EP1220739B1 - Procede et dispositif pour separer des substrats en forme de tranche - Google Patents

Procede et dispositif pour separer des substrats en forme de tranche Download PDF

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Publication number
EP1220739B1
EP1220739B1 EP00972741A EP00972741A EP1220739B1 EP 1220739 B1 EP1220739 B1 EP 1220739B1 EP 00972741 A EP00972741 A EP 00972741A EP 00972741 A EP00972741 A EP 00972741A EP 1220739 B1 EP1220739 B1 EP 1220739B1
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EP
European Patent Office
Prior art keywords
plate
substrate
baseplate
substrates
gripper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP00972741A
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German (de)
English (en)
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EP1220739A1 (fr
Inventor
Josef Gentischer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schmid Technology Systems GmbH
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Schmid Technology Systems GmbH
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Publication date
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Publication of EP1220739A1 publication Critical patent/EP1220739A1/fr
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Publication of EP1220739B1 publication Critical patent/EP1220739B1/fr
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type

Definitions

  • the present invention relates to a method and a device for separating and detaching thin, fracture-sensitive disc-shaped substrates consisting of a preferably fixed on a base plate by means of gluing held substrate block have been cut, according to the The preamble of claim 1 or that of claim 8 (see e.g. JP-A-11-054462).
  • disc-shaped substrates as they are For example, be used for solar cells, one uses Substrate blocks or columns of, for example, silicon, in thin Slices are sawed.
  • the substrate block or the Substrate column adhered to a base plate and thereby there fixed. After sawing sticks each disc-shaped Substrate on its underside still on the glue line or Sides on the base plate, whose top is usually off Glass exists and has been sawn with.
  • the object of the present invention is to provide a method or to provide a device of the type mentioned, with or with such thin fragile ones disc-shaped substrates automatically and thereby damage-free individually from the sawn substrate block of the adhesive seam can be removed.
  • a preferred embodiment of the oscillating Movement results in accordance with the features of claim 2 or those of claim 11. In this way, a oscillating pivoting movement around the adhesive seam or Glue line, causing a fatigue break this adhesive seam leads. In addition, this results in a minimum limited application of force to the disk-shaped substrate even.
  • a preferred embodiment of the gripper device results by the features of claim 12.
  • adjacent disc-shaped substrates also isolated and as a result, can be detached from the base plate, if they are due to moisture, which is process-related Reasons is unavoidable, and / or in a tilted state at least partially adhere to each other.
  • the device 10 shown in the drawing serves for Separation and detachment of thin, fracture-sensitive disc-shaped substrates 11, which consist of a on a Base plate 12 fixedly held substrate block 13 cut have been.
  • a substrate block is, for example, an off Polycrystalline silicon produced silicon block, the For example, with the help of a two-component adhesive on a Glass pane part of the base plate 12 is glued.
  • aid parallel cutting wires is under supply of liquid Cutting the silicon block in individual, eg. As Cut silicon wafers serving solar wafers. This Cutting or sawing the substrate block 13 into individual thin disk-shaped substrates or wafers will be up in the a steel plate part resting glass plate part of Base plate 12 made in it.
  • the single ones disc-shaped substrates 11 are particularly in the field of Adhesive seam 15 in one of the width of the saw cut 14th appropriate distance from each other. Due to the Use of the liquid cutting agent, for example, it is possible that individual adjacent disk-shaped substrates 11 in parallel or oblique position to each other adhere to each other.
  • the disk-shaped substrates 11 have semiconductor wafers a thickness of about 0.7 to 0.8 mm and as a solar wafer one Thickness in the range of 0.2 to 0.3 mm, as well Substrate thicknesses in the range of 0.15 mm are possible.
  • the device 10 With the device 10 according to the invention, it is such thin disk-shaped substrates 11 from the adjacent to dissect disc-shaped substrate and from the Base plate 12 unbroken in an automatic way and also otherwise undamaged to replace in a simple manner and the further storage and / or processing.
  • the device 10 has a gripper device 20, which in Direction of the double arrow B oscillating back and forth is driven swivel and on the one hand the peeling the disc-shaped substrates 11 of the base plate 12 and on the other hand, the removal and continuation of the disc-shaped Substrates 11 is used.
  • the gripper device 20 is for this purpose and for biasing in the direction of arrow C1 on a Gripper holder 30 attached.
  • the gripper device 20 has a gripper plate 21, from the gripper arms 22 in a matrix-like arrangement perpendicular protrude.
  • a matrix-like arrangement of the gripper arms 22 results, for example, in a modification shown in FIG. 1 from Fig. 3.
  • the gripper arms 22 are above the gripper plate 21, whose areal dimension approximately the flat dimension of disc-shaped substrates 11 corresponds, arranged such that they are partially or pointwise essentially about the entire outer surface 16 to be grasped disc-shaped substrate 11 are distributed.
  • the gripper arms 22 have at their the gripper plate 21 facing away from free Ends sucker 23, which, as will be shown, with a Vacuum device 50 are connected.
  • the gripper plate 21 is at its base plate 12 facing away from the upper end and at her the gripper arms 22 facing away from back with a arcuate slider 24 connected in a receptacle 32nd a holder 31 of the gripper holder 30 in the direction of Double Arrows B kept kept.
  • the rear end 26 of the Slider 24 has a link opening 25 in the an eccentric 33 is immersed, which has a Eccentric axis 34 mounted on a holder 31 projecting Mounted flange 35 and a motor, not shown is driven in rotation. Due to the rotational movement of Eccentric 33, the slider 24 in the direction of Double arrow B oscillating curved back and forth, whereby the gripper plate 21 with the gripper arms 22nd is oscillated.
  • the orientation of the holder 31 is such that the imaginary extension of his Central axis 36, the adhesive seam 15 intersects. In this way is using the eccentric 33, 34, the gripper plate 21st oscillating around the adhesive seam 15 between disk-shaped Substrate 11 and base plate 12 is pivoted.
  • the holder 31 is fixed to a holder plate 37, the relative to a support web 38 according to double arrow C linear is movable.
  • the support web 38 is at a distance arranged bolt 39 fixedly connected to the holder plate 37th penetrate axially movable and at its end a Investment disc 41 own. Between the contact washer 41 and the underside of the holding plate 37 are compression springs 40th arranged.
  • the support web 38 is not shown in Way in the direction of arrow C1 upwardly movable or raised, which stroke movement connected to the holder 31 Holder plate 37, as will be shown, follow or can not follow.
  • the support web 38 is provided with a laterally projecting angle 42 connected to the down protruding end a movement detection sensor 43 is mounted, the one area between holder plate 37 and contact washer 41 of the bolt 39 opposite.
  • a Spray nozzle 45 is fixedly arranged, which in not shown Way is connected to a fluid pressure vessel and whose slot-like nozzle opening 46 in the region of Saw cut 14 between two adjacent disk-shaped Substrates 11 is directed.
  • the base plate 12 with the cut substrate block 13 in the direction of Arrows A and thus in the direction of the oscillating swivel Gripper device 20 movable toward.
  • the process or the process of separating and detaching of thin, fragile disc-shaped substrates 11 from one another or from one on the base plate 12 sticking fixedly held substrate block 13, which in the disc-shaped substrates 11 has been cut, runs as follows.
  • the base plate 12 is in the direction of arrow A so far moves until the positioning sensor 27 the correct position for Docking of the foremost disc-shaped substrate 11 to the Gripper device 20 has detected, this Positioning sensor 27 in a lower region near the Adhesive seam 15 is provided.
  • the Spray nozzle device 45 is applied, so that over the Slot mouth 46 a liquid flat stream in the Saw cut 14 between the foremost and the afterwards following disk-shaped substrate 11 is brought, wherein the liquid jet causes a possible sticking of the subsequent disk-shaped substrate 11 dissolved is, and / or that the disc-shaped to be taken Substrate (vertical) sets up.
  • With connecting the Vacuum device 50 will be the foremost one to take disc-shaped substrate 11 of the gripper arms 22nd attached suckers 23 detected.
  • the eccentric 33, 34 in operation set resulting in an oscillating pivoting movement of the Gripper device 20 results.
  • Has the oscillation oscillation a small amplitude in the range between 2 and 6 °, preferably of 3 ° at a frequency range of about 5 to 10 Hz.
  • This oscillation oscillation is applied to that of the Gripper device 20 grasped disk-shaped substrate 11th transfer.
  • the oscillation oscillation of the disk-shaped Substrate 11 takes place until cracks in the adhesive seam 15 between the disc-shaped substrate 11 and the Base plate 12 as far as the damage-free Lifting the disc-shaped substrate 11 allow.
  • the support web 38 of Gripper holder 30 slightly upwards in the direction of arrow C1 moves, wherein the holder plate 37, with the Gripper device 20 is firmly connected, in its position remains.
  • the Compressive springs 40 acted upon in the direction of arrow C1 and the Movement of the spring coils and / or the contact washer 41st is detected by the motion detection sensor 43.
  • the isolated and detached disc-shaped substrate 11 can then in a manner not shown a memory or a be fed to further processing.
  • Gripper arms 22 and their suckers 23 in a certain way wired. All suckers 23 are constantly with a Vacuum generator 51, for example. In the form of an ejector, connected. In addition to the n suckers 23 associated n ejector nozzles 51, n transducers 52 are provided with which to be evaluated can, if and which suckers 23 a corresponding surface of the associated disc-shaped substrate 11 have taken. This allows conclusions to be drawn as to whether the relevant disc-shaped substrate 11 in total or only fragmentary is available. This leaves, for example, a good / bad sorting to.
  • the suckers 23 are in two (or more) format dependent circles 53, 54 summarized and corresponding connected.
  • disk-shaped substrates 11 different outer surface or format 16 ', 16' ', 16 '' ', 16' '' 'handled and recorded. It is possible, this format-dependent circles differentiated with Apply vacuum so that it is also possible To detect fragments of disc-shaped substrates and to remove.
  • the gripper device with only one and possibly larger suction cups to equip.

Claims (19)

  1. Procédé permettant d'individualiser et de séparer des substrats en forme de tranche, sensibles à la rupture, minces, qui ont été découpés dans un bloc de substrat maintenu sur un plateau de base, en étant de préférence fixé par collage, dans lequel le substrat circulaire est saisi au niveau d'un emplacement ou de plusieurs emplacements éloignés de sa surface extérieure libre, et est déplacé de manière oscillante, caractérisé en ce que le substrat circulaire pivote de manière oscillante autour d'un axe sensiblement parallèle à la surface de support, qui se trouve dans son support sur le plateau de base, et est maintenu en étant précontraint pendant son déplacement oscillant dans une direction s'éloignant du plateau de base.
  2. Procédé selon la revendication 1, caractérisé en ce que les substrats en forme de tranche respectivement voisins, de préférence dans leur zone orientée vers le plateau de base, sont individualisés à l'aide d'un jet sous pression.
  3. Procédé selon la revendication 2, caractérisé en ce que l'individualisation de substrats en forme de tranche voisins entre le substrat circulaire à saisir et le suivant est mise en oeuvre.
  4. Procédé selon l'une quelconque des revendications 2 ou 3, caractérisé en ce que, dans la fente de séparation entre les deux substrats en forme de tranche voisins, on dirige un jet plat de liquide.
  5. Procédé selon au moins l'une quelconque des revendications précédentes, caractérisé en ce que le substrat circulaire est saisi par aspiration dans une matrice dépendant du format.
  6. Procédé selon au moins l'une quelconque des revendications 2 à 5, caractérisé en ce que l'individualisation des substrats en forme de tranche voisins et la préhension par aspiration du substrat concerné s'effectuent simultanément.
  7. Procédé selon au moins l'une quelconque des revendications précédentes, caractérisé en ce que le plateau de base doté du bloc de substrat découpé est déplacé peu à peu de manière à saisir le substrat circulaire respectif.
  8. Dispositif (10) permettant d'individualiser et de séparer des substrats (11) en forme de tranche, sensibles à la rupture, minces, qui ont été découpés dans un bloc de substrat (13) maintenu sur un plateau de base (12), en étant de préférence fixé par collage, comportant un dispositif préhenseur (20), à l'aide duquel le substrat circulaire (11) peut être saisi à des emplacements voisins de sa surface extérieure (16) libre, et qui peut être entraíné de manière mobile avec des oscillations, caractérisé en ce que plusieurs bras de préhension (22) dépassent, en étant immobiles, du plateau de préhension (21) du dispositif préhenseur (20), en ce que le plateau de préhension (21) peut pivoter de manière oscillante autour d'un axe (15), qui est sensiblement parallèle à la surface extérieure (16) du substrat circulaire (11) saisi et parcourt la zone de support du substrat circulaire (11) sur le plateau de base (12), et en ce que le plateau de préhension (21) présente un coulisseau (24) de forme incurvée guidé dans un évidement (32), qui peut effectuer un mouvement de va et vient à partir d'une roue excentrique (33, 34) entraínée en rotation.
  9. Dispositif selon la revendication 8, caractérisé en ce que le dispositif préhenseur (20) est raccordé à une bride de préhension (30), de telle sorte que le dispositif préhenseur (20) est précontraint dans une direction soulevant le substrat circulaire (11) du plateau de base (12).
  10. Dispositif selon la revendication 9, caractérisé en ce que la bride de préhension (30) présente un élément de traction (38) raccordé à un entraínement de levage et un plateau de maintien pouvant se déplacer de manière relativement élastique par rapport à l'élément de traction (37), sur lequel est maintenu le dispositif préhenseur (20).
  11. Dispositif selon l'une quelconque des revendications 8 et 10, caractérisé en ce que, sur le plateau de maintien (37) relativement mobile est fixé un bras de levage (31), qui présente l'évidement (32) permettant de guider le coulisseau (24) incurvé du dispositif de préhension (20).
  12. Dispositif selon au moins l'une quelconque des revendications 9 à 11, caractérisé en ce que, sur la pince de préhension (30), il est prévu un capteur (43) permettant de repérer le déplacement relatif entre l'élément de traction (38) et le plateau de maintien (37).
  13. Dispositif selon au moins l'une quelconque des revendications 8 à 12, caractérisé en ce qu'il est prévu une buse de pulvérisation à jet sous pression (45), qui est disposée d'un côté du plateau de base (12) à proximité du support (15) du substrat circulaire (11) sur le plateau de base (12) et en étant orienté entre deux substrats en forme de tranche (11) voisins, moyennant quoi la buse de pulvérisation à jet sous pression (45) et le plateau de base (12) peuvent se déplacer relativement l'un par rapport à l'autre le long du bloc de substrat (13).
  14. Dispositif selon la revendication 13, caractérisé en ce que la buse de pulvérisation de jet sous pression (45) comporte une évacuation (46) se présentant sous la forme d'une fente.
  15. Dispositif selon au moins l'une quelconque des revendications 8 à 14, caractérisé en ce que les bras de préhension (22) du dispositif préhenseur (20) sont dotés de têtes aspirantes (23), qui sont disposées dans une matrice et peuvent être commandées en fonction du format.
  16. Dispositif selon la revendication 15, caractérisé en ce que la matrice d'aspiration est subdivisée en plusieurs circuits.
  17. Dispositif selon l'une quelconque des revendications 15 ou 16, caractérisé en ce que, à chaque tête d'aspiration (23) est affecté un générateur de vide (51) et un convertisseur (52) permettant de repérer le vide adjacent.
  18. Dispositif selon au moins l'une quelconque des revendications 8 à 17, caractérisé en ce que la buse de pulvérisation à jet sous pression (45) est fixe, et le plateau de base (12) peut être déplacé progressivement vers le dispositif préhenseur (20).
  19. Dispositif selon au moins l'une quelconque des revendications 8 à 18, caractérisé en ce que, dans la zone du dispositif préhenseur (20), il est prévu un capteur de positionnement (27) pour le bloc de substrat (13).
EP00972741A 1999-10-16 2000-10-12 Procede et dispositif pour separer des substrats en forme de tranche Expired - Lifetime EP1220739B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19950068 1999-10-16
DE19950068A DE19950068B4 (de) 1999-10-16 1999-10-16 Verfahren und Vorrichtung zum Vereinzeln und Ablösen von Substratscheiben
PCT/EP2000/010036 WO2001028745A1 (fr) 1999-10-16 2000-10-12 Procede et dispositif pour separer des substrats en forme de tranche

Publications (2)

Publication Number Publication Date
EP1220739A1 EP1220739A1 (fr) 2002-07-10
EP1220739B1 true EP1220739B1 (fr) 2005-04-27

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EP00972741A Expired - Lifetime EP1220739B1 (fr) 1999-10-16 2000-10-12 Procede et dispositif pour separer des substrats en forme de tranche

Country Status (9)

Country Link
EP (1) EP1220739B1 (fr)
JP (1) JP4731077B2 (fr)
CN (1) CN1160177C (fr)
AT (1) ATE294056T1 (fr)
AU (1) AU777067B2 (fr)
CA (1) CA2388730A1 (fr)
DE (2) DE19950068B4 (fr)
ES (1) ES2240189T3 (fr)
WO (1) WO2001028745A1 (fr)

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JP4022672B2 (ja) * 1998-03-04 2007-12-19 株式会社東京精密 スライスベース剥離装置
DE19900671C2 (de) * 1999-01-11 2002-04-25 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum Vereinzeln von scheibenförmigen Substraten, insbesondere zur Waferherstellung

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DE50010186D1 (de) 2005-06-02
WO2001028745A1 (fr) 2001-04-26
JP2003512196A (ja) 2003-04-02
EP1220739A1 (fr) 2002-07-10
CN1379708A (zh) 2002-11-13
ATE294056T1 (de) 2005-05-15
ES2240189T3 (es) 2005-10-16
JP4731077B2 (ja) 2011-07-20
CN1160177C (zh) 2004-08-04
AU1136801A (en) 2001-04-30
CA2388730A1 (fr) 2001-04-26
DE19950068A1 (de) 2001-04-26
DE19950068B4 (de) 2006-03-02
AU777067B2 (en) 2004-09-30

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