DK1516076T3 - Fremgangsmåde til elektroplettering af metalliske og metalmatrixkompositfolier, overtræk og mikrokomponenter - Google Patents

Fremgangsmåde til elektroplettering af metalliske og metalmatrixkompositfolier, overtræk og mikrokomponenter

Info

Publication number
DK1516076T3
DK1516076T3 DK02754753T DK02754753T DK1516076T3 DK 1516076 T3 DK1516076 T3 DK 1516076T3 DK 02754753 T DK02754753 T DK 02754753T DK 02754753 T DK02754753 T DK 02754753T DK 1516076 T3 DK1516076 T3 DK 1516076T3
Authority
DK
Denmark
Prior art keywords
metal matrix
coatings
microcomponents
matrix composite
composite sheets
Prior art date
Application number
DK02754753T
Other languages
Danish (da)
English (en)
Inventor
Gino Palumbo
Iain Brooks
Jonathan Mccrea
Glenn D Hibbard
Francisco Gonzalez
Klaus Tomantschger
Uwe Erb
Original Assignee
Integran Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Integran Technologies Inc filed Critical Integran Technologies Inc
Application granted granted Critical
Publication of DK1516076T3 publication Critical patent/DK1516076T3/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C25D5/06—Brush or pad plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20—Electroplating using ultrasonics, vibrations
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/67—Electroplating to repair workpiece
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/04—Tubes; Rings; Hollow bodies

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Manufacture Of Switches (AREA)
DK02754753T 2002-06-25 2002-06-25 Fremgangsmåde til elektroplettering af metalliske og metalmatrixkompositfolier, overtræk og mikrokomponenter DK1516076T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2002/007023 WO2004001100A1 (en) 2002-06-25 2002-06-25 Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents

Publications (1)

Publication Number Publication Date
DK1516076T3 true DK1516076T3 (da) 2008-06-23

Family

ID=29762587

Family Applications (1)

Application Number Title Priority Date Filing Date
DK02754753T DK1516076T3 (da) 2002-06-25 2002-06-25 Fremgangsmåde til elektroplettering af metalliske og metalmatrixkompositfolier, overtræk og mikrokomponenter

Country Status (16)

Country Link
EP (2) EP1826294A1 (ja)
JP (1) JP2005530926A (ja)
KR (1) KR100890819B1 (ja)
AT (1) ATE387522T1 (ja)
AU (1) AU2002321112B2 (ja)
BR (1) BR0215787B1 (ja)
CA (1) CA2490464C (ja)
DE (1) DE60225352T2 (ja)
DK (1) DK1516076T3 (ja)
ES (1) ES2301666T3 (ja)
HK (1) HK1075278A1 (ja)
IL (1) IL165904A0 (ja)
MX (1) MXPA04011940A (ja)
PT (1) PT1516076E (ja)
WO (1) WO2004001100A1 (ja)
ZA (1) ZA200410368B (ja)

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US7387578B2 (en) 2004-12-17 2008-06-17 Integran Technologies Inc. Strong, lightweight article containing a fine-grained metallic layer
US7320832B2 (en) 2004-12-17 2008-01-22 Integran Technologies Inc. Fine-grained metallic coatings having the coefficient of thermal expansion matched to the one of the substrate
US7354354B2 (en) 2004-12-17 2008-04-08 Integran Technologies Inc. Article comprising a fine-grained metallic material and a polymeric material
US7425255B2 (en) * 2005-06-07 2008-09-16 Massachusetts Institute Of Technology Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition
CA2619509C (en) 2005-08-12 2015-01-06 Modumetal, Llc. Compositionally modulated composite materials and methods for making the same
US20070170068A1 (en) * 2006-01-24 2007-07-26 Usc, Llc Electrocomposite coatings for hard chrome replacement
US8202627B2 (en) * 2006-01-24 2012-06-19 Usc, Llc Electrocomposite coatings for hard chrome replacement
US7897265B2 (en) 2006-01-26 2011-03-01 Hamilton Sundstrand Corporation Low cost, environmentally favorable, chromium plate replacement coating for improved wear performance
JP4724581B2 (ja) * 2006-03-28 2011-07-13 新日本製鐵株式会社 磁気特性に優れた表面処理金属材およびその製造方法
US7521128B2 (en) * 2006-05-18 2009-04-21 Xtalic Corporation Methods for the implementation of nanocrystalline and amorphous metals and alloys as coatings
US20070275262A1 (en) * 2006-05-23 2007-11-29 Dechao Lin Reducing formation of tin whiskers on a tin plating layer
US9005420B2 (en) * 2007-12-20 2015-04-14 Integran Technologies Inc. Variable property electrodepositing of metallic structures
US7955721B2 (en) * 2008-01-16 2011-06-07 Hamilton Sundstrand Corporation Article having cobalt-phosphorous coating and method for heat treating
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US8247050B2 (en) 2009-06-02 2012-08-21 Integran Technologies, Inc. Metal-coated polymer article of high durability and vacuum and/or pressure integrity
US8309233B2 (en) * 2009-06-02 2012-11-13 Integran Technologies, Inc. Electrodeposited metallic-materials comprising cobalt on ferrous-alloy substrates
BRPI1010877B1 (pt) 2009-06-08 2020-09-15 Modumetal, Inc Revestimento de multicamadas resistente à corrosão e método de eletrodeposição
DE102009043594B4 (de) 2009-09-25 2013-05-16 Siemens Aktiengesellschaft Verfahren zum elektrochemischen Beschichten und Einbau von Partikeln in die Schicht
DE102009060937A1 (de) 2009-12-22 2011-06-30 Siemens Aktiengesellschaft, 80333 Verfahren zum elektrochemischen Beschichten
CN102947473B (zh) * 2010-03-12 2016-07-20 克斯塔里克公司 具有涂层的物件及涂布方法
US9694562B2 (en) 2010-03-12 2017-07-04 Xtalic Corporation Coated articles and methods
CN105386103B (zh) 2010-07-22 2018-07-31 莫杜美拓有限公司 纳米层压黄铜合金的材料及其电化学沉积方法
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ES2637799T3 (es) 2011-11-15 2017-10-17 Ashwin-Ushas Corporation, Inc. Dispositivo electrocrómico con polímeros complementarios
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US20130186765A1 (en) * 2012-01-23 2013-07-25 Seagate Technology Llc Electrodeposition methods
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DE102012211941B4 (de) * 2012-07-09 2021-04-22 Hilti Aktiengesellschaft Werkzeugmaschine und Herstellungsverfahren
KR101370966B1 (ko) * 2012-10-17 2014-03-07 단국대학교 천안캠퍼스 산학협력단 선택적 전자기파 흡수 및 차폐 기능을 동시에 가지는 복합 금속박판 제조장치 및 제조방법
JP6296491B2 (ja) * 2013-03-14 2018-03-20 セイコーインスツル株式会社 金属構造体、金属構造体の製造方法、ばね部品、時計用発停レバーおよび時計
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US9207515B2 (en) 2013-03-15 2015-12-08 Ashwin-Ushas Corporation, Inc. Variable-emittance electrochromic devices and methods of preparing the same
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Also Published As

Publication number Publication date
KR20050024394A (ko) 2005-03-10
EP1826294A1 (en) 2007-08-29
ATE387522T1 (de) 2008-03-15
EP1516076B1 (en) 2008-02-27
PT1516076E (pt) 2008-03-11
BR0215787A (pt) 2005-03-01
HK1075278A1 (en) 2005-12-09
DE60225352D1 (de) 2008-04-10
JP2005530926A (ja) 2005-10-13
AU2002321112A1 (en) 2004-01-06
KR100890819B1 (ko) 2009-04-06
MXPA04011940A (es) 2005-03-31
WO2004001100A1 (en) 2003-12-31
CA2490464A1 (en) 2003-12-31
ZA200410368B (en) 2006-07-26
EP1516076A1 (en) 2005-03-23
DE60225352T2 (de) 2008-06-12
BR0215787B1 (pt) 2013-12-03
AU2002321112B2 (en) 2008-07-03
ES2301666T3 (es) 2008-07-01
CA2490464C (en) 2008-09-02
IL165904A0 (en) 2006-01-15

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