DE60132950D1 - Vakuumbehandlungsvorrichtung - Google Patents

Vakuumbehandlungsvorrichtung

Info

Publication number
DE60132950D1
DE60132950D1 DE60132950T DE60132950T DE60132950D1 DE 60132950 D1 DE60132950 D1 DE 60132950D1 DE 60132950 T DE60132950 T DE 60132950T DE 60132950 T DE60132950 T DE 60132950T DE 60132950 D1 DE60132950 D1 DE 60132950D1
Authority
DE
Germany
Prior art keywords
treatment device
vacuum treatment
vacuum
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60132950T
Other languages
English (en)
Other versions
DE60132950T2 (de
Inventor
Takeshi Masuda
Takakazu Yamada
Masaki Uematsu
Koukou Suu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Nihon Shinku Gijutsu KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc, Nihon Shinku Gijutsu KK filed Critical Ulvac Inc
Application granted granted Critical
Publication of DE60132950D1 publication Critical patent/DE60132950D1/de
Publication of DE60132950T2 publication Critical patent/DE60132950T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Physical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
DE60132950T 2000-05-18 2001-05-17 Vakuumbehandlungsvorrichtung Expired - Lifetime DE60132950T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2000146072 2000-05-18
JP2000146072 2000-05-18
JP2000176012 2000-06-12
JP2000176012A JP2002035572A (ja) 2000-05-18 2000-06-12 真空処理装置と多室型真空処理装置

Publications (2)

Publication Number Publication Date
DE60132950D1 true DE60132950D1 (de) 2008-04-10
DE60132950T2 DE60132950T2 (de) 2009-02-19

Family

ID=26592103

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60132950T Expired - Lifetime DE60132950T2 (de) 2000-05-18 2001-05-17 Vakuumbehandlungsvorrichtung

Country Status (6)

Country Link
US (1) US20020000197A1 (de)
EP (1) EP1156135B1 (de)
JP (1) JP2002035572A (de)
KR (1) KR100797428B1 (de)
DE (1) DE60132950T2 (de)
TW (1) TW499499B (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7589029B2 (en) * 2002-05-02 2009-09-15 Micron Technology, Inc. Atomic layer deposition and conversion
US20050050708A1 (en) * 2003-09-04 2005-03-10 Taiwan Semiconductor Manufacturing Co., Ltd. Embedded fastener apparatus and method for preventing particle contamination
JP4564349B2 (ja) * 2004-12-22 2010-10-20 三井造船株式会社 原子層成膜装置
JP5014603B2 (ja) * 2005-07-29 2012-08-29 株式会社アルバック 真空処理装置
US7450806B2 (en) 2005-11-08 2008-11-11 Corning Incorporated Microstructured optical fibers and methods
KR100793836B1 (ko) * 2006-06-22 2008-01-11 경일대학교산학협력단 액체질소를 이용한 진공장치
JP2008019477A (ja) * 2006-07-13 2008-01-31 Canon Inc 真空蒸着装置
US20080061453A1 (en) * 2006-09-12 2008-03-13 Rafael J. Diaz Furnace Air Freshener and Vent Deodorizing System
JP2010524225A (ja) * 2007-04-02 2010-07-15 ソースル シーオー エルティディー 基板支持装置及びこれを備えるプラズマエッチング装置
WO2010024036A1 (ja) * 2008-08-28 2010-03-04 東京エレクトロン株式会社 プラズマ処理装置およびプラズマ処理装置のクリーニング方法
JP4523661B1 (ja) * 2009-03-10 2010-08-11 三井造船株式会社 原子層堆積装置及び薄膜形成方法
WO2015171335A1 (en) * 2014-05-06 2015-11-12 Applied Materials, Inc. Directional treatment for multi-dimensional device processing
JP2016169402A (ja) * 2015-03-11 2016-09-23 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
DE102015107297A1 (de) * 2015-05-11 2016-11-17 Von Ardenne Gmbh Prozessieranordnung
WO2022178898A1 (zh) * 2021-02-28 2022-09-01 苏州鱼得水电气科技有限公司 一种化工生产用真空处理装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6289881A (ja) * 1985-10-16 1987-04-24 Hitachi Ltd スパツタ装置
US4842683A (en) * 1986-12-19 1989-06-27 Applied Materials, Inc. Magnetic field-enhanced plasma etch reactor
DE69006809T2 (de) * 1989-09-12 1994-09-15 Shinetsu Chemical Co Vorrichtung für die Verdampfung und Bereitstellung von Organometallverbindungen.
JPH05335280A (ja) * 1992-06-03 1993-12-17 Sony Corp ガス流量制御装置とその製造方法
JP3172758B2 (ja) * 1993-11-20 2001-06-04 東京エレクトロン株式会社 プラズマエッチング方法
JPH07273101A (ja) * 1994-03-31 1995-10-20 Tokyo Electron Ltd 枚葉式熱処理装置
EP0821395A3 (de) * 1996-07-19 1998-03-25 Tokyo Electron Limited Plasma Bearbeitungsgerät
US5855675A (en) * 1997-03-03 1999-01-05 Genus, Inc. Multipurpose processing chamber for chemical vapor deposition processes
US6176929B1 (en) * 1997-07-22 2001-01-23 Ebara Corporation Thin-film deposition apparatus
CA2741216A1 (en) * 2008-10-21 2010-04-29 Google Inc. Search based specification for data synchronization

Also Published As

Publication number Publication date
DE60132950T2 (de) 2009-02-19
KR100797428B1 (ko) 2008-01-23
JP2002035572A (ja) 2002-02-05
EP1156135B1 (de) 2008-02-27
KR20010105238A (ko) 2001-11-28
TW499499B (en) 2002-08-21
EP1156135A3 (de) 2003-12-17
EP1156135A2 (de) 2001-11-21
US20020000197A1 (en) 2002-01-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition