TW200517031A - Co-dielectric structure of circuit board - Google Patents
Co-dielectric structure of circuit boardInfo
- Publication number
- TW200517031A TW200517031A TW092131043A TW92131043A TW200517031A TW 200517031 A TW200517031 A TW 200517031A TW 092131043 A TW092131043 A TW 092131043A TW 92131043 A TW92131043 A TW 92131043A TW 200517031 A TW200517031 A TW 200517031A
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- dielectric
- dielectric layer
- layers
- dielectric structure
- Prior art date
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Abstract
A co-dielectric structure of a circuit board is rovided. The co-dielectric structure is used in a build-up process, which includes a first dielectric layer and a second dielectric layer. The first dielectric layer is formed with a fabric impregnation material having high strength for supporting dielectric layers and circuit layers formed thereon. The second dielectric layer is formed with non-fiber impregnation material having uniform roughness on surfaces thereof for providing circuit layers mounted thereon. By the arrangement, it provides an ability to form a fine pitch circuit board with cooperation of different dielectric layers.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW92131043A TWI227103B (en) | 2003-11-06 | 2003-11-06 | Co-dielectric structure of circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW92131043A TWI227103B (en) | 2003-11-06 | 2003-11-06 | Co-dielectric structure of circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI227103B TWI227103B (en) | 2005-01-21 |
TW200517031A true TW200517031A (en) | 2005-05-16 |
Family
ID=35654751
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW92131043A TWI227103B (en) | 2003-11-06 | 2003-11-06 | Co-dielectric structure of circuit board |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI227103B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI392430B (en) * | 2010-10-20 | 2013-04-01 | Unimicron Technology Corp | Method for fabricating wiring bord |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI753468B (en) * | 2020-06-24 | 2022-01-21 | 欣興電子股份有限公司 | Substrate structure with heat dissipation structure and manufacturing method thereof |
-
2003
- 2003-11-06 TW TW92131043A patent/TWI227103B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI392430B (en) * | 2010-10-20 | 2013-04-01 | Unimicron Technology Corp | Method for fabricating wiring bord |
Also Published As
Publication number | Publication date |
---|---|
TWI227103B (en) | 2005-01-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |