DE69927003D1 - Vakuumbehandlungsvorrichtung - Google Patents

Vakuumbehandlungsvorrichtung

Info

Publication number
DE69927003D1
DE69927003D1 DE69927003T DE69927003T DE69927003D1 DE 69927003 D1 DE69927003 D1 DE 69927003D1 DE 69927003 T DE69927003 T DE 69927003T DE 69927003 T DE69927003 T DE 69927003T DE 69927003 D1 DE69927003 D1 DE 69927003D1
Authority
DE
Germany
Prior art keywords
treatment device
vacuum treatment
vacuum
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69927003T
Other languages
English (en)
Other versions
DE69927003T2 (de
Inventor
Sakae Nakatsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of DE69927003D1 publication Critical patent/DE69927003D1/de
Application granted granted Critical
Publication of DE69927003T2 publication Critical patent/DE69927003T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563—Gas nozzles
    • C23C16/45565—Shower nozzles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
DE69927003T 1998-03-06 1999-03-05 Vakuumbehandlungsvorrichtung Expired - Fee Related DE69927003T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP07317798A JP4147608B2 (ja) 1998-03-06 1998-03-06 熱処理装置
JP7317798 1998-03-06
PCT/JP1999/001078 WO1999045166A1 (fr) 1998-03-06 1999-03-05 Appareil de traitement sous vide

Publications (2)

Publication Number Publication Date
DE69927003D1 true DE69927003D1 (de) 2005-10-06
DE69927003T2 DE69927003T2 (de) 2006-06-22

Family

ID=13510608

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69927003T Expired - Fee Related DE69927003T2 (de) 1998-03-06 1999-03-05 Vakuumbehandlungsvorrichtung

Country Status (6)

Country Link
US (1) US6599367B1 (de)
EP (1) EP1061155B1 (de)
JP (1) JP4147608B2 (de)
KR (1) KR100514726B1 (de)
DE (1) DE69927003T2 (de)
WO (1) WO1999045166A1 (de)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4147608B2 (ja) * 1998-03-06 2008-09-10 東京エレクトロン株式会社 熱処理装置
US8048806B2 (en) 2000-03-17 2011-11-01 Applied Materials, Inc. Methods to avoid unstable plasma states during a process transition
US20040129218A1 (en) * 2001-12-07 2004-07-08 Toshiki Takahashi Exhaust ring mechanism and plasma processing apparatus using the same
US20040025791A1 (en) * 2002-08-09 2004-02-12 Applied Materials, Inc. Etch chamber with dual frequency biasing sources and a single frequency plasma generating source
US20040031565A1 (en) * 2002-08-13 2004-02-19 Taiwan Semiconductor Manufacturing Co., Ltd. Gas distribution plate for processing chamber
US7186630B2 (en) 2002-08-14 2007-03-06 Asm America, Inc. Deposition of amorphous silicon-containing films
WO2004038777A1 (ja) * 2002-10-24 2004-05-06 Tokyo Electron Limited 熱処理装置
US6942753B2 (en) * 2003-04-16 2005-09-13 Applied Materials, Inc. Gas distribution plate assembly for large area plasma enhanced chemical vapor deposition
US8580076B2 (en) * 2003-05-22 2013-11-12 Lam Research Corporation Plasma apparatus, gas distribution assembly for a plasma apparatus and processes therewith
US20040235299A1 (en) * 2003-05-22 2004-11-25 Axcelis Technologies, Inc. Plasma ashing apparatus and endpoint detection process
WO2005054537A2 (en) * 2003-12-01 2005-06-16 Structured Materials Industries, Inc. System and method for forming multi-component films
WO2005067022A1 (ja) * 2003-12-26 2005-07-21 Tadahiro Ohmi シャワープレート、プラズマ処理装置、及び製品の製造方法
US8083853B2 (en) 2004-05-12 2011-12-27 Applied Materials, Inc. Plasma uniformity control by gas diffuser hole design
US8074599B2 (en) * 2004-05-12 2011-12-13 Applied Materials, Inc. Plasma uniformity control by gas diffuser curvature
US8328939B2 (en) * 2004-05-12 2012-12-11 Applied Materials, Inc. Diffuser plate with slit valve compensation
US7429410B2 (en) * 2004-09-20 2008-09-30 Applied Materials, Inc. Diffuser gravity support
KR100634451B1 (ko) * 2005-01-10 2006-10-16 삼성전자주식회사 반도체 소자 제조 장치
US7198677B2 (en) * 2005-03-09 2007-04-03 Wafermasters, Inc. Low temperature wafer backside cleaning
US7695633B2 (en) * 2005-10-18 2010-04-13 Applied Materials, Inc. Independent control of ion density, ion energy distribution and ion dissociation in a plasma reactor
US7780864B2 (en) * 2006-04-24 2010-08-24 Applied Materials, Inc. Process using combined capacitively and inductively coupled plasma sources for controlling plasma ion radial distribution
US20070246162A1 (en) * 2006-04-24 2007-10-25 Applied Materials, Inc. Plasma reactor apparatus with an inductive plasma source and a VHF capacitively coupled plasma source with variable frequency
US20070246161A1 (en) * 2006-04-24 2007-10-25 Applied Materials, Inc. Plasma reactor apparatus with a toroidal plasma source and a VHF capacitively coupled plasma source with variable frequency
US20070245961A1 (en) * 2006-04-24 2007-10-25 Applied Materials, Inc. Dual plasma source process using a variable frequency capacitively coupled source for controlling plasma ion dissociation
US20070246443A1 (en) * 2006-04-24 2007-10-25 Applied Materials, Inc. Process using combined capacitively and inductively coupled plasma process for controlling plasma ion dissociation
US7727413B2 (en) * 2006-04-24 2010-06-01 Applied Materials, Inc. Dual plasma source process using a variable frequency capacitively coupled source to control plasma ion density
US20070245960A1 (en) * 2006-04-24 2007-10-25 Applied Materials, Inc. Process using combined capacitively and inductively coupled plasma sources for controlling plasma ion density
US20070246163A1 (en) * 2006-04-24 2007-10-25 Applied Materials, Inc. Plasma reactor apparatus with independent capacitive and inductive plasma sources
US20070245958A1 (en) * 2006-04-24 2007-10-25 Applied Materials, Inc. Dual plasma source process using a variable frequency capacitively coupled source for controlling ion radial distribution
US7645357B2 (en) * 2006-04-24 2010-01-12 Applied Materials, Inc. Plasma reactor apparatus with a VHF capacitively coupled plasma source of variable frequency
KR100841741B1 (ko) * 2007-04-04 2008-06-27 주식회사 싸이맥스 진공처리장치
US7976631B2 (en) * 2007-10-16 2011-07-12 Applied Materials, Inc. Multi-gas straight channel showerhead
US8342712B2 (en) 2008-09-30 2013-01-01 Disney Enterprises, Inc. Kinetic flame device
US9371973B2 (en) 2010-06-28 2016-06-21 Shenzhen Liown Electronics Company Ltd. Electronic lighting device and method for manufacturing same
US9129778B2 (en) 2011-03-18 2015-09-08 Lam Research Corporation Fluid distribution members and/or assemblies
KR101239109B1 (ko) * 2011-09-23 2013-03-06 주성엔지니어링(주) 균일한 막 증착을 위한 챔버
US20140273460A1 (en) * 2013-03-13 2014-09-18 Applied Materials, Inc. Passive control for through silicon via tilt in icp chamber
CN103305812A (zh) * 2013-06-08 2013-09-18 上海和辉光电有限公司 一种上电极装置
CN104103561B (zh) * 2014-07-24 2016-08-24 河北神通光电科技有限公司 用于气态氟化氢刻蚀二氧化硅的刻蚀腔体及其刻蚀系统
US10760161B2 (en) * 2014-09-05 2020-09-01 Applied Materials, Inc. Inject insert for EPI chamber
US20170081757A1 (en) * 2015-09-23 2017-03-23 Applied Materials, Inc. Shadow frame with non-uniform gas flow clearance for improved cleaning
KR102477354B1 (ko) * 2018-03-29 2022-12-15 삼성전자주식회사 가스 분배 판을 갖는 플라즈마 처리 장치
KR20210125155A (ko) * 2020-04-07 2021-10-18 삼성디스플레이 주식회사 표시 장치의 제조방법
US20220134359A1 (en) * 2020-10-30 2022-05-05 Kabushiki Kaisha Toshiba Rectifying plate, fluid-introducing apparatus, and film-forming apparatus

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4792378A (en) 1987-12-15 1988-12-20 Texas Instruments Incorporated Gas dispersion disk for use in plasma enhanced chemical vapor deposition reactor
JPH02198138A (ja) * 1989-01-27 1990-08-06 Nec Corp 平行平板型ドライエッチング装置の電極板
JPH0344471A (ja) 1989-07-12 1991-02-26 Mitsubishi Electric Corp 化学気相成長装置
DE69024719T2 (de) * 1989-08-14 1996-10-02 Applied Materials Inc Gasverteilungssystem und Verfahren zur Benutzung dieses Systems
JPH04211115A (ja) 1990-01-26 1992-08-03 Fujitsu Ltd Ｒｆプラズマｃｖｄ装置ならびに該装置による薄膜形成方法
JPH0661157A (ja) * 1992-08-12 1994-03-04 Sharp Corp 半導体製造装置
JPH06151368A (ja) * 1992-11-02 1994-05-31 Nec Corp ドライエッチング装置
KR950020993A (ko) * 1993-12-22 1995-07-26 김광호 반도체 제조장치
JP2726005B2 (ja) 1994-07-20 1998-03-11 株式会社ジーティシー 成膜装置および成膜方法
JPH0930892A (ja) 1995-07-20 1997-02-04 Yamaha Corp プラズマｃｖｄ装置
US5781693A (en) * 1996-07-24 1998-07-14 Applied Materials, Inc. Gas introduction showerhead for an RTP chamber with upper and lower transparent plates and gas flow therebetween
US6090210A (en) * 1996-07-24 2000-07-18 Applied Materials, Inc. Multi-zone gas flow control in a process chamber
US6079356A (en) * 1997-12-02 2000-06-27 Applied Materials, Inc. Reactor optimized for chemical vapor deposition of titanium
JP4147608B2 (ja) * 1998-03-06 2008-09-10 東京エレクトロン株式会社 熱処理装置

Also Published As

Publication number Publication date
JP4147608B2 (ja) 2008-09-10
EP1061155A4 (de) 2004-07-07
WO1999045166A1 (fr) 1999-09-10
KR20010041619A (ko) 2001-05-25
US6599367B1 (en) 2003-07-29
JPH11256328A (ja) 1999-09-21
KR100514726B1 (ko) 2005-09-13
EP1061155B1 (de) 2005-08-31
EP1061155A1 (de) 2000-12-20
DE69927003T2 (de) 2006-06-22

Similar Documents

Publication Publication Date Title
DE69927003D1 (de) Vakuumbehandlungsvorrichtung
DE69938863D1 (de) Vakuumbehandlungsvorrichtung
DE59913141D1 (de) Blutbehandlungsgerät
DE69719108D1 (de) Plasmabehandlungsgerät
FI990534A (fi) CT-kuvauslaite
DE69718990T2 (de) Behandlungsgerät
DE59913981D1 (de) Bedienvorrichtung
DE69926741D1 (de) Sterilisationsvorrichtung
DE59914216D1 (de) Prüfsonde-Antriebsvorrichtung
DE60132950D1 (de) Vakuumbehandlungsvorrichtung
DE29806422U1 (de) Krankentransportvorrichtung
DE69905631T2 (de) Fotografisches Behandlungsgerät
DE69926628D1 (de) Turbidimeterkalibrierung-überprüfungsvorrichtung
DE59915029D1 (de) Medizinisches gerät
DE29804988U1 (de) Absauggerät
DE69839736D1 (de) Pseudostereophonie-gerät
DE69903384T2 (de) Insektentöttendes Gerät
DE50005409D1 (de) Hör-behandlungsgerät
DE59909953D1 (de) Bearbeitungseinrichtung
DE29603771U1 (de) Absaugeinrichtung
NO20003844D0 (no) Prosessanordning
DE29805920U1 (de) Entspannungs-Förderungs-Vorrichtung
DE29818649U1 (de) Therapiegerät
FI980531A0 (fi) Suganordning
DE29804990U1 (de) Absauggerät

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee