DE69514201T2 - Verfahren zur Herstellung eines Halbleiterbauelements - Google Patents
Verfahren zur Herstellung eines HalbleiterbauelementsInfo
- Publication number
- DE69514201T2 DE69514201T2 DE69514201T DE69514201T DE69514201T2 DE 69514201 T2 DE69514201 T2 DE 69514201T2 DE 69514201 T DE69514201 T DE 69514201T DE 69514201 T DE69514201 T DE 69514201T DE 69514201 T2 DE69514201 T2 DE 69514201T2
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6314185A JPH08148612A (ja) | 1994-11-24 | 1994-11-24 | 半導体装置およびその製造方法 |
JP33903594A JP3443196B2 (ja) | 1994-12-29 | 1994-12-29 | 半導体装置およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69514201D1 DE69514201D1 (de) | 2000-02-03 |
DE69514201T2 true DE69514201T2 (de) | 2000-08-03 |
Family
ID=26567850
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69514201T Expired - Fee Related DE69514201T2 (de) | 1994-11-24 | 1995-11-21 | Verfahren zur Herstellung eines Halbleiterbauelements |
Country Status (3)
Country | Link |
---|---|
US (2) | US5907190A (de) |
EP (1) | EP0714125B1 (de) |
DE (1) | DE69514201T2 (de) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6909179B2 (en) * | 1996-03-18 | 2005-06-21 | Renesas Technology Corp. | Lead frame and semiconductor device using the lead frame and method of manufacturing the same |
US5880530A (en) * | 1996-03-29 | 1999-03-09 | Intel Corporation | Multiregion solder interconnection structure |
DE19724025A1 (de) * | 1997-06-06 | 1998-12-10 | Siemens Ag | Drucksensor-Bauelement und Verfahren zur Herstellung |
DE1025587T1 (de) * | 1997-07-21 | 2001-02-08 | Aguila Technologies Inc | Halbleiter-flipchippackung und herstellungsverfahren dafür |
DE19756887A1 (de) | 1997-12-19 | 1999-07-01 | Siemens Ag | Kunststoffverbundkörper |
JPH11317475A (ja) * | 1998-02-27 | 1999-11-16 | Canon Inc | 半導体用封止材樹脂および半導体素子 |
US6329832B1 (en) | 1998-10-05 | 2001-12-11 | Micron Technology, Inc. | Method for in-line testing of flip-chip semiconductor assemblies |
CN101037581A (zh) * | 1999-08-25 | 2007-09-19 | 日立化成工业株式会社 | 粘合剂,配线端子的连接方法和配线结构体 |
US6373142B1 (en) * | 1999-11-15 | 2002-04-16 | Lsi Logic Corporation | Method of adding filler into a non-filled underfill system by using a highly filled fillet |
JP2001168241A (ja) * | 1999-12-06 | 2001-06-22 | Oki Electric Ind Co Ltd | 封止樹脂充填材の評価用半導体集積回路及び評価方法 |
DE10016380C2 (de) * | 2000-03-29 | 2002-01-24 | Infineon Technologies Ag | Gehäuse für ein elektrisches Bauteil |
SE0101107D0 (sv) * | 2001-03-28 | 2001-03-28 | Ericsson Telefon Ab L M | Encapsulation arrangement |
US6674172B2 (en) | 2001-05-08 | 2004-01-06 | International Business Machines Corporation | Flip-chip package with underfill having low density filler |
DE10123232A1 (de) * | 2001-05-12 | 2002-11-21 | Infineon Technologies Ag | Halbleitermodul |
US6617524B2 (en) * | 2001-12-11 | 2003-09-09 | Motorola, Inc. | Packaged integrated circuit and method therefor |
US6940177B2 (en) * | 2002-05-16 | 2005-09-06 | Dow Corning Corporation | Semiconductor package and method of preparing same |
US20050003216A1 (en) * | 2003-06-30 | 2005-01-06 | Jean-Marc Frances | Microparticle containing silicone release coatings having improved anti-block and release properties |
DE10335155B4 (de) * | 2003-07-31 | 2006-11-30 | Infineon Technologies Ag | Verfahren zum Herstellen einer Anordnung eines elektrischen Bauelements auf einem Substrat |
US7501585B2 (en) * | 2004-04-29 | 2009-03-10 | Infineon Technologies Ag | Semiconductor device support element with fluid-tight boundary |
US20050287350A1 (en) * | 2004-06-28 | 2005-12-29 | Crouthamel David L | Encapsulating compound having reduced dielectric constant |
DE102004031391B4 (de) * | 2004-06-29 | 2009-06-04 | Osram Opto Semiconductors Gmbh | Elektronisches Bauteil mit Gehäuse zum ESD-Schutz |
DE102004043663B4 (de) * | 2004-09-07 | 2006-06-08 | Infineon Technologies Ag | Halbleitersensorbauteil mit Hohlraumgehäuse und Sensorchip und Verfahren zur Herstellung eines Halbleitersensorbauteils mit Hohlraumgehäuse und Sensorchip |
DE102004049654B3 (de) * | 2004-10-11 | 2006-04-13 | Infineon Technologies Ag | Halbleiterbauteil mit Kunststoffgehäuse und Verfahren zur Herstellung desselben |
DE102004049663B3 (de) * | 2004-10-11 | 2006-04-13 | Infineon Technologies Ag | Kunststoffgehäuse und Halbleiterbauteil mit derartigem Kunststoffgehäuse sowie Verfahren zur Herstellung derselben |
TWI393226B (zh) * | 2004-11-04 | 2013-04-11 | Taiwan Semiconductor Mfg | 基於奈米管之填充物 |
JP5203575B2 (ja) * | 2005-05-04 | 2013-06-05 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | コーティング組成物 |
DE102009055765A1 (de) * | 2009-09-30 | 2011-03-31 | Osram Opto Semiconductors Gmbh | Optisches oder optoelektronisches Bauelement und Verfahren zu dessen Herstellung |
US9545043B1 (en) * | 2010-09-28 | 2017-01-10 | Rockwell Collins, Inc. | Shielding encapsulation for electrical circuitry |
US20120081872A1 (en) | 2010-09-30 | 2012-04-05 | Alcatel-Lucent Canada Inc. | Thermal warp compensation ic package |
US9478473B2 (en) * | 2013-05-21 | 2016-10-25 | Globalfoundries Inc. | Fabricating a microelectronics lid using sol-gel processing |
TWI618205B (zh) * | 2015-05-22 | 2018-03-11 | 南茂科技股份有限公司 | 薄膜覆晶封裝體及其散熱方法 |
TWI562326B (en) * | 2015-05-22 | 2016-12-11 | Chipmos Technologies Inc | Stacked chip on film package structure and manufacturing method thereof |
US10340241B2 (en) * | 2015-06-11 | 2019-07-02 | International Business Machines Corporation | Chip-on-chip structure and methods of manufacture |
KR102514042B1 (ko) | 2018-08-01 | 2023-03-24 | 삼성전자주식회사 | 반도체 패키지 및 이의 제조 방법 |
JP7147500B2 (ja) * | 2018-11-19 | 2022-10-05 | 信越化学工業株式会社 | 感光性樹脂組成物、パターン形成方法、及び反射防止膜 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
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DE2616057A1 (de) * | 1975-04-14 | 1976-10-28 | Gen Electric | Organosiloxan-gele |
JPS60257546A (ja) * | 1984-06-04 | 1985-12-19 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
JPS6151834A (ja) * | 1984-08-20 | 1986-03-14 | Mitsubishi Electric Corp | 樹脂封止型半導体装置の製造方法 |
JPH0622265B2 (ja) * | 1985-02-20 | 1994-03-23 | 株式会社日立製作所 | 半導体装置 |
JPS6292344A (ja) * | 1985-10-18 | 1987-04-27 | Hitachi Ltd | 半導体装置 |
JPS6311310A (ja) * | 1986-07-02 | 1988-01-18 | Nippon Sheet Glass Co Ltd | 複合材料 |
JPH01191056A (ja) * | 1988-01-26 | 1989-08-01 | Nippon Sheet Glass Co Ltd | ZnSe単結晶の転位密度の測定方法 |
KR930009213B1 (ko) * | 1988-09-29 | 1993-09-24 | 이노우에 다카오 | 접착 테이프 |
JPH0292344A (ja) * | 1988-09-29 | 1990-04-03 | Toshiba Corp | 超音波プローブ及び該プローブを備えた超音波診断装置 |
JPH02311520A (ja) * | 1989-05-27 | 1990-12-27 | Toshiba Chem Corp | エポキシ樹脂組成物 |
JPH059270A (ja) * | 1991-06-24 | 1993-01-19 | Sumitomo Bakelite Co Ltd | 樹脂組成物およびその製造方法 |
US5243756A (en) * | 1991-06-28 | 1993-09-14 | Digital Equipment Corporation | Integrated circuit protection by liquid encapsulation |
JPH05206325A (ja) * | 1992-01-24 | 1993-08-13 | Hitachi Ltd | 半導体装置 |
JP2988117B2 (ja) * | 1992-03-30 | 1999-12-06 | 日本電気株式会社 | 樹脂封止型半導体装置 |
JP3175979B2 (ja) * | 1992-09-14 | 2001-06-11 | 株式会社東芝 | 樹脂封止型半導体装置 |
US5348913A (en) * | 1993-08-06 | 1994-09-20 | At&T Bell Laboratories | Methods for encapsulating electronic devices |
US5641997A (en) * | 1993-09-14 | 1997-06-24 | Kabushiki Kaisha Toshiba | Plastic-encapsulated semiconductor device |
US5571851A (en) * | 1994-01-28 | 1996-11-05 | J.M. Huber Corporation | Reinforcing fillers for plastics systems |
US5436203A (en) * | 1994-07-05 | 1995-07-25 | Motorola, Inc. | Shielded liquid encapsulated semiconductor device and method for making the same |
-
1995
- 1995-11-21 DE DE69514201T patent/DE69514201T2/de not_active Expired - Fee Related
- 1995-11-21 EP EP95308313A patent/EP0714125B1/de not_active Expired - Lifetime
- 1995-11-21 US US08/561,472 patent/US5907190A/en not_active Expired - Fee Related
-
1999
- 1999-01-25 US US09/237,610 patent/US5989942A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0714125A2 (de) | 1996-05-29 |
EP0714125A3 (de) | 1996-07-17 |
US5907190A (en) | 1999-05-25 |
EP0714125B1 (de) | 1999-12-29 |
DE69514201D1 (de) | 2000-02-03 |
US5989942A (en) | 1999-11-23 |
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