DE69826068D1 - Magnetron-Zerstäubungsvorrichtung mit rotierender Magnetanordnung - Google Patents
Magnetron-Zerstäubungsvorrichtung mit rotierender MagnetanordnungInfo
- Publication number
- DE69826068D1 DE69826068D1 DE69826068T DE69826068T DE69826068D1 DE 69826068 D1 DE69826068 D1 DE 69826068D1 DE 69826068 T DE69826068 T DE 69826068T DE 69826068 T DE69826068 T DE 69826068T DE 69826068 D1 DE69826068 D1 DE 69826068D1
- Authority
- DE
- Germany
- Prior art keywords
- magnetron sputtering
- magnet arrangement
- sputtering device
- rotating magnet
- rotating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3452—Magnet distribution
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3455—Movable magnets
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US874075 | 1986-06-13 | ||
US08/874,075 US5795451A (en) | 1997-06-12 | 1997-06-12 | Sputtering apparatus with a rotating magnet array |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69826068D1 true DE69826068D1 (de) | 2004-10-14 |
DE69826068T2 DE69826068T2 (de) | 2005-09-29 |
Family
ID=25362929
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69826068T Expired - Lifetime DE69826068T2 (de) | 1997-06-12 | 1998-06-10 | Magnetron-Zerstäubungsvorrichtung mit rotierender Magnetanordnung |
Country Status (4)
Country | Link |
---|---|
US (1) | US5795451A (de) |
EP (1) | EP0884761B1 (de) |
JP (1) | JPH1171670A (de) |
DE (1) | DE69826068T2 (de) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9606920D0 (en) * | 1996-04-02 | 1996-06-05 | Applied Vision Ltd | Magnet array for magnetrons |
GB2340845B (en) * | 1998-08-19 | 2001-01-31 | Kobe Steel Ltd | Magnetron sputtering apparatus |
US6132575A (en) * | 1998-09-28 | 2000-10-17 | Alcatel | Magnetron reactor for providing a high density, inductively coupled plasma source for sputtering metal and dielectric films |
US6497802B2 (en) | 1999-02-12 | 2002-12-24 | Applied Materials, Inc. | Self ionized plasma sputtering |
US6183614B1 (en) | 1999-02-12 | 2001-02-06 | Applied Materials, Inc. | Rotating sputter magnetron assembly |
US6306265B1 (en) * | 1999-02-12 | 2001-10-23 | Applied Materials, Inc. | High-density plasma for ionized metal deposition capable of exciting a plasma wave |
US6290825B1 (en) | 1999-02-12 | 2001-09-18 | Applied Materials, Inc. | High-density plasma source for ionized metal deposition |
US6440282B1 (en) | 1999-07-06 | 2002-08-27 | Applied Materials, Inc. | Sputtering reactor and method of using an unbalanced magnetron |
US6132565A (en) * | 1999-10-01 | 2000-10-17 | Taiwan Semiconductor Manufacturing Company, Ltd | Magnetron assembly equipped with traversing magnets and method of using |
US8696875B2 (en) * | 1999-10-08 | 2014-04-15 | Applied Materials, Inc. | Self-ionized and inductively-coupled plasma for sputtering and resputtering |
US10047430B2 (en) | 1999-10-08 | 2018-08-14 | Applied Materials, Inc. | Self-ionized and inductively-coupled plasma for sputtering and resputtering |
US6398929B1 (en) * | 1999-10-08 | 2002-06-04 | Applied Materials, Inc. | Plasma reactor and shields generating self-ionized plasma for sputtering |
US6432285B1 (en) * | 1999-10-15 | 2002-08-13 | Cierra Photonics, Inc. | Planar magnetron sputtering apparatus |
ATE394789T1 (de) * | 1999-11-15 | 2008-05-15 | Lam Res Corp | Behandlungsvorrichtungen |
US6402903B1 (en) | 2000-02-04 | 2002-06-11 | Steag Hamatech Ag | Magnetic array for sputtering system |
US7067034B2 (en) * | 2000-03-27 | 2006-06-27 | Lam Research Corporation | Method and apparatus for plasma forming inner magnetic bucket to control a volume of a plasma |
US6632322B1 (en) * | 2000-06-30 | 2003-10-14 | Lam Research Corporation | Switched uniformity control |
US6352629B1 (en) * | 2000-07-10 | 2002-03-05 | Applied Materials, Inc. | Coaxial electromagnet in a magnetron sputtering reactor |
US6663754B2 (en) * | 2001-04-13 | 2003-12-16 | Applied Materials, Inc. | Tubular magnet as center pole in unbalanced sputtering magnetron |
US20030024478A1 (en) * | 2001-08-06 | 2003-02-06 | Anelva Corporation | Surface processing apparatus |
US7504006B2 (en) * | 2002-08-01 | 2009-03-17 | Applied Materials, Inc. | Self-ionized and capacitively-coupled plasma for sputtering and resputtering |
US20070108041A1 (en) * | 2005-11-11 | 2007-05-17 | Guo George X | Magnetron source having increased usage life |
KR100910673B1 (ko) * | 2006-08-04 | 2009-08-04 | 어플라이드 머티어리얼스, 인코포레이티드 | 다중 마그네트론들, 특히 2 레벨 접지형 마그네트론들의집단 스캐닝 |
US8137517B1 (en) | 2009-02-10 | 2012-03-20 | Wd Media, Inc. | Dual position DC magnetron assembly |
US8517657B2 (en) | 2010-06-30 | 2013-08-27 | WD Media, LLC | Corner chamber with heater |
CN102315064B (zh) * | 2010-07-02 | 2014-07-30 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种磁控管及应用该磁控管的薄膜沉积处理设备 |
US20130240147A1 (en) * | 2012-03-19 | 2013-09-19 | Sang Ki Nam | Methods and apparatus for selectively modulating azimuthal non-uniformity in a plasma processing system |
US8674327B1 (en) | 2012-05-10 | 2014-03-18 | WD Media, LLC | Systems and methods for uniformly implanting materials on substrates using directed magnetic fields |
US9764093B2 (en) * | 2012-11-30 | 2017-09-19 | Sio2 Medical Products, Inc. | Controlling the uniformity of PECVD deposition |
CN103854819B (zh) * | 2014-03-22 | 2016-10-05 | 沈阳中北通磁科技股份有限公司 | 一种钕铁硼稀土永磁器件的混合镀膜方法 |
GB201815216D0 (en) | 2018-09-18 | 2018-10-31 | Spts Technologies Ltd | Apparatus and a method of controlling thickness variation in a material layer formed using physical vapour deposition |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6289864A (ja) * | 1985-06-27 | 1987-04-24 | Matsushita Electric Ind Co Ltd | マグネトロンスパツタ装置 |
JPH07108748B2 (ja) * | 1985-07-05 | 1995-11-22 | ミノルタ株式会社 | 複写機 |
JPS6260866A (ja) * | 1985-08-02 | 1987-03-17 | Fujitsu Ltd | マグネトロンスパツタ装置 |
DE3619194A1 (de) * | 1986-06-06 | 1987-12-10 | Leybold Heraeus Gmbh & Co Kg | Magnetron-zerstaeubungskatode fuer vakuum-beschichtungsanlagen |
JPS63109163A (ja) * | 1986-10-25 | 1988-05-13 | Sumitomo Light Metal Ind Ltd | スパツタリング装置 |
JP2627651B2 (ja) * | 1988-10-17 | 1997-07-09 | アネルバ株式会社 | マグネトロンスパッタリング装置 |
DE69121446T2 (de) * | 1990-03-30 | 1997-02-20 | Applied Materials Inc | Zerstäubungssystem |
DE4039101C2 (de) * | 1990-12-07 | 1998-05-28 | Leybold Ag | Ortsfeste Magnetron-Zerstäubungskathode für Vakuumbeschichtungsanlagen |
US5194131A (en) * | 1991-08-16 | 1993-03-16 | Varian Associates, Inc. | Apparatus and method for multiple ring sputtering from a single target |
US5374343A (en) * | 1992-05-15 | 1994-12-20 | Anelva Corporation | Magnetron cathode assembly |
US5333726A (en) * | 1993-01-15 | 1994-08-02 | Regents Of The University Of California | Magnetron sputtering source |
US5496455A (en) * | 1993-09-16 | 1996-03-05 | Applied Material | Sputtering using a plasma-shaping magnet ring |
-
1997
- 1997-06-12 US US08/874,075 patent/US5795451A/en not_active Expired - Lifetime
-
1998
- 1998-06-10 EP EP98304609A patent/EP0884761B1/de not_active Expired - Lifetime
- 1998-06-10 DE DE69826068T patent/DE69826068T2/de not_active Expired - Lifetime
- 1998-06-12 JP JP10179795A patent/JPH1171670A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0884761B1 (de) | 2004-09-08 |
JPH1171670A (ja) | 1999-03-16 |
EP0884761A1 (de) | 1998-12-16 |
DE69826068T2 (de) | 2005-09-29 |
US5795451A (en) | 1998-08-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |