SE0000097D0 - Kretsmönsterkort och metod för tillverkning av kretsmönsterkort med tunt kopparskikt - Google Patents

Kretsmönsterkort och metod för tillverkning av kretsmönsterkort med tunt kopparskikt

Info

Publication number
SE0000097D0
SE0000097D0 SE0000097A SE0000097A SE0000097D0 SE 0000097 D0 SE0000097 D0 SE 0000097D0 SE 0000097 A SE0000097 A SE 0000097A SE 0000097 A SE0000097 A SE 0000097A SE 0000097 D0 SE0000097 D0 SE 0000097D0
Authority
SE
Sweden
Prior art keywords
layer
copper layer
carrier
circuit board
copper
Prior art date
Application number
SE0000097A
Other languages
English (en)
Other versions
SE523150C2 (sv
SE0000097L (sv
Inventor
Leif Bergstedt
Per Ligander
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE0000097A priority Critical patent/SE523150C2/sv
Publication of SE0000097D0 publication Critical patent/SE0000097D0/sv
Priority to US09/753,653 priority patent/US6395378B2/en
Publication of SE0000097L publication Critical patent/SE0000097L/sv
Publication of SE523150C2 publication Critical patent/SE523150C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
SE0000097A 2000-01-14 2000-01-14 Kretsmönsterkort och metod för tillverkning av kretsmönsterkort med tunt kopparskikt SE523150C2 (sv)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SE0000097A SE523150C2 (sv) 2000-01-14 2000-01-14 Kretsmönsterkort och metod för tillverkning av kretsmönsterkort med tunt kopparskikt
US09/753,653 US6395378B2 (en) 2000-01-14 2001-01-04 PCB and method for making PCB with thin copper layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0000097A SE523150C2 (sv) 2000-01-14 2000-01-14 Kretsmönsterkort och metod för tillverkning av kretsmönsterkort med tunt kopparskikt

Publications (3)

Publication Number Publication Date
SE0000097D0 true SE0000097D0 (sv) 2000-01-14
SE0000097L SE0000097L (sv) 2001-07-15
SE523150C2 SE523150C2 (sv) 2004-03-30

Family

ID=20278101

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0000097A SE523150C2 (sv) 2000-01-14 2000-01-14 Kretsmönsterkort och metod för tillverkning av kretsmönsterkort med tunt kopparskikt

Country Status (2)

Country Link
US (1) US6395378B2 (sv)
SE (1) SE523150C2 (sv)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6828513B2 (en) * 2002-04-30 2004-12-07 Texas Instruments Incorporated Electrical connector pad assembly for printed circuit board
JP2003332752A (ja) * 2002-05-14 2003-11-21 Shinko Electric Ind Co Ltd メタルコア基板およびその製造方法
US6801880B2 (en) * 2002-07-02 2004-10-05 Dell Products L.P. System and method for minimizing a loading effect of a via by tuning a cutout ratio
JP4291279B2 (ja) * 2005-01-26 2009-07-08 パナソニック株式会社 可撓性多層回路基板
KR101321700B1 (ko) * 2005-12-06 2013-10-25 아이솔라 유에스에이 코프 고속 및 고주파 인쇄 회로 기판용 라미네이트
US10051746B2 (en) * 2014-12-16 2018-08-14 Amphenol Corporation High-speed interconnects for printed circuit boards
CN114178710A (zh) * 2020-08-24 2022-03-15 奥特斯(中国)有限公司 部件承载件及其制造方法
CN114641126B (zh) * 2021-02-09 2024-03-08 广州方邦电子股份有限公司 电磁屏蔽膜及线路板

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3902951A (en) 1969-12-28 1975-09-02 Matsushita Electric Works Ltd Copper-clad laminate and production thereof
US4581301A (en) 1984-04-10 1986-04-08 Michaelson Henry W Additive adhesive based process for the manufacture of printed circuit boards
US4751146A (en) * 1985-07-09 1988-06-14 Showa Denko Kabushiki Kaisha Printed circuit boards
US4735676A (en) 1986-01-14 1988-04-05 Asahi Chemical Research Laboratory Co., Ltd. Method for forming electric circuits on a base board
IT1191680B (it) 1986-03-19 1988-03-23 Gte Telecom Spa Processo per la realizzazione di fori metallizzati in un substrato dotato di cammini conduttivi e resistivi,e prodotto ottenuto con il processo suddetto
US5073456A (en) * 1989-12-05 1991-12-17 E. I. Du Pont De Nemours And Company Multilayer printed circuit board formation
GB2243838A (en) 1990-05-09 1991-11-13 Learonal Process for metallising a through-hole printed circuit board by electroplating
JP2819523B2 (ja) 1992-10-09 1998-10-30 インターナショナル・ビジネス・マシーンズ・コーポレイション 印刷配線板及びその製造方法
US5442789A (en) 1994-03-31 1995-08-15 International Business Machines Corporation System and method for efficiently loading and removing selected functions on digital signal processors without interrupting execution of other functions on the digital signal processors
JPH09507969A (ja) 1994-11-09 1997-08-12 ブラウプンクト−ヴェルケ ゲゼルシャフト ミット ベシュレンクテル ハフツング 導体板上の貫通接続部の製法
TW350194B (en) * 1994-11-30 1999-01-11 Mitsubishi Gas Chemical Co Metal-foil-clad composite ceramic board and process for the production thereof the invention relates to the metal-foil-clad composite ceramic board and process for the production
US6197425B1 (en) * 1995-05-09 2001-03-06 Taiyo Ink Manufacturing Co., Ltd. Curable resin composition, multilayer printed circuit board manufactured by using the composition, and method for the production thereof
TW389780B (en) * 1995-09-13 2000-05-11 Hitachi Chemical Co Ltd Prepreg for printed circuit board
TW383435B (en) 1996-11-01 2000-03-01 Hitachi Chemical Co Ltd Electronic device
JP3785749B2 (ja) * 1997-04-17 2006-06-14 味の素株式会社 エポキシ樹脂組成物並びに該組成物を用いた多層プリント配線板の製造法
SE512578C2 (sv) * 1997-08-29 2000-04-03 Ericsson Telefon Ab L M Förfarande jämte anordning för att framställa ett luftgap över åtminstone en ledare på ett kretskort
WO1999057949A1 (en) 1998-05-01 1999-11-11 Alliedsignal Inc. Intermediate layer to improve peel strength of copper foils
US6242078B1 (en) * 1998-07-28 2001-06-05 Isola Laminate Systems Corp. High density printed circuit substrate and method of fabrication

Also Published As

Publication number Publication date
US6395378B2 (en) 2002-05-28
SE523150C2 (sv) 2004-03-30
US20010008680A1 (en) 2001-07-19
SE0000097L (sv) 2001-07-15

Similar Documents

Publication Publication Date Title
EP1194021A3 (en) Method of producing multilayer printed wiring board and multilayer printed wiring board
FI20030493A (sv) Förfarande för tillverkning av en elektronikmodul och en elektronikmodul
WO2002032198A3 (en) Microelectronic magnetic structure, device including the structure, and methods of forming the structure and device
TW200623282A (en) Method of manufacturing an electronic circuit assembly
FI20020190A0 (sv) F÷rfarande f÷r insõttning av en komponent i ett basmaterial och f÷rbildning av en kontakt
EP1261021A3 (en) Method of production of circuit board, semiconductor device, and plating system
TW200624001A (en) Printed wiring board and manufacturing method therefor
TW200731898A (en) Circuit board structure and method for fabricating the same
MXPA06000842A (es) Tarjeta de circuito impreso con componentes empotrados y metodo de fabricacion.
WO2003028418A1 (fr) Systeme de carte a circuits imprimes a couche mince et son procede de realisation
TW200642554A (en) Multilayer circuit board with embedded components and method of manufacture
TW200518647A (en) Printed wiring board and method of manufacturing same
TW200605373A (en) Printed wiring board, production process thereof and semiconductor device
EP1209959A3 (en) Multilayer circuit board and method of manufacturing the same
TWI267173B (en) Circuit device and method for manufacturing thereof
SE0000097L (sv) Kretsmönsterkort och metod för tillverkning av kretsmönsterkort med tunt kopparskikt
TW200420203A (en) Multilayer board and its manufacturing method
MY122999A (en) Copper foil for use in laser beam drilling
TW200518928A (en) Laminates having a low dielectric, low dissipation factor bond core and method of making same
TW200640314A (en) Manufacturing method of double-access flexible circuit board
EP1261243A3 (en) Method of manufacturing printed wiring board
TW200611620A (en) A manufacturing method of a multi-layer circuit board with embedded passive components
TW200518654A (en) Manufacturing method of PCB, and PCB obtained thereby
WO2002054839A3 (en) Layered circuit boards and methods of production thereof
DE69936045D1 (de) Verfahren zur herstellung eines widerstands