03 | 2016-04-06 | Abb研究有限公司 | 电绝缘体系 |
US8609750B1 (en) * | 2010-06-02 | 2013-12-17 | The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration | Selective clay placement within a silicate-clay epoxy blend nanocomposite |
HUE062902T2 (hu) * | 2010-09-02 | 2023-12-28 | Sumitomo Bakelite Co | Rögzítõ gyanta készítmény rotorban történõ alkalmazásra |
TWI445727B (zh) * | 2010-10-21 | 2014-07-21 | Taiwan Union Technology Corp | 樹脂組合物及由其製成之預浸材與印刷電路板 |
TWI471072B (zh) * | 2010-12-30 | 2015-01-21 | Ind Tech Res Inst | 具有導電膜層的基板組合及其製造方法 |
JP2015502416A (ja) * | 2011-10-28 | 2015-01-22 | スリーエム イノベイティブ プロパティズ カンパニー | ベンゾオキサジンのアミン/エポキシ硬化 |
KR20160020587A (ko) | 2012-01-20 | 2016-02-23 | 아사히 가세이 이-매터리얼즈 가부시키가이샤 | 수지 조성물, 적층체, 다층 프린트 배선판 및 다층 플렉시블 배선판 및 그 제조 방법 |
CN104204104A (zh) * | 2012-03-27 | 2014-12-10 | 积水化学工业株式会社 | 树脂复合材料 |
CN104508760B (zh) | 2012-09-07 | 2016-11-09 | 积水化学工业株式会社 | 绝缘树脂材料及多层基板 |
CN103491716A (zh) * | 2013-08-20 | 2014-01-01 | 鑫纮有限公司 | 图案导电线路的结构及形成方法 |
JP6046665B2 (ja) * | 2014-06-10 | 2016-12-21 | トヨタ自動車株式会社 | 断熱膜の形成方法および断熱膜 |
US10845008B2 (en) | 2014-09-28 | 2020-11-24 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament and LED light bulb |
US11997768B2 (en) | 2014-09-28 | 2024-05-28 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
US11543083B2 (en) | 2014-09-28 | 2023-01-03 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
KR102520360B1 (ko) * | 2014-11-18 | 2023-04-11 | 가부시끼가이샤 레조낙 | 반도체 장치 및 그 제조 방법, 및 가요성 수지층 형성용 수지 조성물 |
JP6450597B2 (ja) * | 2015-01-19 | 2019-01-09 | 株式会社東芝 | 回転電機のコイル絶縁構造体およびその製造方法ならびにこのコイル絶縁構造体を具備してなる回転電機 |
CN109517172B (zh) * | 2017-09-18 | 2023-08-29 | 嘉兴山蒲照明电器有限公司 | 一种有机硅改性聚酰亚胺树脂组合物及其应用 |
US10982048B2 (en) | 2018-04-17 | 2021-04-20 | Jiaxing Super Lighting Electric Appliance Co., Ltd | Organosilicon-modified polyimide resin composition and use thereof |
WO2019216352A1 (ja) * | 2018-05-11 | 2019-11-14 | 日立化成株式会社 | 導体基板、伸縮性配線基板、及び配線基板用伸縮性樹脂フィルム |
CN110600437B (zh) * | 2019-08-23 | 2021-03-09 | 广东盈骅新材料科技有限公司 | 一种具有高玻璃化温度封装基材及生产方法 |
CN110564200A (zh) * | 2019-09-05 | 2019-12-13 | 珠海博纳百润生物科技有限公司 | 一种亲水性的涂料及其应用 |
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JP5202775B2 (ja) * | 2000-05-23 | 2013-06-05 | 三菱瓦斯化学株式会社 | プリプレグ、金属張り積層板及びその使用 |
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JP3962271B2 (ja) * | 2001-05-11 | 2007-08-22 | 積水化学工業株式会社 | 難燃熱硬化性樹脂組成物 |
JP2002363386A (ja) | 2001-06-13 | 2002-12-18 | Nippon Paint Co Ltd | プリント配線基板穴埋め用樹脂組成物 |
CN1162468C (zh) | 2001-11-01 | 2004-08-18 | 财团法人工业技术研究院 | 一种铜箔基板用环氧树脂/粘土纳米复合材料 |
JP3854931B2 (ja) | 2002-02-06 | 2006-12-06 | 積水化学工業株式会社 | 樹脂組成物 |
US7220484B2 (en) * | 2002-11-22 | 2007-05-22 | National Research Council Of Canada | Polymeric nanocomposites comprising epoxy-functionalized graft polymer |
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2003
- 2003-02-04 EP EP03737474A patent/EP1473329A4/en not_active Withdrawn
- 2003-02-04 CN CNB03807334XA patent/CN1333015C/zh not_active Expired - Fee Related
- 2003-02-04 AU AU2003244466A patent/AU2003244466A1/en not_active Abandoned
- 2003-02-04 WO PCT/JP2003/001090 patent/WO2003066741A1/ja active Application Filing
- 2003-02-04 US US10/503,490 patent/US7682691B2/en not_active Expired - Fee Related
- 2003-02-04 CA CA002474694A patent/CA2474694A1/en not_active Abandoned
- 2003-02-04 KR KR1020047012180A patent/KR100704320B1/ko not_active IP Right Cessation
- 2003-02-06 TW TW092102372A patent/TWI247027B/zh not_active IP Right Cessation
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US4851021A (en) * | 1987-02-17 | 1989-07-25 | Armstrong World Industries, Inc. | Multi-ply composites and sheets of epoxy and flocced 2:1 layered silicates and methods for them |
WO2000034378A1 (en) * | 1998-12-07 | 2000-06-15 | Eastman Chemical Company | Polymer/clay nanocomposite and process for making same |
EP1350815A1 (en) * | 2000-12-08 | 2003-10-08 | Sekisui Chemical Co., Ltd. | Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polyimide film, film for tab, and prepreg |
Non-Patent Citations (1)
Title |
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See also references of WO03066741A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO2003066741A1 (fr) | 2003-08-14 |
AU2003244466A1 (en) | 2003-09-02 |
TWI247027B (en) | 2006-01-11 |
CN1643071A (zh) | 2005-07-20 |
US7682691B2 (en) | 2010-03-23 |
TW200302851A (en) | 2003-08-16 |
CA2474694A1 (en) | 2003-08-14 |
EP1473329A1 (en) | 2004-11-03 |
KR100704320B1 (ko) | 2007-04-10 |
KR20040091013A (ko) | 2004-10-27 |
US20050107497A1 (en) | 2005-05-19 |
CN1333015C (zh) | 2007-08-22 |
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