TW200517031A - Co-dielectric structure of circuit board - Google Patents

Co-dielectric structure of circuit board

Info

Publication number
TW200517031A
TW200517031A TW092131043A TW92131043A TW200517031A TW 200517031 A TW200517031 A TW 200517031A TW 092131043 A TW092131043 A TW 092131043A TW 92131043 A TW92131043 A TW 92131043A TW 200517031 A TW200517031 A TW 200517031A
Authority
TW
Taiwan
Prior art keywords
circuit board
dielectric
dielectric layer
layers
dielectric structure
Prior art date
Application number
TW092131043A
Other languages
Chinese (zh)
Other versions
TWI227103B (en
Inventor
Shih-Ping Hsu
Ruei-Chih Chang
Original Assignee
Phoenix Prec Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Prec Technology Corp filed Critical Phoenix Prec Technology Corp
Priority to TW92131043A priority Critical patent/TWI227103B/en
Application granted granted Critical
Publication of TWI227103B publication Critical patent/TWI227103B/en
Publication of TW200517031A publication Critical patent/TW200517031A/en

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)

Abstract

A co-dielectric structure of a circuit board is rovided. The co-dielectric structure is used in a build-up process, which includes a first dielectric layer and a second dielectric layer. The first dielectric layer is formed with a fabric impregnation material having high strength for supporting dielectric layers and circuit layers formed thereon. The second dielectric layer is formed with non-fiber impregnation material having uniform roughness on surfaces thereof for providing circuit layers mounted thereon. By the arrangement, it provides an ability to form a fine pitch circuit board with cooperation of different dielectric layers.
TW92131043A 2003-11-06 2003-11-06 Co-dielectric structure of circuit board TWI227103B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92131043A TWI227103B (en) 2003-11-06 2003-11-06 Co-dielectric structure of circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92131043A TWI227103B (en) 2003-11-06 2003-11-06 Co-dielectric structure of circuit board

Publications (2)

Publication Number Publication Date
TWI227103B TWI227103B (en) 2005-01-21
TW200517031A true TW200517031A (en) 2005-05-16

Family

ID=35654751

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92131043A TWI227103B (en) 2003-11-06 2003-11-06 Co-dielectric structure of circuit board

Country Status (1)

Country Link
TW (1) TWI227103B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI392430B (en) * 2010-10-20 2013-04-01 Unimicron Technology Corp Method for fabricating wiring bord

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI753468B (en) * 2020-06-24 2022-01-21 欣興電子股份有限公司 Substrate structure with heat dissipation structure and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI392430B (en) * 2010-10-20 2013-04-01 Unimicron Technology Corp Method for fabricating wiring bord

Also Published As

Publication number Publication date
TWI227103B (en) 2005-01-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees