DE69828904D1 - Plasmabehandlungsgerät mit rotierenden magneten - Google Patents
Plasmabehandlungsgerät mit rotierenden magnetenInfo
- Publication number
- DE69828904D1 DE69828904D1 DE69828904T DE69828904T DE69828904D1 DE 69828904 D1 DE69828904 D1 DE 69828904D1 DE 69828904 T DE69828904 T DE 69828904T DE 69828904 T DE69828904 T DE 69828904T DE 69828904 D1 DE69828904 D1 DE 69828904D1
- Authority
- DE
- Germany
- Prior art keywords
- treatment device
- plasma treatment
- rotating magnets
- magnets
- rotating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32055—Arc discharge
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9704260A SE511139C2 (sv) | 1997-11-20 | 1997-11-20 | Plasmabearbetningsapparat med vridbara magneter |
SE9704260 | 1997-11-20 | ||
EP98954885A EP1033068B2 (de) | 1997-11-20 | 1998-11-03 | Plasmabehandlungsgerät mit rotierenden magneten |
PCT/SE1998/001983 WO1999027758A1 (en) | 1997-11-20 | 1998-11-03 | Plasma processing apparatus having rotating magnets |
Publications (3)
Publication Number | Publication Date |
---|---|
DE69828904D1 true DE69828904D1 (de) | 2005-03-10 |
DE69828904T2 DE69828904T2 (de) | 2006-01-12 |
DE69828904T3 DE69828904T3 (de) | 2012-02-09 |
Family
ID=20409052
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69828904T Expired - Lifetime DE69828904T3 (de) | 1997-11-20 | 1998-11-03 | Plasmabehandlungsgerät mit rotierenden magneten |
Country Status (8)
Country | Link |
---|---|
US (1) | US6351075B1 (de) |
EP (1) | EP1033068B2 (de) |
JP (1) | JP4491132B2 (de) |
AU (1) | AU1182099A (de) |
CZ (1) | CZ298474B6 (de) |
DE (1) | DE69828904T3 (de) |
SE (1) | SE511139C2 (de) |
WO (1) | WO1999027758A1 (de) |
Families Citing this family (56)
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---|---|---|---|---|
US7067034B2 (en) * | 2000-03-27 | 2006-06-27 | Lam Research Corporation | Method and apparatus for plasma forming inner magnetic bucket to control a volume of a plasma |
CZ296094B6 (cs) * | 2000-12-18 | 2006-01-11 | Shm, S. R. O. | Zarízení pro odparování materiálu k povlakování predmetu |
SE525231C2 (sv) * | 2001-06-14 | 2005-01-11 | Chemfilt R & D Ab | Förfarande och anordning för att alstra plasma |
US6777885B2 (en) | 2001-10-12 | 2004-08-17 | Semiconductor Energy Laboratory Co., Ltd. | Drive circuit, display device using the drive circuit and electronic apparatus using the display device |
US6811657B2 (en) * | 2003-01-27 | 2004-11-02 | Micron Technology, Inc. | Device for measuring the profile of a metal film sputter deposition target, and system and method employing same |
US6864773B2 (en) * | 2003-04-04 | 2005-03-08 | Applied Materials, Inc. | Variable field magnet apparatus |
JP3508110B1 (ja) * | 2003-04-25 | 2004-03-22 | 卓三 岩田 | イオン化可能物質の活性化装置 |
JP2006024775A (ja) * | 2004-07-08 | 2006-01-26 | Tokyo Electron Ltd | プラズマ処理装置、該装置の制御方法及び該方法を実行するプログラム |
WO2006006637A1 (ja) | 2004-07-09 | 2006-01-19 | National Institute For Materials Science | 磁束配置(バランス型/アンバランス型)を切換可能としたマグネトロンスパッタリング装置とこの装置を用いた無機質薄膜体材料の成膜方法、及びデユアル形式のマグネトロンスパッタリング装置とこの装置による低温成膜を可能とした無機質薄膜体材料の成膜方法 |
DE102005019101A1 (de) * | 2005-04-25 | 2006-10-26 | Steag Hama Tech Ag | Verfahren und Vorrichtung zum Beschichten von Substraten |
CN100460557C (zh) * | 2005-09-28 | 2009-02-11 | 中芯国际集成电路制造(上海)有限公司 | 操作物理气相沉积工艺的方法与系统 |
CN101283114B (zh) * | 2005-10-07 | 2012-04-18 | 国立大学法人东北大学 | 磁控溅射装置 |
JP5342240B2 (ja) * | 2005-12-22 | 2013-11-13 | テル・ソーラー・アクチェンゲゼルシャフト | 少なくとも1つのスパッタコーティングされた基板を製造する方法およびスパッタソース |
JP5078889B2 (ja) * | 2006-06-08 | 2012-11-21 | 芝浦メカトロニクス株式会社 | マグネトロンスパッタ用磁石装置、マグネトロンスパッタ装置及びマグネトロンスパッタ方法 |
US10043642B2 (en) * | 2008-02-01 | 2018-08-07 | Oerlikon Surface Solutions Ag, Pfäffikon | Magnetron sputtering source and arrangement with adjustable secondary magnet arrangement |
KR101009642B1 (ko) * | 2008-07-09 | 2011-01-19 | 삼성모바일디스플레이주식회사 | 자화 방지용 마그네트론 부 이송 장치 및 이를 갖는마그네트론 스퍼터링 설비 |
US8698400B2 (en) * | 2009-04-28 | 2014-04-15 | Leybold Optics Gmbh | Method for producing a plasma beam and plasma source |
US9545360B2 (en) | 2009-05-13 | 2017-01-17 | Sio2 Medical Products, Inc. | Saccharide protective coating for pharmaceutical package |
DK2251454T3 (da) | 2009-05-13 | 2014-10-13 | Sio2 Medical Products Inc | Coating og inspektion af beholder |
US9458536B2 (en) | 2009-07-02 | 2016-10-04 | Sio2 Medical Products, Inc. | PECVD coating methods for capped syringes, cartridges and other articles |
WO2011029096A2 (en) * | 2009-09-05 | 2011-03-10 | General Plasma, Inc. | Plasma enhanced chemical vapor deposition apparatus |
US11624115B2 (en) | 2010-05-12 | 2023-04-11 | Sio2 Medical Products, Inc. | Syringe with PECVD lubrication |
WO2011156877A1 (en) | 2010-06-18 | 2011-12-22 | Mahle Metal Leve S/A | Plasma processing device |
WO2011156876A1 (en) | 2010-06-18 | 2011-12-22 | Mahle Metal Leve S/A | Plasma processing device |
US9878101B2 (en) | 2010-11-12 | 2018-01-30 | Sio2 Medical Products, Inc. | Cyclic olefin polymer vessels and vessel coating methods |
US9272095B2 (en) | 2011-04-01 | 2016-03-01 | Sio2 Medical Products, Inc. | Vessels, contact surfaces, and coating and inspection apparatus and methods |
KR20140004785A (ko) * | 2011-05-30 | 2014-01-13 | 히타치 긴조쿠 가부시키가이샤 | 레이스트랙 형상의 마그네트론 스퍼터링용 자장 발생 장치 |
KR101241049B1 (ko) | 2011-08-01 | 2013-03-15 | 주식회사 플라즈마트 | 플라즈마 발생 장치 및 플라즈마 발생 방법 |
KR101246191B1 (ko) * | 2011-10-13 | 2013-03-21 | 주식회사 윈텔 | 플라즈마 장치 및 기판 처리 장치 |
CN103930595A (zh) | 2011-11-11 | 2014-07-16 | Sio2医药产品公司 | 用于药物包装的钝化、pH保护性或润滑性涂层、涂布方法以及设备 |
US11116695B2 (en) | 2011-11-11 | 2021-09-14 | Sio2 Medical Products, Inc. | Blood sample collection tube |
US9664626B2 (en) | 2012-11-01 | 2017-05-30 | Sio2 Medical Products, Inc. | Coating inspection method |
EP2920567B1 (de) | 2012-11-16 | 2020-08-19 | SiO2 Medical Products, Inc. | Verfahren und vorrichtung zur erkennung von schnellen sperrbeschichtungsintegritätseigenschaften |
US9764093B2 (en) | 2012-11-30 | 2017-09-19 | Sio2 Medical Products, Inc. | Controlling the uniformity of PECVD deposition |
WO2014085348A2 (en) | 2012-11-30 | 2014-06-05 | Sio2 Medical Products, Inc. | Controlling the uniformity of pecvd deposition on medical syringes, cartridges, and the like |
EP2778253B1 (de) * | 2013-02-26 | 2018-10-24 | Oerlikon Surface Solutions AG, Pfäffikon | Zylinderförmige Verdampfungsquelle |
US9662450B2 (en) | 2013-03-01 | 2017-05-30 | Sio2 Medical Products, Inc. | Plasma or CVD pre-treatment for lubricated pharmaceutical package, coating process and apparatus |
US9937099B2 (en) | 2013-03-11 | 2018-04-10 | Sio2 Medical Products, Inc. | Trilayer coated pharmaceutical packaging with low oxygen transmission rate |
KR102211788B1 (ko) | 2013-03-11 | 2021-02-04 | 에스아이오2 메디컬 프로덕츠, 인크. | 코팅된 패키징 |
US9508532B2 (en) | 2013-03-13 | 2016-11-29 | Bb Plasma Design Ab | Magnetron plasma apparatus |
US9863042B2 (en) | 2013-03-15 | 2018-01-09 | Sio2 Medical Products, Inc. | PECVD lubricity vessel coating, coating process and apparatus providing different power levels in two phases |
CN103269555B (zh) * | 2013-04-28 | 2016-07-06 | 哈尔滨工业大学 | 用具零磁场区的磁场位形约束高温等离子体的系统和方法 |
RU2554085C2 (ru) * | 2013-09-20 | 2015-06-27 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Московский государственный университет имени М.В. Ломоносова" (МГУ) | Способ нагрева электродов и создания самостоятельного дугового разряда с поджигом от тонкой металлической проволочки в свободном пространстве в магнитном поле |
EP3122917B1 (de) | 2014-03-28 | 2020-05-06 | SiO2 Medical Products, Inc. | Antistatische beschichtungen für kunststoffbehälter |
US9550694B2 (en) * | 2014-03-31 | 2017-01-24 | Corning Incorporated | Methods and apparatus for material processing using plasma thermal source |
US9533909B2 (en) | 2014-03-31 | 2017-01-03 | Corning Incorporated | Methods and apparatus for material processing using atmospheric thermal plasma reactor |
US10410889B2 (en) | 2014-07-25 | 2019-09-10 | Applied Materials, Inc. | Systems and methods for electrical and magnetic uniformity and skew tuning in plasma processing reactors |
RU2577040C2 (ru) * | 2014-07-29 | 2016-03-10 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Московский государственный университет имени М.В. Ломоносова" (МГУ) | Магнитный гаситель самостоятельного дугового разряда |
JP6403269B2 (ja) * | 2014-07-30 | 2018-10-10 | 株式会社神戸製鋼所 | アーク蒸発源 |
US20160200618A1 (en) | 2015-01-08 | 2016-07-14 | Corning Incorporated | Method and apparatus for adding thermal energy to a glass melt |
KR20180048694A (ko) | 2015-08-18 | 2018-05-10 | 에스아이오2 메디컬 프로덕츠, 인크. | 산소 전달률이 낮은, 의약품 및 다른 제품의 포장용기 |
RU2614526C2 (ru) * | 2015-08-31 | 2017-03-28 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Московский государственный университет имени М.В. Ломоносова" (МГУ) | Способ отклонения тепловой кумулятивной струи расплавленного металла и образованного ей канала на металлической поверхности катода в дуговом импульсном разряде при взрыве проволочки между электродами действием поперечного магнитного поля |
WO2017221134A1 (en) * | 2016-06-21 | 2017-12-28 | Medident Technologies Inc. | Plasmaclave device |
FR3079775B1 (fr) * | 2018-04-06 | 2021-11-26 | Addup | Dispositif de chauffage a confinement magnetique pour appareil de fabrication additive selective |
US11784033B2 (en) | 2021-05-28 | 2023-10-10 | Applied Materials, Inc. | Methods and apparatus for processing a substrate |
CN118480675A (zh) * | 2024-07-09 | 2024-08-13 | 河南通达电缆股份有限公司 | 一种防止铜线氧化的退火系统及方法 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5143371A (en) * | 1974-10-12 | 1976-04-14 | Daido Steel Co Ltd | Netsushorihohooyobi netsushorisochi |
US4588490A (en) * | 1985-05-22 | 1986-05-13 | International Business Machines Corporation | Hollow cathode enhanced magnetron sputter device |
JPH02243762A (ja) † | 1989-03-17 | 1990-09-27 | Hitachi Ltd | スパッタ装置 |
JPH02246216A (ja) | 1989-03-20 | 1990-10-02 | Hitachi Ltd | プラズマ装置 |
JPH0688229A (ja) * | 1991-01-29 | 1994-03-29 | Boc Group Inc:The | 二重円筒マグネトロンに於けるスパッタリングターゲットの磁場ゾーン回転の電気制御 |
JPH04346662A (ja) * | 1991-05-22 | 1992-12-02 | Ube Ind Ltd | スパッタリング方法およびその装置 |
US5411624A (en) * | 1991-07-23 | 1995-05-02 | Tokyo Electron Limited | Magnetron plasma processing apparatus |
JPH05148642A (ja) † | 1991-11-28 | 1993-06-15 | Hitachi Ltd | マグネトロンスパツタ装置 |
NO174450C (no) * | 1991-12-12 | 1994-05-04 | Kvaerner Eng | Anordning ved plasmabrenner for kjemiske prosesser |
JP3311064B2 (ja) * | 1992-03-26 | 2002-08-05 | 株式会社東芝 | プラズマ生成装置、表面処理装置および表面処理方法 |
KR0127663B1 (ko) * | 1992-04-17 | 1998-04-01 | 모리시타 요이찌 | 플라즈마발생장치 및 플라즈마발생방법 |
JPH06181187A (ja) * | 1992-12-11 | 1994-06-28 | Hitachi Ltd | スパッタリング装置 |
US5399253A (en) † | 1992-12-23 | 1995-03-21 | Balzers Aktiengesellschaft | Plasma generating device |
JPH06212420A (ja) | 1993-01-13 | 1994-08-02 | Shin Etsu Chem Co Ltd | スパッタ及びエッチング方法 |
JP2704352B2 (ja) | 1993-01-22 | 1998-01-26 | 信越化学工業株式会社 | 磁場発生装置 |
JP3174982B2 (ja) | 1993-03-27 | 2001-06-11 | 東京エレクトロン株式会社 | プラズマ処理装置 |
JP2970317B2 (ja) * | 1993-06-24 | 1999-11-02 | 松下電器産業株式会社 | スパッタリング装置及びスパッタリング方法 |
US5518547A (en) * | 1993-12-23 | 1996-05-21 | International Business Machines Corporation | Method and apparatus for reducing particulates in a plasma tool through steady state flows |
JP3124204B2 (ja) * | 1994-02-28 | 2001-01-15 | 株式会社東芝 | プラズマ処理装置 |
ZA956811B (en) † | 1994-09-06 | 1996-05-14 | Boc Group Inc | Dual cylindrical target magnetron with multiple anodes |
SE503141C2 (sv) * | 1994-11-18 | 1996-04-01 | Ladislav Bardos | Apparat för alstring av linjär ljusbågsurladdning för plasmabearbetning |
JPH08319552A (ja) * | 1995-05-22 | 1996-12-03 | Nagata Tekko Kk | プラズマトーチおよびプラズマ溶射装置 |
-
1997
- 1997-11-20 SE SE9704260A patent/SE511139C2/sv not_active IP Right Cessation
-
1998
- 1998-11-03 AU AU11820/99A patent/AU1182099A/en not_active Abandoned
- 1998-11-03 DE DE69828904T patent/DE69828904T3/de not_active Expired - Lifetime
- 1998-11-03 WO PCT/SE1998/001983 patent/WO1999027758A1/en active IP Right Grant
- 1998-11-03 JP JP2000522766A patent/JP4491132B2/ja not_active Expired - Fee Related
- 1998-11-03 EP EP98954885A patent/EP1033068B2/de not_active Expired - Lifetime
- 1998-11-03 CZ CZ20001853A patent/CZ298474B6/cs not_active IP Right Cessation
- 1998-11-03 US US09/554,666 patent/US6351075B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1033068B2 (de) | 2011-03-09 |
SE9704260D0 (sv) | 1997-11-20 |
DE69828904T3 (de) | 2012-02-09 |
US6351075B1 (en) | 2002-02-26 |
EP1033068A1 (de) | 2000-09-06 |
JP4491132B2 (ja) | 2010-06-30 |
AU1182099A (en) | 1999-06-15 |
DE69828904T2 (de) | 2006-01-12 |
CZ298474B6 (cs) | 2007-10-10 |
WO1999027758A1 (en) | 1999-06-03 |
EP1033068B1 (de) | 2005-02-02 |
CZ20001853A3 (cs) | 2000-08-16 |
JP2001524743A (ja) | 2001-12-04 |
SE511139C2 (sv) | 1999-08-09 |
SE9704260L (sv) | 1999-05-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8363 | Opposition against the patent | ||
8366 | Restricted maintained after opposition proceedings |