DE69512376D1 - Plasma-bearbeitungsvorrichtung - Google Patents

Plasma-bearbeitungsvorrichtung

Info

Publication number
DE69512376D1
DE69512376D1 DE69512376T DE69512376T DE69512376D1 DE 69512376 D1 DE69512376 D1 DE 69512376D1 DE 69512376 T DE69512376 T DE 69512376T DE 69512376 T DE69512376 T DE 69512376T DE 69512376 D1 DE69512376 D1 DE 69512376D1
Authority
DE
Germany
Prior art keywords
processing device
plasma processing
plasma
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69512376T
Other languages
English (en)
Inventor
Hiroshi Sumitomo-Kouto Mabuchi
Takahiro Yoshiki
Naoki Sumitomo-Kouto Matsumoto
Kyoichi Komachi
Syuta Kanayama
Toshiki Ebata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Sumitomo Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP6162021A external-priority patent/JP2932942B2/ja
Priority claimed from JP11733495A external-priority patent/JP3703877B2/ja
Application filed by Sumitomo Metal Industries Ltd filed Critical Sumitomo Metal Industries Ltd
Application granted granted Critical
Publication of DE69512376D1 publication Critical patent/DE69512376D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32211—Means for coupling power to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32211—Means for coupling power to the plasma
    • H01J37/32229—Waveguides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32211—Means for coupling power to the plasma
    • H01J37/32238—Windows

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
DE69512376T 1994-07-14 1995-07-13 Plasma-bearbeitungsvorrichtung Expired - Lifetime DE69512376D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP6162021A JP2932942B2 (ja) 1994-07-14 1994-07-14 プラズマ処理装置
JP11733495A JP3703877B2 (ja) 1995-05-16 1995-05-16 プラズマ装置
PCT/JP1995/001403 WO1996003019A1 (fr) 1994-07-14 1995-07-13 Dispositif de traitement au plasma

Publications (1)

Publication Number Publication Date
DE69512376D1 true DE69512376D1 (de) 1999-10-28

Family

ID=26455471

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69512376T Expired - Lifetime DE69512376D1 (de) 1994-07-14 1995-07-13 Plasma-bearbeitungsvorrichtung

Country Status (6)

Country Link
US (1) US5788798A (de)
EP (1) EP0723386B1 (de)
KR (1) KR100205476B1 (de)
DE (1) DE69512376D1 (de)
TW (1) TW397320U (de)
WO (1) WO1996003019A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6652709B1 (en) * 1999-11-02 2003-11-25 Canon Kabushiki Kaisha Plasma processing apparatus having circular waveguide, and plasma processing method
JP3792089B2 (ja) * 2000-01-14 2006-06-28 シャープ株式会社 プラズマプロセス装置
KR20020091857A (ko) * 2001-05-30 2002-12-11 사단법인 고등기술연구원 연구조합 다중 공진 모드를 이용한 플라즈마 방전 시스템
TW200415726A (en) * 2002-12-05 2004-08-16 Adv Lcd Tech Dev Ct Co Ltd Plasma processing apparatus and plasma processing method
JP5222744B2 (ja) * 2009-01-21 2013-06-26 国立大学法人東北大学 プラズマ処理装置
KR20140023807A (ko) * 2012-08-17 2014-02-27 삼성전자주식회사 반도체 소자를 제조하는 설비

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3244391A1 (de) * 1982-12-01 1984-06-07 Leybold-Heraeus GmbH, 5000 Köln Vorrichtung zur beschichtung von substraten durch plasmapolymerisation
JPS625600A (ja) * 1985-06-28 1987-01-12 住友金属工業株式会社 マイクロ波プラズマ処理装置
JPH0695479B2 (ja) * 1985-10-25 1994-11-24 住友金属工業株式会社 マイクロ波プラズマ発生装置
JP2552140B2 (ja) * 1987-07-03 1996-11-06 新日本無線株式会社 プラズマ発生反応装置
JP2570090B2 (ja) * 1992-10-08 1997-01-08 日本電気株式会社 ドライエッチング装置

Also Published As

Publication number Publication date
WO1996003019A1 (fr) 1996-02-01
EP0723386A4 (de) 1997-01-29
US5788798A (en) 1998-08-04
EP0723386B1 (de) 1999-09-22
TW397320U (en) 2000-07-01
KR100205476B1 (ko) 1999-07-01
EP0723386A1 (de) 1996-07-24
KR960705336A (ko) 1996-10-09

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Legal Events

Date Code Title Description
8332 No legal effect for de