DE69838442D1 - Herstellungsverfahren einer Halbleitervorrichtung mit einem Paar Strahlungsabschlüssen und einer Vielfalt von Aussenverbindungen die aus einem einzelnen Leiterrahmen geformt sind - Google Patents

Herstellungsverfahren einer Halbleitervorrichtung mit einem Paar Strahlungsabschlüssen und einer Vielfalt von Aussenverbindungen die aus einem einzelnen Leiterrahmen geformt sind

Info

Publication number
DE69838442D1
DE69838442D1 DE69838442T DE69838442T DE69838442D1 DE 69838442 D1 DE69838442 D1 DE 69838442D1 DE 69838442 T DE69838442 T DE 69838442T DE 69838442 T DE69838442 T DE 69838442T DE 69838442 D1 DE69838442 D1 DE 69838442D1
Authority
DE
Germany
Prior art keywords
terminations
radiation
variety
pair
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69838442T
Other languages
English (en)
Other versions
DE69838442T2 (de
Inventor
Seiji Ichikawa
Takeshi Umemoto
Toshiaki Nishibe
Kazunari Sato
Kunihiko Tsubota
Masato Suga
Yoshikazu Nishimura
Keita Okahira
Tatsuya Miya
Toru Kitakoga
Kazuhiro Tahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
Original Assignee
NEC Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Electronics Corp filed Critical NEC Electronics Corp
Publication of DE69838442D1 publication Critical patent/DE69838442D1/de
Application granted granted Critical
Publication of DE69838442T2 publication Critical patent/DE69838442T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DE69838442T 1997-05-21 1998-05-20 Verfahren zur Herstellung einer Halbleitervorrichtung mit einem Paar Strahlungsanschlüssen und einer Vielfalt von Außenverbindungen, die aus einem einzelnen Leiterrahmen geformt sind Expired - Lifetime DE69838442T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9130986A JP2959521B2 (ja) 1997-05-21 1997-05-21 半導体装置の製造方法、リードフレーム
JP13098697 1997-05-21

Publications (2)

Publication Number Publication Date
DE69838442D1 true DE69838442D1 (de) 2007-10-31
DE69838442T2 DE69838442T2 (de) 2008-06-19

Family

ID=15047253

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69838442T Expired - Lifetime DE69838442T2 (de) 1997-05-21 1998-05-20 Verfahren zur Herstellung einer Halbleitervorrichtung mit einem Paar Strahlungsanschlüssen und einer Vielfalt von Außenverbindungen, die aus einem einzelnen Leiterrahmen geformt sind

Country Status (7)

Country Link
US (2) US6165818A (de)
EP (1) EP0880178B1 (de)
JP (1) JP2959521B2 (de)
KR (1) KR100286906B1 (de)
CN (1) CN1110092C (de)
DE (1) DE69838442T2 (de)
TW (1) TW369711B (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6544817B2 (en) * 2000-06-23 2003-04-08 Carsem Semiconductor Sdn. Bhd. Method for sawing a moulded leadframe package
US6787388B1 (en) * 2000-09-07 2004-09-07 Stmicroelectronics, Inc. Surface mount package with integral electro-static charge dissipating ring using lead frame as ESD device
KR20010087803A (ko) * 2001-06-07 2001-09-26 김덕중 방열효과를 개선하는 반도체 에스. 오(ｓｏ) 패키지
DE102004014207A1 (de) * 2004-03-23 2005-10-13 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil mit mehrteiligem Gehäusekörper
JP2006196598A (ja) * 2005-01-12 2006-07-27 Sharp Corp ソリッドステートリレー、電子機器及びソリッドステートリレーの製造方法
US7397060B2 (en) * 2005-11-14 2008-07-08 Macronix International Co., Ltd. Pipe shaped phase change memory
DE102006035876A1 (de) * 2006-08-01 2008-02-07 Infineon Technologies Ag Chip-Modul, Verfahren zur Herstellung eines Chip-Moduls und Mehrfachchip-Modul
CN102074541B (zh) * 2010-11-26 2014-09-03 天水华天科技股份有限公司 一种无载体无引脚栅格阵列ic芯片封装件及其生产方法
DE102014218702A1 (de) * 2014-09-17 2016-03-17 Continental Teves Ag & Co. Ohg Sensor mit Wärmeableitflächen am Leadframe
WO2018109820A1 (ja) * 2016-12-13 2018-06-21 新電元工業株式会社 電子モジュール
CN107993942B (zh) * 2017-11-24 2019-12-24 中山复盛机电有限公司 引线框架的制造工艺
CN110828413B (zh) * 2018-08-07 2022-03-18 株洲中车时代半导体有限公司 一种引线框架及利用引线框架制作转模功率模块的方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3413713A (en) * 1965-06-18 1968-12-03 Motorola Inc Plastic encapsulated transistor and method of making same
DE2315711B2 (de) * 1973-03-29 1980-07-17 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum Kontaktieren einer integrierten Schaltungsanordnung
JPS61125058A (ja) * 1984-11-22 1986-06-12 Hitachi Ltd 半導体装置
JPS62198144A (ja) * 1986-02-25 1987-09-01 Nec Corp リ−ドフレ−ムの構造
JPS62206868A (ja) * 1986-03-07 1987-09-11 Hitachi Ltd 電子装置
JPS63207161A (ja) * 1987-02-24 1988-08-26 Toshiba Corp 樹脂封止型半導体装置の製造方法
JPH01262649A (ja) * 1988-04-14 1989-10-19 Toshiba Corp 半導体装置
JPH0217856A (ja) * 1988-07-06 1990-01-22 Alps Electric Co Ltd ステツピングモータ
JP2519806B2 (ja) * 1989-09-12 1996-07-31 株式会社東芝 樹脂封止型半導体装置
JPH04225268A (ja) * 1990-12-26 1992-08-14 Toshiba Corp 半導体装置
US5231375A (en) * 1991-06-07 1993-07-27 Rolm Company Apparatus and method for detecting theft of electronic equipment
GB9214600D0 (en) * 1992-07-09 1992-08-19 Newcom Services Ltd Alarm circuit
JPH06120396A (ja) * 1992-10-05 1994-04-28 Hitachi Ltd 半導体装置
US5406260A (en) * 1992-12-18 1995-04-11 Chrimar Systems, Inc. Network security system for detecting removal of electronic equipment
KR960000706B1 (ko) * 1993-07-12 1996-01-11 한국전기통신공사 전력소자용 플라스틱 패키지 구조 및 그 제조방법
KR0126781Y1 (ko) * 1994-08-23 1999-05-01 이형도 반도체소자 방열장치
DE69603354T2 (de) * 1995-02-24 2000-01-20 Compusafe International Ltd., Windsor Überwachungsvorrichtung
DE69625340T2 (de) * 1995-03-17 2003-10-16 Tp Control Ab, Stockholm Alarmsystem für rechnereinrichtung in einem netzwerk
US5675321A (en) * 1995-11-29 1997-10-07 Mcbride; Randall C. Personal computer security system
JP3108856B2 (ja) * 1995-12-28 2000-11-13 ローム株式会社 樹脂パッケージ型半導体装置およびこれを実装した電子回路基板

Also Published As

Publication number Publication date
EP0880178B1 (de) 2007-09-19
JPH10321783A (ja) 1998-12-04
EP0880178A3 (de) 1999-02-03
JP2959521B2 (ja) 1999-10-06
KR19980087121A (ko) 1998-12-05
KR100286906B1 (ko) 2001-06-01
CN1200569A (zh) 1998-12-02
TW369711B (en) 1999-09-11
DE69838442T2 (de) 2008-06-19
US6177720B1 (en) 2001-01-23
US6165818A (en) 2000-12-26
CN1110092C (zh) 2003-05-28
EP0880178A2 (de) 1998-11-25

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