WO2009107558A1 - プローブの検査方法及び硬化性樹脂組成物 - Google Patents
プローブの検査方法及び硬化性樹脂組成物 Download PDFInfo
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- WO2009107558A1 WO2009107558A1 PCT/JP2009/053046 JP2009053046W WO2009107558A1 WO 2009107558 A1 WO2009107558 A1 WO 2009107558A1 JP 2009053046 W JP2009053046 W JP 2009053046W WO 2009107558 A1 WO2009107558 A1 WO 2009107558A1
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- acrylate
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- curable resin
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/50—Improvements relating to the production of bulk chemicals
- Y02P20/582—Recycling of unreacted starting or intermediate materials
Definitions
- the present invention relates to an inspection method for inspecting the state of a probe, a curable resin composition used in a probe inspection process, a cured body obtained by curing the curable resin composition, and an inspection apparatus including a sheet made of the cured body. .
- the electrical characteristics are generally inspected using a probe device.
- a probe device When inspecting the electrical characteristics of the IC chip using the probe device, it is necessary to align the probe in order to bring the electrode pad on the IC chip into contact with the probe provided on the probe card.
- the tip of the probe is photographed with a CCD camera or the like, and the position of the probe tip is determined based on the X and Y coordinate positions at this time.
- this method has a problem that it takes a long time to align the probe because it takes time to focus the camera on the tip of the probe.
- the electrode pad on the IC chip and the probe in electrical contact, it is necessary to push the tip of the probe to a predetermined depth.
- the position of the tip of the probe is fixed in a certain direction. There are times when it shifts.
- the conventional probe positioning method determines the position of the tip of the probe in a non-contact state, and does not take into account the shift at the time of contact.
- a probe inspection method and a probe inspection apparatus that provide a member for transferring a needle trace, transfer the probe trace of the probe to the member, and align the probe based on the transferred needle trace. Proposed.
- the tip traces of a plurality of probes on a probe card are transferred to a deformed body before inspection, and the push-in depth of the probe into the electrode is calculated based on the size of the needle trace opening. The time required for alignment is shortened.
- Patent Document 2 a support base is provided in the probe inspection apparatus, and a sheet for providing probe traces on the support base is provided, and the probe is aligned based on the transferred needle traces. Methods and inspection devices have been proposed.
- Patent Document 3 the needle trace transferred to the needle trace evaluation wafer is image-recognized, and the needle trace evaluation of the probe that evaluates the needle trace by superimposing the virtual electrode pad and the image-recognized needle trace is performed. A method has been proposed.
- Patent Document 4 a probe is brought into contact with a probe position adjusting film made of an elastomer composition to make a scar, and the positional relationship between the scar and the electrode portion of the integrated circuit is confirmed. Based on the positional relationship, A method for adjusting the position of the probe is described.
- Patent Document 5 a transparent film is pasted on a detection substrate on which an electrode is formed, and the position of the needle trace transferred onto the transparent film is compared with the position of the electrode on the substrate, thereby providing a stage.
- a method is described in which the probe is positioned with high accuracy without being affected by the repetition accuracy of movement.
- Patent Document 1 although it is described that the deformable body is heated to refill the needle traces and reused, examples of the material of the deformable body include low melting point metals, alloys, or organic insulators. However, specific materials and heating conditions for implementing reuse are not shown. Further, in Patent Document 2, when transferring a needle trace a plurality of times, the transfer position of the needle trace must be shifted each time, so that the number of repetitions is limited, and the probe is further shifted from a predetermined position. In some cases, there is a possibility of overlapping with the last transferred needle trace. Further, no method for reusing the sheet other than shifting the needle mark transfer position is shown.
- Patent Documents 3 and 4 do not mention the reuse of the needle trace transfer member, and in Patent Document 4, in particular, the heat resistance remaining of the needle trace is imparted so that the needle trace does not disappear. Therefore, it is difficult to eliminate the needle trace and reuse it.
- Patent Document 5 although the adhesiveness of the transparent film is lowered by ultraviolet irradiation and the substrate for detection can be reused by peeling the film, the method for reusing the transparent film is not shown.
- the cured body of the curable resin composition is brought into contact with the probe for inspecting the electrical characteristics of the object to be inspected, and the needle trace of the probe is transferred to the cured body.
- a probe that includes the steps of confirming the state of the probe on the basis and transferring the probe traces of the probe and then heating the cured body to a temperature equal to or higher than the glass transition temperature of the cured body to erase the probe traces of the probe, and subjecting to repeated inspections An inspection method is provided.
- (A) monofunctional (meth) acrylate and / or (meth) acrylamide and (C) a photopolymerization initiator are contained, and the glass transition temperature is 130 ° C. or less.
- a curable resin composition for transferring the needle trace of the probe is provided.
- the needle trace can be easily transferred by bringing the member that transfers the needle trace into contact with the probe, and the member that transfers the needle trace can be easily heated to the glass transition temperature or higher. The effect that the needle mark can be erased is obtained.
- the resin composition which contains (A) monofunctional (meth) acrylate and / or (meth) acrylamide, and (C) photoinitiator, and a glass transition temperature is 130 degrees C or less.
- an inspection apparatus for inspecting electrical characteristics of an object to be inspected which includes a probe card having a probe and an imaging device for confirming the state of the probe trace transferred to the sheet.
- the needle trace can be easily transferred by being brought into contact with the probe, and the needle trace can be easily erased by heating to a glass transition temperature or higher. Probes can be repeatedly inspected without changing each wafer type.
- the “curable resin composition” means a mixture that is cured by light irradiation or heating to become a cured product.
- the curable resin composition has a temperature range that is a glass transition temperature described below.
- the “glass transition temperature” is a temperature at which the liquid state (rubber state) reversibly changes to an amorphous solid (glass state) or an amorphous solid (glass state) to a liquid state (rubber state). ) Means a reversibly changing temperature.
- the glass transition temperature is defined by, for example, JIS C 6481.
- the present inventor can transfer the needle trace by bringing the probe into contact with the cured body of the curable resin composition, and then heating the cured body to a temperature higher than the glass transition temperature to obtain the needle trace.
- the needle trace transferred onto the cured body and the reference position formed on the wafer can be simultaneously observed with the same focus.
- the inventors have obtained knowledge and have reached the present invention.
- the curable resin composition according to this embodiment contains (A) a monofunctional (meth) acrylate and / or (meth) acrylamide and (C) a photopolymerization initiator, and has a glass transition temperature of 130 ° C. or lower.
- a curable resin composition for transferring a probe mark of a probe contains (A) a monofunctional (meth) acrylate and / or (meth) acrylamide and (C) a photopolymerization initiator, and has a glass transition temperature of 130 ° C. or lower.
- the needle trace can be easily transferred by bringing the member that transfers the needle trace into contact with the probe, and the member that transfers the needle trace can be easily heated to the glass transition temperature or higher. The effect that the needle mark can be erased is obtained.
- curable resin composition Although it does not specifically limit as curable resin composition, (A) Monofunctional (meth) acrylate and / or (meth) acrylamide and (C) Photoinitiator are contained, and glass transition temperature is 130 degrees C or less. It is characterized by being. Hereinafter, each component of the curable resin composition will be described.
- the curable resin composition preferably contains (A) a monofunctional (meth) acrylate monomer or (meth) acrylamide.
- the monofunctional (meth) acrylate monomer methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isomyristyl (meth) Acrylate, isooctyl (meth) acrylate, isodecyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, phenyl (meth) acrylate, butoxyethyl (meth) acrylate, cyclohexyl (meth) acrylate, dicyclopentanyl ( (Meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, isobornyl (meth)
- isobornyl (meth) acrylate isodecyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, and butoxyethyl (meth) acrylate are effective. Is preferred.
- the group consisting of butyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, isobornyl (meth) acrylate and isodecyl (meth) acrylate 1 type or 2 or more types are preferable, isobornyl (meth) acrylate and / or isodecyl (meth) acrylate are more preferable, and combined use of isobornyl (meth) acrylate and isodecyl (meth) acrylate is the most preferable.
- isobornyl (meth) acrylate and isodecyl (meth) acrylate are used in combination, the combined proportion of isobornyl (meth) acrylate and isodecyl (meth) acrylate is based on a total of 100 parts by mass of isobornyl (meth) acrylate and isodecyl (meth) acrylate.
- isobornyl (meth) acrylate: isodecyl (meth) acrylate 80 to 99 parts by mass: 1 to 20 parts by mass is preferable, and 85 to 95 parts by mass: 5 to 15 parts by mass is more preferable.
- the combined proportion of isobornyl (meth) acrylate and butoxyethyl (meth) acrylate is a total of 100 masses of isobornyl (meth) acrylate and butoxyethyl (meth) acrylate.
- N, N-diethyl (meth) acrylamide and / or (meth) acryloylmorpholine are preferable, and N, N-diethyl (meth) acrylamide is more preferable because of its high effect.
- monofunctional (meth) acrylates and / or (meth) acrylamides monofunctional (meth) acrylates are preferred because of their large effects.
- the addition amount of (A) monofunctional (meth) acrylate and / or (meth) acrylamide is (A) monofunctional (meth) acrylate and / or (meth) acrylamide and (B) polyfunctional (meth) acrylate component described later. Is preferably 40 to 100 parts by mass, more preferably 45 to 55 parts by mass. Such a blending amount is preferable in that a needle mark having a sufficient depth can be transferred to the cured resin.
- Monofunctional (meth) acrylate and / or (meth) acrylamide may be used alone or in combination of two or more.
- the curable resin composition may further contain (B) a polyfunctional (meth) acrylate.
- the (B) polyfunctional (meth) acrylate is not particularly limited, but it is preferable to use a polyfunctional (meth) acrylate oligomer / polymer / monomer having two or more (meth) acryloyl groups.
- a polyfunctional (meth) acrylate oligomer / polymer / monomer having two or more (meth) acryloyl groups By adding polyfunctional (meth) acrylate to the curable resin composition, the resin can be prevented from melting during heating.
- the polyfunctional (meth) acrylate oligomer / polymer is not particularly limited, but 1,2-polybutadiene-terminated urethane (meth) acrylate (for example, “TE-2000”, “TEA-1000” manufactured by Nippon Soda Co., Ltd.), the above Hydrogenated product (for example, “TEAI-1000” manufactured by Nippon Soda Co., Ltd.), 1,4-polybutadiene-terminated urethane (meth) acrylate (for example, “BAC-45” manufactured by Osaka Organic Chemical Co., Ltd.), polyisoprene terminal (meta ) Acrylate, polyester-based urethane (meth) acrylate, polyether-based urethane (meth) acrylate, polyester (meth) acrylate, bisphenol A type epoxy (meth) acrylate (for example, “Biscoat # 540” manufactured by Osaka Organic Chemical Co., Ltd., Showa “Biscoat VR-77” manufactured
- 1,2-polybutadiene-terminated urethane (meth) acrylate and / or the above hydrogenated product are preferable, and a hydrogenated product of 1,2-polybutadiene-terminated urethane (meth) acrylate is more preferable because of its great effect.
- These polyfunctional (meth) acrylate oligomers / polymers are preferred in terms of improving handling properties and preventing melting during heating.
- polyfunctional (meth) acrylate monomer is not particularly limited, but the following are preferable.
- bifunctional (meth) acrylate monomer examples include 1,3-butylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,9- Nonanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, dicyclopentanyl di (meth) acrylate, 2-ethyl-2-butyl-propanediol (meth) acrylate, neopentyl glycol modified trimethylolpropane di (Meth) acrylate, stearic acid-modified pentaerythritol diacrylate, polypropylene glycol di (meth) acrylate, 2,2-bis (4- (meth) acryloxydiethoxyphenyl) propane, 2,2-bis (4- (meta ) Acryloxip Pokishifeniru)
- trifunctional (meth) acrylate monomer examples include trimethylolpropane tri (meth) acrylate, tris [(meth) acryloxyethyl] isocyanurate, and the like.
- tetrafunctional or higher (meth) acrylate monomers include dimethylolpropane tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol ethoxytetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, and dipentaerythritol.
- examples include hexa (meth) acrylate.
- the above-mentioned polyfunctional (meth) acrylate monomer is preferable in terms of preventing melting during heating.
- the amount of (B) polyfunctional (meth) acrylate added is (A) and (B ) 60 parts by mass or less is preferable in 100 parts by mass of the total amount of components, and 45 to 55 parts by mass is more preferable.
- the addition amount of polyfunctional (meth) acrylate is 60 mass parts or less, the needle trace of sufficient depth to recognize a needle trace can be transcribe
- composition of the components (A) and (B) includes (meth) acryloyloxyethyl acid phosphate, dibutyl 2- (meth) acryloyloxyethyl acid phosphate, dioctyl 2- (meth) acryloyloxyethyl phosphate
- a phosphate ester having a vinyl group or (meth) acryloyl group such as diphenyl 2- (meth) acryloyloxyethyl phosphate, (meth) acryloyloxyethyl polyethylene glycol acid phosphate may be used in combination.
- the adhesiveness to a metal surface can further be improved.
- the curable resin composition may further contain a photopolymerization initiator in addition to the above (A) and (B).
- the photopolymerization initiator is blended for sensitization with visible light or actinic light of ultraviolet rays to promote photocuring of the resin composition, and various known photopolymerization initiators are preferably used.
- (C) photopolymerization initiator is not particularly limited, but benzophenone and its derivatives, benzyl and its derivatives, anthraquinone and its derivatives, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isobutyl ether Benzoin derivatives such as benzyldimethyl ketal, acetophenone derivatives such as diethoxyacetophenone and 4-t-butyltrichloroacetophenone, 2-dimethylaminoethylbenzoate, p-dimethylaminoethylbenzoate, diphenyldisulfide, thioxanthone and derivatives thereof, camphorquinone, 7,7-dimethyl-2,3-dioxobicyclo [2.2.1] heptane-1-carboxylic acid, 7,7-dimethyl-2,3-dioxobi Chlo [2.2.1
- benzoin derivatives and ⁇ -aminoalkylphenone derivatives are preferable because they are highly effective.
- Benzyldimethyl ketal and 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropane-1- On is more preferred.
- the photopolymerization initiator one or a combination of two or more of the above substances can be used.
- the addition amount of the photopolymerization initiator is preferably 0.1 to 20 parts by mass with respect to 100 parts by mass of the total amount of the above (A) and (B). (C) If the addition amount of a photoinitiator is 0.1 mass part or more, the effect of hardening acceleration will be acquired reliably, and if it is 20 mass parts or less, a sufficient curing rate can be achieved.
- the addition amount of the photopolymerization initiator is further preferably 0.5 to 10 parts by mass. By using such an addition amount, a cured product having sufficient adhesive strength can be obtained.
- the said curable resin composition may contain the polymerization inhibitor for the storage stability improvement.
- the polymerization inhibitor is not particularly limited, but methylhydroquinone, hydroquinone, 2,2-methylene-bis (4-methyl-6-tertiarybutylphenol), pentaerythritol tetrakis (3- (3,5-ditertiary) Butyl-4-hydroxyphenyl) propionate, octadecyl-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate, isooctyl-3- (3,5-di-tert-butyl-4-hydroxyphenyl) ) Propionate, catechol, hydroquinone monomethyl ether, monotertiary butyl hydroquinone, 2,5-ditertiary butyl hydroquinone, p-benzoquinone, 2,5-diphenyl-p-benzoquinone, 2,5-ditertiary butyl-p-ben Quinone, picric acid, citric acid, phenothiazin
- the content of these polymerization inhibitors is preferably 0.001 to 3 parts by mass with respect to 100 parts by mass of the total amount of the above (A) and (B). If the content of the polymerization inhibitor is 0.001 part by mass or more, the storage stability is sufficient, and if it is 3 parts by mass or less, reliable adhesiveness is obtained and there is no possibility of becoming uncured. Further, the content of the polymerization inhibitor is more preferably 0.01 to 2 parts by mass. Thereby, the effect that storage stability and durability improve further can be acquired.
- the curable resin composition includes various elastomers such as commonly used acrylic rubber, urethane rubber, acrylonitrile-butadiene-styrene rubber, inorganic filler, solvent, filler, reinforcing material, plasticizer, thickener, Additives such as dyes, pigments, flame retardants, silane coupling agents and surfactants may be included.
- elastomers such as commonly used acrylic rubber, urethane rubber, acrylonitrile-butadiene-styrene rubber, inorganic filler, solvent, filler, reinforcing material, plasticizer, thickener, Additives such as dyes, pigments, flame retardants, silane coupling agents and surfactants may be included.
- the cured product of the curable resin composition can be obtained as a thin film.
- the needle trace transferred to the cured product of the curable resin composition and the reference position on the wafer can be observed simultaneously with the same focus. Leads to shortening.
- the thickness of the cured body is preferably 20 to 100 ⁇ m, and more preferably 40 to 60 ⁇ m. If the thickness of the cured body is 20 ⁇ m or more, it is sufficient to reliably obtain a continuous cured body. Further, if the thickness of the cured body is 100 ⁇ m or less, it can correspond to the thickness of a general semiconductor wafer, and the needle trace transferred to the cured body and the reference position on the wafer can be observed simultaneously with the same focus.
- the cured body of the curable resin composition is brought into contact with the probe for inspecting the electrical characteristics of the object to be inspected, and the probe traces of the probe are transferred to the cured body and transferred. After checking the probe state based on the needle trace and transferring the probe trace of the probe, it includes the process of erasing the probe trace of the probe by heating the cured body above the glass transition temperature of the cured body. This is a probe inspection method used for
- the inspection of the probe can be repeatedly performed without replacing the member for transferring the needle trace for each inspection or for each type of wafer.
- “without replacement” does not mean that the member for transferring the needle trace is not permanently replaced. That is, when replacement is necessary due to deterioration or wear, the replacement is performed as appropriate, but it is sufficient that it can be used repeatedly at least twice.
- a cured body of the curable resin composition is brought into contact with a probe used for inspection, and the needle trace of the probe is transferred to the cured body. Then, after confirming the needle trace of the transferred probe, the wafer is inspected using the probe. At this time, if the confirmation operation reveals that the position of the probe is not appropriate or the depth of pushing is not sufficient, the probe can be appropriately adjusted.
- the contact means that the probe is pressed against the surface of the cured body so that a probe mark of the probe is formed on the surface of the cured body.
- probe traces of the probe are formed on the surface of the cured body.
- transfer is that the needle trace of a probe is formed in the hardening body surface by said contact operation.
- the confirmation is to visually check the transferred probe traces with an imaging device such as a CCD camera. Although it is preferable to confirm the needle trace by visual observation, it is preferable. For example, an image captured by the imaging apparatus may be analyzed by software to automatically correct the probe arrangement.
- the temperature at the time of contact and transfer is the same as the temperature at which the electrical characteristics of the IC chip are inspected, and examples thereof include a room temperature of 20 to 30 ° C. and a high temperature of 80 to 90 ° C. Further, the temperature at the time of confirmation is the same as or lower than the above temperature.
- the cured body is heated to a temperature higher than the glass transition temperature of the cured body to erase the probe traces of the probe. Further, erasure of needle traces may be performed for each inspection of different types of wafers.
- erasing the needle trace is to erase the probe trace formed on the surface of the cured body by heating the cured body to raise the temperature of the cured body to the glass transition temperature or higher. Needle traces need not be erased completely. For example, if the height gap between the lowermost part of the needle trace and the surface of the cured body becomes 100 nm or less, it is assumed that the erased portion has been erased. More preferably, it will be erase
- Whether or not the needle trace has been erased can be confirmed by visual observation using an imaging device. By erasing the needle marks formed on the surface of the cured body, a plurality of inspections can be repeated with one cured body.
- the cured body is a cured body obtained by curing the curable resin composition by light irradiation or heating, and is not particularly limited, but uses the curable resin composition described in the first embodiment. It is preferable. Accordingly, the needle trace can be easily transferred by being brought into contact with the probe, and the needle trace can be easily erased by heating to a temperature equal to or higher than the glass transition temperature. Therefore, it is preferably used for the inspection of the probe. And after erasing the needle trace, it can be reused by cooling to the temperature at the time of contact, transfer and confirmation.
- the inspection object when the inspection object is inspected at a high temperature, it is possible to transfer the needle marks to the cured body as long as it is below the glass transition temperature, and the temperature of the cured body is also the temperature at the time of inspection of the inspection object. Can be the same. If the needle trace can be transferred to the cured body even if it is above the glass transition temperature, the temperature of the cured body can be the same as the temperature at the time of inspection of the object to be inspected. That is, the position of the probe tip of the probe at a high temperature can be detected. As a result, even when the inspection object is inspected at a high temperature, the probe tip can be accurately brought into contact with the electrode pad without the probe tip position being deviated from the detection position.
- a sheet 10 made of a cured body, a support base 12 on which the sheet 10 is placed, and the sheet 10 are heated to a temperature higher than the glass transition temperature of the cured body.
- a heating device (not shown), a mounting table 13 on which the object to be inspected is mounted, a probe card 14 having a probe 15, and the state of the needle trace 11 of the probe 15 transferred to the sheet 10.
- An inspection device including an imaging device 16 for performing the above is preferably used.
- the constituent members of the inspection apparatus are not limited to those described above, and may include a vacuum pump, a gas supply source, a control mechanism for controlling the movement of the mounting table, and the like.
- the said inspection apparatus may be integrated in apparatuses, such as a vacuum chamber.
- the curable resin composition according to Embodiments 1 and 2 can erase the needle trace by heating the glass trace temperature or higher after contacting the probe after curing to transfer the needle trace.
- the glass transition temperature of the curable resin composition can be obtained by a simple heating method. Although it does not specifically limit as a heating method, Since it can be used easily, it is preferable to use an electric heater, a dryer, etc.
- the heating temperature is preferably 180 ° C. or lower, and more preferably 50 to 150 ° C. A heating temperature of 180 ° C. or lower is preferable because the curable resin composition can withstand multiple uses.
- the heating device means, for example, an electric heater or a dryer.
- the heating device needs to be able to heat the temperature of the sheet 10 to the glass transition temperature or higher, but is preferably attached so as not to affect other members and the object to be inspected.
- the needle trace erasing method can be not only heating but also combining heating and pressurization. By applying pressure, the surface of the cured body can be kept flat.
- a method for pressurizing the curable resin composition it is preferable to use a conventionally known apparatus such as a press.
- a glass transition temperature is 40 degreeC or more and 130 degrees C or less. If it is this range, it can heat easily with an electric heater, a dryer, etc. Furthermore, the glass transition temperature is preferably 40 ° C. or higher and 120 ° C. or lower, and more preferably 50 ° C. or higher and 100 ° C. or lower. If it is this range, the needle trace of sufficient depth can be transcribe
- the curable resin compositions of Embodiments 1 and 2 can be used repeatedly, but the number of repetitions is preferably 2 or more, and from the viewpoint of cost, it is preferable that the curable resin composition can be used repeatedly 30 or more times.
- the cured body of the curable resin composition is brought into contact with the probe for inspecting the electrical characteristics of the object to be inspected, the probe trace of the probe is transferred to the cured body, and the transfer is performed. And confirming the state of the probe based on the recorded needle trace, and after transferring the probe trace of the probe, including a step of erasing the probe trace of the probe by heating the cured body to a temperature higher than the glass transition temperature of the cured body,
- This is a probe inspection method for repeated inspection. According to the inspection method described above, an effect is obtained that the inspection of the probe can be repeatedly performed without replacing the member for transferring the needle trace for each inspection or for each type of wafer.
- the thickness of the cured body of the curable resin composition may be 20 to 100 ⁇ m. More preferably, it is 40-60 ⁇ m. As a result, the probe trace transferred to the cured body and the reference position formed on the wafer can be simultaneously observed with the same focus, and the working time can be shortened.
- a mark may be produced on the cured body of the curable resin composition as a reference position.
- the method for producing the mark include ink application by ink jet, screen printing, metal vapor deposition, laser ablation, and the like, but ink application by ink jet is preferable from the viewpoint of workability and durability against repeated use.
- the curable resin composition contains (A) a monofunctional (meth) acrylate and / or (meth) acrylamide and (C) a photopolymerization initiator, and has a glass transition temperature. It may be 130 ° C. or lower.
- the needle trace can be easily transferred by being brought into contact with the probe, and the needle trace can be easily erased by heating to the glass transition temperature or higher, so that it can be repeatedly used for the inspection of the probe.
- the curable resin composition may further contain (B) a polyfunctional (meth) acrylate.
- B a polyfunctional (meth) acrylate.
- the curable resin composition may further contain a polymerization inhibitor.
- the curable resin composition according to the embodiment of the present invention contains (A) a monofunctional (meth) acrylate and / or (meth) acrylamide and (C) a photopolymerization initiator, and has a glass transition temperature of 130 ° C.
- a curable resin composition for transferring a probe trace of a probe which is characterized by the following. According to the curable resin composition, it is possible to easily transfer the needle trace by bringing it into contact with the probe and to easily erase the needle trace by heating to a glass transition temperature or higher.
- the curable resin composition may further contain (B) a polyfunctional (meth) acrylate. This can prevent the resin from melting after heating.
- the curable resin composition may further contain a polymerization inhibitor. Thereby, the effect that storage stability and durability improve can be acquired.
- the curable resin composition is 40 to 100 parts by mass of (A), 60 parts by mass or less of (B) with respect to 100 parts by mass of the total amount of (A) and (B), (C) May be contained in an amount of 0.1 to 20 parts by mass.
- the cured product obtained by curing the curable resin composition can easily transfer the needle traces by contacting with the probe, and can easily erase the needle traces by heating above the glass transition temperature. Can be used repeatedly.
- seat which consists of the said hardening body, the support stand which mounts the said sheet
- the said to-be-inspected object For inspecting the electrical characteristics of an object to be inspected, comprising: a mounting table on which the probe is placed; a probe card having a probe; and an imaging device for confirming the state of the needle trace of the probe transferred to the sheet.
- An inspection apparatus is provided. In this inspection apparatus, since the inspection of the probe can be repeatedly performed without replacing the member for transferring the needle trace for each inspection or for each type of wafer, it is possible to shorten the time for the inspection process.
- Example 1 Each material was mix
- MDP Polymerization inhibitor 2,2-methylene-bis (4-methyl-6-tertiarybutylphenol)
- the glass transition temperature was measured with a differential scanning calorimeter “SII EXSTAR DSC 6220” (manufactured by Seiko Instruments Inc.) (heating rate 10 ° C./min).
- the tensile shear bond strength was measured according to JIS K 6850. Specifically, heat-resistant Pyrex (registered trademark) glass (25 mm ⁇ 25 mm ⁇ 2.0 mm) is used as the adherend, and the bonded portion is 8 mm in diameter. (Registered trademark) Glass bonded and cured by a fusion device using an electrodeless discharge lamp, cured under conditions of an integrated light quantity of 2000 mJ / cm 2 at a wavelength of 365 nm, and a test piece for measuring tensile shear bond strength was made. Then, using a universal testing machine, the tensile shear bond strength of the prepared test piece was measured at a temperature of 23 ° C. and a humidity of 50% at a tensile speed of 10 mm / min.
- a curable resin composition was applied to a thickness of 50 ⁇ m on a silicon wafer, and cured by a fusion device manufactured by Fusion Corporation using an electrodeless discharge lamp under conditions of an integrated light quantity of 4000 mJ / cm 2 with a wavelength of 365 nm. A piece was made. Using a manual prober, the probe was lowered by 40 ⁇ m at a speed of about 15 ⁇ m / s and brought into contact with the cured body of the curable resin composition on the silicon wafer. When the probe is in contact, the temperature of the cured body of the curable resin composition is 25 ° C.
- the presence or absence of transfer of needle marks on the surface of the curable resin composition was observed with a confocal laser microscope.
- the needle trace transferability in Table 1 was measured when the probe trace of the probe was formed on the surface of the cured body of the curable resin composition.
- the depth of the needle trace was measured with a confocal laser microscope (OLYMPUS, “OLS1100”).
- Examples 2 to 9 A curable resin composition was prepared in the same manner as in Example 1 except that the raw materials of the type shown in Table 1 were used in the composition shown in Table 1. The obtained curable resin composition was evaluated in the same manner as in Example 1. Table 1 shows the experimental results. In addition, the needle trace transferability of Example 9 was evaluated at 85 ° C.
- TEA-1000 1,2-polybutadiene-terminated urethane acrylate (manufactured by Nippon Soda Co., Ltd., “TEA-1000”)
- ACMO Acryloyl morpholine (manufactured by Kojinsha, “ACMO”)
- 2-HEMA 2-hydroxyethyl methacrylate (Mitsubishi Gas Chemical Co., “2-HEMA”)
- DEAA Diethylacrylamide (manufactured by Kojinsha, "DEAA”)
- IB-XA Isobornyl acrylate (manufactured by Kyoeisha Chemical Co., “IB-XA”) ID: Isodecyl methacrylate (manufactured by Kyoeisha Chemical Co., “ID”)
- BDK benzyl dimethyl ketal
- the needle trace could be transferred and the needle trace could be erased by heating. That is, by using the curable resin composition according to the present invention, the inspection of the probe can be repeatedly performed without replacing the member for transferring the needle trace for each inspection or for each type of wafer.
- Comparative Example 1 could transfer the needle traces, it could not be erased by heating because it was not heated above the glass transition temperature. Further, in Comparative Example 2, the crosslink density was high, and it was not possible to transfer a needle trace sufficient for recognition.
- the cured product of the curable resin composition according to the present invention can be formed to a thickness of about 20 to 100 ⁇ m.
- the cured body By forming the cured body to such a thickness, it is possible to cope with the thickness of a general semiconductor wafer. That is, the probe trace transferred to the cured body and the reference position formed on the wafer can be observed simultaneously with the same focus, and the working time can be shortened.
- the composition of the curable resin composition was such that (A) was 5 to 100 parts by mass, (B) was 60 parts by mass or less, and (A) and (B) (C) is 0.1 to 20 parts by mass with respect to 100 parts by mass in total.
- Table 1 by using such a composition, a cured product having sufficient adhesive strength of 10 MPa or more can be obtained.
- Example 9 if the glass transition temperature is high, it can be used at a high temperature, and deep needle traces can be transferred by raising the temperature at the time of needle trace transfer. If you want to transfer the probe trace of the probe to the cured body at a high temperature, (A) use monofunctional (meth) acrylate, and (B) not use polyfunctional (meth) acrylate. It is preferable in terms of easy trace transfer (Example 9). When it is desired to increase the adhesiveness, it is preferable to use (A) monofunctional (meth) acrylate and (B) polyfunctional (meth) acrylate in combination (Example 1).
- a hardened body of a curable resin is brought into contact with a probe for inspecting the electrical characteristics of an object to be inspected, and the needle trace of the probe is transferred to the hardened body.
- a method for inspecting a probe for checking a state wherein after transferring the probe trace of the probe, the cured body is heated to a temperature higher than the glass transition temperature of the cured body to erase the probe trace of the probe, and repeatedly inspected.
- a probe inspection method is provided. According to the inspection method described above, an effect is obtained that the inspection of the probe can be repeatedly performed without replacing the member for transferring the needle trace for each inspection or for each type of wafer.
- (A) monofunctional (meth) acrylate and / or (meth) acrylamide and (C) a photopolymerization initiator are contained, and the glass transition temperature is 130 ° C. or less.
- a curable resin composition for use in inspection of a probe is provided. According to the curable resin composition, it is possible to easily transfer the needle trace by bringing it into contact with the probe and to easily erase the needle trace by heating to a glass transition temperature or higher.
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Abstract
Description
11 針跡
12 支持台
13 載置台
14 プローブカード
15 プローブ
16 CCDカメラ(撮像装置)
W ウエハ
本明細書において、「硬化性樹脂組成物」とは、光の照射や加熱によって硬化して硬化体となるような混合物のことを意味する。そして、一般的に、硬化性樹脂組成物は、次に説明するガラス転移温度なる温度領域を有する。
本発明者は、硬化性樹脂組成物の硬化体にプローブを接触させることで針跡を転写させることが可能であり、続いて、該硬化体をガラス転移温度以上に加熱することによって上記針跡を消去できること、さらに、上記硬化性樹脂組成物の硬化体を薄膜として得ることで、硬化体上に転写された針跡とウエハ上に形成された基準位置とを同じフォーカスで同時に観察できるとの知見を得て、本発明に至ったものである。
本実施形態に係る硬化性樹脂組成物は、(A)単官能(メタ)アクリレート及び/又は(メタ)アクリルアミドと、(C)光重合開始剤とを含有し、ガラス転移温度が130℃以下であることを特徴とするプローブの針跡を転写するための硬化性樹脂組成物である。
硬化性樹脂組成物としては、特に限定されないが、(A)単官能(メタ)アクリレート及び/又は(メタ)アクリルアミドと、(C)光重合開始剤とを含有し、ガラス転移温度が130℃以下であることを特徴とする。
以下、硬化性樹脂組成物の各成分について説明する。
ここで、単官能(メタ)アクリレートモノマーとしては、メチル(メタ)アクリレート、エチル(メタ)アクリレート、プロピル(メタ)アクリレート、ブチル(メタ)アクリレート、2-エチルヘキシル(メタ)アクリレート、イソミリスチル(メタ)アクリレート、イソオクチル(メタ)アクリレート、イソデシル(メタ)アクリレート、ラウリル(メタ)アクリレート、ステアリル(メタ)アクリレート、フェニル(メタ)アクリレート、ブトキシエチル(メタ)アクリレート、シクロヘキシル(メタ)アクリレート、ジシクロペンタニル(メタ)アクリレート、ジシクロペンテニル(メタ)アクリレート、ジシクロペンテニルオキシエチル(メタ)アクリレート、イソボルニル(メタ)アクリレート、メトキシ化シクロデカトリエン(メタ)アクリレート、2-ヒドロキシエチル(メタ)アクリレート、2-ヒドロキシプロピル(メタ)アクリレート、3-ヒドロキシプロピル(メタ)アクリレート、4-ヒドロキシブチル(メタ)アクリレート、テトラヒドロフルフリル(メタ)アクリレート、2-ヒドロキシ-3-フェノキシプロピル(メタ)アクリレート、グリシジル(メタ)アクリレート、ポリカプロラクトン変性ヒドロキシエチル(メタ)アクリレート、(メタ)アクリロイル末端ポリアクリレート、カプロラクトン変性テトラヒドロフルフリル(メタ)アクリレート、3-クロロ-2-ヒドロキシプロピル(メタ)アクリレート、N,N-ジメチルアミノエチル(メタ)アクリレート、N,N-ジエチルアミノエチル(メタ)アクリレート、t-ブチルアミノエチル(メタ)アクリレート、エトキシカルボニルメチル(メタ)アクリレートやブトキシエチル(メタ)アクリレート等のアルコキシアルキル(メタ)アクリレート、フェノールエチレンオキサイド変性アクリレート、フェノール(エチレンオキサイド2モル変性)アクリレート、フェノール(エチレンオキサイド4モル変性)アクリレート、パラクミルフェノールエチレンオキサイド変性アクリレート、ノニルフェノールエチレンオキサイド変性アクリレート、ノニルフェノール(エチレンオキサイド4モル変性)アクリレート、ノニルフェノール(エチレンオキサイド8モル変性)アクリレート、ノニルフェノール(プロピレンオキサイド2.5モル変性)アクリレート、2-エチルヘキシルカルビトールアクリレート、エチレンオキサイド変性フタル酸(メタ)アクリレ-ト、エチレンオキサイド変性コハク酸(メタ)アクリレート、トリフロロエチル(メタ)アクリレート、ω-カルボキシ-ポリカプロラクトンモノ(メタ)アクリレート、フタル酸モノヒドロキシエチル(メタ)アクリレート、(メタ)アクリル酸ダイマー、β-(メタ)アクリロイルオキシエチルハイドロジェンサクシネート、n-(メタ)アクリロイルオキシアルキルヘキサヒドロフタルイミド等が挙げられる。
これらの単官能(メタ)アクリレートモノマーは、針跡転写性を付与するという点において好ましい。
イソボルニル(メタ)アクリレート及びイソデシル(メタ)アクリレートを併用した場合、イソボルニル(メタ)アクリレート及びイソデシル(メタ)アクリレートの併用割合は、イソボルニル(メタ)アクリレート及びイソデシル(メタ)アクリレートの合計100質量部に対して、イソボルニル(メタ)アクリレート:イソデシル(メタ)アクリレート=80~99質量部:1~20質量部が好ましく、85~95質量部:5~15質量部がより好ましい。
これにより、室温から高温の温度領域において、針跡転写性を付与することができるという効果を得ることができる。
イソボルニル(メタ)アクリレート及びブトキシエチル(メタ)アクリレートを併用した場合、イソボルニル(メタ)アクリレート及びブトキシエチル(メタ)アクリレートの併用割合は、イソボルニル(メタ)アクリレート及びブトキシエチル(メタ)アクリレートの合計100質量部に対して、イソボルニル(メタ)アクリレート:ブトキシエチル(メタ)アクリレート=40~80質量部:20~60質量部が好ましく、50~70質量部:30~50質量部がより好ましい。
これにより、硬化性樹脂組成物の接着性が向上するという効果を得ることができる。
また、(メタ)アクリルアミドとしては、N-イソプロピル(メタ)アクリルアミド、N,N-ジメチル(メタ)アクリルアミド、N,N-ジエチル(メタ)アクリルアミド、N-ヒドロキシエチル(メタ)アクリルアミド、(メタ)アクリロイルモルフォリン等が挙げられる。
これらのアクリルアミドは、表面硬化性が良好であるという点において好ましい。
(A)単官能(メタ)アクリレート及び/又は(メタ)アクリルアミドの中では、効果が大きい点で、単官能(メタ)アクリレートが好ましい。
上記硬化性樹脂組成物は、さらに(B)多官能(メタ)アクリレートを含有していてもよい。
(B)多官能(メタ)アクリレートの添加量が60質量部以下であれば、硬化後の樹脂に針跡を認識するのに十分な深さの針跡を転写させることができる。
これにより、金属面への密着性をさらに向上させることができる。
上記硬化性樹脂組成物は、上記(A)及び(B)に加えて、さらに光重合開始剤を含んでいてもよい。(C)光重合開始剤は、可視光線や紫外線の活性光線により増感させて樹脂組成物の光硬化を促進するために配合するものであり、公知の各種光重合開始剤が好ましく用いられる。
光重合開始剤としては、上記の物質を1種又は2種以上組み合わせて用いることができる。
上記硬化性樹脂組成物は、その貯蔵安定性向上のため、重合禁止剤を含んでいてもよい。
これらの中では、効果が大きい点で、2,2-メチレン-ビス(4-メチル-6-ターシャリーブチルフェノール)が好ましい。
さらには、重合禁止剤の含有量は0.01~2質量部がより好ましい。これにより、貯蔵安定性及び耐久性がさらに向上するという効果を得ることができる。
上記硬化性樹脂組成物の硬化体は薄膜として得ることが可能である。硬化性樹脂組成物の硬化体を薄膜として得ることにより、上記硬化性樹脂組成物の硬化体に転写した針跡とウエハ上の基準位置とを同じフォーカスで同時に観察することができるため、作業時間の短縮につながる。
本実施形態に係るプローブの検査方法は、被検査体の電気的特性を検査するプローブに硬化性樹脂組成物の硬化体を接触させ、硬化体にプローブの針跡を転写して、転写された針跡を基にプローブの状態を確認し、かつ、プローブの針跡を転写した後に、硬化体を硬化体のガラス転移温度以上に加熱してプローブの針跡を消去する工程を含み、繰り返し検査に供するプローブの検査方法である。
先ず、検査に用いるプローブに硬化性樹脂組成物の硬化体を接触させ、該硬化体に該プローブの針跡を転写する。そして、転写されたプローブの針跡の確認を行った後、該プローブを用いたウエハの検査が行われる。このとき、上記確認操作によって、プローブの位置が適切でないことや、押し込み深さが充分でないことが判明した場合には、適宜プローブの調整を行うことができる。
例えば、針跡の最下部と硬化体表面との高さのギャップが100nm以下になれば、消去されたものとする。さらに好ましくは、50nm以下になれば、消去されたものとする。
これにより、プローブと接触させて針跡を容易に転写でき、しかもガラス転移温度以上に加熱することで容易に針跡を消去できるので、上記プローブの検査に好ましく用いられる。そして、針跡を消去した後、接触、転写及び確認時の温度まで冷却することで、再利用することができる。
上記プローブの検査には、図1に示すような、硬化体からなるシート10と、該シート10を載置する支持台12と、該シート10を該硬化体のガラス転移温度以上に加熱するための加熱装置(図示せず)と、該被検査体を載置する載置台13と、プローブ15を有するプローブカード14と、該シート10に転写された上記プローブ15の針跡11の状態を確認するための撮像装置16とを備える検査装置が好ましく用いられる。
ここで、検査装置の構成部材は上記のものに限られるわけではなく、他に真空ポンプやガス供給源、載置台の動きを制御する制御機構等を備えていてもよい。また、上記検査装置は、真空チャンバー等の装置内に組み込まれていても良い。
実施形態1及び2に係る硬化性樹脂組成物は、硬化後にプローブを接触させて針跡を転写した後、ガラス転移温度以上に加熱することで針跡を消去することが可能である。
加熱温度としては、180℃以下が好ましく、50~150℃がより好ましい。加熱温度が180℃以下であれば、硬化性樹脂組成物が複数回の使用に耐えうるため好ましい。
上記実施形態1及び2において、ガラス転移温度は、40℃以上130℃以下であることが好ましい。この範囲であれば、電気ヒーター、乾燥機等で容易に加熱が行える。さらに、ガラス転移温度は、40℃以上120℃以下であることが好ましく、50℃以上100℃以下であることがより好ましい。この範囲であれば、室温から高温の温度領域において、硬化体に充分な深さの針跡を転写することができる。
上記検査方法によれば、針跡を転写する部材を検査毎もしくはウエハの種類ごとに交換せずに、プローブの検査を繰り返し行うことができるという効果が得られる。
これにより、プローブと接触させて針跡を容易に転写でき、しかもガラス転移温度以上に加熱することで容易に針跡が消去できるので、プローブの検査に繰り返し用いることができる。
上記硬化性樹脂組成物によれば、プローブと接触させて針跡を容易に転写でき、しかもガラス転移温度以上に加熱することで容易に針跡が消去できるという効果が得られる。
この検査装置では、針跡を転写する部材を検査毎もしくはウエハの種類ごとに交換せずに、プローブの検査を繰り返し行うことができるため、検査工程の時間を短縮することが可能である。
以下の組成で各材料を配合し、硬化性樹脂組成物を作製した。
・(A)単官能(メタ)アクリレート
イソボルニルメタクリレート(共栄社化学社製、「ライトエステル IB-X」、以下「IB-X」と略す。)30質量部及びブトキシエチルメタクリレート(共栄社化学社製、「ライトエステル BO」、以下「BO」と略す。)20質量部。
・(B)多官能(メタ)アクリレート
水添1,2-ポリブタジエン末端ウレタンアクリレート(日本曹達社製、「TEAI-1000」、以下「TEAI-1000」と略す。)50質量部。
・(C)光重合開始剤
上記(A)及び(B)からなる組成物100質量部に対して、2-メチル-1-[4-(メチルチオ)フェニル]-2-モルフォリノプロパン-1-オン(チバ・スペシャルティ・ケミカルズ社製、「IRGACURE907」、以下「I-907」と略す。)1質量部。
・重合禁止剤
上記(A)及び(B)からなる組成物100質量部に対して、2,2-メチレン-ビス(4-メチル-6-ターシャリーブチルフェノール)(以下、「MDP」と略す。)0.1質量部。
ガラス転移温度は示差走査熱量計「SII EXSTAR DSC6220」(セイコーインスツル社製)により測定した(昇温速度10℃/min)。
引張せん断接着強さは、JIS K 6850に従い測定した。具体的には、被着材として耐熱パイレックス(登録商標)ガラス(25mm×25mm×2.0mm)を用いて、接着部位を直径8mmとして、作製した硬化性樹脂組成物にて2枚の耐熱パイレックス(登録商標)ガラスを貼り合わせ、無電極放電ランプを使用したフュージョン社製硬化装置により、365nmの波長の積算光量2000mJ/cm2の条件にて硬化させ、引張せん断接着強さ測定用の試験片を作製した。そして、万能試験機を使用して、温度23℃、湿度50%の環境下、引張速度10mm/minで、作製した試験片の引張せん断接着強さを測定した。
シリコンウェハ上に硬化性樹脂組成物を50μmの厚さに塗布し、無電極放電ランプを使用したフュージョン社製硬化装置により、365nmの波長の積算光量4000mJ/cm2の条件にて硬化させ、試験片を作製した。マニュアルプローバを用いて、プローブを速度約15μm/sの条件で40μm下降させ、シリコンウェハ上の硬化性樹脂組成物の硬化体に接触させた。プローブの接触時、硬化性樹脂組成物の硬化体の温度は25℃である。
表1に示す種類の原材料を表1に示す組成で使用したこと以外は実施例1と同様にして硬化性樹脂組成物を作製した。得られた硬化性樹脂組成物について、実施例1と同様に上記評価を行った。それらの実験結果を表1に示す。
なお、実施例9の針跡転写性は85℃にて評価した。
以下に、実施例2~9で使用した各材料とその略称を明記する。なお、この略称は表1と対応している。
TEA-1000:1,2-ポリブタジエン末端ウレタンアクリレート(日本曹達社製、「TEA-1000」)
ACMO:アクリロイルモルフォリン(興人社製、「ACMO」)
2-HEMA:2-ヒドロキシエチルメタクリレート(三菱ガス化学社製、「2-HEMA」)
DEAA:ジエチルアクリルアミド(興人社製、「DEAA」)
IB-XA:イソボルニルアクリレート(共栄社化学社製、「IB-XA」)
ID:イソデシルメタクリレート(共栄社化学社製、「ID」)
BDK:ベンジルジメチルケタール
表1に示す種類の原材料を表1に示す組成で使用したこと以外は実施例1と同様にして樹脂組成物を作製した。得られた樹脂組成物に関して、実施例1と同様に評価を行った。それらの結果を表1に示す。
以下に、比較例1及び2で使用した各材料とその略称を明記する。なお、この略称は表1と対応している。
R-684:ジシクロペンタニルジアクリレート(日本化薬社製、「KAYARAD R-684」)
表1からわかるように、実施例1~9では、針跡を転写することができ、かつ加熱によって針跡を消去することができた。即ち、本発明に係る硬化性樹脂組成物を使用することによって、針跡を転写する部材を検査毎もしくはウエハの種類ごとに交換せずに、プローブの検査を繰り返し行うことができる。
上記検査方法によれば、針跡を転写する部材を検査毎もしくはウエハの種類ごとに交換せずに、プローブの検査を繰り返し行うことができるという効果が得られる。
上記硬化性樹脂組成物によれば、プローブと接触させて針跡を容易に転写でき、しかもガラス転移温度以上に加熱することで容易に針跡が消去できるという効果が得られる。
Claims (11)
- 被検査体の電気的特性を検査するプローブに硬化性樹脂組成物の硬化体を接触させ、
硬化体にプローブの針跡を転写して、転写された針跡を基にプローブの状態を確認し、
かつ、プローブの針跡を転写した後に、硬化体を硬化体のガラス転移温度以上に加熱してプローブの針跡を消去する工程を含み、繰り返し検査に供するプローブの検査方法。 - 硬化性樹脂組成物の硬化体の厚さが20~100μmである請求項1に記載のプローブの検査方法。
- 硬化性樹脂組成物が、(A)単官能(メタ)アクリレート及び/又は(メタ)アクリルアミドと、(C)光重合開始剤とを含有し、ガラス転移温度が130℃以下である請求項1に記載のプローブの検査方法。
- 硬化性樹脂組成物が、さらに(B)多官能(メタ)アクリレートを含有する請求項1に記載のプローブの検査方法。
- 硬化性樹脂組成物が、さらに、重合禁止剤を含有する請求項1に記載のプローブの検査方法。
- (A)単官能(メタ)アクリレート及び/又は(メタ)アクリルアミドと、(C)光重合開始剤とを含有し、ガラス転移温度が130℃以下であるプローブの針跡を転写するための硬化性樹脂組成物。
- さらに(B)多官能(メタ)アクリレートを含有する請求項6に記載の硬化性樹脂組成物。
- さらに重合禁止剤を含有する請求項6に記載の硬化性樹脂組成物。
- (A)単官能(メタ)アクリレート及び/又は(メタ)アクリルアミドと(B)多官能(メタ)アクリレートとの合計量100質量部に対して、(A)単官能(メタ)アクリレート及び/又は(メタ)アクリルアミドを40~100質量部、(B)多官能(メタ)アクリレートを60質量部以下、(C)光重合開始剤を0.1~20質量部含有する請求項6に記載の硬化性樹脂組成物。
- 請求項6に記載の硬化性樹脂組成物を硬化してなる硬化体。
- 請求項10に記載の硬化体からなるシートと、
シートを載置する支持台と、
シートを硬化体のガラス転移温度以上に加熱するための加熱装置と、
被検査体を載置する載置台と、
プローブを有するプローブカードと、
シートに転写されたプローブの針跡の状態を確認するための撮像装置とを備える、被検査体の電気的特性を検査するための検査装置。
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Cited By (3)
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WO2012111154A1 (ja) * | 2011-02-18 | 2012-08-23 | 電気化学工業株式会社 | プローブの検査方法及び硬化性樹脂組成物 |
WO2018235718A1 (ja) * | 2017-06-23 | 2018-12-27 | 東京エレクトロン株式会社 | プローブ装置及び針跡転写方法 |
JP7176284B2 (ja) | 2018-08-07 | 2022-11-22 | 東京エレクトロン株式会社 | プローブ装置、プローブの検査方法、及び記憶媒体 |
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CN110031658B (zh) * | 2012-11-21 | 2021-11-30 | 康拉德有限责任公司 | 用于测试工件的方法及装置 |
TWI790144B (zh) * | 2022-03-18 | 2023-01-11 | 漢民測試系統股份有限公司 | 針位校正片治具以及用於探針卡之探針校正裝置 |
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US8723537B2 (en) | 2014-05-13 |
US20110128023A1 (en) | 2011-06-02 |
TW200946921A (en) | 2009-11-16 |
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