DE602007002660D1 - Flüssigkeitsverarbeitungsvorrichtung - Google Patents

Flüssigkeitsverarbeitungsvorrichtung

Info

Publication number
DE602007002660D1
DE602007002660D1 DE602007002660T DE602007002660T DE602007002660D1 DE 602007002660 D1 DE602007002660 D1 DE 602007002660D1 DE 602007002660 T DE602007002660 T DE 602007002660T DE 602007002660 T DE602007002660 T DE 602007002660T DE 602007002660 D1 DE602007002660 D1 DE 602007002660D1
Authority
DE
Germany
Prior art keywords
cup
substrate
liquid
exhaust
drain
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007002660T
Other languages
German (de)
English (en)
Inventor
Masami Akimoto
Takayuki Toshima
Satoshi Kaneko
Kazuhisa Matsumoto
Norihiro Ito
Hiromitsu Nanba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of DE602007002660D1 publication Critical patent/DE602007002660D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Weting (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Coating Apparatus (AREA)
DE602007002660T 2006-04-18 2007-04-17 Flüssigkeitsverarbeitungsvorrichtung Active DE602007002660D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006114959 2006-04-18

Publications (1)

Publication Number Publication Date
DE602007002660D1 true DE602007002660D1 (de) 2009-11-19

Family

ID=38121611

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007002660T Active DE602007002660D1 (de) 2006-04-18 2007-04-17 Flüssigkeitsverarbeitungsvorrichtung

Country Status (8)

Country Link
US (1) US7793610B2 (https=)
EP (1) EP1848024B1 (https=)
JP (1) JP5156114B2 (https=)
KR (1) KR101019444B1 (https=)
CN (1) CN101060069B (https=)
AT (1) ATE445229T1 (https=)
DE (1) DE602007002660D1 (https=)
TW (1) TW200802563A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117153740A (zh) * 2023-10-31 2023-12-01 宁波润华全芯微电子设备有限公司 一种晶圆加工装置

Families Citing this family (23)

* Cited by examiner, † Cited by third party
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JP5312856B2 (ja) * 2008-06-27 2013-10-09 大日本スクリーン製造株式会社 基板処理装置
CN101992165B (zh) * 2009-08-27 2012-10-24 沈阳芯源微电子设备有限公司 一种用于圆形薄片状物体进行化学液喷洒处理的装置
US9799537B2 (en) * 2010-12-03 2017-10-24 Applied Materials, Inc. Processing assembly for semiconductor workpiece and methods of processing same
US8541309B2 (en) 2010-12-03 2013-09-24 Applied Materials, Inc. Processing assembly for semiconductor workpiece and methods of processing same
JP5472169B2 (ja) * 2011-03-16 2014-04-16 東京エレクトロン株式会社 液処理装置、液処理方法および記憶媒体
JP5387636B2 (ja) * 2011-08-31 2014-01-15 東京エレクトロン株式会社 液処理装置
JP5596071B2 (ja) * 2012-03-09 2014-09-24 東京エレクトロン株式会社 液処理装置
JP6057624B2 (ja) 2012-09-03 2017-01-11 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ カップおよび基板処理装置
JP6281161B2 (ja) * 2013-09-27 2018-02-21 東京エレクトロン株式会社 液処理装置
TWI569349B (zh) 2013-09-27 2017-02-01 斯克林集團公司 基板處理裝置及基板處理方法
CN103567175A (zh) * 2013-10-30 2014-02-12 广西钦州天山微电子有限公司 铬板清洗机
JP6090113B2 (ja) * 2013-10-30 2017-03-08 東京エレクトロン株式会社 液処理装置
CN103639089A (zh) * 2013-11-14 2014-03-19 上海和辉光电有限公司 显影剂喷涂装置及方法
CN103691631B (zh) * 2013-12-16 2016-01-27 南通大学 带保护结构的匀胶机托盘
JP6287750B2 (ja) * 2013-12-27 2018-03-07 東京エレクトロン株式会社 基板液処理装置
CN108155133B (zh) * 2014-02-27 2022-04-15 斯克林集团公司 基板处理装置
KR102277539B1 (ko) * 2014-09-17 2021-07-15 세메스 주식회사 기판 처리 장치 및 컵 유닛
JP6797526B2 (ja) * 2014-11-11 2020-12-09 株式会社荏原製作所 基板洗浄装置
CN105161442B (zh) * 2015-07-21 2018-02-23 北京七星华创电子股份有限公司 一种清洗液体收集装置
CN112053970B (zh) * 2019-06-05 2024-11-08 东京毅力科创株式会社 基板处理装置
CN111069219B (zh) * 2019-12-27 2022-06-07 上海至纯洁净系统科技股份有限公司 一种排液罩以及半导体清洗设备
TWI800064B (zh) * 2021-10-29 2023-04-21 弘塑科技股份有限公司 單晶圓濕處理設備
JP2024060970A (ja) * 2022-10-20 2024-05-07 東京エレクトロン株式会社 カップ、液処理装置及び液処理方法

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JPH0537469Y2 (https=) * 1990-10-08 1993-09-22
JPH04174848A (ja) * 1990-11-08 1992-06-23 Fujitsu Ltd レジスト塗布装置
JPH05146736A (ja) * 1991-11-27 1993-06-15 Sharp Corp スピン式コーテイング装置
JP3138897B2 (ja) 1993-10-07 2001-02-26 大日本スクリーン製造株式会社 回転式基板処理装置
US5626675A (en) * 1993-11-18 1997-05-06 Tokyo Electron Limited Resist processing apparatus, substrate processing apparatus and method of transferring a processed article
JP3102831B2 (ja) 1994-06-20 2000-10-23 大日本スクリーン製造株式会社 回転処理装置
JPH0878368A (ja) 1994-09-07 1996-03-22 Hitachi Ltd ワークの処理方法および装置
TW406216B (en) * 1995-05-24 2000-09-21 Tokyo Electron Ltd Apparatus for coating resist on substrate
JPH0945750A (ja) * 1995-07-26 1997-02-14 Hitachi Ltd 板状物保持部材およびそれを用いた回転処理装置
JPH09122558A (ja) * 1995-11-06 1997-05-13 Dainippon Screen Mfg Co Ltd 回転式塗布装置
US5997653A (en) 1996-10-07 1999-12-07 Tokyo Electron Limited Method for washing and drying substrates
JP3276601B2 (ja) * 1997-01-22 2002-04-22 東京エレクトロン株式会社 洗浄処理方法及び洗浄処理装置
JP2000084503A (ja) * 1998-07-13 2000-03-28 Kokusai Electric Co Ltd 被処理物の流体処理方法及びその装置
JP2000138163A (ja) * 1998-10-30 2000-05-16 Tokyo Electron Ltd 液処理装置
KR100726015B1 (ko) * 1999-10-06 2007-06-08 가부시키가이샤 에바라 세이사꾸쇼 기판세정방법 및 그 장치
JP3837017B2 (ja) 2000-12-04 2006-10-25 大日本スクリーン製造株式会社 基板処理装置及び基板処理方法ならびに基板処理装置の洗浄方法
JP4074814B2 (ja) * 2002-01-30 2008-04-16 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP3890025B2 (ja) * 2003-03-10 2007-03-07 東京エレクトロン株式会社 塗布処理装置及び塗布処理方法
JP4029066B2 (ja) 2003-08-28 2008-01-09 東京エレクトロン株式会社 基板処理装置
JP4446875B2 (ja) * 2004-06-14 2010-04-07 大日本スクリーン製造株式会社 基板処理装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117153740A (zh) * 2023-10-31 2023-12-01 宁波润华全芯微电子设备有限公司 一种晶圆加工装置
CN117153740B (zh) * 2023-10-31 2024-02-09 宁波润华全芯微电子设备有限公司 一种晶圆加工装置

Also Published As

Publication number Publication date
KR101019444B1 (ko) 2011-03-07
US20070240638A1 (en) 2007-10-18
CN101060069B (zh) 2010-11-03
KR20070103310A (ko) 2007-10-23
JP2011238967A (ja) 2011-11-24
EP1848024B1 (en) 2009-10-07
TW200802563A (en) 2008-01-01
US7793610B2 (en) 2010-09-14
TWI353632B (https=) 2011-12-01
CN101060069A (zh) 2007-10-24
JP5156114B2 (ja) 2013-03-06
ATE445229T1 (de) 2009-10-15
EP1848024A1 (en) 2007-10-24

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