DE69409586D1 - Verpacken von Hochleistungshalbleiterlasern - Google Patents
Verpacken von HochleistungshalbleiterlasernInfo
- Publication number
- DE69409586D1 DE69409586D1 DE69409586T DE69409586T DE69409586D1 DE 69409586 D1 DE69409586 D1 DE 69409586D1 DE 69409586 T DE69409586 T DE 69409586T DE 69409586 T DE69409586 T DE 69409586T DE 69409586 D1 DE69409586 D1 DE 69409586D1
- Authority
- DE
- Germany
- Prior art keywords
- packaging
- high power
- power semiconductor
- semiconductor lasers
- lasers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/0014—Measuring characteristics or properties thereof
- H01S5/0021—Degradation or life time measurements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
- H01S5/0287—Facet reflectivity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02218—Material of the housings; Filling of the housings
- H01S5/0222—Gas-filled housings
- H01S5/02224—Gas-filled housings the gas comprising oxygen, e.g. for avoiding contamination of the light emitting facets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02235—Getter material for absorbing contamination
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Semiconductor Lasers (AREA)
- Packages (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/091,657 US5392305A (en) | 1993-07-14 | 1993-07-14 | Packaging of high power semiconductor lasers |
US08/168,125 US5513198A (en) | 1993-07-14 | 1993-12-17 | Packaging of high power semiconductor lasers |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69409586D1 true DE69409586D1 (de) | 1998-05-20 |
DE69409586T2 DE69409586T2 (de) | 1998-10-15 |
Family
ID=26784203
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69409586T Expired - Fee Related DE69409586T2 (de) | 1993-07-14 | 1994-07-14 | Verpacken von Hochleistungshalbleiterlasern |
Country Status (9)
Country | Link |
---|---|
US (3) | US5513198A (de) |
EP (1) | EP0634822B1 (de) |
JP (1) | JP3452214B2 (de) |
KR (1) | KR100298149B1 (de) |
CN (1) | CN1063587C (de) |
AU (1) | AU672705B2 (de) |
CA (1) | CA2128068C (de) |
DE (1) | DE69409586T2 (de) |
TW (1) | TW291471B (de) |
Families Citing this family (67)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5513198A (en) * | 1993-07-14 | 1996-04-30 | Corning Incorporated | Packaging of high power semiconductor lasers |
BE1007779A3 (nl) * | 1993-11-25 | 1995-10-17 | Philips Electronics Nv | Opto-electronische halfgeleiderinrichting met een straling-emitterende halfgeleiderdiode en werkwijze van een dergelijke inrichting. |
US5696785A (en) * | 1994-10-11 | 1997-12-09 | Corning Incorporated | Impurity getters in laser enclosures |
CA2162095A1 (en) * | 1994-12-27 | 1996-06-28 | Jeffery Alan Demeritt | Getter housing for electronic packages |
US5898211A (en) * | 1996-04-30 | 1999-04-27 | Cutting Edge Optronics, Inc. | Laser diode package with heat sink |
JPH10178077A (ja) * | 1996-12-17 | 1998-06-30 | Nec Corp | 半導体基板の定量汚染試料の作製方法 |
SG72795A1 (en) * | 1997-03-21 | 2000-05-23 | Tokuyama Corp | Container for holding high-purity isopropyl alcohol |
EP1038312A1 (de) * | 1998-01-07 | 2000-09-27 | Fed Corporation | Verfahren und vorrichtung zum behausen integrierter anzeigen |
US5913108A (en) * | 1998-04-30 | 1999-06-15 | Cutting Edge Optronics, Inc. | Laser diode packaging |
US6008529A (en) * | 1998-06-25 | 1999-12-28 | Bily Wang | Laser diode package |
US6303986B1 (en) | 1998-07-29 | 2001-10-16 | Silicon Light Machines | Method of and apparatus for sealing an hermetic lid to a semiconductor die |
JP2000133736A (ja) | 1998-10-26 | 2000-05-12 | Furukawa Electric Co Ltd:The | 半導体レーザ素子の気密封止方法及び気密封止装置 |
US6123464A (en) * | 1999-02-10 | 2000-09-26 | The Furukawa Electric Co., Ltd. | Optical module package and method for manufacturing the same |
US6636538B1 (en) | 1999-03-29 | 2003-10-21 | Cutting Edge Optronics, Inc. | Laser diode packaging |
US6220767B1 (en) | 1999-05-14 | 2001-04-24 | Corning Incorporated | Semiconductor laser optical waveguide telecommunications module and method of making |
TWI233430B (en) * | 2000-01-28 | 2005-06-01 | Shinetsu Chemical Co | Method for manufacturing glass base material, glass base material, and optical fiber |
US6590283B1 (en) * | 2000-02-28 | 2003-07-08 | Agere Systems Inc. | Method for hermetic leadless device interconnect using a submount |
JP4629843B2 (ja) * | 2000-09-29 | 2011-02-09 | 古河電気工業株式会社 | 半導体レーザモジュール及びその製造方法並びにシステム |
US6387723B1 (en) * | 2001-01-19 | 2002-05-14 | Silicon Light Machines | Reduced surface charging in silicon-based devices |
US6700913B2 (en) | 2001-05-29 | 2004-03-02 | Northrop Grumman Corporation | Low cost high integrity diode laser array |
JP2003110180A (ja) * | 2001-07-25 | 2003-04-11 | Furukawa Electric Co Ltd:The | 半導体レーザモジュール並びに光測定方法及び光測定装置 |
US6930364B2 (en) * | 2001-09-13 | 2005-08-16 | Silicon Light Machines Corporation | Microelectronic mechanical system and methods |
JP2003163407A (ja) * | 2001-11-28 | 2003-06-06 | Fujitsu Ltd | 光半導体装置 |
US7110425B2 (en) * | 2002-04-03 | 2006-09-19 | Fuji Photo Film Co., Ltd. | Laser module and production process thereof |
US6767751B2 (en) * | 2002-05-28 | 2004-07-27 | Silicon Light Machines, Inc. | Integrated driver process flow |
US6829258B1 (en) | 2002-06-26 | 2004-12-07 | Silicon Light Machines, Inc. | Rapidly tunable external cavity laser |
US6813059B2 (en) | 2002-06-28 | 2004-11-02 | Silicon Light Machines, Inc. | Reduced formation of asperities in contact micro-structures |
US7160368B1 (en) | 2002-07-12 | 2007-01-09 | Em4, Inc. | System and method for gettering gas-phase contaminants within a sealed enclosure |
DE10241983A1 (de) * | 2002-09-11 | 2004-03-25 | Tui Laser Ag | Festkörperlasersystem mit Gehäuse sowie Verfahren zur Montage |
US6829077B1 (en) | 2003-02-28 | 2004-12-07 | Silicon Light Machines, Inc. | Diffractive light modulator with dynamically rotatable diffraction plane |
US6806997B1 (en) | 2003-02-28 | 2004-10-19 | Silicon Light Machines, Inc. | Patterned diffractive light modulator ribbon for PDL reduction |
TWI236196B (en) * | 2003-04-24 | 2005-07-11 | Sanyo Electric Co | Semiconductor laser device |
US7553355B2 (en) * | 2003-06-23 | 2009-06-30 | Matheson Tri-Gas | Methods and materials for the reduction and control of moisture and oxygen in OLED devices |
US20050044802A1 (en) * | 2003-08-27 | 2005-03-03 | Bellman Robert A. | Method and module for improving the lifetime of metal fluoride optical elements |
US7560820B2 (en) * | 2004-04-15 | 2009-07-14 | Saes Getters S.P.A. | Integrated getter for vacuum or inert gas packaged LEDs |
CN101132113A (zh) * | 2004-05-26 | 2008-02-27 | 夏普株式会社 | 氮化物半导体激光器件 |
JP2006013436A (ja) * | 2004-05-26 | 2006-01-12 | Sharp Corp | 窒化物半導体レーザ装置、その製造方法およびその組み立て装置 |
JP4030556B2 (ja) * | 2005-06-30 | 2008-01-09 | シャープ株式会社 | 窒化物半導体レーザ素子および窒化物半導体レーザ装置 |
CN100454694C (zh) * | 2005-08-02 | 2009-01-21 | 夏普株式会社 | 氮化物半导体发光器件 |
KR100694019B1 (ko) * | 2006-02-16 | 2007-03-12 | 주식회사 두산 | 유기 전계 발광소자용 패키징 재료 |
JP2007280975A (ja) * | 2006-03-13 | 2007-10-25 | Mitsubishi Electric Corp | 半導体レーザ |
JP5030625B2 (ja) * | 2006-03-22 | 2012-09-19 | 三洋電機株式会社 | 半導体レーザ装置 |
US7656915B2 (en) | 2006-07-26 | 2010-02-02 | Northrop Grumman Space & Missions Systems Corp. | Microchannel cooler for high efficiency laser diode heat extraction |
JP4895791B2 (ja) | 2006-12-14 | 2012-03-14 | 株式会社リコー | 光学装置、半導体レーザモジュール、光走査装置及び画像形成装置 |
WO2010075254A2 (en) * | 2008-12-22 | 2010-07-01 | Ams Research Corporation | Laser resonator |
US8345720B2 (en) | 2009-07-28 | 2013-01-01 | Northrop Grumman Systems Corp. | Laser diode ceramic cooler having circuitry for control and feedback of laser diode performance |
US9498846B2 (en) | 2010-03-29 | 2016-11-22 | The Aerospace Corporation | Systems and methods for preventing or reducing contamination enhanced laser induced damage (C-LID) to optical components using gas phase additives |
US8672929B2 (en) | 2010-12-15 | 2014-03-18 | Ams Research Corporation | Laser probe tip |
US9590388B2 (en) | 2011-01-11 | 2017-03-07 | Northrop Grumman Systems Corp. | Microchannel cooler for a single laser diode emitter based system |
US8660164B2 (en) | 2011-03-24 | 2014-02-25 | Axsun Technologies, Inc. | Method and system for avoiding package induced failure in swept semiconductor source |
US8937976B2 (en) | 2012-08-15 | 2015-01-20 | Northrop Grumman Systems Corp. | Tunable system for generating an optical pulse based on a double-pass semiconductor optical amplifier |
US9323051B2 (en) | 2013-03-13 | 2016-04-26 | The Aerospace Corporation | Systems and methods for inhibiting contamination enhanced laser induced damage (CELID) based on fluorinated self-assembled monolayers disposed on optics |
US9625671B2 (en) | 2013-10-23 | 2017-04-18 | Lasermax, Inc. | Laser module and system |
US9859680B2 (en) | 2013-12-17 | 2018-01-02 | Lasermax, Inc. | Shock resistant laser module |
KR101549406B1 (ko) * | 2014-04-04 | 2015-09-03 | 코닝정밀소재 주식회사 | 발광 다이오드의 색변환용 기판 및 그 제조방법 |
JP6624899B2 (ja) * | 2015-11-18 | 2019-12-25 | 住友電気工業株式会社 | 光モジュール及び光モジュールの製造方法 |
ITUB20160888A1 (it) * | 2016-02-19 | 2017-08-19 | Getters Spa | Sistema led |
US11079227B2 (en) | 2019-04-01 | 2021-08-03 | Honeywell International Inc. | Accelerometer system enclosing gas |
US11119116B2 (en) | 2019-04-01 | 2021-09-14 | Honeywell International Inc. | Accelerometer for determining an acceleration based on modulated optical signals |
US10705112B1 (en) | 2019-04-22 | 2020-07-07 | Honeywell International Inc. | Noise rejection for optomechanical devices |
US10956768B2 (en) | 2019-04-22 | 2021-03-23 | Honeywell International Inc. | Feedback cooling and detection for optomechanical devices |
US11119114B2 (en) | 2019-07-17 | 2021-09-14 | Honeywell International Inc. | Anchor structure for securing optomechanical structure |
US11408911B2 (en) | 2019-07-17 | 2022-08-09 | Honeywell International Inc. | Optomechanical structure with corrugated edge |
US11372019B2 (en) | 2019-08-13 | 2022-06-28 | Honeywell International Inc. | Optomechanical resonator stabilization for optomechanical devices |
US11408912B2 (en) | 2019-08-13 | 2022-08-09 | Honeywell International Inc. | Feedthrough rejection for optomechanical devices |
US11150264B2 (en) | 2019-08-13 | 2021-10-19 | Honeywell International Inc. | Feedthrough rejection for optomechanical devices using elements |
DE102022102087A1 (de) | 2022-01-28 | 2023-08-03 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Laserpackage und verfahren zur herstellung eines laserpackage |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3576474A (en) * | 1968-02-23 | 1971-04-27 | Gen Motors Corp | Passivated power rectifier |
US3810044A (en) * | 1973-02-22 | 1974-05-07 | Hughes Aircraft Co | Methods for protecting laser optical elements from surface damage |
US4352119A (en) * | 1979-09-17 | 1982-09-28 | Beckman Instruments, Inc. | Electrical device and method for particle entrapment device for an electrical component |
JPS5661761A (en) * | 1979-10-24 | 1981-05-27 | Toshiba Corp | Metal-vapor electric-discharge lamp |
JPS5941620A (ja) * | 1982-08-31 | 1984-03-07 | Mazda Motor Corp | ディ−ゼルエンジンの排気ガス浄化装置 |
FR2538618B1 (fr) * | 1982-12-28 | 1986-03-07 | Inf Milit Spatiale Aeronaut | Boitier pour composant electronique comportant un element fixant l'humidite |
US4656638A (en) * | 1983-02-14 | 1987-04-07 | Xerox Corporation | Passivation for surfaces and interfaces of semiconductor laser facets or the like |
US4563368A (en) * | 1983-02-14 | 1986-01-07 | Xerox Corporation | Passivation for surfaces and interfaces of semiconductor laser facets or the like |
NL8300631A (nl) * | 1983-02-21 | 1984-09-17 | Philips Nv | Inrichting voor het opwekken van coherente straling. |
JPS59208860A (ja) * | 1983-05-13 | 1984-11-27 | Hitachi Micro Comput Eng Ltd | 半導体装置 |
JPS60186076A (ja) * | 1984-03-05 | 1985-09-21 | Nippon Telegr & Teleph Corp <Ntt> | 半導体発光装置 |
US4631267A (en) * | 1985-03-18 | 1986-12-23 | Corning Glass Works | Method of producing high-strength high surface area catalyst supports |
JPS62212220A (ja) * | 1986-03-13 | 1987-09-18 | Toyo Soda Mfg Co Ltd | ゼオライト成型体の製造方法 |
JPS62297211A (ja) * | 1986-06-13 | 1987-12-24 | Kanebo Ltd | ゼオライト多孔体及びその製造法 |
US4769345A (en) * | 1987-03-12 | 1988-09-06 | Olin Corporation | Process for producing a hermetically sealed package for an electrical component containing a low amount of oxygen and water vapor |
GB8807385D0 (en) * | 1988-03-29 | 1988-05-05 | British Telecomm | Semiconductor device assembly |
US4980137A (en) * | 1989-04-03 | 1990-12-25 | Sanitech, Inc. | Process for NOx and CO control |
US5144634A (en) * | 1989-09-07 | 1992-09-01 | International Business Machines Corporation | Method for mirror passivation of semiconductor laser diodes |
JPH0484480A (ja) * | 1990-07-27 | 1992-03-17 | Nec Corp | チップキャリア型複合光素子 |
JP2820557B2 (ja) * | 1991-08-01 | 1998-11-05 | 富士通株式会社 | 伝送ネットワーク集中監視システム |
JPH05343812A (ja) * | 1992-06-12 | 1993-12-24 | Kubota Corp | 半導体装置 |
US5392305A (en) * | 1993-07-14 | 1995-02-21 | Corning Incorporated | Packaging of high power semiconductor lasers |
US5513198A (en) * | 1993-07-14 | 1996-04-30 | Corning Incorporated | Packaging of high power semiconductor lasers |
-
1993
- 1993-12-17 US US08/168,125 patent/US5513198A/en not_active Expired - Lifetime
-
1994
- 1994-07-14 CA CA002128068A patent/CA2128068C/en not_active Expired - Fee Related
- 1994-07-14 AU AU67440/94A patent/AU672705B2/en not_active Ceased
- 1994-07-14 EP EP94305179A patent/EP0634822B1/de not_active Expired - Lifetime
- 1994-07-14 JP JP18413694A patent/JP3452214B2/ja not_active Expired - Lifetime
- 1994-07-14 KR KR1019940016986A patent/KR100298149B1/ko not_active IP Right Cessation
- 1994-07-14 DE DE69409586T patent/DE69409586T2/de not_active Expired - Fee Related
- 1994-07-14 CN CN94108432A patent/CN1063587C/zh not_active Expired - Fee Related
- 1994-07-27 TW TW083106975A patent/TW291471B/zh active
-
1995
- 1995-06-07 US US08/481,008 patent/US5629952A/en not_active Expired - Lifetime
-
1997
- 1997-04-07 US US08/833,548 patent/US5770473A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5629952A (en) | 1997-05-13 |
TW291471B (de) | 1996-11-21 |
KR960016028A (ko) | 1996-05-22 |
JP3452214B2 (ja) | 2003-09-29 |
KR100298149B1 (ko) | 2001-10-24 |
US5513198A (en) | 1996-04-30 |
CN1103373A (zh) | 1995-06-07 |
CA2128068A1 (en) | 1995-01-15 |
US5770473A (en) | 1998-06-23 |
CA2128068C (en) | 1998-12-15 |
AU672705B2 (en) | 1996-10-10 |
DE69409586T2 (de) | 1998-10-15 |
CN1063587C (zh) | 2001-03-21 |
AU6744094A (en) | 1995-01-27 |
JPH07147457A (ja) | 1995-06-06 |
EP0634822B1 (de) | 1998-04-15 |
EP0634822A1 (de) | 1995-01-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |