DE69030744D1 - Plasma-Bearbeitungsgerät - Google Patents

Plasma-Bearbeitungsgerät

Info

Publication number
DE69030744D1
DE69030744D1 DE69030744T DE69030744T DE69030744D1 DE 69030744 D1 DE69030744 D1 DE 69030744D1 DE 69030744 T DE69030744 T DE 69030744T DE 69030744 T DE69030744 T DE 69030744T DE 69030744 D1 DE69030744 D1 DE 69030744D1
Authority
DE
Germany
Prior art keywords
processing device
plasma processing
plasma
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69030744T
Other languages
English (en)
Other versions
DE69030744T2 (de
Inventor
Tohru Ohtsubo
Mitsuo Tokuda
Yasuhiro Yamaguchi
Ichiro Sasaki
Kazuhiro Ohara
Hirohisa Usuami
Junzo Azuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE69030744D1 publication Critical patent/DE69030744D1/de
Publication of DE69030744T2 publication Critical patent/DE69030744T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32357—Generation remote from the workpiece, e.g. down-stream

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
DE69030744T 1989-02-08 1990-01-31 Plasma-Bearbeitungsgerät Expired - Lifetime DE69030744T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1027406A JP2993675B2 (ja) 1989-02-08 1989-02-08 プラズマ処理方法及びその装置

Publications (2)

Publication Number Publication Date
DE69030744D1 true DE69030744D1 (de) 1997-06-26
DE69030744T2 DE69030744T2 (de) 1997-10-23

Family

ID=12220198

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69030744T Expired - Lifetime DE69030744T2 (de) 1989-02-08 1990-01-31 Plasma-Bearbeitungsgerät

Country Status (5)

Country Link
US (1) US4985109A (de)
EP (1) EP0382065B1 (de)
JP (1) JP2993675B2 (de)
KR (1) KR930005945B1 (de)
DE (1) DE69030744T2 (de)

Families Citing this family (77)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5134965A (en) * 1989-06-16 1992-08-04 Hitachi, Ltd. Processing apparatus and method for plasma processing
JPH03193880A (ja) * 1989-08-03 1991-08-23 Mikakutou Seimitsu Kogaku Kenkyusho:Kk 高圧力下でのマイクロ波プラズマｃｖｄによる高速成膜方法及びその装置
JP3056772B2 (ja) * 1990-08-20 2000-06-26 株式会社日立製作所 プラズマの制御方法ならびにプラズマ処理方法およびその装置
DE69123808T2 (de) * 1990-09-26 1997-06-26 Hitachi Ltd Verfahren und Gerät zur Bearbeitung mittels Mikrowellenplasma
US5804033A (en) * 1990-09-26 1998-09-08 Hitachi, Ltd. Microwave plasma processing method and apparatus
JP3020580B2 (ja) * 1990-09-28 2000-03-15 株式会社日立製作所 マイクロ波プラズマ処理装置
DE4037091C2 (de) * 1990-11-22 1996-06-20 Leybold Ag Vorrichtung für die Erzeugung eines homogenen Mikrowellenfeldes
US5474650A (en) * 1991-04-04 1995-12-12 Hitachi, Ltd. Method and apparatus for dry etching
JP3323530B2 (ja) * 1991-04-04 2002-09-09 株式会社日立製作所 半導体装置の製造方法
EP0512677B1 (de) * 1991-04-04 1999-11-24 Hitachi, Ltd. Verfahren und Vorrichtung zur Plasmabehandlung
US6008133A (en) * 1991-04-04 1999-12-28 Hitachi, Ltd. Method and apparatus for dry etching
JP3000717B2 (ja) * 1991-04-26 2000-01-17 ソニー株式会社 ドライエッチング方法
JP3375646B2 (ja) * 1991-05-31 2003-02-10 株式会社日立製作所 プラズマ処理装置
US6046425A (en) * 1991-05-31 2000-04-04 Hitachi, Ltd. Plasma processing apparatus having insulator disposed on inner surface of plasma generating chamber
US5480533A (en) * 1991-08-09 1996-01-02 Matsushita Electric Industrial Co., Ltd. Microwave plasma source
US5342472A (en) * 1991-08-12 1994-08-30 Tokyo Electron Limited Plasma processing apparatus
US5228052A (en) * 1991-09-11 1993-07-13 Nihon Shinku Gijutsu Kabushiki Kaisha Plasma ashing apparatus
EP0554039B1 (de) * 1992-01-30 1996-11-20 Hitachi, Ltd. Verfahren und Vorrichtung zur Plasmaerzeugung und Verfahren zur Halbleiter-Bearbeitung
US5231334A (en) * 1992-04-15 1993-07-27 Texas Instruments Incorporated Plasma source and method of manufacturing
JP3073327B2 (ja) * 1992-06-30 2000-08-07 キヤノン株式会社 堆積膜形成方法
FR2693619B1 (fr) * 1992-07-08 1994-10-07 Valeo Vision Dispositif pour le dépôt de polymère par l'intermédiaire d'un plasma excité par micro-ondes.
USRE40963E1 (en) * 1993-01-12 2009-11-10 Tokyo Electron Limited Method for plasma processing by shaping an induced electric field
KR100238627B1 (ko) * 1993-01-12 2000-01-15 히가시 데쓰로 플라즈마 처리장치
US5433812A (en) * 1993-01-19 1995-07-18 International Business Machines Corporation Apparatus for enhanced inductive coupling to plasmas with reduced sputter contamination
DE4317623C2 (de) * 1993-05-27 2003-08-21 Bosch Gmbh Robert Verfahren und Vorrichtung zum anisotropen Plasmaätzen von Substraten und dessen Verwendung
US5466295A (en) * 1993-10-25 1995-11-14 Board Of Regents Acting For The Univ. Of Michigan ECR plasma generation apparatus and methods
JP2611732B2 (ja) * 1993-12-13 1997-05-21 日本電気株式会社 プラズマ処理装置
JPH07169740A (ja) * 1993-12-14 1995-07-04 Nec Corp マイクロ波プラズマ処理装置
US5783100A (en) * 1994-03-16 1998-07-21 Micron Display Technology, Inc. Method of high density plasma etching for semiconductor manufacture
EP0673055A1 (de) * 1994-03-17 1995-09-20 Shin-Etsu Chemical Co., Ltd. Verfahren zur Herstellung einer superharten kohlenstoffhaltigen Schutzschicht auf Objekten
WO1995027998A1 (de) * 1994-04-11 1995-10-19 Wu Jeng Ming Plasmagerät
JP3171222B2 (ja) * 1994-06-14 2001-05-28 日本電気株式会社 マイクロ波プラズマ処理装置
JP3257328B2 (ja) * 1995-03-16 2002-02-18 株式会社日立製作所 プラズマ処理装置及びプラズマ処理方法
US5571577A (en) * 1995-04-07 1996-11-05 Board Of Trustees Operating Michigan State University Method and apparatus for plasma treatment of a surface
US5961851A (en) * 1996-04-02 1999-10-05 Fusion Systems Corporation Microwave plasma discharge device
JP2921499B2 (ja) * 1996-07-30 1999-07-19 日本電気株式会社 プラズマ処理装置
TW392215B (en) * 1997-02-19 2000-06-01 Anelva Corp Surface processing apparatus
EP1189493A3 (de) 1997-05-22 2004-06-23 Canon Kabushiki Kaisha Plasmabehandlungsvorrichtung mit Mikrowellenapplikation und ringförmigem Wellenleiter sowie Behandlungsverfahren
JP3430959B2 (ja) * 1999-03-04 2003-07-28 東京エレクトロン株式会社 平面アンテナ部材、これを用いたプラズマ処理装置及びプラズマ処理方法
JP3496560B2 (ja) * 1999-03-12 2004-02-16 東京エレクトロン株式会社 プラズマ処理装置
US6263830B1 (en) * 1999-04-12 2001-07-24 Matrix Integrated Systems, Inc. Microwave choke for remote plasma generator
KR100416308B1 (ko) * 1999-05-26 2004-01-31 동경 엘렉트론 주식회사 플라즈마 처리 장치
JP2001203099A (ja) 2000-01-20 2001-07-27 Yac Co Ltd プラズマ生成装置およびプラズマ処理装置
US6910440B2 (en) 2000-03-30 2005-06-28 Tokyo Electron Ltd. Apparatus for plasma processing
JP4522356B2 (ja) * 2000-03-30 2010-08-11 東京エレクトロン株式会社 プラズマ処理装置
JP4504511B2 (ja) * 2000-05-26 2010-07-14 忠弘 大見 プラズマ処理装置
US6677549B2 (en) * 2000-07-24 2004-01-13 Canon Kabushiki Kaisha Plasma processing apparatus having permeable window covered with light shielding film
JP3872650B2 (ja) * 2000-09-06 2007-01-24 東京エレクトロン株式会社 プラズマ処理装置及び方法
US6830653B2 (en) * 2000-10-03 2004-12-14 Matsushita Electric Industrial Co., Ltd. Plasma processing method and apparatus
US20020038791A1 (en) * 2000-10-03 2002-04-04 Tomohiro Okumura Plasma processing method and apparatus
JP4680400B2 (ja) * 2001-02-16 2011-05-11 東京エレクトロン株式会社 プラズマ装置及びその製造方法
JP4252749B2 (ja) * 2001-12-13 2009-04-08 忠弘 大見 基板処理方法および基板処理装置
JP3914071B2 (ja) * 2002-03-12 2007-05-16 東京エレクトロン株式会社 プラズマ処理装置
JP4163432B2 (ja) * 2002-03-26 2008-10-08 矢崎総業株式会社 プラズマ処理装置
JP4141764B2 (ja) * 2002-08-20 2008-08-27 東京エレクトロン株式会社 プラズマ処理装置
US7303789B2 (en) * 2003-02-17 2007-12-04 Ngk Insulators, Ltd. Methods for producing thin films on substrates by plasma CVD
JP2005033055A (ja) * 2003-07-08 2005-02-03 Canon Inc 放射状スロットに円弧状スロットを併設したマルチスロットアンテナを用いた表面波プラズマ処理装置
WO2006001253A1 (ja) * 2004-06-25 2006-01-05 Kyoto University プラズマ処理装置
KR20060026321A (ko) * 2004-09-20 2006-03-23 삼성전자주식회사 플라즈마 처리 장치 및 그 제어 방법
JP2006324551A (ja) * 2005-05-20 2006-11-30 Shibaura Mechatronics Corp プラズマ発生装置及びプラズマ処理装置
US7485827B2 (en) 2006-07-21 2009-02-03 Alter S.R.L. Plasma generator
JP2008059991A (ja) * 2006-09-01 2008-03-13 Canon Inc プラズマ処理装置及びプラズマ処理方法
WO2009041629A1 (ja) * 2007-09-28 2009-04-02 Tokyo Electron Limited プラズマ処理装置
JP4585574B2 (ja) * 2008-02-26 2010-11-24 東京エレクトロン株式会社 プラズマ処理装置およびプラズマ処理方法
JP4793662B2 (ja) * 2008-03-28 2011-10-12 独立行政法人産業技術総合研究所 マイクロ波プラズマ処理装置
US8760054B2 (en) * 2011-01-21 2014-06-24 Axcelis Technologies Inc. Microwave plasma electron flood
JP5893865B2 (ja) * 2011-03-31 2016-03-23 東京エレクトロン株式会社 プラズマ処理装置およびマイクロ波導入装置
KR102007059B1 (ko) * 2011-12-12 2019-08-02 도쿄엘렉트론가부시키가이샤 플라즈마 발생용 안테나, 플라즈마 처리 장치 및 플라즈마 처리 방법
JP2014026773A (ja) * 2012-07-25 2014-02-06 Tokyo Electron Ltd プラズマ処理装置
JP2015109249A (ja) * 2013-10-22 2015-06-11 東京エレクトロン株式会社 プラズマ処理装置
US10340123B2 (en) * 2016-05-26 2019-07-02 Tokyo Electron Limited Multi-frequency power modulation for etching high aspect ratio features
JP7111299B2 (ja) * 2016-11-14 2022-08-02 国立研究開発法人産業技術総合研究所 ダイヤモンドを合成する方法及びプラズマ処理装置
JP6807792B2 (ja) * 2017-03-27 2021-01-06 東京エレクトロン株式会社 プラズマ生成方法及びこれを用いたプラズマ処理方法、並びにプラズマ処理装置
US20190051495A1 (en) * 2017-08-10 2019-02-14 Qiwei Liang Microwave Reactor For Deposition or Treatment of Carbon Compounds
JP7045954B2 (ja) * 2018-07-25 2022-04-01 東京エレクトロン株式会社 ハードマスク用膜を形成する方法および装置、ならびに半導体装置の製造方法
CN110769585B (zh) * 2018-07-27 2023-08-18 北京北方华创微电子装备有限公司 表面波等离子体装置
CN113543443B (zh) * 2021-06-29 2025-01-21 徐子一 一种等离子体发生装置及处理物体的方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0264913B1 (de) * 1986-10-20 1994-06-22 Hitachi, Ltd. Plasmabearbeitungsgerät
KR920002864B1 (ko) * 1987-07-20 1992-04-06 가부시기가이샤 히다찌세이사꾸쇼 플라즈마 처리방법 및 그 장치

Also Published As

Publication number Publication date
DE69030744T2 (de) 1997-10-23
KR930005945B1 (ko) 1993-06-29
KR900013589A (ko) 1990-09-06
EP0382065A2 (de) 1990-08-16
EP0382065A3 (de) 1991-07-17
JPH02209484A (ja) 1990-08-20
EP0382065B1 (de) 1997-05-21
US4985109A (en) 1991-01-15
JP2993675B2 (ja) 1999-12-20

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Legal Events

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