DE69933225D1 - Leiterplattensubstrat mit hoher dichte und herstellungsmethode - Google Patents
Leiterplattensubstrat mit hoher dichte und herstellungsmethodeInfo
- Publication number
- DE69933225D1 DE69933225D1 DE69933225T DE69933225T DE69933225D1 DE 69933225 D1 DE69933225 D1 DE 69933225D1 DE 69933225 T DE69933225 T DE 69933225T DE 69933225 T DE69933225 T DE 69933225T DE 69933225 D1 DE69933225 D1 DE 69933225D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- high density
- pcb substrate
- dielectric layer
- density pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5383—Multilayer substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0296—Fibers with a special cross-section, e.g. elliptical
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Battery Electrode And Active Subsutance (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US123952 | 1998-07-28 | ||
US09/123,952 US6242078B1 (en) | 1998-07-28 | 1998-07-28 | High density printed circuit substrate and method of fabrication |
PCT/US1999/016803 WO2000007219A2 (en) | 1998-07-28 | 1999-07-22 | High density printed circuit substrate and method of fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69933225D1 true DE69933225D1 (de) | 2006-10-26 |
DE69933225T2 DE69933225T2 (de) | 2007-09-20 |
Family
ID=22411883
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69933225T Expired - Lifetime DE69933225T2 (de) | 1998-07-28 | 1999-07-22 | Leiterplattensubstrat mit hoher dichte und herstellungsmethode |
Country Status (11)
Country | Link |
---|---|
US (1) | US6242078B1 (de) |
EP (1) | EP1103168B1 (de) |
JP (1) | JP2002521835A (de) |
KR (1) | KR20010053614A (de) |
CN (1) | CN1314072A (de) |
AT (1) | ATE339873T1 (de) |
AU (1) | AU5127499A (de) |
DE (1) | DE69933225T2 (de) |
ES (1) | ES2274632T3 (de) |
TW (1) | TW507494B (de) |
WO (1) | WO2000007219A2 (de) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6141870A (en) * | 1997-08-04 | 2000-11-07 | Peter K. Trzyna | Method for making electrical device |
SG82591A1 (en) * | 1998-12-17 | 2001-08-21 | Eriston Technologies Pte Ltd | Bumpless flip chip assembly with solder via |
US6613413B1 (en) * | 1999-04-26 | 2003-09-02 | International Business Machines Corporation | Porous power and ground planes for reduced PCB delamination and better reliability |
SE523150C2 (sv) * | 2000-01-14 | 2004-03-30 | Ericsson Telefon Ab L M | Kretsmönsterkort och metod för tillverkning av kretsmönsterkort med tunt kopparskikt |
DE10018025A1 (de) * | 2000-04-04 | 2001-10-18 | Atotech Deutschland Gmbh | Verfahren zum Erzeugen von lötfähigen Oberflächen und funktionellen Oberflächen auf Schaltungsträgern |
KR100509058B1 (ko) * | 2000-04-11 | 2005-08-18 | 엘지전자 주식회사 | 인쇄회로기판의 제조방법 |
JP4023076B2 (ja) * | 2000-07-27 | 2007-12-19 | 富士通株式会社 | 表裏導通基板及びその製造方法 |
JP2002111185A (ja) * | 2000-10-03 | 2002-04-12 | Sony Chem Corp | バンプ付き配線回路基板及びその製造方法 |
DE10109786A1 (de) * | 2001-02-28 | 2002-12-12 | Fractal Ag | Verfahren zur Herstellung von Leiterplatten |
TW560102B (en) * | 2001-09-12 | 2003-11-01 | Itn Energy Systems Inc | Thin-film electrochemical devices on fibrous or ribbon-like substrates and methd for their manufacture and design |
US7258819B2 (en) | 2001-10-11 | 2007-08-21 | Littelfuse, Inc. | Voltage variable substrate material |
DE10392524B4 (de) * | 2002-04-08 | 2008-08-07 | OTC Littelfuse, Inc., Des Plaines | Vorrichtungen mit spannungsvariablem Material zur direkten Anwendung |
US7132922B2 (en) * | 2002-04-08 | 2006-11-07 | Littelfuse, Inc. | Direct application voltage variable material, components thereof and devices employing same |
US7183891B2 (en) * | 2002-04-08 | 2007-02-27 | Littelfuse, Inc. | Direct application voltage variable material, devices employing same and methods of manufacturing such devices |
US6596384B1 (en) * | 2002-04-09 | 2003-07-22 | International Business Machines Corporation | Selectively roughening conductors for high frequency printed wiring boards |
US7438969B2 (en) * | 2002-07-10 | 2008-10-21 | Ngk Spark Plug Co., Ltd. | Filling material, multilayer wiring board, and process of producing multilayer wiring board |
US7060364B2 (en) * | 2002-12-26 | 2006-06-13 | Mitsui Mining & Smelting Co., Ltd. | Film carrier tape for mounting electronic devices thereon |
US6960831B2 (en) * | 2003-09-25 | 2005-11-01 | International Business Machines Corporation | Semiconductor device having a composite layer in addition to a barrier layer between copper wiring and aluminum bond pad |
JP2005202382A (ja) * | 2003-12-18 | 2005-07-28 | Sumitomo Bakelite Co Ltd | 光プリント回路基板、面実装型半導体パッケージ、及びマザーボード |
US20060152334A1 (en) * | 2005-01-10 | 2006-07-13 | Nathaniel Maercklein | Electrostatic discharge protection for embedded components |
JP4520392B2 (ja) * | 2005-05-12 | 2010-08-04 | 株式会社丸和製作所 | プリント基板の製造方法 |
WO2008112068A1 (en) * | 2007-02-20 | 2008-09-18 | Dynamic Details, Inc. | Multilayer printed wiring boards with copper filled through-holes |
US20080318413A1 (en) * | 2007-06-21 | 2008-12-25 | General Electric Company | Method for making an interconnect structure and interconnect component recovery process |
EP2129199A1 (de) * | 2008-05-28 | 2009-12-02 | LG Electronics Inc. | Verfahren zur Herstellung von flexibler Folie |
DE102009028194B3 (de) * | 2009-08-03 | 2011-03-24 | Robert Bosch Gmbh | Sensorelement mit Durchkontaktierloch |
TWI405317B (zh) * | 2010-03-04 | 2013-08-11 | Unimicron Technology Corp | 封裝基板及其製法 |
US8693203B2 (en) | 2011-01-14 | 2014-04-08 | Harris Corporation | Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices |
JP6099453B2 (ja) * | 2012-11-28 | 2017-03-22 | Dowaメタルテック株式会社 | 電子部品搭載基板およびその製造方法 |
TWI462672B (zh) * | 2013-02-08 | 2014-11-21 | Ichia Tech Inc | 前驅基板、軟性印刷電路板及其製造方法 |
WO2016007718A1 (en) * | 2014-07-10 | 2016-01-14 | Isola Usa Corp. | Thin resin films and their use in layups |
WO2016100405A1 (en) * | 2014-12-16 | 2016-06-23 | Amphenol Corporation | High-speed interconnects for printed circuit boards |
KR20210143727A (ko) * | 2019-03-27 | 2021-11-29 | 미쓰이금속광업주식회사 | 프린트 배선판용 금속박, 캐리어를 구비하는 금속박 및 금속 클래드 적층판, 그리고 그것들을 사용한 프린트 배선판의 제조 방법 |
CN112020232B (zh) * | 2020-08-27 | 2021-12-28 | 湖南维胜科技电路板有限公司 | 一种pcb印制电路板的uv烘烤炉 |
JP2022187865A (ja) * | 2021-06-08 | 2022-12-20 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE332214B (de) * | 1968-07-12 | 1971-02-01 | Gylling & Co | |
US4288282A (en) * | 1979-09-28 | 1981-09-08 | Hewlett-Packard Company | Method for producing a metallic pattern upon a substrate |
US5217796A (en) * | 1985-02-19 | 1993-06-08 | Nitto Boseki Co., Ltd. | Woven material of inorganic fiber and process for making the same |
US4707565A (en) * | 1985-03-19 | 1987-11-17 | Nitto Boseki Co., Ltd. | Substrate for printed circuit |
CA1298451C (en) | 1985-08-02 | 1992-04-07 | Hiromi Shigemoto | Surface-roughened film and sheet, and process for production and use thereof |
US4863808A (en) | 1985-09-13 | 1989-09-05 | Gould Inc. | Copper-chromium-polyimide composite |
EP0227857B1 (de) | 1985-12-30 | 1990-03-28 | Ibm Deutschland Gmbh | Verfahren zum Herstellen von gedruckten Schaltungen |
JPS6417874A (en) | 1987-07-10 | 1989-01-20 | Ibm | Metallizing method |
US4869930A (en) | 1987-07-10 | 1989-09-26 | International Business Machines Corporation | Method for preparing substrates for deposition of metal seed from an organometallic vapor for subsequent electroless metallization |
JPH0744320B2 (ja) * | 1989-10-20 | 1995-05-15 | 松下電器産業株式会社 | 樹脂回路基板及びその製造方法 |
JP2993065B2 (ja) * | 1990-07-27 | 1999-12-20 | 三菱瓦斯化学株式会社 | 表面平滑金属箔張積層板 |
JP3014421B2 (ja) | 1990-08-22 | 2000-02-28 | 三井化学株式会社 | 多層プリント基板の外装板粗面化用マットフィルム |
EP0520236A2 (de) | 1991-06-25 | 1992-12-30 | E.I. Du Pont De Nemours And Company | Polyimide auf Basis von 9-Aryl-9-(perfluoroalkyl)-xanthen-2,3,6,7-dianhydrid oder 9,9'-bis-(perfluoroalkyl)-xanthen-2,3,6,7-dianhydrid und Benzidinderivaten |
US5288541A (en) | 1991-10-17 | 1994-02-22 | International Business Machines Corporation | Method for metallizing through holes in thin film substrates, and resulting devices |
DE4236334A1 (de) * | 1992-10-28 | 1994-05-05 | Bosch Gmbh Robert | Monolithisch integriertes MOS-Endstufenbauteil mit einer Überlast-Schutzeinrichtung |
US5622769A (en) | 1993-02-12 | 1997-04-22 | Kabushiki Kaisha Toshiba | Ceramic circuit board having a thermal conductivity substrate |
US5622789A (en) | 1994-09-12 | 1997-04-22 | Apple Computer, Inc. | Battery cell having an internal circuit for controlling its operation |
JP3862770B2 (ja) * | 1995-09-07 | 2006-12-27 | 日立化成工業株式会社 | 金属張積層板の製造方法 |
JP3155920B2 (ja) * | 1996-01-16 | 2001-04-16 | 三井金属鉱業株式会社 | プリント配線板用電解銅箔及びその製造方法 |
US6544584B1 (en) * | 1997-03-07 | 2003-04-08 | International Business Machines Corporation | Process for removal of undesirable conductive material on a circuitized substrate and resultant circuitized substrate |
-
1998
- 1998-07-28 US US09/123,952 patent/US6242078B1/en not_active Expired - Lifetime
-
1999
- 1999-07-22 JP JP2000562933A patent/JP2002521835A/ja active Pending
- 1999-07-22 ES ES99935896T patent/ES2274632T3/es not_active Expired - Lifetime
- 1999-07-22 CN CN99810010A patent/CN1314072A/zh active Pending
- 1999-07-22 AU AU51274/99A patent/AU5127499A/en not_active Abandoned
- 1999-07-22 DE DE69933225T patent/DE69933225T2/de not_active Expired - Lifetime
- 1999-07-22 KR KR1020017001221A patent/KR20010053614A/ko not_active Application Discontinuation
- 1999-07-22 WO PCT/US1999/016803 patent/WO2000007219A2/en active IP Right Grant
- 1999-07-22 AT AT99935896T patent/ATE339873T1/de not_active IP Right Cessation
- 1999-07-22 EP EP99935896A patent/EP1103168B1/de not_active Expired - Lifetime
- 1999-10-01 TW TW088112792A patent/TW507494B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2002521835A (ja) | 2002-07-16 |
US6242078B1 (en) | 2001-06-05 |
ES2274632T3 (es) | 2007-05-16 |
WO2000007219A2 (en) | 2000-02-10 |
KR20010053614A (ko) | 2001-06-25 |
CN1314072A (zh) | 2001-09-19 |
DE69933225T2 (de) | 2007-09-20 |
EP1103168B1 (de) | 2006-09-13 |
ATE339873T1 (de) | 2006-10-15 |
TW507494B (en) | 2002-10-21 |
WO2000007219A3 (en) | 2000-05-11 |
EP1103168A2 (de) | 2001-05-30 |
AU5127499A (en) | 2000-02-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69933225D1 (de) | Leiterplattensubstrat mit hoher dichte und herstellungsmethode | |
MY125599A (en) | Printed circuit boards and method of producing the same | |
FI20020190A0 (fi) | Menetelmõ komponentin upottamiseksi alustaan ja kontaktin muodostamiseksi | |
MY117854A (en) | Printed circuit board with embedded decoupling capacitance and method for producing same | |
ES2089467T3 (es) | Estructura de blindaje electromagnetico y metodo para su fabricacion. | |
MY120077A (en) | Multilayer printed wiring board having a roughened inner conductor layer and production method thereof | |
TW243584B (en) | Apparatus having inner layers supporting surface-mount components and a method of manufacturing the same | |
ATE207227T1 (de) | Chipkarte, verfahren zur herstellung einer chipkarte und halbleiterchip zur verwendung in einer chipkarte | |
PT1459332E (pt) | Processo para produção de uma camada de resistência condutora eléctrica, bem como dispositivo de aquecimento e/ou arrefecimento | |
TW200603703A (en) | Circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same | |
DE3682150D1 (de) | Anisotrop elektrisch leitfaehiger gegenstand. | |
ATE350885T1 (de) | Methode zur herstellung von multifunktionellen mikrowellen-modulen aus fluoropolymer kompositsubstraten | |
MXPA04002482A (es) | Etiqueta de seguridad y procedimiento para fabricar la misma. | |
MY117104A (en) | Design of high density structures with laser etch stop | |
KR101352819B1 (ko) | 프린트 기판의 제조 방법 및 이것을 이용한 프린트 기판 | |
IL128055A (en) | Method for making printed circuits and resulting printed circuit | |
HUP0002959A2 (hu) | Transzponder, valamint eljárás transzponder és transzpondertekercs előállítására | |
MY120367A (en) | Composite material used in making printed wiring boards. | |
ATE369030T1 (de) | Verfahren zur durchführung von elektronischen bauteilen in durchgangslöchern eines mehrschichtigen multichip-moduls | |
MY140777A (en) | Method of manufacturing copper foil with insulating layer | |
SE0000097D0 (sv) | Kretsmönsterkort och metod för tillverkning av kretsmönsterkort med tunt kopparskikt | |
KR920005460B1 (ko) | 미세한 선폭의 회로패턴 형성방법 | |
TW350077B (en) | Chip-shaped electronic parts and the manufacturing method | |
KR950001266B1 (ko) | 알루미늄 회로기판의 제조방법 및 그 회로기판 | |
TW200517031A (en) | Co-dielectric structure of circuit board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |