DE69619717T2 - Verbesserte Schlitzventiltür - Google Patents

Verbesserte Schlitzventiltür

Info

Publication number
DE69619717T2
DE69619717T2 DE69619717T DE69619717T DE69619717T2 DE 69619717 T2 DE69619717 T2 DE 69619717T2 DE 69619717 T DE69619717 T DE 69619717T DE 69619717 T DE69619717 T DE 69619717T DE 69619717 T2 DE69619717 T2 DE 69619717T2
Authority
DE
Germany
Prior art keywords
valve door
slit valve
improved slit
improved
door
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69619717T
Other languages
English (en)
Other versions
DE69619717D1 (de
Inventor
Frederik W Freerks
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of DE69619717D1 publication Critical patent/DE69619717D1/de
Publication of DE69619717T2 publication Critical patent/DE69619717T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/06—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials
    • H01L21/08—Preparation of the foundation plate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
    • F16K51/02—Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Gasket Seals (AREA)
  • Sliding Valves (AREA)
  • Details Of Valves (AREA)
  • Chemical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
DE69619717T 1995-03-31 1996-03-29 Verbesserte Schlitzventiltür Expired - Fee Related DE69619717T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/414,420 US5579718A (en) 1995-03-31 1995-03-31 Slit valve door

Publications (2)

Publication Number Publication Date
DE69619717D1 DE69619717D1 (de) 2002-04-18
DE69619717T2 true DE69619717T2 (de) 2002-11-07

Family

ID=23641384

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69619717T Expired - Fee Related DE69619717T2 (de) 1995-03-31 1996-03-29 Verbesserte Schlitzventiltür

Country Status (5)

Country Link
US (1) US5579718A (de)
EP (2) EP0735574B1 (de)
JP (1) JPH1050791A (de)
KR (1) KR100371996B1 (de)
DE (1) DE69619717T2 (de)

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KR960002534A (ko) * 1994-06-07 1996-01-26 이노우에 아키라 감압·상압 처리장치
US5746434A (en) * 1996-07-09 1998-05-05 Lam Research Corporation Chamber interfacing O-rings and method for implementing same
US6032419A (en) * 1997-04-08 2000-03-07 Tokyo Electron Limited Vacuum processing apparatus with low particle generating vacuum seal
US6089543A (en) * 1997-07-11 2000-07-18 Applied Materials, Inc. Two-piece slit valve door with molded-in-place seal for a vacuum processing system
US6056267A (en) * 1998-05-19 2000-05-02 Applied Materials, Inc. Isolation valve with extended seal life
US6192827B1 (en) * 1998-07-03 2001-02-27 Applied Materials, Inc. Double slit-valve doors for plasma processing
US6126527A (en) * 1998-07-10 2000-10-03 Aplex Inc. Seal for polishing belt center support having a single movable sealed cavity
US6217272B1 (en) 1998-10-01 2001-04-17 Applied Science And Technology, Inc. In-line sputter deposition system
US6328858B1 (en) 1998-10-01 2001-12-11 Nexx Systems Packaging, Llc Multi-layer sputter deposition apparatus
US6328316B1 (en) 1999-01-12 2001-12-11 Dupont Dow Elastomers, L.L.C. Rubber seal for semi-dynamic applications
US6291814B1 (en) * 1999-06-04 2001-09-18 Utek Semiconductor Corporation Slit valve with safety detect device
US6463203B1 (en) * 1999-07-29 2002-10-08 Avaya Technology Corp. High pressure sealed telecommunications equipment enclosure
US6682288B2 (en) 2000-07-27 2004-01-27 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
US6530733B2 (en) 2000-07-27 2003-03-11 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
US6821912B2 (en) 2000-07-27 2004-11-23 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
WO2003064900A1 (en) 2002-01-31 2003-08-07 Dupont Dow Elastomers L.L.C. Gate valve seal assembly
US6824343B2 (en) * 2002-02-22 2004-11-30 Applied Materials, Inc. Substrate support
US6883776B2 (en) * 2002-08-20 2005-04-26 Asm America, Inc. Slit valve for a semiconductor processing system
TW200407513A (en) * 2002-11-07 2004-05-16 Wei-Yueh Wu Gate valve assembly
US7100954B2 (en) 2003-07-11 2006-09-05 Nexx Systems, Inc. Ultra-thin wafer handling system
US7282097B2 (en) * 2004-06-14 2007-10-16 Applied Materials, Inc. Slit valve door seal
US7422653B2 (en) * 2004-07-13 2008-09-09 Applied Materials, Inc. Single-sided inflatable vertical slit valve
CN1323250C (zh) * 2005-06-15 2007-06-27 黄作兴 双向四氟密封蝶阀
TWI295816B (en) 2005-07-19 2008-04-11 Applied Materials Inc Hybrid pvd-cvd system
US7396001B2 (en) * 2005-12-20 2008-07-08 Vat Holding Ag Valve for essentially gastight closing a flow path
JP4821314B2 (ja) * 2005-12-26 2011-11-24 ダイキン工業株式会社 半導体製造装置用バルブの弁体およびその製造方法
WO2008046048A2 (en) * 2006-10-12 2008-04-17 Parker-Hannifin Corporation Slit valve door assembly
US20080191474A1 (en) * 2007-02-12 2008-08-14 Kotz George J Tri-Lobed O-Ring Seal
US7806383B2 (en) * 2007-06-01 2010-10-05 Applied Materials, Inc. Slit valve
US9383036B2 (en) * 2007-08-14 2016-07-05 Parker-Hannifin Corporation Bonded slit valve door seal with thin non-metallic film gap control bumper
WO2009055507A1 (en) * 2007-10-26 2009-04-30 Applied Materials, Inc. Methods and apparatus for sealing a slit valve door
US20090184279A1 (en) * 2008-01-23 2009-07-23 Buckhorn Rubber Products, Inc. Wedge and covered insert assembly
US8011381B2 (en) * 2008-10-02 2011-09-06 Applied Material, Inc. Balanced purge slit valve
US20100127201A1 (en) * 2008-11-21 2010-05-27 Applied Materials, Inc. Interlocking valve chamber and lid
DE102009004493B3 (de) * 2009-01-09 2010-06-10 Sovello Ag Vakuumbeschichtungsanlage und Verfahren zum Betrieb einer Vakuumbeschichtungsanlage
US9010718B2 (en) * 2009-08-10 2015-04-21 Dean Foote Seal assembly for a pressure plate in a blowout preventer
DE102010053411B4 (de) * 2009-12-15 2023-07-06 Vat Holding Ag Vakuumventil
CA2782366A1 (en) 2009-12-16 2011-07-14 Opko Curna, Llc Treatment of membrane bound transcription factor peptidase, site 1 (mbtps1) related diseases by inhibition of natural antisense transcript to mbtps1
JP4814384B2 (ja) * 2010-04-05 2011-11-16 株式会社日立ハイテクノロジーズ 弁体
US10023954B2 (en) 2011-09-15 2018-07-17 Applied Materials, Inc. Slit valve apparatus, systems, and methods
JP2013161887A (ja) * 2012-02-02 2013-08-19 Toyota Motor Corp 筐体
US20130269599A1 (en) * 2012-04-13 2013-10-17 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and Apparatus for Continuous Pressure Control Processing
ITMI20120694A1 (it) * 2012-04-26 2013-10-27 Mib Italiana Spa Valvola di controllo a petali con guarnizione di tenuta per unita' di collegamento separabili per tubi flessibili.
KR101383668B1 (ko) * 2012-04-27 2014-04-10 주식회사 테라세미콘 실링부재 및 이를 사용한 기판 처리 장치
EP2853351B1 (de) * 2013-09-27 2019-12-25 Aktiebolaget SKF Drehanordnung, Verfahren zum Ausbau eines Dichtelements und Ausbauwerkzeug zum Ausbauen eines Dichtelements
JP6160926B2 (ja) * 2014-06-05 2017-07-12 Smc株式会社 ゲートバルブ
KR101725250B1 (ko) * 2015-05-04 2017-04-11 프리시스 주식회사 진공밸브용 블레이드
US10072776B2 (en) 2015-08-20 2018-09-11 Deere & Company Fluid connector with annular groove and seal
US20170213705A1 (en) * 2016-01-27 2017-07-27 Applied Materials, Inc. Slit valve gate coating and methods for cleaning slit valve gates
JP6388182B1 (ja) * 2017-07-25 2018-09-12 Smc株式会社 ゲートバルブの取付構造
JP7456993B2 (ja) 2018-07-19 2024-03-27 アプライド マテリアルズ インコーポレイテッド シールを行うためのマルチノード複数回使用ｏリングおよび方法
JP7281968B2 (ja) * 2019-05-30 2023-05-26 東京エレクトロン株式会社 アリ溝加工方法及び基板処理装置
KR102277809B1 (ko) * 2019-07-15 2021-07-14 세메스 주식회사 기판 지지 유닛 및 이를 구비하는 기판 처리 시스템
KR102617386B1 (ko) * 2021-10-07 2023-12-27 (주)다산이엔지 진공 게이트 밸브
CN113932011A (zh) * 2021-11-23 2022-01-14 深圳市尊绅投资有限公司 一种应用于tft、pecvd工艺的腔体真空传输阀门密封组件
US11867307B1 (en) * 2022-07-28 2024-01-09 Applied Materials, Inc. Multi-piece slit valve gate

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Also Published As

Publication number Publication date
EP0735574B1 (de) 2002-03-13
EP1179835A2 (de) 2002-02-13
EP0735574A1 (de) 1996-10-02
KR960035774A (ko) 1996-10-28
US5579718A (en) 1996-12-03
JPH1050791A (ja) 1998-02-20
KR100371996B1 (ko) 2003-04-10
DE69619717D1 (de) 2002-04-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee