DK0935628T3 - Copolymer af styren og maleinsyreanhydrid, der omfatter en epoxyharpikssammensætning og et co-tværbindingsmiddel - Google Patents

Copolymer af styren og maleinsyreanhydrid, der omfatter en epoxyharpikssammensætning og et co-tværbindingsmiddel

Info

Publication number
DK0935628T3
DK0935628T3 DK97910373T DK97910373T DK0935628T3 DK 0935628 T3 DK0935628 T3 DK 0935628T3 DK 97910373 T DK97910373 T DK 97910373T DK 97910373 T DK97910373 T DK 97910373T DK 0935628 T3 DK0935628 T3 DK 0935628T3
Authority
DK
Denmark
Prior art keywords
epoxy resin
maleic anhydride
copolymer
styrene
resin composition
Prior art date
Application number
DK97910373T
Other languages
Danish (da)
English (en)
Inventor
Franz Tikart
Karl-Heinz Leis
Karl Walter Kopp
Original Assignee
Isola Laminate Systems Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=8224531&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DK0935628(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Isola Laminate Systems Corp filed Critical Isola Laminate Systems Corp
Application granted granted Critical
Publication of DK0935628T3 publication Critical patent/DK0935628T3/da

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L35/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L35/06Copolymers with vinyl aromatic monomers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/14Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62Alcohols or phenols
    • C08G59/621Phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02Homopolymers or copolymers of hydrocarbons
    • C08L25/04Homopolymers or copolymers of styrene
    • C08L25/08Copolymers of styrene
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445Five-membered rings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/249921Web or sheet containing structurally defined element or component
    • Y10T428/249924Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994Fiber embedded in or on the surface of a polymeric matrix
    • Y10T428/24995Two or more layers
    • Y10T428/249951Including a free metal or alloy constituent
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether
    • Y10T428/31515As intermediate layer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether
    • Y10T428/31515As intermediate layer
    • Y10T428/31522Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DK97910373T 1996-10-29 1997-09-24 Copolymer af styren og maleinsyreanhydrid, der omfatter en epoxyharpikssammensætning og et co-tværbindingsmiddel DK0935628T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP96203016 1996-10-29
PCT/EP1997/005308 WO1998018845A1 (fr) 1996-10-29 1997-09-24 Copolymere de styrene et d'anhydride maleique comprenant une composition de resine epoxyde et un agent de co-reticulation

Publications (1)

Publication Number Publication Date
DK0935628T3 true DK0935628T3 (da) 2002-03-04

Family

ID=8224531

Family Applications (1)

Application Number Title Priority Date Filing Date
DK97910373T DK0935628T3 (da) 1996-10-29 1997-09-24 Copolymer af styren og maleinsyreanhydrid, der omfatter en epoxyharpikssammensætning og et co-tværbindingsmiddel

Country Status (11)

Country Link
US (5) US6509414B2 (fr)
EP (1) EP0935628B1 (fr)
JP (1) JP3593347B2 (fr)
KR (1) KR100473241B1 (fr)
AT (1) ATE210161T1 (fr)
CA (1) CA2270208C (fr)
DE (1) DE69708908T2 (fr)
DK (1) DK0935628T3 (fr)
ES (1) ES2168615T3 (fr)
TW (1) TW455613B (fr)
WO (1) WO1998018845A1 (fr)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2168615T3 (es) * 1996-10-29 2002-06-16 Isola Laminate Systems Corp Copolimero de estireno y de anhidrido maleico que comprende una composicion de resina epoxidica y un agente de co-reticulacion.
US8313836B2 (en) * 1996-10-29 2012-11-20 Isola Usa Corp. Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross-linking agent
GB9817799D0 (en) * 1998-08-14 1998-10-14 Dow Deutschland Inc Viscosity modifier for thermosetting resin compositioning
WO2001059002A1 (fr) * 2000-02-14 2001-08-16 Resolution Research Nederland B.V. Compositions de resine epoxy ininflammable contenant du phosphore sans halogene
KR100792099B1 (ko) * 2001-01-30 2008-01-04 히다치 가세고교 가부시끼가이샤 열경화성 수지 조성물 및 그의 용도
WO2003048251A1 (fr) * 2001-12-05 2003-06-12 Isola Laminate Systems Corp. Preimpregne et composition de resine(s) epoxyde(s), copolymere(s) styrene anhydride maleique (sma) et resine(s) bismaleimides triazines
EP1418206B1 (fr) * 2002-10-19 2004-10-13 LEUNA-Harze GmbH Composition de resine Epoxy reticulable
US20040101689A1 (en) 2002-11-26 2004-05-27 Ludovic Valette Hardener composition for epoxy resins
AU2003293148A1 (en) * 2002-12-23 2004-07-29 Dow Global Technologies Inc. Method of smc molding
CN101522752B (zh) * 2006-09-29 2012-01-25 日立化成工业株式会社 热固性树脂组合物及用其形成的预浸料及层叠板
WO2009034966A1 (fr) * 2007-09-11 2009-03-19 Kaneka Corporation Composition de résine liquide et produit durci utilisant la composition de résine liquide
US8217099B2 (en) * 2008-05-22 2012-07-10 Iteq (Dongguan) Corporation Thermosetting resin composition
US8104148B2 (en) * 2008-05-22 2012-01-31 Iteq (Dongguan) Corporation Kind of prepolymer and its product-thermosetting resins composite
CN101368077B (zh) * 2008-10-09 2011-11-30 腾辉电子(苏州)有限公司 一种环氧树脂胶液
CN101481490B (zh) * 2009-01-19 2014-01-15 东莞联茂电子科技有限公司 一种热固性树脂组合物及应用
TWI400267B (zh) * 2009-03-06 2013-07-01 Nanya Plastics Corp Modified maleic anhydride and epoxy resin
KR20120040153A (ko) * 2009-06-22 2012-04-26 다우 글로벌 테크놀로지스 엘엘씨 에폭시 수지용 경화제 조성물
US8114508B2 (en) * 2009-10-20 2012-02-14 Nan Ya Plastics Corporation Composition of modified maleic anhydride and epdxy resin
TWI471350B (zh) 2010-05-12 2015-02-01 Taiwan Union Technology Corp 無鹵素的阻燃性環氧樹脂組成物及由其製成的預浸材和印刷電路板
KR101014430B1 (ko) * 2010-06-18 2011-02-16 주식회사 에스피씨 내열도가 높고 열팽창 계수가 안정적인 홀플러깅용 고분자와 이를 포함하는 수지 조성물 및 그 홀플러깅 방법
US20110315435A1 (en) * 2010-06-28 2011-12-29 Ming Jen Tzou Acid anhydride curable thermosetting resin composition
US20130123391A1 (en) * 2010-08-25 2013-05-16 Dow Global Technologies Llc Copolymers
CN102453225A (zh) * 2010-10-15 2012-05-16 合正科技股份有限公司 热固型树脂组成物及其在预浸胶片或积层板中的应用
US8633293B2 (en) * 2010-11-30 2014-01-21 GM Global Technology Operations LLC Self-repairing polymer
KR20140007448A (ko) 2011-02-24 2014-01-17 아이솔라 유에스에이 코프 초박 라미네이트
TWI449722B (zh) 2011-04-12 2014-08-21 Taiwan Union Technology Corp 樹脂組合物及其應用
CN102746616B (zh) * 2011-04-19 2014-10-01 台燿科技股份有限公司 一种树脂组合物及其应用
WO2014067082A1 (fr) 2012-10-31 2014-05-08 广东生益科技股份有限公司 Composition de résine thermodurcissable et ses utilisations
CN103881299B (zh) 2012-12-20 2016-08-31 中山台光电子材料有限公司 无卤素树脂组合物及其应用
WO2015102350A1 (fr) * 2013-12-30 2015-07-09 코오롱인더스트리 주식회사 Composition de résine époxy durcissable et produit durci correspondant
JP6298691B2 (ja) * 2014-04-09 2018-03-20 東京応化工業株式会社 相分離構造を含む構造体の製造方法及びトップコート膜の成膜方法
CN105784988B (zh) * 2016-03-01 2018-07-13 华南师范大学 一种基于聚合物发光点的免疫探针及其制备方法与应用
CA3032191C (fr) 2016-07-25 2023-08-29 Isola Usa Corp. Formation de resine d'anhydride maleique styrene (sma) amelioree
CN109563004B (zh) 2016-07-27 2022-04-05 康宁股份有限公司 陶瓷和聚合物复合物、其制造方法及其用途
WO2018031103A1 (fr) 2016-08-11 2018-02-15 Icl-Ip America Inc. Composition d'époxy pouvant durcir
NL2032660B1 (en) * 2016-10-31 2023-02-24 Cabot Corp Polymers for inkjet ink compositions
TWI674288B (zh) 2017-03-27 2019-10-11 南亞塑膠工業股份有限公司 一種耐燃改質型苯乙烯馬來酸酐樹脂硬化劑製法與環氧樹脂之組合物及在銅箔基板與膠片應用

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE389105C (de) 1922-07-15 1924-02-02 Alexander Hess Schmuckwarengro Taschenfeuerzeug mit lose eingelegten Ersatz-Cereisensteinen
US2707177A (en) 1952-11-29 1955-04-26 Gen Electric Ethoxyline-triallyl cyanurate resinous compositions
GB994484A (en) 1960-10-10 1965-06-10 Carborundum Co Coated abrasive products
US3306954A (en) * 1964-01-21 1967-02-28 Dow Chemical Co Thermosettable liquid resin system
US3632689A (en) * 1966-12-13 1972-01-04 Monsanto Co Arylene phosphinites
JPS5240073B2 (fr) 1972-10-09 1977-10-08
US3766109A (en) * 1973-01-26 1973-10-16 Atlantic Richfield Co Epoxy powders containing sma copolymers
IT1002973B (it) * 1973-02-21 1976-05-20 Sumitomo Bakelite Co Laminati placcati di metallo fles sibili e metodo per produrli
JPS5236152B2 (fr) 1973-02-21 1977-09-13
CA1035889A (fr) * 1973-10-13 1978-08-01 Tsutomu Watanabe Colle souple et mode d'emploi
JPS535920B2 (fr) * 1974-06-03 1978-03-02
US3997499A (en) * 1974-08-29 1976-12-14 Gulf Oil Corporation Resin-forming homogeneous solutions of styrene, maleic anhydride and copolymers thereof
US4167539A (en) * 1975-06-26 1979-09-11 Gulf Oil Corporation Styrene-grafted polyanhydride copolymer
US4042550A (en) 1975-11-28 1977-08-16 Allied Chemical Corporation Encapsulant compositions based on anhydride-hardened epoxy resins
JPS56159012A (en) 1980-05-09 1981-12-08 Mitsubishi Electric Corp Method of manufacturing prepreg insulator
JPS5864259A (ja) * 1981-10-09 1983-04-16 電気化学工業株式会社 熱硬化性樹脂組成物
JPS5894461A (ja) * 1981-12-01 1983-06-04 松下電工株式会社 白色エポキシ樹脂積層板
US4456712A (en) * 1982-06-14 1984-06-26 International Business Machines Corporation Bismaleimide triazine composition
CA1276358C (fr) 1984-01-31 1990-11-13 Dieter H. Klein Resine epoxy pour la preparation de stratifies electriques
JPS612725A (ja) 1984-06-15 1986-01-08 Mitsubishi Electric Corp 熱硬化性樹脂組成物
US4581158A (en) * 1984-09-26 1986-04-08 W. R. Grace & Co. Conductive thermosetting compositions and process for using same
US4604317A (en) 1984-10-05 1986-08-05 The Dow Chemical Company Curable compositions containing a polyepoxide and a halogenated bisphenol
US4596843A (en) * 1985-03-20 1986-06-24 Insilco Corporation High solids coating compositions
EP0204158A3 (fr) * 1985-05-07 1988-08-24 W.R. Grace & Co. Dispersion réactive de plastisol
US4756954A (en) * 1986-01-22 1988-07-12 The Dow Chemical Company Epoxy resin laminating varnish and laminates prepared therefrom
JPH01230643A (ja) * 1987-11-19 1989-09-14 Dainippon Ink & Chem Inc エポキシ樹脂組成物及びこれを用いたプリプレグと積層板の製造法
DE3839105A1 (de) 1987-11-19 1989-06-01 Dainippon Ink & Chemicals Epoxyharzmasse
DE3915823A1 (de) * 1989-05-16 1990-11-22 Ruetgerswerke Ag Verfahren zur herstellung von verbundwerkstoffen
US5210157A (en) 1989-08-15 1993-05-11 Akzo N.V. Interpenetrating network of ring-containing allyl polymers and epoxy resin, and a laminate prepared therefrom
ATE97923T1 (de) 1989-09-15 1993-12-15 Akzo Nv Chemisch verankertes interpenetrierendes netzwerk.
JPH0649822B2 (ja) * 1990-06-05 1994-06-29 出光石油化学株式会社 ポリカーボネート樹脂組成物
KR970705590A (ko) 1994-09-08 1997-10-09 샬크비즈크 피이터 코르넬리스; 페트 귄터 에틸렌성 불포화 무수물과 비닐 화합물의 공중합체로 구성된 알릴-함유 에폭시 수지 조성물(allyl-containing epoxy resin composition comprising a copolymer of an ethylenically unsaturated anhydride and a vinyl compound)
US5928767A (en) * 1995-06-07 1999-07-27 Dexter Corporation Conductive film composite
ES2168615T3 (es) * 1996-10-29 2002-06-16 Isola Laminate Systems Corp Copolimero de estireno y de anhidrido maleico que comprende una composicion de resina epoxidica y un agente de co-reticulacion.

Also Published As

Publication number Publication date
TW455613B (en) 2001-09-21
JP3593347B2 (ja) 2004-11-24
JP2001502745A (ja) 2001-02-27
US8022140B2 (en) 2011-09-20
US20070275250A1 (en) 2007-11-29
US20030153683A1 (en) 2003-08-14
US20050095435A1 (en) 2005-05-05
US6509414B2 (en) 2003-01-21
EP0935628A1 (fr) 1999-08-18
DE69708908T2 (de) 2002-07-18
KR20000036164A (ko) 2000-06-26
ATE210161T1 (de) 2001-12-15
CA2270208C (fr) 2004-09-14
EP0935628B1 (fr) 2001-12-05
KR100473241B1 (ko) 2005-03-07
ES2168615T3 (es) 2002-06-16
WO1998018845A1 (fr) 1998-05-07
US20080255306A1 (en) 2008-10-16
US20020082350A1 (en) 2002-06-27
CA2270208A1 (fr) 1998-05-07
US7897258B2 (en) 2011-03-01
DE69708908D1 (de) 2002-01-17

Similar Documents

Publication Publication Date Title
DK0935628T3 (da) Copolymer af styren og maleinsyreanhydrid, der omfatter en epoxyharpikssammensætning og et co-tværbindingsmiddel
AU2002224832A1 (en) Positive type photosensitive epoxy resin composition and printed circuit board using the same
DE69622606D1 (de) Gedruckte Schaltungsplatte
DE69016681D1 (de) Elektronische Schaltungsvorrichtung.
DE68908687D1 (de) Gedruckte Schaltungsplatte.
DE69737317D1 (de) Mehrschichtige gedruckte Leiterplatte
DE60032696D1 (de) Dielektrische Zusammensetzung
DE69019030D1 (de) Gedruckte Leiterplatte.
AU2001260142A1 (en) High molecular weight epoxy resin and resinous composition for printed circuit board
DE69631236D1 (de) Gedruckte Schaltungsplatten
AU2824900A (en) Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed circuit board
ID20388A (id) Sirkuit perbaikan lapangan suara
DE69700216D1 (de) Leiterplatte mit verbesserten Positionierungsmitteln
AU3470897A (en) Circuit board test
DE68906160D1 (de) Gedruckte schaltungsplatte.
AU7726591A (en) The bonding of polyimide films, and printed circuit boards
EP1142953A4 (fr) Composition de cyanate et de resine epoxy, et preimpregne, plaque stratifiee en papier metallique et carte de circuit imprime utilisant cette composition
DE69420798D1 (de) Fernsprechverteilerleiste
KR970048507U (ko) 고밀도 인쇄회로 기판
AU2001264035A1 (en) Flexible, insulating and heat-stable composite materials
ES1029623Y (es) Tablero de juego perfeccionado.
KR950005185U (ko) 회로기판
KR970003713U (ko) 테스트포인트 지정용 홀을 갖춘 인쇄회로기판
KR970064617U (ko) 인쇄회로기판 고정구조물
KR940025660U (ko) 오디오 기기용 뮤트회로