DE60300477T2 - Nichtflüchtige Speichervorrichtung mit vertikalen Nanoröhren - Google Patents
Nichtflüchtige Speichervorrichtung mit vertikalen Nanoröhren Download PDFInfo
- Publication number
- DE60300477T2 DE60300477T2 DE60300477T DE60300477T DE60300477T2 DE 60300477 T2 DE60300477 T2 DE 60300477T2 DE 60300477 T DE60300477 T DE 60300477T DE 60300477 T DE60300477 T DE 60300477T DE 60300477 T2 DE60300477 T2 DE 60300477T2
- Authority
- DE
- Germany
- Prior art keywords
- layer
- memory device
- nanotube
- silicon
- electron
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/02—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using elements whose operation depends upon chemical change
- G11C13/025—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using elements whose operation depends upon chemical change using fullerenes, e.g. C60, or nanotubes, e.g. carbon or silicon nanotubes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0466—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells with charge storage in an insulating layer, e.g. metal-nitride-oxide-silicon [MNOS], silicon-oxide-nitride-oxide-silicon [SONOS]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/69—IGFETs having charge trapping gate insulators, e.g. MNOS transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/69—IGFETs having charge trapping gate insulators, e.g. MNOS transistors
- H10D30/691—IGFETs having charge trapping gate insulators, e.g. MNOS transistors having more than two programming levels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/69—IGFETs having charge trapping gate insulators, e.g. MNOS transistors
- H10D30/693—Vertical IGFETs having charge trapping gate insulators
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
- H10K85/221—Carbon nanotubes
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/10—Resistive cells; Technology aspects
- G11C2213/16—Memory cell being a nanotube, e.g. suspended nanotube
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/10—Resistive cells; Technology aspects
- G11C2213/17—Memory cell being a nanowire transistor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/902—Specified use of nanostructure
- Y10S977/932—Specified use of nanostructure for electronic or optoelectronic application
- Y10S977/943—Information storage or retrieval using nanostructure
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2002071041 | 2002-11-15 | ||
| KR1020020071041A KR100790859B1 (ko) | 2002-11-15 | 2002-11-15 | 수직 나노튜브를 이용한 비휘발성 메모리 소자 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE60300477D1 DE60300477D1 (de) | 2005-05-12 |
| DE60300477T2 true DE60300477T2 (de) | 2006-02-23 |
Family
ID=32171633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60300477T Expired - Lifetime DE60300477T2 (de) | 2002-11-15 | 2003-11-11 | Nichtflüchtige Speichervorrichtung mit vertikalen Nanoröhren |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6930343B2 (enExample) |
| EP (1) | EP1420414B1 (enExample) |
| JP (2) | JP4047797B2 (enExample) |
| KR (1) | KR100790859B1 (enExample) |
| CN (1) | CN1317768C (enExample) |
| DE (1) | DE60300477T2 (enExample) |
Families Citing this family (58)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10250829B4 (de) * | 2002-10-31 | 2006-11-02 | Infineon Technologies Ag | Nichtflüchtige Speicherzelle, Speicherzellen-Anordnung und Verfahren zum Herstellen einer nichtflüchtigen Speicherzelle |
| US7274064B2 (en) * | 2003-06-09 | 2007-09-25 | Nanatero, Inc. | Non-volatile electromechanical field effect devices and circuits using same and methods of forming same |
| US7280394B2 (en) | 2003-06-09 | 2007-10-09 | Nantero, Inc. | Field effect devices having a drain controlled via a nanotube switching element |
| KR101015498B1 (ko) * | 2003-06-14 | 2011-02-21 | 삼성전자주식회사 | 수직 카본나노튜브 전계효과트랜지스터 및 그 제조방법 |
| US7374793B2 (en) | 2003-12-11 | 2008-05-20 | International Business Machines Corporation | Methods and structures for promoting stable synthesis of carbon nanotubes |
| US7038299B2 (en) | 2003-12-11 | 2006-05-02 | International Business Machines Corporation | Selective synthesis of semiconducting carbon nanotubes |
| US7211844B2 (en) | 2004-01-29 | 2007-05-01 | International Business Machines Corporation | Vertical field effect transistors incorporating semiconducting nanotubes grown in a spacer-defined passage |
| US20050167655A1 (en) | 2004-01-29 | 2005-08-04 | International Business Machines Corporation | Vertical nanotube semiconductor device structures and methods of forming the same |
| US7829883B2 (en) | 2004-02-12 | 2010-11-09 | International Business Machines Corporation | Vertical carbon nanotube field effect transistors and arrays |
| US7709880B2 (en) * | 2004-06-09 | 2010-05-04 | Nantero, Inc. | Field effect devices having a gate controlled via a nanotube switching element |
| US7109546B2 (en) | 2004-06-29 | 2006-09-19 | International Business Machines Corporation | Horizontal memory gain cells |
| CN101010793B (zh) * | 2004-06-30 | 2011-09-28 | Nxp股份有限公司 | 制造具有通过纳米线接触的导电材料层的电子器件的方法 |
| KR100666187B1 (ko) * | 2004-08-04 | 2007-01-09 | 학교법인 한양학원 | 나노선을 이용한 수직형 반도체 소자 및 이의 제조 방법 |
| US7233071B2 (en) * | 2004-10-04 | 2007-06-19 | International Business Machines Corporation | Low-k dielectric layer based upon carbon nanostructures |
| DE102004049452A1 (de) * | 2004-10-11 | 2006-04-20 | Infineon Technologies Ag | Mikroelektronisches Halbleiterbauelement und Verfahren zum Herstellen eines mikroelektronischen Halbleiterbauelements |
| KR100657910B1 (ko) * | 2004-11-10 | 2006-12-14 | 삼성전자주식회사 | 멀티비트 플래시 메모리 소자, 그 동작 방법, 및 그 제조방법 |
| US8362525B2 (en) * | 2005-01-14 | 2013-01-29 | Nantero Inc. | Field effect device having a channel of nanofabric and methods of making same |
| US7598544B2 (en) * | 2005-01-14 | 2009-10-06 | Nanotero, Inc. | Hybrid carbon nanotude FET(CNFET)-FET static RAM (SRAM) and method of making same |
| US7535016B2 (en) * | 2005-01-31 | 2009-05-19 | International Business Machines Corporation | Vertical carbon nanotube transistor integration |
| KR100688542B1 (ko) * | 2005-03-28 | 2007-03-02 | 삼성전자주식회사 | 수직형 나노튜브 반도체소자 및 그 제조방법 |
| US7479654B2 (en) | 2005-05-09 | 2009-01-20 | Nantero, Inc. | Memory arrays using nanotube articles with reprogrammable resistance |
| US7838943B2 (en) * | 2005-07-25 | 2010-11-23 | International Business Machines Corporation | Shared gate for conventional planar device and horizontal CNT |
| US7352607B2 (en) | 2005-07-26 | 2008-04-01 | International Business Machines Corporation | Non-volatile switching and memory devices using vertical nanotubes |
| EP1763037A1 (en) | 2005-09-08 | 2007-03-14 | STMicroelectronics S.r.l. | Nanotube memory cell with floating gate based on passivated nanoparticles and manufacturing process thereof |
| DE102005046427B4 (de) * | 2005-09-28 | 2010-09-23 | Infineon Technologies Ag | Leistungstransistor mit parallelgeschalteten Nanodrähten |
| KR100723412B1 (ko) * | 2005-11-10 | 2007-05-30 | 삼성전자주식회사 | 나노튜브를 이용하는 비휘발성 메모리 소자 |
| KR100695167B1 (ko) * | 2006-01-04 | 2007-03-14 | 삼성전자주식회사 | 다중벽 탄소나노튜브를 이용한 불휘발성 탄소나노튜브메모리 소자 및 그 동작방법 |
| KR100721020B1 (ko) * | 2006-01-20 | 2007-05-23 | 삼성전자주식회사 | 콘택 구조체를 포함하는 반도체 소자 및 그 형성 방법 |
| GB0611557D0 (en) * | 2006-06-12 | 2006-07-19 | Univ Belfast | Nanostructured systems and a method of manufacture of the same |
| KR100749751B1 (ko) | 2006-08-02 | 2007-08-17 | 삼성전자주식회사 | 트랜지스터 및 그 제조 방법 |
| KR100806129B1 (ko) | 2006-08-02 | 2008-02-22 | 삼성전자주식회사 | 탄소 나노 튜브의 형성 방법 |
| KR100745769B1 (ko) * | 2006-09-11 | 2007-08-02 | 삼성전자주식회사 | 나노와이어 전기기계 스위칭 소자 및 그 제조방법, 상기나노와이어 전기기계 소자를 이용한 전기기계 메모리 소자 |
| KR100820174B1 (ko) | 2006-12-05 | 2008-04-08 | 한국전자통신연구원 | 수직구조의 탄소나노튜브를 이용한 전자소자 및 그제조방법 |
| WO2008069485A1 (en) * | 2006-12-05 | 2008-06-12 | Electronics And Telecommunications Research Institute | The electronic devices using carbon nanotubes having vertical structure and the manufacturing method thereof |
| US9806273B2 (en) * | 2007-01-03 | 2017-10-31 | The United States Of America As Represented By The Secretary Of The Army | Field effect transistor array using single wall carbon nano-tubes |
| GB0801494D0 (en) * | 2007-02-23 | 2008-03-05 | Univ Ind & Acad Collaboration | Nonvolatile memory electronic device using nanowire used as charge channel and nanoparticles used as charge trap and method for manufacturing the same |
| US8546863B2 (en) | 2007-04-19 | 2013-10-01 | Nxp B.V. | Nonvolatile memory cell comprising a nanowire and manufacturing method thereof |
| KR100866966B1 (ko) | 2007-05-10 | 2008-11-06 | 삼성전자주식회사 | 비휘발성 메모리 소자, 그 제조 방법 및 반도체 패키지 |
| US8223548B2 (en) | 2007-05-24 | 2012-07-17 | National Institute Of Advanced Industrial Science And Technology | Memory device with reduced programming voltage method of reduction of programming voltage and method of reading such memory device |
| US8633537B2 (en) | 2007-05-25 | 2014-01-21 | Cypress Semiconductor Corporation | Memory transistor with multiple charge storing layers and a high work function gate electrode |
| US9449831B2 (en) | 2007-05-25 | 2016-09-20 | Cypress Semiconductor Corporation | Oxide-nitride-oxide stack having multiple oxynitride layers |
| US8940645B2 (en) | 2007-05-25 | 2015-01-27 | Cypress Semiconductor Corporation | Radical oxidation process for fabricating a nonvolatile charge trap memory device |
| US20090179253A1 (en) | 2007-05-25 | 2009-07-16 | Cypress Semiconductor Corporation | Oxide-nitride-oxide stack having multiple oxynitride layers |
| US20110018053A1 (en) * | 2007-12-07 | 2011-01-27 | Agency For Science, Technology And Research | Memory cell and methods of manufacturing thereof |
| JP2011507231A (ja) * | 2007-12-07 | 2011-03-03 | エージェンシー フォー サイエンス,テクノロジー アンド リサーチ | シリコン−ゲルマニウムナノワイヤ構造およびその形成方法 |
| KR101002336B1 (ko) * | 2008-02-04 | 2010-12-20 | 엘지디스플레이 주식회사 | 나노 디바이스, 이를 포함하는 트랜지스터, 나노 디바이스및 이를 포함하는 트랜지스터의 제조 방법 |
| WO2010004437A2 (en) * | 2008-07-07 | 2010-01-14 | Nanunanu Ltd. | Inorganic nanotubes |
| US8212237B2 (en) | 2008-07-09 | 2012-07-03 | Qunano Ab | Nanostructured memory device |
| KR101061150B1 (ko) * | 2009-05-22 | 2011-08-31 | 서울대학교산학협력단 | 발광 디바이스와 이의 제조 방법 |
| US8350360B1 (en) | 2009-08-28 | 2013-01-08 | Lockheed Martin Corporation | Four-terminal carbon nanotube capacitors |
| US8405189B1 (en) * | 2010-02-08 | 2013-03-26 | Lockheed Martin Corporation | Carbon nanotube (CNT) capacitors and devices integrated with CNT capacitors |
| TWI476948B (zh) * | 2011-01-27 | 2015-03-11 | Hon Hai Prec Ind Co Ltd | 外延結構及其製備方法 |
| FR2980918B1 (fr) * | 2011-10-04 | 2014-03-07 | Univ Granada | Point memoire ram a un transistor |
| EP2831917A4 (en) * | 2012-03-31 | 2015-11-04 | Cypress Semiconductor Corp | OXID NITRIDE OXIDE STACK WITH MULTIPLE OXYNITRIDE LAYERS |
| CN102931237B (zh) * | 2012-10-10 | 2015-07-22 | 哈尔滨工程大学 | 垂直非对称环栅mosfet器件的结构及其制造方法 |
| US9917169B2 (en) * | 2014-07-02 | 2018-03-13 | Taiwan Semiconductor Manufacturing Company Limited | Semiconductor device and method of formation |
| US10222346B2 (en) * | 2017-01-09 | 2019-03-05 | National Research Council Of Canada | Decomposable S-tetrazine based polymers for single walled carbon nanotube applications |
| CN110176489A (zh) * | 2019-05-14 | 2019-08-27 | 中国科学院微电子研究所 | 纳米级晶体管及其制备方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3392547B2 (ja) * | 1994-11-21 | 2003-03-31 | 株式会社東芝 | 不揮発性半導体記憶装置 |
| JPH102002A (ja) * | 1996-06-17 | 1998-01-06 | Daiwa:Kk | 排水桝と排水桝の内底形成方法 |
| JPH1093083A (ja) * | 1996-09-18 | 1998-04-10 | Toshiba Corp | 半導体装置の製造方法 |
| AU3698100A (en) * | 1999-02-12 | 2000-08-29 | Board Of Trustees Of Michigan State University | Nanocapsules containing charged particles, their uses and methods of forming thesame |
| JP2001077219A (ja) * | 1999-06-29 | 2001-03-23 | Toshiba Corp | 不揮発性半導体記憶装置及びその製造方法 |
| KR100343210B1 (ko) * | 1999-08-11 | 2002-07-10 | 윤종용 | 단일 전자 충전 mnos계 메모리 및 그 구동 방법 |
| KR100360476B1 (ko) * | 2000-06-27 | 2002-11-08 | 삼성전자 주식회사 | 탄소나노튜브를 이용한 나노 크기 수직 트랜지스터 및 그제조방법 |
| JP4112358B2 (ja) * | 2000-07-04 | 2008-07-02 | インフィネオン テクノロジーズ アクチエンゲゼルシャフト | 電界効果トランジスタ |
| CN101887935B (zh) * | 2000-08-22 | 2013-09-11 | 哈佛学院董事会 | 掺杂的拉长半导体,其生长,包含这类半导体的器件及其制造 |
| KR100393189B1 (ko) * | 2001-01-10 | 2003-07-31 | 삼성전자주식회사 | 탄소나노튜브를 이용한 mram 및 그 제조 방법 |
| EP1341184B1 (en) * | 2002-02-09 | 2005-09-14 | Samsung Electronics Co., Ltd. | Memory device utilizing carbon nanotubes and method of fabricating the memory device |
| US6515325B1 (en) * | 2002-03-06 | 2003-02-04 | Micron Technology, Inc. | Nanotube semiconductor devices and methods for making the same |
-
2002
- 2002-11-15 KR KR1020020071041A patent/KR100790859B1/ko not_active Expired - Lifetime
-
2003
- 2003-11-04 CN CNB2003101138152A patent/CN1317768C/zh not_active Expired - Lifetime
- 2003-11-11 EP EP03257104A patent/EP1420414B1/en not_active Expired - Lifetime
- 2003-11-11 DE DE60300477T patent/DE60300477T2/de not_active Expired - Lifetime
- 2003-11-14 JP JP2003384459A patent/JP4047797B2/ja not_active Expired - Lifetime
- 2003-11-17 US US10/713,214 patent/US6930343B2/en not_active Expired - Lifetime
-
2007
- 2007-08-14 JP JP2007211348A patent/JP5307993B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP5307993B2 (ja) | 2013-10-02 |
| KR100790859B1 (ko) | 2008-01-03 |
| EP1420414A1 (en) | 2004-05-19 |
| JP4047797B2 (ja) | 2008-02-13 |
| CN1317768C (zh) | 2007-05-23 |
| CN1501503A (zh) | 2004-06-02 |
| JP2007329500A (ja) | 2007-12-20 |
| US20040095837A1 (en) | 2004-05-20 |
| EP1420414B1 (en) | 2005-04-06 |
| JP2004172616A (ja) | 2004-06-17 |
| DE60300477D1 (de) | 2005-05-12 |
| US6930343B2 (en) | 2005-08-16 |
| KR20040043043A (ko) | 2004-05-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE60300477T2 (de) | Nichtflüchtige Speichervorrichtung mit vertikalen Nanoröhren | |
| DE4335834C2 (de) | Nichtflüchtige Speicherzelle mit einer L-förmigen potentialfreien Gateelektrode und Verfahren zu ihrer Herstellung | |
| DE102014117780B4 (de) | Halbleiterbauelement mit einer Grabenelektrode und Verfahren zur Herstellung | |
| DE102013101113B4 (de) | Leistungs-MOS-Transistor und Verfahren zu dessen Herstellung | |
| DE102004046697B4 (de) | Hochspannungsfestes Halbleiterbauelement mit vertikal leitenden Halbleiterkörperbereichen und einer Grabenstruktur sowie Verfahren zur Herstellung desselben | |
| DE69531477T2 (de) | Halbleiteranordnung aus halbleitendem, organischem material | |
| DE69324880T2 (de) | Vertikal-MOSFET mit einem Graben, der mit Mehrschichten-Gatefilm bedeckt ist | |
| DE112012005591B4 (de) | Halbleitervorrichtung | |
| DE102014107325A1 (de) | Halbleiterbauelement | |
| DE102010062721A1 (de) | Halbleiterbauelement mit verbessertem Einschaltwiderstand | |
| DE102005052731A1 (de) | Siliziumkarbidhalbleitervorrichtung und Verfahren zur Herstellung derselben | |
| DE102013010245A1 (de) | Halbleitervorrichtung | |
| DE1464390B2 (de) | Feldeffekttransistor | |
| DE4130555C2 (de) | Halbleitervorrichtung mit hoher Durchbruchsspannung und geringem Widerstand, sowie Herstellungsverfahren | |
| DE4042163A1 (de) | Verfahren zur herstellung einer halbleitervorrichtung | |
| DE102004044619B4 (de) | Kondensatorstruktur in Grabenstrukturen von Halbleiterbauteilen und Halbleiterbauteile mit derartigen Kondensatorstrukturen und Verfahren zur Herstellung derselben | |
| DE2911484C2 (de) | Metall-Isolator-Halbleiterbauelement | |
| DE102021118301B4 (de) | Grenzflächenschicht zum abschwächen des grösseneffekts einer speichervorrichtung | |
| DE69720441T2 (de) | Bauelement mit gesteuerter Leitung | |
| DE10333549B3 (de) | Charge-Trapping-Speicherzelle | |
| DE3915594A1 (de) | Halbleitervorrichtung | |
| DE3119137A1 (de) | Halbleiter und verfahren zu deren herstellung | |
| DE3871823T2 (de) | Halbleiterspeicheranordnung. | |
| DE69219194T2 (de) | Josephsoneffekt-Halbleiteranordnung | |
| DE102005011967B4 (de) | Halbleiterbauelement mit Driftstrecke und Grabenstruktur sowie Verfahren zur Herstellung desselben |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition |