DE69833829D1 - Verfahren zur Herstellung eines Halbleiter-Speicherbauteils - Google Patents

Verfahren zur Herstellung eines Halbleiter-Speicherbauteils

Info

Publication number
DE69833829D1
DE69833829D1 DE69833829T DE69833829T DE69833829D1 DE 69833829 D1 DE69833829 D1 DE 69833829D1 DE 69833829 T DE69833829 T DE 69833829T DE 69833829 T DE69833829 T DE 69833829T DE 69833829 D1 DE69833829 D1 DE 69833829D1
Authority
DE
Germany
Prior art keywords
manufacturing
memory device
semiconductor memory
semiconductor
memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69833829T
Other languages
English (en)
Other versions
DE69833829T2 (de
Inventor
Young-Woo Park
Jun-Yong Noh
Bon-Young Koo
Chang-Jin Kang
Chul Jung
Seok-Woo Nam
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of DE69833829D1 publication Critical patent/DE69833829D1/de
Application granted granted Critical
Publication of DE69833829T2 publication Critical patent/DE69833829T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03—Making the capacitor or connections thereto
    • H10B12/033—Making the capacitor or connections thereto the capacitor extending over the transistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03—Making the capacitor or connections thereto
    • H10B12/033—Making the capacitor or connections thereto the capacitor extending over the transistor
    • H10B12/0335—Making a connection between the transistor and the capacitor, e.g. plug
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/48—Data lines or contacts therefor
    • H10B12/482—Bit lines

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Memories (AREA)
DE69833829T 1997-06-10 1998-01-16 Verfahren zur Herstellung eines Halbleiter-Speicherbauteils Expired - Lifetime DE69833829T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR9723917 1997-06-10
KR1019970023917A KR100234379B1 (ko) 1997-06-10 1997-06-10 비트라인의 산화를 방지하기 위한 반도체 메모리장치의 제조방법

Publications (2)

Publication Number Publication Date
DE69833829D1 true DE69833829D1 (de) 2006-05-11
DE69833829T2 DE69833829T2 (de) 2006-11-30

Family

ID=19509098

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69833829T Expired - Lifetime DE69833829T2 (de) 1997-06-10 1998-01-16 Verfahren zur Herstellung eines Halbleiter-Speicherbauteils

Country Status (8)

Country Link
US (1) US7282407B1 (de)
EP (2) EP1521303A3 (de)
JP (1) JPH1117150A (de)
KR (1) KR100234379B1 (de)
CN (1) CN1128474C (de)
DE (1) DE69833829T2 (de)
RU (1) RU2234763C2 (de)
TW (1) TW451418B (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100533376B1 (ko) * 1998-12-30 2006-04-21 주식회사 하이닉스반도체 반도체 장치의 크라운형 커패시터 제조 방법
KR100482753B1 (ko) * 1999-11-09 2005-04-14 주식회사 하이닉스반도체 반도체 소자의 캐패시터 제조방법
KR100416659B1 (ko) * 2001-06-28 2004-01-31 동부전자 주식회사 반도체장치의 커패시터 제조방법
KR101039136B1 (ko) * 2004-12-20 2011-06-03 주식회사 하이닉스반도체 코아 영역의 디자인 룰을 줄일 수 있는 반도체 소자의제조방법
KR100714893B1 (ko) * 2005-12-29 2007-05-04 삼성전자주식회사 식각저지막을 갖는 반도체소자의 제조방법 및 관련된 소자
JP5223167B2 (ja) * 2006-03-06 2013-06-26 富士通株式会社 磁気抵抗効果素子を含む半導体装置及びその製造方法
US20080149978A1 (en) * 2006-12-21 2008-06-26 Till Schloesser Memory device and method of fabricating a memory device
TWI405271B (zh) * 2010-12-30 2013-08-11 Anpec Electronics Corp 製作具有超級介面之功率半導體元件之方法
TWI517463B (zh) * 2012-11-20 2016-01-11 佳能安內華股份有限公司 磁阻效應元件之製造方法
CN104681538B (zh) * 2013-11-26 2017-09-22 中芯国际集成电路制造(上海)有限公司 接触孔及其形成方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5196364A (en) * 1990-10-24 1993-03-23 Micron Technology, Inc. Method of making a stacked capacitor dram cell
US5126280A (en) * 1991-02-08 1992-06-30 Micron Technology, Inc. Stacked multi-poly spacers with double cell plate capacitor
TW243541B (de) * 1991-08-31 1995-03-21 Samsung Electronics Co Ltd
JPH05121655A (ja) * 1991-10-25 1993-05-18 Nec Corp 半導体装置の製造方法
KR960002073B1 (ko) 1992-06-10 1996-02-10 삼성전자주식회사 반도체 장치의 제조방법
US5445999A (en) * 1992-11-13 1995-08-29 Micron Technology, Inc. Advanced technique to improve the bonding arrangement on silicon surfaces to promote uniform nitridation
JP2972554B2 (ja) 1995-05-31 1999-11-08 日本電気株式会社 半導体装置の製造方法
US5595928A (en) * 1995-09-18 1997-01-21 Vanguard International Semiconductor Corporation High density dynamic random access memory cell structure having a polysilicon pillar capacitor
JPH09139478A (ja) * 1995-11-10 1997-05-27 Nippon Steel Corp 半導体記憶装置の製造方法
TW311256B (en) * 1996-09-21 1997-07-21 Nanya Technology Co Ltd Manufacturing method of dynamic random access memory
KR100244288B1 (ko) * 1997-06-05 2000-02-01 김영환 반도체소자의 커패시터 제조방법
US5763306A (en) * 1997-10-24 1998-06-09 Vanguard International Semiconductor Corporation Method of fabricating capacitor over bit line COB structure for a very high density DRAM applications

Also Published As

Publication number Publication date
EP0884777A2 (de) 1998-12-16
JPH1117150A (ja) 1999-01-22
RU2234763C2 (ru) 2004-08-20
CN1128474C (zh) 2003-11-19
EP1521303A2 (de) 2005-04-06
KR100234379B1 (ko) 1999-12-15
DE69833829T2 (de) 2006-11-30
EP1521303A3 (de) 2005-09-28
CN1202003A (zh) 1998-12-16
KR19990000815A (ko) 1999-01-15
EP0884777A3 (de) 2000-03-29
EP0884777B1 (de) 2006-03-15
TW451418B (en) 2001-08-21
US7282407B1 (en) 2007-10-16

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Legal Events

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