DE69126912D1 - Halbleiteranordnung und ihre Prüfungsverfahren - Google Patents

Halbleiteranordnung und ihre Prüfungsverfahren

Info

Publication number
DE69126912D1
DE69126912D1 DE69126912T DE69126912T DE69126912D1 DE 69126912 D1 DE69126912 D1 DE 69126912D1 DE 69126912 T DE69126912 T DE 69126912T DE 69126912 T DE69126912 T DE 69126912T DE 69126912 D1 DE69126912 D1 DE 69126912D1
Authority
DE
Germany
Prior art keywords
semiconductor device
test methods
test
methods
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69126912T
Other languages
English (en)
Other versions
DE69126912T2 (de
Inventor
Tohru Furuyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE69126912D1 publication Critical patent/DE69126912D1/de
Publication of DE69126912T2 publication Critical patent/DE69126912T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/408—Address circuits
    • G11C11/4085—Word line control circuits, e.g. word line drivers, - boosters, - pull-up, - pull-down, - precharge
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • G11C29/46—Test trigger logic
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/50—Marginal testing, e.g. race, voltage or current testing
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
    • G11C5/145—Applications of charge pumps; Boosted voltage circuits; Clamp circuits therefor
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
    • G11C5/147—Voltage reference generators, voltage or current regulators; Internally lowered supply levels; Compensation for voltage drops
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • For Increasing The Reliability Of Semiconductor Memories (AREA)
  • Dram (AREA)
  • Tests Of Electronic Circuits (AREA)
DE69126912T 1990-05-11 1991-05-10 Halbleiteranordnung und ihre Prüfungsverfahren Expired - Fee Related DE69126912T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2119948A JP2533221B2 (ja) 1990-05-11 1990-05-11 ダイナミック型ランダムアクセスメモリ

Publications (2)

Publication Number Publication Date
DE69126912D1 true DE69126912D1 (de) 1997-08-28
DE69126912T2 DE69126912T2 (de) 1997-12-04

Family

ID=14774146

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69131872T Expired - Fee Related DE69131872T2 (de) 1990-05-11 1991-05-10 Dynamische Halbleiterspeicherschaltung
DE69126912T Expired - Fee Related DE69126912T2 (de) 1990-05-11 1991-05-10 Halbleiteranordnung und ihre Prüfungsverfahren

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69131872T Expired - Fee Related DE69131872T2 (de) 1990-05-11 1991-05-10 Dynamische Halbleiterspeicherschaltung

Country Status (5)

Country Link
US (2) US5428576A (de)
EP (2) EP0456254B1 (de)
JP (1) JP2533221B2 (de)
KR (1) KR950014679B1 (de)
DE (2) DE69131872T2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2533221B2 (ja) * 1990-05-11 1996-09-11 株式会社東芝 ダイナミック型ランダムアクセスメモリ
JP3392497B2 (ja) * 1994-02-25 2003-03-31 株式会社東芝 テスト電位転送回路およびこれを用いた半導体記憶装置
US5724286A (en) * 1994-12-14 1998-03-03 Mosaid Technologies Incorporated Flexible DRAM array
US6551574B2 (en) * 1995-06-07 2003-04-22 Rhomed Incorporated Tuftsin metallopeptide analogs and uses thereof
KR0170286B1 (ko) * 1995-12-22 1999-03-30 김광호 반도체 메모리장치의 전압 승압회로
US5644258A (en) * 1996-01-04 1997-07-01 Winbond Electronics Corp. Driver circuit, with low idle power consumption, for an attachment unit interface
JP3601901B2 (ja) * 1996-03-26 2004-12-15 株式会社 沖マイクロデザイン 昇圧回路
US5917766A (en) * 1996-05-28 1999-06-29 Mitsubishi Denki Kabushiki Kaisha Semiconductor memory device that can carry out read disturb testing and burn-in testing reliably
US5999466A (en) * 1998-01-13 1999-12-07 Micron Technology, Inc. Method, apparatus and system for voltage screening of integrated circuits
JPH11260053A (ja) * 1998-03-12 1999-09-24 Nec Corp 半導体記憶装置の昇圧回路
JP2000339996A (ja) * 1999-05-31 2000-12-08 Nec Corp 半導体記憶装置およびそのバーンインテスト方法
US8611164B2 (en) 2011-08-01 2013-12-17 International Business Machines Corporation Device and method for detecting resistive defect
CN105827101B (zh) * 2016-05-06 2019-02-05 成都芯源系统有限公司 电压转换集成电路、自举电路以及开关驱动方法
JP7175555B2 (ja) * 2018-03-09 2022-11-21 エイブリック株式会社 テスト回路及び半導体装置

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4418403A (en) * 1981-02-02 1983-11-29 Mostek Corporation Semiconductor memory cell margin test circuit
JPS5891594A (ja) * 1981-11-27 1983-05-31 Fujitsu Ltd ダイナミツク型半導体記憶装置
JPS60157250A (ja) * 1984-01-25 1985-08-17 Mitsubishi Electric Corp Ｍｏｓダイナミツクｒａｍのスクリ−ニング方法
JPS61219162A (ja) * 1985-03-25 1986-09-29 Nec Corp 半導体装置の配線パタ−ン
JPH0789433B2 (ja) * 1985-11-22 1995-09-27 株式会社日立製作所 ダイナミツク型ｒａｍ
JPS6394499A (ja) * 1986-10-07 1988-04-25 Toshiba Corp 半導体記憶装置
US4751679A (en) * 1986-12-22 1988-06-14 Motorola, Inc. Gate stress test of a MOS memory
JPS63181196A (ja) * 1987-01-22 1988-07-26 Oki Electric Ind Co Ltd 半導体集積回路装置
JPS63183689A (ja) * 1987-01-26 1988-07-29 Hitachi Ltd 半導体集積回路装置
JP2684365B2 (ja) * 1987-04-24 1997-12-03 株式会社日立製作所 半導体記憶装置
JPS6455857A (en) * 1987-08-26 1989-03-02 Nec Corp Semiconductor integrated device
US4809231A (en) * 1987-11-12 1989-02-28 Motorola, Inc. Method and apparatus for post-packaging testing of one-time programmable memories
JPH01166391A (ja) * 1987-12-23 1989-06-30 Toshiba Corp スタティック型ランダムアクセスメモリ
JPH0218779A (ja) * 1988-07-05 1990-01-23 Mitsubishi Electric Corp ダイナミック型半導体記憶装置
JP2533221B2 (ja) * 1990-05-11 1996-09-11 株式会社東芝 ダイナミック型ランダムアクセスメモリ
JPH04225182A (ja) * 1990-12-26 1992-08-14 Toshiba Corp 半導体記憶装置
JPH0770620B2 (ja) * 1990-12-26 1995-07-31 株式会社東芝 半導体記憶装置
JP2925337B2 (ja) * 1990-12-27 1999-07-28 株式会社東芝 半導体装置
JPH07123134B2 (ja) * 1990-12-27 1995-12-25 株式会社東芝 半導体装置
JPH0756759B2 (ja) * 1990-12-27 1995-06-14 株式会社東芝 スタティック型半導体記憶装置
JP3381929B2 (ja) * 1990-12-27 2003-03-04 株式会社東芝 半導体装置
JP2829135B2 (ja) * 1990-12-27 1998-11-25 株式会社東芝 半導体記憶装置
KR960007478B1 (ko) * 1990-12-27 1996-06-03 가부시키가이샤 도시바 반도체장치 및 반도체장치의 제조방법
JP2829134B2 (ja) * 1990-12-27 1998-11-25 株式会社東芝 半導体記憶装置

Also Published As

Publication number Publication date
DE69126912T2 (de) 1997-12-04
JP2533221B2 (ja) 1996-09-11
US5568436A (en) 1996-10-22
EP0456254A3 (en) 1991-12-27
EP0456254A2 (de) 1991-11-13
EP0740308B1 (de) 1999-12-22
JPH0417191A (ja) 1992-01-21
KR910020731A (ko) 1991-12-20
DE69131872T2 (de) 2000-05-18
EP0456254B1 (de) 1997-07-23
US5428576A (en) 1995-06-27
KR950014679B1 (ko) 1995-12-13
DE69131872D1 (de) 2000-01-27
EP0740308A3 (de) 1996-12-27
EP0740308A2 (de) 1996-10-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee