DE60310127T2 - Hochtemperatur-lcp für abriebfestigkeit - Google Patents

Hochtemperatur-lcp für abriebfestigkeit Download PDF

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Publication number
DE60310127T2
DE60310127T2 DE60310127T DE60310127T DE60310127T2 DE 60310127 T2 DE60310127 T2 DE 60310127T2 DE 60310127 T DE60310127 T DE 60310127T DE 60310127 T DE60310127 T DE 60310127T DE 60310127 T2 DE60310127 T2 DE 60310127T2
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DE
Germany
Prior art keywords
filler
composition
wear resistance
mpa
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60310127T
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German (de)
English (en)
Other versions
DE60310127D1 (de
Inventor
Sawyer Joy Wilmington BLOOM
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of DE60310127D1 publication Critical patent/DE60310127D1/de
Application granted granted Critical
Publication of DE60310127T2 publication Critical patent/DE60310127T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00Liquid crystal materials
    • C09K19/52Liquid crystal materials characterised by components which are not liquid crystals, e.g. additives with special physical aspect: solvents, solid particles
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00Liquid crystal materials
    • C09K19/04Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
    • C09K19/38Polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00Liquid crystal materials
    • C09K19/04Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
    • C09K19/38Polymers
    • C09K19/3833Polymers with mesogenic groups in the side chain
    • C09K19/3838Polyesters; Polyester derivatives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Lubricants (AREA)
  • Thermistors And Varistors (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Organic Insulating Materials (AREA)
  • Inorganic Insulating Materials (AREA)
DE60310127T 2002-12-18 2003-12-16 Hochtemperatur-lcp für abriebfestigkeit Expired - Lifetime DE60310127T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US43426102P 2002-12-18 2002-12-18
US434261P 2002-12-18
PCT/US2003/040243 WO2004058916A2 (en) 2002-12-18 2003-12-16 High temperature lcp for wear resistance

Publications (2)

Publication Number Publication Date
DE60310127D1 DE60310127D1 (de) 2007-01-11
DE60310127T2 true DE60310127T2 (de) 2007-10-25

Family

ID=32682016

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60310127T Expired - Lifetime DE60310127T2 (de) 2002-12-18 2003-12-16 Hochtemperatur-lcp für abriebfestigkeit

Country Status (10)

Country Link
EP (1) EP1572793B1 (https=)
JP (1) JP2006515638A (https=)
KR (1) KR101094591B1 (https=)
CN (1) CN100482724C (https=)
AT (1) ATE346882T1 (https=)
AU (1) AU2003301014A1 (https=)
CA (1) CA2509050A1 (https=)
DE (1) DE60310127T2 (https=)
ES (1) ES2277157T3 (https=)
WO (1) WO2004058916A2 (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040158005A1 (en) * 2002-12-18 2004-08-12 Bloom Joy Sawyer Low coefficient of friction thermoplastic containing filler
CN101578711A (zh) * 2006-11-09 2009-11-11 跃进封装公司 Led反射性封装体
CN101768448B (zh) * 2008-12-30 2013-06-12 上海普利特化工新材料有限公司 一种含炭黑的液晶高分子复合物及其制备方法
JP5633338B2 (ja) * 2010-11-30 2014-12-03 住友化学株式会社 液晶ポリエステル組成物
CN102153735A (zh) * 2011-02-28 2011-08-17 桂林理工大学 一种联苯型热致性聚酯液晶的制备方法
CN102352259B (zh) * 2011-08-31 2013-10-23 金发科技股份有限公司 一种液晶聚合物组合物及其制备方法与应用
CN105377986B (zh) * 2013-07-31 2017-09-08 住友化学株式会社 液晶聚酯组合物
CN108431682A (zh) * 2015-11-24 2018-08-21 Iqlp有限责任公司 用于高温半导体工艺的液晶聚合物制品
JP7029237B2 (ja) * 2017-07-04 2022-03-03 Eneos株式会社 液晶ポリエステル組成物およびその成形品
CN108148433A (zh) * 2017-12-26 2018-06-12 上海普利特化工新材料有限公司 一种低翘曲耐高温导电液晶聚酯复合材料及其制备方法
CN208914713U (zh) * 2018-08-22 2019-05-31 浙江长盛滑动轴承股份有限公司 一种轴承用导电自润滑复合板
JP2020050748A (ja) * 2018-09-26 2020-04-02 住友化学株式会社 樹脂組成物及び成形品
JP7245043B2 (ja) * 2018-12-19 2023-03-23 瀋陽中航機電三洋制冷設備有限公司 回転圧縮機及び回転圧縮機の製造方法
CN109867982B (zh) * 2019-01-07 2021-04-30 江阴骏驰新材料科技有限公司 一种低热膨胀系数和低逸散因子的液晶高分子复合材料及应用
WO2022004471A1 (ja) * 2020-07-03 2022-01-06 三菱瓦斯化学株式会社 樹脂組成物及び成形体
KR102461065B1 (ko) * 2020-12-29 2022-11-01 세양폴리머주식회사 액정 폴리에스테르 수지 조성물 및 이를 포함하는 저분진 특성의 전자부품 소재
CN114891322A (zh) * 2022-03-29 2022-08-12 珠海万通特种工程塑料有限公司 一种全芳族液晶聚酯复合材料及其制备方法和应用
CN114773792A (zh) * 2022-04-21 2022-07-22 江苏沃特特种材料制造有限公司 音圈电机内壁轨道材料及其制备方法、应用
CN115785692A (zh) * 2022-12-08 2023-03-14 上海斯必特橡塑有限公司 一种高性能电子电器用改性lcp材料及其制备方法
CN116200110B (zh) * 2023-04-27 2023-08-15 季华实验室 有机无机改性间苯型聚酯自润滑复合涂层及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0739533B2 (ja) * 1986-12-10 1995-05-01 ポリプラスチックス株式会社 液晶性ポリエステル樹脂組成物
GB8915475D0 (en) * 1989-07-06 1989-08-23 T & N Technology Ltd Wear-resistant articles
JP2535666B2 (ja) * 1989-11-30 1996-09-18 三井東圧化学株式会社 ポリイミド系樹脂組成物
JP2550797B2 (ja) * 1991-04-10 1996-11-06 東レ株式会社 液晶ポリマ樹脂組成物
JP3293653B2 (ja) * 1991-05-31 2002-06-17 エヌティエヌ株式会社 分離爪
JP3265719B2 (ja) * 1992-10-22 2002-03-18 東レ株式会社 液晶性樹脂組成物
JPH07252410A (ja) * 1994-01-31 1995-10-03 Ntn Corp スクロール型コンプレッサのシール部材用組成物
JP3282505B2 (ja) * 1996-07-09 2002-05-13 住友化学工業株式会社 液晶ポリエステル樹脂組成物
JP4632394B2 (ja) * 2000-04-20 2011-02-16 上野製薬株式会社 液晶ポリエステル樹脂
EP1314760A4 (en) * 2000-08-29 2004-11-10 Otsuka Chemical Co Ltd RESIN COMPOSITION, MOLDED OBJECT MANUFACTURED FROM SUCH A COMPOSITION AND USE THEREOF
JP2002294038A (ja) * 2001-03-28 2002-10-09 Sumitomo Chem Co Ltd 液晶ポリエステル樹脂組成物

Also Published As

Publication number Publication date
JP2006515638A (ja) 2006-06-01
WO2004058916A3 (en) 2004-08-26
KR101094591B1 (ko) 2011-12-15
AU2003301014A8 (en) 2004-07-22
EP1572793B1 (en) 2006-11-29
KR20050085722A (ko) 2005-08-29
CN100482724C (zh) 2009-04-29
DE60310127D1 (de) 2007-01-11
ES2277157T3 (es) 2007-07-01
EP1572793A2 (en) 2005-09-14
WO2004058916A2 (en) 2004-07-15
AU2003301014A1 (en) 2004-07-22
CN1735652A (zh) 2006-02-15
ATE346882T1 (de) 2006-12-15
CA2509050A1 (en) 2004-07-15

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Legal Events

Date Code Title Description
8381 Inventor (new situation)

Inventor name: BLOOM, SAWYER JOY, WILMINGTON, DEL., US

8364 No opposition during term of opposition