KR101019444B1 - 액 처리 장치 - Google Patents

액 처리 장치 Download PDF

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Publication number
KR101019444B1
KR101019444B1 KR1020070037375A KR20070037375A KR101019444B1 KR 101019444 B1 KR101019444 B1 KR 101019444B1 KR 1020070037375 A KR1020070037375 A KR 1020070037375A KR 20070037375 A KR20070037375 A KR 20070037375A KR 101019444 B1 KR101019444 B1 KR 101019444B1
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KR
South Korea
Prior art keywords
cup
substrate
liquid
exhaust
drainage
Prior art date
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KR1020070037375A
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English (en)
Korean (ko)
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KR20070103310A (ko
Inventor
마사미 아키모토
다카유키 도시마
사토시 가네코
가즈히사 마츠모토
노리히로 이토
히로미츠 난바
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR20070103310A publication Critical patent/KR20070103310A/ko
Application granted granted Critical
Publication of KR101019444B1 publication Critical patent/KR101019444B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Weting (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Coating Apparatus (AREA)
KR1020070037375A 2006-04-18 2007-04-17 액 처리 장치 Active KR101019444B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006114959 2006-04-18
JPJP-P-2006-00114959 2006-04-18

Publications (2)

Publication Number Publication Date
KR20070103310A KR20070103310A (ko) 2007-10-23
KR101019444B1 true KR101019444B1 (ko) 2011-03-07

Family

ID=38121611

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070037375A Active KR101019444B1 (ko) 2006-04-18 2007-04-17 액 처리 장치

Country Status (8)

Country Link
US (1) US7793610B2 (https=)
EP (1) EP1848024B1 (https=)
JP (1) JP5156114B2 (https=)
KR (1) KR101019444B1 (https=)
CN (1) CN101060069B (https=)
AT (1) ATE445229T1 (https=)
DE (1) DE602007002660D1 (https=)
TW (1) TW200802563A (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5312856B2 (ja) * 2008-06-27 2013-10-09 大日本スクリーン製造株式会社 基板処理装置
CN101992165B (zh) * 2009-08-27 2012-10-24 沈阳芯源微电子设备有限公司 一种用于圆形薄片状物体进行化学液喷洒处理的装置
US9799537B2 (en) * 2010-12-03 2017-10-24 Applied Materials, Inc. Processing assembly for semiconductor workpiece and methods of processing same
US8541309B2 (en) 2010-12-03 2013-09-24 Applied Materials, Inc. Processing assembly for semiconductor workpiece and methods of processing same
JP5472169B2 (ja) * 2011-03-16 2014-04-16 東京エレクトロン株式会社 液処理装置、液処理方法および記憶媒体
JP5387636B2 (ja) * 2011-08-31 2014-01-15 東京エレクトロン株式会社 液処理装置
JP5596071B2 (ja) * 2012-03-09 2014-09-24 東京エレクトロン株式会社 液処理装置
JP6057624B2 (ja) 2012-09-03 2017-01-11 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ カップおよび基板処理装置
JP6281161B2 (ja) * 2013-09-27 2018-02-21 東京エレクトロン株式会社 液処理装置
TWI569349B (zh) 2013-09-27 2017-02-01 斯克林集團公司 基板處理裝置及基板處理方法
CN103567175A (zh) * 2013-10-30 2014-02-12 广西钦州天山微电子有限公司 铬板清洗机
JP6090113B2 (ja) * 2013-10-30 2017-03-08 東京エレクトロン株式会社 液処理装置
CN103639089A (zh) * 2013-11-14 2014-03-19 上海和辉光电有限公司 显影剂喷涂装置及方法
CN103691631B (zh) * 2013-12-16 2016-01-27 南通大学 带保护结构的匀胶机托盘
JP6287750B2 (ja) * 2013-12-27 2018-03-07 東京エレクトロン株式会社 基板液処理装置
CN108155133B (zh) * 2014-02-27 2022-04-15 斯克林集团公司 基板处理装置
KR102277539B1 (ko) * 2014-09-17 2021-07-15 세메스 주식회사 기판 처리 장치 및 컵 유닛
JP6797526B2 (ja) * 2014-11-11 2020-12-09 株式会社荏原製作所 基板洗浄装置
CN105161442B (zh) * 2015-07-21 2018-02-23 北京七星华创电子股份有限公司 一种清洗液体收集装置
CN112053970B (zh) * 2019-06-05 2024-11-08 东京毅力科创株式会社 基板处理装置
CN111069219B (zh) * 2019-12-27 2022-06-07 上海至纯洁净系统科技股份有限公司 一种排液罩以及半导体清洗设备
TWI800064B (zh) * 2021-10-29 2023-04-21 弘塑科技股份有限公司 單晶圓濕處理設備
JP2024060970A (ja) * 2022-10-20 2024-05-07 東京エレクトロン株式会社 カップ、液処理装置及び液処理方法
CN117153740B (zh) * 2023-10-31 2024-02-09 宁波润华全芯微电子设备有限公司 一种晶圆加工装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5997653A (en) 1996-10-07 1999-12-07 Tokyo Electron Limited Method for washing and drying substrates
JP2002170804A (ja) 2000-12-04 2002-06-14 Dainippon Screen Mfg Co Ltd 基板処理装置及び基板処理方法
EP1335412A2 (en) 2002-01-30 2003-08-13 Dainippon Screen Mfg. Co., Ltd. Substrate treatment apparatus and substrate treatment method
US20040180141A1 (en) * 2003-03-10 2004-09-16 Shinji Kobayashi Coating and processing apparatus and method

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0537469Y2 (https=) * 1990-10-08 1993-09-22
JPH04174848A (ja) * 1990-11-08 1992-06-23 Fujitsu Ltd レジスト塗布装置
JPH05146736A (ja) * 1991-11-27 1993-06-15 Sharp Corp スピン式コーテイング装置
JP3138897B2 (ja) 1993-10-07 2001-02-26 大日本スクリーン製造株式会社 回転式基板処理装置
US5626675A (en) * 1993-11-18 1997-05-06 Tokyo Electron Limited Resist processing apparatus, substrate processing apparatus and method of transferring a processed article
JP3102831B2 (ja) 1994-06-20 2000-10-23 大日本スクリーン製造株式会社 回転処理装置
JPH0878368A (ja) 1994-09-07 1996-03-22 Hitachi Ltd ワークの処理方法および装置
TW406216B (en) * 1995-05-24 2000-09-21 Tokyo Electron Ltd Apparatus for coating resist on substrate
JPH0945750A (ja) * 1995-07-26 1997-02-14 Hitachi Ltd 板状物保持部材およびそれを用いた回転処理装置
JPH09122558A (ja) * 1995-11-06 1997-05-13 Dainippon Screen Mfg Co Ltd 回転式塗布装置
JP3276601B2 (ja) * 1997-01-22 2002-04-22 東京エレクトロン株式会社 洗浄処理方法及び洗浄処理装置
JP2000084503A (ja) * 1998-07-13 2000-03-28 Kokusai Electric Co Ltd 被処理物の流体処理方法及びその装置
JP2000138163A (ja) * 1998-10-30 2000-05-16 Tokyo Electron Ltd 液処理装置
KR100726015B1 (ko) * 1999-10-06 2007-06-08 가부시키가이샤 에바라 세이사꾸쇼 기판세정방법 및 그 장치
JP4029066B2 (ja) 2003-08-28 2008-01-09 東京エレクトロン株式会社 基板処理装置
JP4446875B2 (ja) * 2004-06-14 2010-04-07 大日本スクリーン製造株式会社 基板処理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5997653A (en) 1996-10-07 1999-12-07 Tokyo Electron Limited Method for washing and drying substrates
JP2002170804A (ja) 2000-12-04 2002-06-14 Dainippon Screen Mfg Co Ltd 基板処理装置及び基板処理方法
EP1335412A2 (en) 2002-01-30 2003-08-13 Dainippon Screen Mfg. Co., Ltd. Substrate treatment apparatus and substrate treatment method
US20040180141A1 (en) * 2003-03-10 2004-09-16 Shinji Kobayashi Coating and processing apparatus and method

Also Published As

Publication number Publication date
US20070240638A1 (en) 2007-10-18
CN101060069B (zh) 2010-11-03
KR20070103310A (ko) 2007-10-23
JP2011238967A (ja) 2011-11-24
EP1848024B1 (en) 2009-10-07
TW200802563A (en) 2008-01-01
US7793610B2 (en) 2010-09-14
TWI353632B (https=) 2011-12-01
CN101060069A (zh) 2007-10-24
JP5156114B2 (ja) 2013-03-06
DE602007002660D1 (de) 2009-11-19
ATE445229T1 (de) 2009-10-15
EP1848024A1 (en) 2007-10-24

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