DE69624976T2 - Verfahren zur Herstellung von MOS-Leistungstransistoren - Google Patents

Verfahren zur Herstellung von MOS-Leistungstransistoren

Info

Publication number
DE69624976T2
DE69624976T2 DE69624976T DE69624976T DE69624976T2 DE 69624976 T2 DE69624976 T2 DE 69624976T2 DE 69624976 T DE69624976 T DE 69624976T DE 69624976 T DE69624976 T DE 69624976T DE 69624976 T2 DE69624976 T2 DE 69624976T2
Authority
DE
Germany
Prior art keywords
production
mos transistors
power mos
power
transistors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69624976T
Other languages
English (en)
Other versions
DE69624976D1 (de
Inventor
Min-Koo Han
Chong-Man Yun
Yearn-Ik Choi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of DE69624976D1 publication Critical patent/DE69624976D1/de
Application granted granted Critical
Publication of DE69624976T2 publication Critical patent/DE69624976T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70—Bipolar devices
    • H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/73—Bipolar junction transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66234—Bipolar junction transistors [BJT]
    • H01L29/66325—Bipolar junction transistors [BJT] controlled by field-effect, e.g. insulated gate bipolar transistors [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/1095—Body region, i.e. base region, of DMOS transistors or IGBTs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66234—Bipolar junction transistors [BJT]
    • H01L29/66325—Bipolar junction transistors [BJT] controlled by field-effect, e.g. insulated gate bipolar transistors [IGBT]
    • H01L29/66333—Vertical insulated gate bipolar transistors
    • H01L29/6634—Vertical insulated gate bipolar transistors with a recess formed by etching in the source/emitter contact region
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70—Bipolar devices
    • H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
    • H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
    • H01L29/7395—Vertical transistors, e.g. vertical IGBT
    • H01L29/7396—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70—Bipolar devices
    • H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
    • H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
    • H01L29/7395—Vertical transistors, e.g. vertical IGBT
    • H01L29/7398—Vertical transistors, e.g. vertical IGBT with both emitter and collector contacts in the same substrate side
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
    • H01L29/41725—Source or drain electrodes for field effect devices
    • H01L29/41766—Source or drain electrodes for field effect devices with at least part of the source or drain electrode having contact below the semiconductor surface, e.g. the source or drain electrode formed at least partially in a groove or with inclusions of conductor inside the semiconductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
    • H01L29/7809—Vertical DMOS transistors, i.e. VDMOS transistors having both source and drain contacts on the same surface, i.e. Up-Drain VDMOS transistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Thyristors (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
DE69624976T 1995-05-22 1996-05-16 Verfahren zur Herstellung von MOS-Leistungstransistoren Expired - Lifetime DE69624976T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950012803A KR0143459B1 (ko) 1995-05-22 1995-05-22 모오스 게이트형 전력 트랜지스터

Publications (2)

Publication Number Publication Date
DE69624976D1 DE69624976D1 (de) 2003-01-09
DE69624976T2 true DE69624976T2 (de) 2003-04-24

Family

ID=19415080

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69624976T Expired - Lifetime DE69624976T2 (de) 1995-05-22 1996-05-16 Verfahren zur Herstellung von MOS-Leistungstransistoren

Country Status (5)

Country Link
US (1) US5891776A (de)
EP (1) EP0744769B1 (de)
JP (1) JP2868728B2 (de)
KR (1) KR0143459B1 (de)
DE (1) DE69624976T2 (de)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6043126A (en) * 1996-10-25 2000-03-28 International Rectifier Corporation Process for manufacture of MOS gated device with self aligned cells
US5972741A (en) * 1996-10-31 1999-10-26 Sanyo Electric Co., Ltd. Method of manufacturing semiconductor device
US5879968A (en) 1996-11-18 1999-03-09 International Rectifier Corporation Process for manufacture of a P-channel MOS gated device with base implant through the contact window
KR100418517B1 (ko) * 1996-12-13 2004-05-17 페어차일드코리아반도체 주식회사 전력용 모스트랜지스터
DE19740905C1 (de) * 1997-09-17 1999-03-04 Siemens Ag Verfahren zum Beseitigen von Sauerstoff-Restverunreinigungen aus tiegelgezogenen Siliziumwafern
JP3464382B2 (ja) * 1998-05-18 2003-11-10 ローム株式会社 縦型二重拡散ｍｏｓｆｅｔの製造方法
DE59914556D1 (de) * 1998-12-04 2007-12-27 Infineon Technologies Ag Leistungshalbleiterschalter
JP2000188395A (ja) * 1998-12-22 2000-07-04 Mitsubishi Electric Corp 半導体装置及びその製造方法
US6238981B1 (en) * 1999-05-10 2001-05-29 Intersil Corporation Process for forming MOS-gated devices having self-aligned trenches
US8389370B2 (en) * 1999-08-02 2013-03-05 Schilmass Co. L.L.C. Radiation-tolerant integrated circuit device and method for fabricating
US6133117A (en) * 1999-08-06 2000-10-17 United Microlelectronics Corp. Method of forming trench isolation for high voltage device
US6255694B1 (en) * 2000-01-18 2001-07-03 International Business Machines Corporation Multi-function semiconductor structure and method
US6642577B2 (en) * 2000-03-16 2003-11-04 Denso Corporation Semiconductor device including power MOSFET and peripheral device and method for manufacturing the same
US6921939B2 (en) * 2000-07-20 2005-07-26 Fairchild Semiconductor Corporation Power MOSFET and method for forming same using a self-aligned body implant
FI117488B (fi) * 2001-05-16 2006-10-31 Myorigo Sarl Informaation selaus näytöllä
KR100400079B1 (ko) * 2001-10-10 2003-09-29 한국전자통신연구원 트랜치 게이트 구조를 갖는 전력용 반도체 소자의 제조 방법
ITVA20010045A1 (it) * 2001-12-14 2003-06-16 St Microelectronics Srl Flusso di processo per la realizzazione di un vdmos a canale scalato e basso gradiente di body per prestazioni ad elevata densita' di corren
US6870218B2 (en) * 2002-12-10 2005-03-22 Fairchild Semiconductor Corporation Integrated circuit structure with improved LDMOS design
KR100940113B1 (ko) * 2002-12-26 2010-02-02 매그나칩 반도체 유한회사 고전압 트랜지스터 제조방법
KR100520430B1 (ko) * 2003-11-27 2005-10-11 재단법인서울대학교산학협력재단 수평형 절연게이트 바이폴라 트랜지스터
US7352036B2 (en) 2004-08-03 2008-04-01 Fairchild Semiconductor Corporation Semiconductor power device having a top-side drain using a sinker trench
DE102004057235B4 (de) * 2004-11-26 2007-12-27 Infineon Technologies Ag Vertikaler Trenchtransistor und Verfahren zu dessen Herstellung
WO2006108011A2 (en) 2005-04-06 2006-10-12 Fairchild Semiconductor Corporation Trenched-gate field effect transistors and methods of forming the same
US7314794B2 (en) * 2005-08-08 2008-01-01 International Business Machines Corporation Low-cost high-performance planar back-gate CMOS
US7378317B2 (en) * 2005-12-14 2008-05-27 Freescale Semiconductor, Inc. Superjunction power MOSFET
US7968394B2 (en) * 2005-12-16 2011-06-28 Freescale Semiconductor, Inc. Transistor with immersed contacts and methods of forming thereof
US7790527B2 (en) * 2006-02-03 2010-09-07 International Business Machines Corporation High-voltage silicon-on-insulator transistors and methods of manufacturing the same
US7446374B2 (en) 2006-03-24 2008-11-04 Fairchild Semiconductor Corporation High density trench FET with integrated Schottky diode and method of manufacture
KR100906555B1 (ko) * 2007-08-30 2009-07-07 주식회사 동부하이텍 절연게이트 양극성 트랜지스터 및 그 제조방법
ITMI20072340A1 (it) * 2007-12-14 2009-06-15 St Microelectronics Srl Regioni di guardia profonde migliorate per ridurre il latch-up in dispositivi elettronici
ITMI20072341A1 (it) * 2007-12-14 2009-06-15 St Microelectronics Srl Contatti profondi di dispositivi elettronici integrati basati su regioni inpiantate attraverso solchi
US7795691B2 (en) 2008-01-25 2010-09-14 Cree, Inc. Semiconductor transistor with P type re-grown channel layer
US20100117153A1 (en) * 2008-11-07 2010-05-13 Honeywell International Inc. High voltage soi cmos device and method of manufacture
JP5423018B2 (ja) 2009-02-02 2014-02-19 三菱電機株式会社 半導体装置
JP2011243915A (ja) * 2010-05-21 2011-12-01 Toshiba Corp 半導体装置及びその製造方法
US8742451B2 (en) * 2010-05-24 2014-06-03 Ixys Corporation Power transistor with increased avalanche current and energy rating
CN102403256B (zh) * 2010-09-08 2014-02-26 上海华虹宏力半导体制造有限公司 赝埋层及制造方法、深孔接触及三极管
US8253164B2 (en) * 2010-12-23 2012-08-28 Force Mos Technology Co., Ltd. Fast switching lateral insulated gate bipolar transistor (LIGBT) with trenched contacts
CN103839992A (zh) * 2012-11-23 2014-06-04 中国科学院微电子研究所 一种功率器件—ti-igbt的结构及其制备方法
CN103839987A (zh) * 2012-11-23 2014-06-04 中国科学院微电子研究所 功率器件-mpt-ti-igbt的结构及其制备方法
CN104517832B (zh) * 2013-09-27 2017-09-29 无锡华润上华半导体有限公司 功率二极管的制备方法
JP6526591B2 (ja) * 2016-03-16 2019-06-05 株式会社東芝 半導体装置
CN106409895B (zh) * 2016-06-27 2019-05-10 电子科技大学 一种绝缘栅双极晶体管及其制造方法
SE542311C2 (en) * 2018-03-16 2020-04-07 Klas Haakan Eklund Med Firma K Eklund Innovation A semiconductor device comprising a low voltage insulated gate field effect transistor connected in series with a high voltage field effect transistor
US11031480B2 (en) * 2019-09-13 2021-06-08 K. Eklund Innovation Semiconductor device, comprising an insulated gate field effect transistor connected in series with a field effect transistor
CN111244182B (zh) * 2020-01-19 2023-03-28 深圳市昭矽微电子科技有限公司 金属氧化物半导体场效应晶体管及其制作方法
CN113594039B (zh) * 2020-04-30 2023-11-10 中芯国际集成电路制造(上海)有限公司 半导体结构及其形成方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4419811A (en) * 1982-04-26 1983-12-13 Acrian, Inc. Method of fabricating mesa MOSFET using overhang mask
US4503598A (en) * 1982-05-20 1985-03-12 Fairchild Camera & Instrument Corporation Method of fabricating power MOSFET structure utilizing self-aligned diffusion and etching techniques
US4561168A (en) * 1982-11-22 1985-12-31 Siliconix Incorporated Method of making shadow isolated metal DMOS FET device
US4587713A (en) * 1984-02-22 1986-05-13 Rca Corporation Method for making vertical MOSFET with reduced bipolar effects
EP0202477A3 (de) * 1985-04-24 1988-04-20 General Electric Company Verfahren zum Herstellen elektrischer Kurzschlüsse zwischen benachbarten Gebieten in einer Halbleiteranordnung mit isoliertem Gate
US4895810A (en) * 1986-03-21 1990-01-23 Advanced Power Technology, Inc. Iopographic pattern delineated power mosfet with profile tailored recessed source
JPH0817233B2 (ja) * 1987-11-11 1996-02-21 三菱電機株式会社 絶縁ゲート型バイポーラトランジスタ
JPH0286136A (ja) * 1988-09-22 1990-03-27 Hitachi Ltd 半導体素子およびその製造方法
US4960723A (en) * 1989-03-30 1990-10-02 Motorola, Inc. Process for making a self aligned vertical field effect transistor having an improved source contact
US5132238A (en) * 1989-12-28 1992-07-21 Nissan Motor Co., Ltd. Method of manufacturing semiconductor device utilizing an accumulation layer
JP2526476B2 (ja) * 1993-02-22 1996-08-21 日本電気株式会社 半導体装置の製造方法
JP3217552B2 (ja) * 1993-08-16 2001-10-09 株式会社東芝 横型高耐圧半導体素子

Also Published As

Publication number Publication date
JPH08330589A (ja) 1996-12-13
DE69624976D1 (de) 2003-01-09
EP0744769B1 (de) 2002-11-27
US5891776A (en) 1999-04-06
EP0744769A2 (de) 1996-11-27
KR0143459B1 (ko) 1998-07-01
JP2868728B2 (ja) 1999-03-10
KR960043266A (ko) 1996-12-23
EP0744769A3 (de) 1998-10-07

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