EP0735574A1 - Verbesserte Schlitzventiltür - Google Patents

Verbesserte Schlitzventiltür Download PDF

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Publication number
EP0735574A1
EP0735574A1 EP96105015A EP96105015A EP0735574A1 EP 0735574 A1 EP0735574 A1 EP 0735574A1 EP 96105015 A EP96105015 A EP 96105015A EP 96105015 A EP96105015 A EP 96105015A EP 0735574 A1 EP0735574 A1 EP 0735574A1
Authority
EP
European Patent Office
Prior art keywords
door
wall
recited
recess
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP96105015A
Other languages
English (en)
French (fr)
Other versions
EP0735574B1 (de
Inventor
Frederik W. Freerks
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to EP01120661A priority Critical patent/EP1179835A2/de
Publication of EP0735574A1 publication Critical patent/EP0735574A1/de
Application granted granted Critical
Publication of EP0735574B1 publication Critical patent/EP0735574B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/06—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials
    • H01L21/08—Preparation of the foundation plate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
    • F16K51/02—Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece

Definitions

  • This invention relates to improvements to a vacuum processing chamber used in semiconductor manufacturing. More particularly, it relates to an improved slit valve door for sealing apertures formed in the walls of such a chamber.
  • a number of silicon wafers 10 are stacked in a wafer elevator 12. Individual wafers 14 are sequentially removed from the elevator by means of a robot arm 16 and inserted into a particular chamber 18 through an open aperture or slit 19, typically rectangular shaped, barely accommodate the blade of the robot carrying the wafer 14.
  • each chamber has its own slit, 19, 19.1, 19.2, and 19.3, respectively, and the robot arm 16 services all four chambers.
  • the aperture 19 is closed by a mechanism generally referred to as a slit valve closure mechanism 20.
  • a mechanism generally referred to as a slit valve closure mechanism 20 For the sake of clarity, only one closure mechanism is illustrated. In practice, however, each slit 19, 19.1, 19.2, and 19.3 has its own closure mechanism.
  • the fabrication process commences, which typically involves pumping the chamber to a reduced pressure, or injecting a reactive processing gas into the chamber, or a combination thereof. Thus, the chamber must be environmentally isolated and the slits must be vacuum sealable.
  • the closure mechanism 20 is operated to open the slit 19. The wafer 14 is then removed from the chamber 18 by the robot arm 16 and inserted into another processing chamber 18.1 or returned to the rack 12.
  • FIG. 2 illustrates one possible mechanism for opening and closing the slit valve door 21.
  • Other mechanisms do, however, exist. Two examples are described in U.S. Patent No. 5,275,303, the disclosures of which are incorporated herein by reference.
  • the closure mechanisms 20 shown in FIGs. 2 and 2A includes a slit valve door 21, which comprises an aperture cover plate 22 and a seal 30.
  • the closure means, as illustrated, in FIG. 2 appears to have only one linkage 28. This is as a result of the particular view depicted and it is usual for the closure means to include at least two identical and parallel linkages respectively positioned at the opposite ends of the slit valve door 21.
  • the linkage 28 in Fig. 2A may be a pneumatically actuated rod.
  • the slit valve door 21 is shown to close and seal an aperture 19 in the sidewall 24 of the semiconductor reaction chamber 18.
  • the linkage 28 in cooperation with unillustrated pivots, moves the door 21 from an open position (shown in broken lines) 21' away from the chamber sidewall 24 to the sealing position 21 shown in solid line.
  • a circumferential O-ring 30 is fitted into a groove 40 in the face 26 of the door 21.
  • this O-ring is made of a resilient, compressible, and heat-resistant material. Most commercial O-rings are composed of an elastomeric material.
  • the O-ring 30 is typically retained in a dovetail groove 40 formed in the wall-facing face 26 of the door 21.
  • the O-ring 30 is press-fitted into the groove 40.
  • the side surfaces 42 of the groove 40 slope inwardly up toward the face 26 to form a restriction 46 at the face 26. This restriction is narrower than the diameter of the O-ring 30.
  • the O-ring seal is intended to prevent the leakage of process gases through the slit 19 out of the process chamber and to prevent atmosphere from entering to thus reduce contamination therefrom.
  • the prior art device described above does not seal the slit 19 as well as might be desired. Because the restriction 46 is narrower than the O-ring 30, the O-ring 30 must be forced past the restriction 46. This can damage the sealing surfaces of the O-ring 30, resulting in leakage of gases into or out of the reaction chamber. The O-ring 30 may also twist during insertion or be unevenly tensioned after insertion. In either case, the O-ring 30 does not have a uniform dimension and does not seat properly in the dovetail groove 40. This results in poor performance and short life, as well as a less effective seal.
  • FIGs. 4 and 4A is a plan view onto the relevant portion of the face 26 of a prior art slit valve door with a dovetail groove 40.
  • This groove 40 is typically machined into the door by a router with a dovetail bit.
  • the dovetail groove 40 is narrower at its opening 41 than at its bottom surface 44, as indicated in FIG. 3. This makes the groove 40 difficult to machine in such a way that it is uniform along its entire length and such that it does not begin or terminate at an edge of the face 26.
  • a uniformly dovetailed groove could be achieved by starting the groove 40 at an edge of the face 26, this is generally considered less ideal than starting the groove 40 by simply plunging the router bit into the face 26.
  • the router bit then travels in a closed loop, cutting the dovetail groove 40, and terminates at its starting point.
  • This procedure results in a hole 48 at the starting point that is wider than the opening 41 of the groove and whose width is that of the bottom surface 44 of the groove (shown in FIG. 3).
  • the restriction 46 of FIG. 3 does not exist and thus there is no retention of the O-ring 30 at that point. This adversely affects the sealing ability of the O-ring 30.
  • a small groove 50 is cut in the face 26 such that it is orthogonal to the groove 40 and such that it has a lower surface even with the groove's bottom surface 44. This allows the O-ring 30 to be pried out by means of a small tool inserted in the small groove 50 below the O-ring 30. This creates two problems. First, the O-ring 30 is no longer supported by the sides 42 of the dovetail groove 40. Second, use of the small tool to remove the O-ring 30 may result in damage to the bottom 40 of the dovetail groove near the intersection with the small groove 50. Both of these difficulties reduce the effectiveness of the O-ring seal 30.
  • an improved slit valve door for sealing an aperture in the wall of a semiconductor process chamber.
  • the door includes an aperture cover plate, a removable insert which fits into a recess in the aperture cover plate, and an O-ring seal which is retained between the aperture cover plate and the insert.
  • the aperture cover plate has a recess for receiving the insert, along with an O-ring receiving seat defined by a shoulder and an inwardly angled wall.
  • the insert has an angled face which, when the insert is received in the recess, combines with the shoulder and angled wall to define a dovetail groove that retains the O-ring seal between the cover plate and the insert.
  • the insert is secured to the cover plate by means of screws which pass from the rear face of the cover plate into the recess and screw into the insert.
  • An O-ring is placed over and held by the lower portion of the insert and the lower portion is then inserted into the recess.
  • the O-ring moves with the insert into the recess until it contacts the shoulder of the O-ring receiving seat, which prevents the O-ring from moving further into the recess.
  • Further tightening of the screws causes the angled face of the insert to come into contact with the O-ring, and the angled face forces the O-ring into contact with the inwardly angled wall of the O-ring receiving seat.
  • the O-ring is thus held in place by the shoulder, inwardly angled wall, and angled face. Part of it protrudes beyond the generally uniform face defined by the cover plate and insert, and when the slit valve door is closed, the protruding part of the O-ring comes in contact with the wall of the chamber.
  • the O-ring receiving seat has a radiused corner between the shoulder and inwardly angled wall.
  • This radiused corner has the advantage of being easier to machine than a sharp corner having an acute angle. It reduces the volume of the pocket between the O-ring, shoulder, and inwardly angled wall, thus reducing the amount of air trapped in the pocket when the O-ring is received in the O-ring seat and reducing the vacuum which tends to hold the O-ring in place and makes removal more difficult.
  • One advantage of this invention is that the contamination of the chamber's interior is reduced by providing a more effective seal. This is achieved by reducing the twisting, uneven tensioning, and uneven placement of the O-ring as it is placed in the slit valve door.
  • the present invention facilitates removal of the O-ring seal and does not require use of a prying tool which could damage the surfaces of the slit valve door's retaining groove and thus reduce the effectiveness of the seal.
  • a further advantage of the present invention is that less stress is placed on the O-ring seal as it is inserted into the slit valve door, reducing the possibility of damage to the O-ring and thus increasing its life. This means the O-ring will not have to be replaced as frequently, which reduces the downtime for replacement of the O-ring.
  • Yet another advantage of the present invention is that it can be retrofitted to an existing processing apparatus to replace the prior art slit valve doors as illustrated in FIG. 2.
  • a slit valve door retaining the O-ring 30 in accordance with the present invention is shown, and generally indicated as 51. As illustrated, it comprises a first part in the form of an aperture cover plate 52, often referred to as a door, in combination with a second part in the form of an insert 54.
  • the cover plate 52 has a recess 56 formed in its face 58 for receiving the insert 54.
  • the insert 54 has a seating surface 60 that adjoins the bottom surface 90 of the recess 56 when the cover plate 52 and insert 54 are combined.
  • the cover plate 52 further includes an O-ring seat 62, including an inwardly angled wall 66 and a stepped formation which forms a shoulder 64 for supporting the O-ring 30.
  • the included angle between the wall 66 and the shoulder 64 is typically 60-63 degrees.
  • the wall 66 and the shoulder 64 define two of the three primary sides of a dovetail O-ring retainer.
  • the insert 54 has an upper, protruding lip 68, including an angled surface 70, which is formed so that it overhangs the shoulder 64 when the insert 54 is received in the recess 56 and is inwardly angled with respect to the resultant dovetail groove. In this way, the third primary side of the dovetail O-ring retainer is defined.
  • the O-ring 30 To insert the O-ring 30, it is first placed over a lower portion 63 of the insert 54 before the insert 54 is lowered into the cover plate 52.
  • the lower portion is sized such that the elastic O-ring 30 is held thereon under tension.
  • the lower portion 63 of the insert 54 is then inserted into the recess 56 formed in the cover plate 52.
  • the O-ring 30 first passes the tip of the cover plate wall 66 and then bears against the shoulder 64 and is prevented from moving further into the recess 56.
  • the insert 54 continues to be forced into the recess 56, causing the O-ring 30 to move up against, and thereafter, stretch over, the angled face 70.
  • the cover plate 52 has two symetrically placed holes 76 extending from its rear face 80 into the recess 56.
  • the insert 54 is joined to the cover plate 52 by means of screws 74, which pass through the holes 76 in the cover plate 52 and screw into holes 78 tapped into the seating surface 60 of the insert 54.
  • screws 74 By tightening the screws 74 appropriately, the top wall of insert 54 is pulled into close proximity with the face 58 of the cover plate 52.
  • the O-ring 30 which has been placed over the insert 54, is forced into contact with the shoulder 64.
  • the shoulder 64 prevents further movement of the O-ring 30 into the recess 56 and forces the O-ring 30 up against the angled face 70. This pushes the O-ring 30 into contact with the wall 66.
  • Further tightening of the screws 74 increases the compressive force on the O-ring 30 exerted by the angled surface 70, the wall 66, and the shoulder 64, and thus improves the sealing between the cover plate 52 and the insert 54.
  • An improvement to the invention comprises secondary seals 86 between the cover plate 52 and the insert 54.
  • Grooves 88 are formed in the recess 56 such that they completely encircle the holes 76.
  • Each secondary O-ring seal 86 is placed in a groove 88 and is dimensioned so that when it is placed in the groove 88, it protrudes above the bottom surface 90 of the recess 56.
  • the seating surface 60 comes into contact with the secondary O-ring seals 86, thus sealing the holes 74. This has the advantage of further preventing leakage of air between the cover plate 52 and insert 54.
  • a further improvement to the invention comprises a radiused corner 82 between the wall 66 and the shoulder 64, as shown in FIG. 6.
  • the radiused corner 82 has the advantage of being easier to machine than a sharp corner having an acute angle.
  • This feature also has the advantage of reducing the volume of trapped air in the pocket 84 defined between the O-ring 30, the shoulder 64, and the wall 66. This improves the sealing, because when the screws 74 are tightened to place the O-ring 30 under compression, the angled surface 70 forces the O-ring 30 further into the pocket 84 and reduces the volume of the pocket 84.
  • the O-ring 30 is already in contact with the wall 66 and the shoulder 64, effectively sealing the pocket 84.
  • the trapped air can escape, through strategically placed vents in the wall and shoulder as is a common practice in vacuum applications.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Gasket Seals (AREA)
  • Sliding Valves (AREA)
  • Details Of Valves (AREA)
  • Chemical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
EP96105015A 1995-03-31 1996-03-29 Verbesserte Schlitzventiltür Expired - Lifetime EP0735574B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP01120661A EP1179835A2 (de) 1995-03-31 1996-03-29 Verbesserte Schlitzventiltür und Verfahren zum Zusammenbau

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US414420 1989-09-29
US08/414,420 US5579718A (en) 1995-03-31 1995-03-31 Slit valve door

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP01120661A Division EP1179835A2 (de) 1995-03-31 1996-03-29 Verbesserte Schlitzventiltür und Verfahren zum Zusammenbau

Publications (2)

Publication Number Publication Date
EP0735574A1 true EP0735574A1 (de) 1996-10-02
EP0735574B1 EP0735574B1 (de) 2002-03-13

Family

ID=23641384

Family Applications (2)

Application Number Title Priority Date Filing Date
EP01120661A Withdrawn EP1179835A2 (de) 1995-03-31 1996-03-29 Verbesserte Schlitzventiltür und Verfahren zum Zusammenbau
EP96105015A Expired - Lifetime EP0735574B1 (de) 1995-03-31 1996-03-29 Verbesserte Schlitzventiltür

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP01120661A Withdrawn EP1179835A2 (de) 1995-03-31 1996-03-29 Verbesserte Schlitzventiltür und Verfahren zum Zusammenbau

Country Status (5)

Country Link
US (1) US5579718A (de)
EP (2) EP1179835A2 (de)
JP (1) JPH1050791A (de)
KR (1) KR100371996B1 (de)
DE (1) DE69619717T2 (de)

Cited By (7)

* Cited by examiner, † Cited by third party
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WO1998045874A1 (en) * 1997-04-08 1998-10-15 Tokyo Electron Arizona, Inc. Vacuum processing apparatus with low particle generating vacuum seal
WO1999003132A1 (en) * 1997-07-11 1999-01-21 Applied Materials, Inc. Two-piece slit valve door with molded-in-place seal for a vacuum processing system
WO2000002228A1 (en) * 1998-07-03 2000-01-13 Applied Materials, Inc. Double slit-valve doors for plasma processing
CN103375588A (zh) * 2012-04-27 2013-10-30 泰拉半导体株式会社 密封件及使用该密封件的基板处理装置
WO2017132205A1 (en) * 2016-01-27 2017-08-03 Applied Materials, Inc. Slit valve gate coating and methods for cleaning slit valve gates
US10023954B2 (en) 2011-09-15 2018-07-17 Applied Materials, Inc. Slit valve apparatus, systems, and methods
CN109296768A (zh) * 2017-07-25 2019-02-01 Smc株式会社 闸阀门的安装构造

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US6682288B2 (en) 2000-07-27 2004-01-27 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
US6821912B2 (en) 2000-07-27 2004-11-23 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
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KR100909332B1 (ko) * 2002-01-31 2009-07-24 듀폰 퍼포먼스 엘라스토머스 엘.엘.씨. 게이트 밸브용 씰 조립체
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RU2639550C2 (ru) 2009-12-16 2017-12-21 Курна, Инк. Лечение заболеваний, связанных с сайт-1 мембраносвязанной пептидазой транскрипционных факторов (mbtps1), путем ингибирования природного антисмыслового транскрипта к mbtps1
JP4814384B2 (ja) * 2010-04-05 2011-11-16 株式会社日立ハイテクノロジーズ 弁体
JP2013161887A (ja) * 2012-02-02 2013-08-19 Toyota Motor Corp 筐体
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ITMI20120694A1 (it) * 2012-04-26 2013-10-27 Mib Italiana Spa Valvola di controllo a petali con guarnizione di tenuta per unita' di collegamento separabili per tubi flessibili.
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JP6160926B2 (ja) * 2014-06-05 2017-07-12 Smc株式会社 ゲートバルブ
KR101725250B1 (ko) * 2015-05-04 2017-04-11 프리시스 주식회사 진공밸브용 블레이드
US10072776B2 (en) 2015-08-20 2018-09-11 Deere & Company Fluid connector with annular groove and seal
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JP7281968B2 (ja) * 2019-05-30 2023-05-26 東京エレクトロン株式会社 アリ溝加工方法及び基板処理装置
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CN113932011A (zh) * 2021-11-23 2022-01-14 深圳市尊绅投资有限公司 一种应用于tft、pecvd工艺的腔体真空传输阀门密封组件
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Also Published As

Publication number Publication date
EP0735574B1 (de) 2002-03-13
JPH1050791A (ja) 1998-02-20
EP1179835A2 (de) 2002-02-13
DE69619717D1 (de) 2002-04-18
DE69619717T2 (de) 2002-11-07
KR960035774A (ko) 1996-10-28
KR100371996B1 (ko) 2003-04-10
US5579718A (en) 1996-12-03

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