EP0536170B1 - Gold-elektrolyt-kombination zur stromlosen goldabscheidung - Google Patents
Gold-elektrolyt-kombination zur stromlosen goldabscheidung Download PDFInfo
- Publication number
- EP0536170B1 EP0536170B1 EP91910402A EP91910402A EP0536170B1 EP 0536170 B1 EP0536170 B1 EP 0536170B1 EP 91910402 A EP91910402 A EP 91910402A EP 91910402 A EP91910402 A EP 91910402A EP 0536170 B1 EP0536170 B1 EP 0536170B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- gold
- electrolyte
- bath electrolyte
- combination
- salts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010931 gold Substances 0.000 title claims abstract description 80
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 60
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 59
- 230000008021 deposition Effects 0.000 title claims abstract description 17
- 239000003792 electrolyte Substances 0.000 title claims description 35
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 12
- 238000005554 pickling Methods 0.000 claims abstract description 7
- 229910000990 Ni alloy Inorganic materials 0.000 claims abstract description 6
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 19
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 14
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 11
- 235000019270 ammonium chloride Nutrition 0.000 claims description 10
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 9
- LSNNMFCWUKXFEE-UHFFFAOYSA-L sulfite Chemical compound [O-]S([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-L 0.000 claims description 9
- -1 Co(II) ions Chemical class 0.000 claims description 7
- 239000007858 starting material Substances 0.000 claims description 7
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 claims description 6
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 5
- 230000002378 acidificating effect Effects 0.000 claims description 5
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 claims description 5
- 235000019256 formaldehyde Nutrition 0.000 claims description 5
- 235000010265 sodium sulphite Nutrition 0.000 claims description 5
- 239000003513 alkali Substances 0.000 claims description 4
- 239000008139 complexing agent Substances 0.000 claims description 4
- 150000003839 salts Chemical class 0.000 claims description 4
- 239000003381 stabilizer Substances 0.000 claims description 4
- PQUCIEFHOVEZAU-UHFFFAOYSA-N Diammonium sulfite Chemical compound [NH4+].[NH4+].[O-]S([O-])=O PQUCIEFHOVEZAU-UHFFFAOYSA-N 0.000 claims description 3
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical class [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 claims description 3
- 239000003638 chemical reducing agent Substances 0.000 claims description 3
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical class [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 claims description 3
- 150000003863 ammonium salts Chemical class 0.000 claims 1
- XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 claims 1
- 238000000151 deposition Methods 0.000 description 12
- 239000000243 solution Substances 0.000 description 12
- 239000001509 sodium citrate Substances 0.000 description 6
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 6
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 150000001450 anions Chemical class 0.000 description 5
- BWKOZPVPARTQIV-UHFFFAOYSA-N azanium;hydron;2-hydroxypropane-1,2,3-tricarboxylate Chemical compound [NH4+].OC(=O)CC(O)(C(O)=O)CC([O-])=O BWKOZPVPARTQIV-UHFFFAOYSA-N 0.000 description 5
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 3
- 229910021580 Cobalt(II) chloride Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 150000001447 alkali salts Chemical class 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- UFMZWBIQTDUYBN-UHFFFAOYSA-N cobalt dinitrate Chemical compound [Co+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O UFMZWBIQTDUYBN-UHFFFAOYSA-N 0.000 description 2
- 229910052593 corundum Inorganic materials 0.000 description 2
- 210000001061 forehead Anatomy 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- SDKPSXWGRWWLKR-UHFFFAOYSA-M sodium;9,10-dioxoanthracene-1-sulfonate Chemical compound [Na+].O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2S(=O)(=O)[O-] SDKPSXWGRWWLKR-UHFFFAOYSA-M 0.000 description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 description 2
- GSMCZRMXOTVCGF-UHFFFAOYSA-N 2-bromo-1-(5-methyl-1,2-oxazol-3-yl)ethanone Chemical compound CC1=CC(C(=O)CBr)=NO1 GSMCZRMXOTVCGF-UHFFFAOYSA-N 0.000 description 1
- 229910000789 Aluminium-silicon alloy Inorganic materials 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 241001533099 Callanthias legras Species 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000010531 catalytic reduction reaction Methods 0.000 description 1
- BGTFCAQCKWKTRL-YDEUACAXSA-N chembl1095986 Chemical compound C1[C@@H](N)[C@@H](O)[C@H](C)O[C@H]1O[C@@H]([C@H]1C(N[C@H](C2=CC(O)=CC(O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O)=C2C=2C(O)=CC=C(C=2)[C@@H](NC(=O)[C@@H]2NC(=O)[C@@H]3C=4C=C(C(=C(O)C=4)C)OC=4C(O)=CC=C(C=4)[C@@H](N)C(=O)N[C@@H](C(=O)N3)[C@H](O)C=3C=CC(O4)=CC=3)C(=O)N1)C(O)=O)=O)C(C=C1)=CC=C1OC1=C(O[C@@H]3[C@H]([C@H](O)[C@@H](O)[C@H](CO[C@@H]5[C@H]([C@@H](O)[C@H](O)[C@@H](C)O5)O)O3)O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O[C@@H]3[C@H]([C@H](O)[C@@H](CO)O3)O)C4=CC2=C1 BGTFCAQCKWKTRL-YDEUACAXSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 description 1
- QAHREYKOYSIQPH-UHFFFAOYSA-L cobalt(II) acetate Chemical compound [Co+2].CC([O-])=O.CC([O-])=O QAHREYKOYSIQPH-UHFFFAOYSA-L 0.000 description 1
- 229910000335 cobalt(II) sulfate Inorganic materials 0.000 description 1
- PFQLIVQUKOIJJD-UHFFFAOYSA-L cobalt(ii) formate Chemical compound [Co+2].[O-]C=O.[O-]C=O PFQLIVQUKOIJJD-UHFFFAOYSA-L 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- CUHVTYCUTYWQOR-UHFFFAOYSA-N formaldehyde Chemical compound O=C.O=C CUHVTYCUTYWQOR-UHFFFAOYSA-N 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- UJLXKYSGBFPPAD-UHFFFAOYSA-N gold;2-hydroxypropane-1,2,3-tricarboxylic acid Chemical compound [Au].OC(=O)CC(O)(C(O)=O)CC(O)=O UJLXKYSGBFPPAD-UHFFFAOYSA-N 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- BRWIZMBXBAOCCF-UHFFFAOYSA-N hydrazinecarbothioamide Chemical compound NNC(N)=S BRWIZMBXBAOCCF-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- XWGJFPHUCFXLBL-UHFFFAOYSA-M rongalite Chemical compound [Na+].OCS([O-])=O XWGJFPHUCFXLBL-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 235000001892 vitamin D2 Nutrition 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to a gold-electrolyte combination for electroless gold deposition and the use of this combination.
- Electroless gold baths for the production of gold layers is generally known (Goldie, gold as a surface, technical and decorative gold plating, Eugen G. Leuze Verlag, Saulgau, 1983, p. 91 ff.).
- Electroless gold baths containing the anion disulfitoaurate (I) are known from the publications DD-PS 150 762, DD-PS 240 915 or DD-PS 244 768.
- electroless gold baths containing potassium dicyanoaurate (I) are described in the documents DD-PS 273 651 or US Pat. No. 3,506,462. Gold plating difficulties arise when depositing on nickel surfaces. Either there is no deposition on nickel or nickel alloy surfaces (US Pat. No.
- Gold layers of 0.2 - 3.0 »m are required for chip or wire bonding.
- the electrolytes indicated for this with a high deposition rate are only stable to a limited extent (Rich, DW, Proc. Am. Electroplat. Soc. 1971, p. 58 and US Pat. No. 4,169,171).
- Alkaline soluble photoresists or varnishes are often used for selective coating tasks to cover surfaces that are not to be coated. It is therefore not possible to work in the alkaline range, in particular pH> 9 Gold electrolytes are used (Dettke, electroless coating, Eugen G. Leuze Verlag, 1988, pp. 74-78).
- DD-PS 263 307 also describes an electroless gold bath with a high deposition rate.
- the disadvantage of this bath is that a simultaneous cementation process takes place.
- the object of the present invention is therefore to achieve stable deposition of adhesive, bondable gold layers with layer thicknesses> 0.2 »m within short deposition times.
- the gold prebath electrolyte can contain disulfitoaurate (I) in the form of its ammonium or alkali salts.
- Suitable reducing agents for the gold prebath electrolyte are, for example, aldehyde and aldehyde-sulfite adducts.
- Formaldehyde (methanal) and the adduct formaldehyde / sodium sulfite are particularly suitable.
- a complexing agent for example ethylenediamine, can optionally be added to the prebath.
- dicyanoaurate (I) can also be used in the form of its ammonium or alkali salts become.
- Thiourea or its derivatives are added to the main bath as stabilizers; for example thiosemicarbazide.
- cobalt (II) salts are added to the electrolyte, for example cobalt (II) halides, cobalt (II) sulfate, cobalt (II) nitrate, cobalt (II) formate or Cobalt (II) acetate.
- a nickel salt for example a nickel halide, with particular advantage nickel (II) chloride, can be added to the main bath to increase the deposition rate.
- This pickling solution consists of a hydroxycarboxylic acid, for example tartaric acid or citric acid, or its salts and ammonium chloride.
- the invention further relates to the use of the gold-electrolyte combination for electroless gold deposition together with a decapitation solution and a starter solution.
- the decapitation solution is to be used if the nickel or nickel alloy surface present in the gold coating has a high level of cementation and there is an additional dissolution of the nickel layer by the acidic electrolyte solution.
- a gold prebath electrolyte that works in the neutral range up to a maximum of pH 8 and also contains an alkali or ammonium carboxylic acid and ammonium chloride ensures that gold layers are deposited firmly. An additional dissolution of the passive nickel layers (for example selective under the gold layers) does not occur.
- the dense layer deposited from the gold prebath electrolyte protects the nickel surface from the selective dissolution in the acidic gold main bath electrolyte.
- the acidic gold main bath electrolyte is additionally stabilized by the use of thiourea or its derivatives, whereby, with the stability remaining, an adapted concentration of nickel ions (nickel chloride) in the electrolyte accelerates the catalytic reduction reaction and thus achieves a deposition rate of 2 »m / h becomes.
- a starter solution in the case of gold plating of gold surfaces and / or gold-plated surfaces can accelerate the start reaction of the deposition of the gold layer deposited from the gold main bath electrolyte.
- the starter solution contains heavy metal ions, e.g. Ni2+ ions in an acidic environment, which are adsorbed on the gold surface and change the surface potential.
- the subject of the invention is particularly well suited for the deposition of gold layers on conductive ceramic chip carrier housings. These are metallized with chemical-reductive nickel-phosphor layers and gold (layer thickness: 2 - 3 »m) as an external contact layer system.
- the nickel-phosphorus layer was first treated with the following pickling solution for 30 seconds at room temperature: 10 g sodium citrate / liter 15 g ammonium chloride / liter.
- Gold prebath electrolyte 30 minutes treatment time, 60 ° C Gold as Na3 [Au (SO3) 2] 0.6 g / l Methanal 0.1 g / l Sodium citrate 10.0 g / l Na2SO3 5.0 g / l Ethylenediamine 0.84 g / l NH4Cl 15.0 g / l
- Gold main bath electrolyte 90 minutes treatment time, 82 - 84 ° C K [Au (CN) 2] 5.0 g / l Thiourea 24.8 g / l CoCl2. 6 H2O 20.0 g / l NiCl2. 6 H2O 10.0 g / l Ammonium dihydrogen citrate 20.0 g / l
- a miniature printed circuit board partially covered with alkali-soluble solid resist Riston 3615 should be selectively gold-plated on existing, chemically-reductively nickel-plated copper contact layer structures. Decapitation solution as in example 1.
- the gilding was then carried out using the following combination according to the invention: a) Gold prebath electrolyte: 15 minutes treatment time, 60 ° C, adjustment to pH 5.1 with citric acid Gold as (NH4) 3 [Au (SO3) 2] 1.0 g / l Methanal 0.15 g / l Sodium citrate 15.0 g / l Na2SO3 7.0 g / l Ethylenediamine 0.84 g / l NH4Cl 10.0 g / l b) Gold main bath electrolyte: 30 minutes treatment time, 82 - 84 ° C K [Au (CN) 2] 4.0 g / l Thiourea 20.0 g / l CoCl2.6
- the adhesive strength of the Ni x P y -Au layer system was 1300 N / cm2.
- Au wires (diameter 20 »m) bonded with the Thermosonic process showed tear strengths of 9.1 ⁇ 1.3 cN (pull test).
- the Au layers were reflow solderable (controlled with the PCB bending test).
- a stripline circuit on Al2O3 ceramic should be built up with the layer system Ni x P y -galvanic Cu - Ni x P y Au.
- the circuit structure including galvanic copper was first produced using lift-off technology. After the photoresist had been removed, the layer system Ni x P y -galvanic copper was coated with Ni x P y from an alkaline electrolyte and gold-plated with the combination according to the invention as follows: a) Gold prebath electrolyte: 30 minutes treatment time, 60 ° C analogous to Example 2, but with Gold as (NH4) 3 [Au (SO3) 2] 1.2 g / l Ammonium dihydrogen citrate 20.0 g / l (instead of sodium citrate) b) Starter solution for gold: 4 minutes treatment time, 82 - 84 ° C NiCl2.
- the adhesive strength of the layer system was 1800 +/- 100 N / cm2 (forehead pull test).
- Ni x P y structure was produced from an alkaline electrolyte on Al2O3 ceramic by laser metallization. This structure should be gold-plated for the production of wire bond islands.
- Gold prebath electrolyte 15 minutes treatment time, 60 ° C Gold as (NH4) 3 [Au (SO3) 2] 2.0 g / l Methanal 0.1 g / l Sodium citrate 10.0 g / l Na2SO3 5.0 g / l Ethylenediamine 0.84 g / l NH4Cl 15.0 g / l
- Gold main bath electrolyte 30 minutes treatment time, 82 - 84 ° C, adjustment to pH 5 with NH4OH, K [Au (CN) 2] 5.0 g / l Thiourea 24.8 g / l CoCl2.6 H2O 20.0 g / l NiCl2.6 H2O 10.0 g / l Ammonium dihydrogen citrate 20.0 g / l
- the IC chip was attached by gluing.
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4020795A DE4020795C1 (enrdf_load_stackoverflow) | 1990-06-28 | 1990-06-28 | |
| DE4020795 | 1990-06-28 | ||
| PCT/DE1991/000498 WO1992000398A1 (de) | 1990-06-28 | 1991-06-13 | Kombination wässriger bäder zur stromlosen goldabscheidung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP0536170A1 EP0536170A1 (de) | 1993-04-14 |
| EP0536170B1 true EP0536170B1 (de) | 1995-08-30 |
Family
ID=6409370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP91910402A Expired - Lifetime EP0536170B1 (de) | 1990-06-28 | 1991-06-13 | Gold-elektrolyt-kombination zur stromlosen goldabscheidung |
Country Status (9)
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4241657C1 (de) * | 1992-12-04 | 1994-07-14 | Atotech Deutschland Gmbh | Verfahren zur Erzeugung homogener Goldschichten aus stromlosen Goldbädern und Verwendung des Verfahrens |
| US5803957A (en) * | 1993-03-26 | 1998-09-08 | C. Uyemura & Co.,Ltd. | Electroless gold plating bath |
| JP3392873B2 (ja) * | 1994-12-27 | 2003-03-31 | イビデン株式会社 | 無電解めっき用前処理液、無電解めっき浴および無電解めっき方法 |
| DE19652991A1 (de) * | 1996-12-13 | 1998-06-18 | Albert Thorp Gmbh | Verfahren zur zumindest teilweisen Goldbeschichtung eines Trägers |
| DE19745602C1 (de) | 1997-10-08 | 1999-07-15 | Atotech Deutschland Gmbh | Verfahren und Lösung zur Herstellung von Goldschichten |
| DE19745601C2 (de) * | 1997-10-08 | 2001-07-12 | Fraunhofer Ges Forschung | Lösung und Verfahren zum stromlosen Abscheiden von Goldschichten sowie Verwendung der Lösung |
| KR101194201B1 (ko) * | 2004-07-15 | 2012-10-25 | 세키스이가가쿠 고교가부시키가이샤 | 도전성 미립자, 도전성 미립자의 제조 방법, 및 이방성도전 재료 |
| JP5116956B2 (ja) * | 2005-07-14 | 2013-01-09 | 関東化学株式会社 | 無電解硬質金めっき液 |
| DE102009041264A1 (de) | 2009-09-11 | 2011-03-24 | IPHT Jena Institut für Photonische Technologien e.V. | Verfahren zur Herstellung von optisch aktiven Nanostrukturen |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3506462A (en) * | 1966-10-29 | 1970-04-14 | Nippon Electric Co | Electroless gold plating solutions |
| DD150762B1 (de) * | 1980-04-17 | 1987-05-13 | Falk Richter | Cyanidfreies bad fuer die stromlose goldabscheidung |
| DD240915B1 (de) * | 1983-12-22 | 1988-05-25 | Falk Richter | Cyanidfreies bad zur stromlosen abscheidung von hartgoldschichten |
| CN1003524B (zh) * | 1985-10-14 | 1989-03-08 | 株式会社日立制作所 | 无电浸镀金溶液 |
| DD244768B1 (de) * | 1985-12-24 | 1990-08-08 | Liebknecht Mikroelektron | Verfahren zur erhaltung der loetfaehigkeit von nickelschichten |
| DD263307A1 (de) * | 1987-08-17 | 1988-12-28 | Mittweida Ing Hochschule | Chemisch-reduktives goldbad mit hoher abscheidungsrate |
| DD273651A1 (de) * | 1988-07-05 | 1989-11-22 | Robotron Elektronik | Bad zur chemischen vergoldung |
| US5130168A (en) * | 1988-11-22 | 1992-07-14 | Technic, Inc. | Electroless gold plating bath and method of using same |
| DE4021681A1 (de) * | 1989-07-12 | 1991-03-14 | Kojima Chemicals Co Ltd | Nichtelektrolytische goldplattierloesung |
| US4978559A (en) * | 1989-11-03 | 1990-12-18 | General Electric Company | Autocatalytic electroless gold plating composition |
-
1990
- 1990-06-28 DE DE4020795A patent/DE4020795C1/de not_active Expired - Lifetime
-
1991
- 1991-06-13 US US07/962,582 patent/US5320667A/en not_active Expired - Lifetime
- 1991-06-13 CA CA002086341A patent/CA2086341C/en not_active Expired - Lifetime
- 1991-06-13 WO PCT/DE1991/000498 patent/WO1992000398A1/de active IP Right Grant
- 1991-06-13 AT AT91910402T patent/ATE127166T1/de not_active IP Right Cessation
- 1991-06-13 DE DE59106385T patent/DE59106385D1/de not_active Expired - Fee Related
- 1991-06-13 KR KR1019920703362A patent/KR930701639A/ko not_active Ceased
- 1991-06-13 JP JP3509884A patent/JPH0649947B2/ja not_active Expired - Lifetime
- 1991-06-13 EP EP91910402A patent/EP0536170B1/de not_active Expired - Lifetime
- 1991-06-28 CN CN91105281A patent/CN1060504A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CA2086341C (en) | 1998-03-31 |
| DE4020795C1 (enrdf_load_stackoverflow) | 1991-10-17 |
| DE59106385D1 (de) | 1995-10-05 |
| JPH0649947B2 (ja) | 1994-06-29 |
| JPH05506887A (ja) | 1993-10-07 |
| US5320667A (en) | 1994-06-14 |
| ATE127166T1 (de) | 1995-09-15 |
| EP0536170A1 (de) | 1993-04-14 |
| WO1992000398A1 (de) | 1992-01-09 |
| CA2086341A1 (en) | 1991-12-29 |
| KR930701639A (ko) | 1993-06-12 |
| CN1060504A (zh) | 1992-04-22 |
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