DE69417368T2 - Reinigungsbehälter für Halbleitersubstrate - Google Patents

Reinigungsbehälter für Halbleitersubstrate

Info

Publication number
DE69417368T2
DE69417368T2 DE69417368T DE69417368T DE69417368T2 DE 69417368 T2 DE69417368 T2 DE 69417368T2 DE 69417368 T DE69417368 T DE 69417368T DE 69417368 T DE69417368 T DE 69417368T DE 69417368 T2 DE69417368 T2 DE 69417368T2
Authority
DE
Germany
Prior art keywords
semiconductor substrates
cleaning containers
containers
cleaning
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69417368T
Other languages
English (en)
Other versions
DE69417368D1 (de
Inventor
Hideo Kudo
Isao Uchiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of DE69417368D1 publication Critical patent/DE69417368D1/de
Application granted granted Critical
Publication of DE69417368T2 publication Critical patent/DE69417368T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S269/00—Work holders
    • Y10S269/903—Work holder for electrical circuit assemblages or wiring systems
DE69417368T 1993-12-14 1994-12-12 Reinigungsbehälter für Halbleitersubstrate Expired - Fee Related DE69417368T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5312948A JP2888409B2 (ja) 1993-12-14 1993-12-14 ウェーハ洗浄槽

Publications (2)

Publication Number Publication Date
DE69417368D1 DE69417368D1 (de) 1999-04-29
DE69417368T2 true DE69417368T2 (de) 1999-09-30

Family

ID=18035409

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69417368T Expired - Fee Related DE69417368T2 (de) 1993-12-14 1994-12-12 Reinigungsbehälter für Halbleitersubstrate

Country Status (4)

Country Link
US (1) US5503173A (de)
EP (1) EP0658923B1 (de)
JP (1) JP2888409B2 (de)
DE (1) DE69417368T2 (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2609815B2 (ja) * 1994-07-22 1997-05-14 九州日本電気株式会社 ウェット処理装置
JP3145252B2 (ja) * 1994-07-29 2001-03-12 淀川化成株式会社 基板支承用側板およびそれを用いたカセット
KR100278731B1 (ko) * 1995-05-05 2001-03-02 보스트 스티븐 엘. 슬립 방지 수직 선반
US5713474A (en) * 1995-08-28 1998-02-03 Viasystems Technologies Corporation Innerlayer surface treating rack
DE19545881C2 (de) * 1995-12-08 1999-09-23 Ibm Halte- und Abstandsveränderungsvorrichtung
US5823361A (en) * 1996-02-06 1998-10-20 Progressive System Technologies, Inc. Substrate support apparatus for a substrate housing
DE19655219C2 (de) * 1996-04-24 2003-11-06 Steag Micro Tech Gmbh Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter
US5759273A (en) 1996-07-16 1998-06-02 Micron Technology, Inc. Cross-section sample staining tool
US6041938A (en) * 1996-08-29 2000-03-28 Scp Global Technologies Compliant process cassette
KR100226489B1 (ko) * 1996-12-28 1999-10-15 김영환 웨이퍼 지지 및 이송 기구
JPH10223585A (ja) 1997-02-04 1998-08-21 Canon Inc ウェハ処理装置及びその方法並びにｓｏｉウェハの製造方法
US6391067B2 (en) 1997-02-04 2002-05-21 Canon Kabushiki Kaisha Wafer processing apparatus and method, wafer convey robot, semiconductor substrate fabrication method, and semiconductor fabrication apparatus
DE19706072C1 (de) * 1997-02-17 1998-06-04 Steag Microtech Gmbh Pliezhaus Vorrichtung und Verfahren zum Behandeln von Substraten in einem Fluid-Behälter
JP3560011B2 (ja) * 1998-02-24 2004-09-02 東京エレクトロン株式会社 基板保持具
US6039187A (en) * 1998-08-17 2000-03-21 Micron Technology, Inc. Off center three point carrier for wet processing semiconductor substrates
DE19859468C2 (de) * 1998-12-22 2002-01-17 Steag Micro Tech Gmbh Vorrichtung zum Behandeln und Handhaben von Substraten
US6340090B1 (en) * 1999-01-07 2002-01-22 Tooltek Engineering Corporation Substrate fixturing device
JP2001000934A (ja) 1999-06-18 2001-01-09 Fujitsu Ltd ローバー剥がし洗浄治具およびローバー剥がし洗浄方法
US6871657B2 (en) * 2001-04-06 2005-03-29 Akrion, Llc Low profile wafer carrier
CN100447312C (zh) * 2002-07-17 2008-12-31 中国石油化工股份有限公司 一种远红外磁性纤维及其制造方法
JP2004207503A (ja) * 2002-12-25 2004-07-22 Canon Inc 処理装置
FR2858306B1 (fr) * 2003-07-28 2007-11-23 Semco Engineering Sa Support de plaquettes, convertible pouvant recevoir au moins deux types de plaquettes differencies par la dimension des plaquettes.
US7748542B2 (en) * 2005-08-31 2010-07-06 Applied Materials, Inc. Batch deposition tool and compressed boat
DE102006059810A1 (de) * 2006-12-15 2008-06-19 Rena Sondermaschinen Gmbh Vorrichtung und Verfahren zum Reinigen von Gegenständen, insbesondere von dünnen Scheiben
KR101231182B1 (ko) * 2007-09-12 2013-02-07 삼성전자주식회사 반도체 세정 설비의 웨이퍼 브로큰 방지용 웨이퍼 가이드
WO2009098042A1 (en) * 2008-02-06 2009-08-13 Meyer Burger Ag Device for cleaning flat substrates
JP5966250B2 (ja) * 2011-03-16 2016-08-10 富士電機株式会社 基板支持治具
DE102014207266A1 (de) * 2014-04-15 2015-10-15 Siltronic Ag Verfahren zum Trocknen von scheibenförmigen Substraten undScheibenhalter zur Durchführung des Verfahrens
US10068787B2 (en) * 2016-12-30 2018-09-04 Sunpower Corporation Bowing semiconductor wafers
CN108816882A (zh) * 2018-06-11 2018-11-16 镇江建华轴承有限公司 一种用于轴承的清洗装置
CN111524831B (zh) * 2020-04-24 2022-04-15 江苏芯梦半导体设备有限公司 清洗机花篮运送机构
CN114985365B (zh) * 2022-04-18 2023-07-14 江苏鑫华半导体科技股份有限公司 多晶硅样芯清洗分析方法以及系统

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5285477A (en) * 1976-01-09 1977-07-15 Senken Kk Wafer carrying container for integrated circuit
JPS5375068U (de) * 1976-11-25 1978-06-22
US4191295A (en) * 1978-08-14 1980-03-04 Rca Corporation Processing rack
JPS59134834A (ja) * 1983-01-21 1984-08-02 Mitsubishi Electric Corp 半導体ウエハの洗浄装置
JPS59199477A (ja) * 1983-04-25 1984-11-12 住友電気工業株式会社 ウエハ−ボツクス
JPS63173245U (de) * 1987-04-30 1988-11-10
FR2626261B1 (fr) * 1988-01-26 1992-08-14 Recif Sa Appareil elevateur de plaquettes de silicium notamment
NL8900480A (nl) * 1989-02-27 1990-09-17 Philips Nv Werkwijze en inrichting voor het drogen van substraten na behandeling in een vloeistof.
JPH03116731A (ja) * 1989-09-28 1991-05-17 Dan Kagaku:Kk 半導体ウエハ用移送装置
JPH03231428A (ja) * 1990-02-07 1991-10-15 Hitachi Cable Ltd 半導体ウエハの洗浄方法
JPH03266431A (ja) * 1990-03-15 1991-11-27 Fujitsu Ltd 基板の洗浄装置
JPH049619A (ja) * 1990-04-26 1992-01-14 Tokyo Electric Co Ltd 電子料金秤
JP2913119B2 (ja) * 1991-05-07 1999-06-28 東京エレクトロン株式会社 被洗浄体の移載方法及びその装置並びに被移載体の位置決め装置
JP2767165B2 (ja) * 1991-07-31 1998-06-18 信越半導体株式会社 ウエーハ洗浄槽

Also Published As

Publication number Publication date
EP0658923B1 (de) 1999-03-24
EP0658923A1 (de) 1995-06-21
DE69417368D1 (de) 1999-04-29
JPH07169731A (ja) 1995-07-04
US5503173A (en) 1996-04-02
JP2888409B2 (ja) 1999-05-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee