DE69229814D1 - Methode für die Trockenätzung - Google Patents
Methode für die TrockenätzungInfo
- Publication number
- DE69229814D1 DE69229814D1 DE69229814T DE69229814T DE69229814D1 DE 69229814 D1 DE69229814 D1 DE 69229814D1 DE 69229814 T DE69229814 T DE 69229814T DE 69229814 T DE69229814 T DE 69229814T DE 69229814 D1 DE69229814 D1 DE 69229814D1
- Authority
- DE
- Germany
- Prior art keywords
- dry etching
- etching method
- dry
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
- H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
- H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
- H01L21/32137—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas of silicon-containing layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Drying Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12429791A JP3210359B2 (ja) | 1991-05-29 | 1991-05-29 | ドライエッチング方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69229814D1 true DE69229814D1 (de) | 1999-09-23 |
DE69229814T2 DE69229814T2 (de) | 2000-01-20 |
Family
ID=14881849
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69229814T Expired - Lifetime DE69229814T2 (de) | 1991-05-29 | 1992-05-26 | Methode für die Trockenätzung |
Country Status (6)
Country | Link |
---|---|
US (1) | US5259923A (de) |
EP (1) | EP0516043B1 (de) |
JP (1) | JP3210359B2 (de) |
KR (1) | KR0170412B1 (de) |
DE (1) | DE69229814T2 (de) |
TW (1) | TW282561B (de) |
Families Citing this family (67)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06151382A (ja) * | 1992-11-11 | 1994-05-31 | Toshiba Corp | ドライエッチング方法 |
JP3181741B2 (ja) * | 1993-01-11 | 2001-07-03 | 富士通株式会社 | 半導体装置の製造方法 |
US5421957A (en) * | 1993-07-30 | 1995-06-06 | Applied Materials, Inc. | Low temperature etching in cold-wall CVD systems |
US5759922A (en) * | 1993-08-25 | 1998-06-02 | Micron Technology, Inc. | Control of etch profiles during extended overetch |
US5354417A (en) * | 1993-10-13 | 1994-10-11 | Applied Materials, Inc. | Etching MoSi2 using SF6, HBr and O2 |
JP3172758B2 (ja) * | 1993-11-20 | 2001-06-04 | 東京エレクトロン株式会社 | プラズマエッチング方法 |
JPH07221076A (ja) * | 1994-02-07 | 1995-08-18 | Nec Corp | エッチング方法及びこれに用いられる装置 |
JPH07331460A (ja) * | 1994-06-02 | 1995-12-19 | Nippon Telegr & Teleph Corp <Ntt> | ドライエッチング方法 |
JP2792459B2 (ja) * | 1995-03-31 | 1998-09-03 | 日本電気株式会社 | 半導体装置の製造方法 |
JP3028927B2 (ja) * | 1996-02-16 | 2000-04-04 | 日本電気株式会社 | 高融点金属膜のドライエッチング方法 |
US5698113A (en) * | 1996-02-22 | 1997-12-16 | The Regents Of The University Of California | Recovery of Mo/Si multilayer coated optical substrates |
US5854137A (en) * | 1996-04-29 | 1998-12-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for reduction of polycide residues |
US5874363A (en) * | 1996-05-13 | 1999-02-23 | Kabushiki Kaisha Toshiba | Polycide etching with HCL and chlorine |
US5910452A (en) * | 1996-05-13 | 1999-06-08 | Winbond Electronics Corporation | Method for reducing antenna effect during plasma etching procedure for semiconductor device fabrication |
KR100259609B1 (ko) * | 1996-06-13 | 2000-08-01 | 우성일 | 전이금속 박막의 식각방법 |
TW409152B (en) | 1996-06-13 | 2000-10-21 | Samsung Electronic | Etching gas composition for ferroelectric capacitor electrode film and method for etching a transition metal thin film |
US6008139A (en) * | 1996-06-17 | 1999-12-28 | Applied Materials Inc. | Method of etching polycide structures |
US5880033A (en) * | 1996-06-17 | 1999-03-09 | Applied Materials, Inc. | Method for etching metal silicide with high selectivity to polysilicon |
JP2904167B2 (ja) * | 1996-12-18 | 1999-06-14 | 日本電気株式会社 | 半導体装置の製造方法 |
JPH10223608A (ja) * | 1997-02-04 | 1998-08-21 | Sony Corp | 半導体装置の製造方法 |
US5866483A (en) * | 1997-04-04 | 1999-02-02 | Applied Materials, Inc. | Method for anisotropically etching tungsten using SF6, CHF3, and N2 |
US6797188B1 (en) | 1997-11-12 | 2004-09-28 | Meihua Shen | Self-cleaning process for etching silicon-containing material |
US6136211A (en) * | 1997-11-12 | 2000-10-24 | Applied Materials, Inc. | Self-cleaning etch process |
US6872322B1 (en) | 1997-11-12 | 2005-03-29 | Applied Materials, Inc. | Multiple stage process for cleaning process chambers |
US6322714B1 (en) | 1997-11-12 | 2001-11-27 | Applied Materials Inc. | Process for etching silicon-containing material on substrates |
KR100259352B1 (ko) * | 1998-01-09 | 2000-08-01 | 김영환 | 반도체 소자의 다층막 건식각 방법 |
JP4013308B2 (ja) * | 1998-01-21 | 2007-11-28 | ヤマハ株式会社 | 配線形成方法 |
JP3171161B2 (ja) * | 1998-03-20 | 2001-05-28 | 日本電気株式会社 | プラズマエッチング方法及びプラズマエッチング装置 |
US6067999A (en) * | 1998-04-23 | 2000-05-30 | International Business Machines Corporation | Method for deposition tool cleaning |
JP2000252259A (ja) * | 1999-02-25 | 2000-09-14 | Sony Corp | ドライエッチング方法及び半導体装置の製造方法 |
US6660643B1 (en) * | 1999-03-03 | 2003-12-09 | Rwe Schott Solar, Inc. | Etching of semiconductor wafer edges |
TW501199B (en) | 1999-03-05 | 2002-09-01 | Applied Materials Inc | Method for enhancing etching of TiSix |
JP2000353804A (ja) | 1999-06-11 | 2000-12-19 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
US6306312B1 (en) * | 1999-06-30 | 2001-10-23 | Lam Research Corporation | Method for etching a gold metal layer using a titanium hardmask |
US6613682B1 (en) * | 1999-10-21 | 2003-09-02 | Applied Materials Inc. | Method for in situ removal of a dielectric antireflective coating during a gate etch process |
JP2001237218A (ja) | 2000-02-21 | 2001-08-31 | Nec Corp | 半導体装置の製造方法 |
US6527968B1 (en) | 2000-03-27 | 2003-03-04 | Applied Materials Inc. | Two-stage self-cleaning silicon etch process |
US6544887B1 (en) | 2000-03-31 | 2003-04-08 | Lam Research Corporation | Polycide etch process |
US6350699B1 (en) * | 2000-05-30 | 2002-02-26 | Sharp Laboratories Of America, Inc. | Method for anisotropic plasma etching using non-chlorofluorocarbon, fluorine-based chemistry |
US6225202B1 (en) * | 2000-06-21 | 2001-05-01 | Chartered Semiconductor Manufacturing, Ltd. | Selective etching of unreacted nickel after salicidation |
US6440870B1 (en) | 2000-07-12 | 2002-08-27 | Applied Materials, Inc. | Method of etching tungsten or tungsten nitride electrode gates in semiconductor structures |
US6423644B1 (en) | 2000-07-12 | 2002-07-23 | Applied Materials, Inc. | Method of etching tungsten or tungsten nitride electrode gates in semiconductor structures |
US6461974B1 (en) | 2000-10-06 | 2002-10-08 | Lam Research Corporation | High temperature tungsten etching process |
US6905800B1 (en) | 2000-11-21 | 2005-06-14 | Stephen Yuen | Etching a substrate in a process zone |
US6852242B2 (en) | 2001-02-23 | 2005-02-08 | Zhi-Wen Sun | Cleaning of multicompositional etchant residues |
WO2002086957A1 (fr) * | 2001-04-19 | 2002-10-31 | Tokyo Electron Limited | Procede de gravure a sec |
JP2005527101A (ja) * | 2001-08-21 | 2005-09-08 | シーゲイト テクノロジー エルエルシー | 炭素ベースのガスを用いる磁気薄膜のイオンビームエッチング選択性の向上 |
US6479383B1 (en) * | 2002-02-05 | 2002-11-12 | Chartered Semiconductor Manufacturing Ltd | Method for selective removal of unreacted metal after silicidation |
US20030235995A1 (en) * | 2002-06-21 | 2003-12-25 | Oluseyi Hakeem M. | Method of increasing selectivity to mask when etching tungsten or tungsten nitride |
US7098141B1 (en) * | 2003-03-03 | 2006-08-29 | Lam Research Corporation | Use of silicon containing gas for CD and profile feature enhancements of gate and shallow trench structures |
US7141505B2 (en) * | 2003-06-27 | 2006-11-28 | Lam Research Corporation | Method for bilayer resist plasma etch |
DE10358025A1 (de) * | 2003-12-11 | 2005-07-21 | Infineon Technologies Ag | Verfahren zum Ätzen von Wolfram mit einer kontrollierten Seitenwandpassivierung und mit hoher Selektivität zu Polysilizium |
US20050252529A1 (en) * | 2004-05-12 | 2005-11-17 | Ridgeway Robert G | Low temperature CVD chamber cleaning using dilute NF3 |
JP2007036018A (ja) * | 2005-07-28 | 2007-02-08 | Toshiba Corp | 半導体装置の製造方法 |
JP4593402B2 (ja) * | 2005-08-25 | 2010-12-08 | 株式会社日立ハイテクノロジーズ | エッチング方法およびエッチング装置 |
US7544621B2 (en) * | 2005-11-01 | 2009-06-09 | United Microelectronics Corp. | Method of removing a metal silicide layer on a gate electrode in a semiconductor manufacturing process and etching method |
JP2007266466A (ja) * | 2006-03-29 | 2007-10-11 | Tokyo Electron Ltd | プラズマエッチング方法、プラズマエッチング装置、コンピュータ記憶媒体及び処理レシピが記憶された記憶媒体 |
US7754610B2 (en) * | 2006-06-02 | 2010-07-13 | Applied Materials, Inc. | Process for etching tungsten silicide overlying polysilicon particularly in a flash memory |
WO2008103632A2 (en) | 2007-02-20 | 2008-08-28 | Qualcomm Mems Technologies, Inc. | Equipment and methods for etching of mems |
US7985681B2 (en) * | 2007-06-22 | 2011-07-26 | Micron Technology, Inc. | Method for selectively forming symmetrical or asymmetrical features using a symmetrical photomask during fabrication of a semiconductor device and electronic systems including the semiconductor device |
WO2009036215A2 (en) * | 2007-09-14 | 2009-03-19 | Qualcomm Mems Technologies, Inc. | Etching processes used in mems production |
US8118946B2 (en) | 2007-11-30 | 2012-02-21 | Wesley George Lau | Cleaning process residues from substrate processing chamber components |
JP5932599B2 (ja) * | 2011-10-31 | 2016-06-08 | 株式会社日立ハイテクノロジーズ | プラズマエッチング方法 |
TWI497586B (zh) * | 2011-10-31 | 2015-08-21 | Hitachi High Tech Corp | Plasma etching method |
JP6725176B2 (ja) * | 2016-10-31 | 2020-07-15 | 株式会社日立ハイテク | プラズマエッチング方法 |
CN110571151B (zh) * | 2019-09-02 | 2021-10-26 | 武汉新芯集成电路制造有限公司 | 多晶硅层的制作方法、闪存及其制作方法 |
WO2022039849A1 (en) * | 2020-08-18 | 2022-02-24 | Applied Materials, Inc. | Methods for etching structures and smoothing sidewalls |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3216823A1 (de) * | 1982-05-05 | 1983-11-10 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum herstellen von strukturen von aus metallsilizid und polysilizium bestehenden doppelschichten auf integrierte halbleiterschaltungen enthaltenden substraten durch reaktives ionenaetzen |
US4680086A (en) * | 1986-03-20 | 1987-07-14 | Motorola, Inc. | Dry etching of multi-layer structures |
US4713141A (en) * | 1986-09-22 | 1987-12-15 | Intel Corporation | Anisotropic plasma etching of tungsten |
EP0297898B1 (de) * | 1987-07-02 | 1995-10-11 | Kabushiki Kaisha Toshiba | Verfahren zum Trockenätzen |
JPH0383335A (ja) * | 1989-08-28 | 1991-04-09 | Hitachi Ltd | エッチング方法 |
DE69126149T2 (de) * | 1990-01-22 | 1998-01-02 | Sony Corp | Trockenätzverfahren |
US5169487A (en) * | 1990-08-27 | 1992-12-08 | Micron Technology, Inc. | Anisotropic etch method |
US5094712A (en) * | 1990-10-09 | 1992-03-10 | Micron Technology, Inc. | One chamber in-situ etch process for oxide and conductive material |
-
1991
- 1991-05-29 JP JP12429791A patent/JP3210359B2/ja not_active Expired - Lifetime
-
1992
- 1992-05-26 DE DE69229814T patent/DE69229814T2/de not_active Expired - Lifetime
- 1992-05-26 EP EP92108844A patent/EP0516043B1/de not_active Expired - Lifetime
- 1992-05-28 US US07/889,627 patent/US5259923A/en not_active Expired - Lifetime
- 1992-05-29 KR KR1019920009345A patent/KR0170412B1/ko not_active IP Right Cessation
- 1992-06-29 TW TW081105118A patent/TW282561B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR920022416A (ko) | 1992-12-19 |
EP0516043A3 (en) | 1993-10-06 |
KR0170412B1 (ko) | 1999-03-30 |
US5259923A (en) | 1993-11-09 |
JP3210359B2 (ja) | 2001-09-17 |
TW282561B (de) | 1996-08-01 |
DE69229814T2 (de) | 2000-01-20 |
EP0516043B1 (de) | 1999-08-18 |
JPH04350932A (ja) | 1992-12-04 |
EP0516043A2 (de) | 1992-12-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69229814D1 (de) | Methode für die Trockenätzung | |
DE69228333D1 (de) | Trockenätzverfahren | |
KR960012337A (ko) | 에칭방법 | |
DE68927699T2 (de) | Trockenätzverfahren | |
KR950700859A (ko) | 순수의 제조 방법(Pure water manufacturing method) | |
DE69206512T2 (de) | Herstellungsverfahren von Hartfetten. | |
DE69126149T2 (de) | Trockenätzverfahren | |
DE3852230D1 (de) | Trockenätzverfahren. | |
DE68926855T2 (de) | Trockenätzverfahren | |
ITMI920569A1 (it) | Procedimento per la fabbricazione di tastiere | |
DE69125208T2 (de) | Trockenätzverfahren für Halbleiter | |
NO883787D0 (no) | Flertrinns opprenskningsprosess. | |
FI924075A (fi) | Elektrokemisk process | |
DE69227759D1 (de) | Mehrfachteilungsegmentierungsverfahren | |
DE69231268T2 (de) | Verfahren zur Trockenätzung | |
DE69229749D1 (de) | Trockenätzverfahren für GaAs | |
DE69219741D1 (de) | Hydrolisylierungsverfahren | |
DK0512652T3 (da) | Hydrodecykliseringsfremgangsmåde | |
DE69229470T2 (de) | Fotochemisches Trocken-Ätzverfahren | |
FI941802A (fi) | Hapetusmenetelmä | |
KR900012297A (ko) | 플렛 케이블 제조방법 | |
KR910003769A (ko) | 드라이에칭방법 | |
ATE137592T1 (de) | Vorblitz-me methode | |
KR920007073A (ko) | 피모오스 ldd 제조방법 | |
DE4294247T1 (de) | Zwei-Schichten-Ätzprozess |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
R071 | Expiry of right |
Ref document number: 516043 Country of ref document: EP |