DE602006010310D1 - Nickelpulver, leitfähige Paste und mehrlagigen elektronischen Komponenten damit - Google Patents

Nickelpulver, leitfähige Paste und mehrlagigen elektronischen Komponenten damit

Info

Publication number
DE602006010310D1
DE602006010310D1 DE602006010310T DE602006010310T DE602006010310D1 DE 602006010310 D1 DE602006010310 D1 DE 602006010310D1 DE 602006010310 T DE602006010310 T DE 602006010310T DE 602006010310 T DE602006010310 T DE 602006010310T DE 602006010310 D1 DE602006010310 D1 DE 602006010310D1
Authority
DE
Germany
Prior art keywords
nickel powder
powder
electronic component
conductive paste
nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006010310T
Other languages
English (en)
Inventor
Yuji Akimoto
Kazuro Nagashima
Hidenori Ieda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shoei Chemical Inc
Original Assignee
Shoei Chemical Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shoei Chemical Inc filed Critical Shoei Chemical Inc
Publication of DE602006010310D1 publication Critical patent/DE602006010310D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00Making metallic powder or suspensions thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/008Selection of materials
    • H01G4/0085Fried electrodes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/107Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/16Metallic particles coated with a non-metal
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10Processes characterised by the sequence of their steps
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991Coated

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Conductive Materials (AREA)
  • Ceramic Capacitors (AREA)
  • Powder Metallurgy (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Non-Insulated Conductors (AREA)
DE602006010310T 2005-12-07 2006-11-24 Nickelpulver, leitfähige Paste und mehrlagigen elektronischen Komponenten damit Active DE602006010310D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005352925A JP4697539B2 (ja) 2005-12-07 2005-12-07 ニッケル粉末、導体ペーストおよびそれを用いた積層電子部品

Publications (1)

Publication Number Publication Date
DE602006010310D1 true DE602006010310D1 (de) 2009-12-24

Family

ID=37995796

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006010310T Active DE602006010310D1 (de) 2005-12-07 2006-11-24 Nickelpulver, leitfähige Paste und mehrlagigen elektronischen Komponenten damit

Country Status (10)

Country Link
US (1) US7618474B2 (de)
EP (1) EP1800773B1 (de)
JP (1) JP4697539B2 (de)
KR (1) KR100853599B1 (de)
CN (1) CN100565713C (de)
AT (1) ATE448039T1 (de)
CA (1) CA2568811C (de)
DE (1) DE602006010310D1 (de)
MY (1) MY148386A (de)
TW (1) TWI400719B (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008041541A1 (en) 2006-10-02 2008-04-10 Shoei Chemical Inc. Nickel-rhenium alloy powder and conductor paste containing the nickel-rhenium alloy powder
CA2663438C (en) 2006-10-02 2013-08-06 Shoei Chemical Inc. Nickel-rhenium alloy powder and conductor paste containing the same
JP4807581B2 (ja) * 2007-03-12 2011-11-02 昭栄化学工業株式会社 ニッケル粉末、その製造方法、導体ペーストおよびそれを用いた積層セラミック電子部品
US20100038604A1 (en) * 2007-08-03 2010-02-18 Noritake Co., Limited Nickel Paste
JP2009037974A (ja) * 2007-08-03 2009-02-19 Noritake Co Ltd ニッケルペースト
US8178192B2 (en) 2008-03-06 2012-05-15 Ngk Insulators, Ltd. Ceramic green sheet, ceramic green sheet laminate, production method of ceramic green sheet, and production method of ceramic green sheet laminate
KR101015127B1 (ko) * 2008-08-20 2011-02-16 주식회사 하이닉스반도체 반도체 장치의 전극, 캐패시터 및 그의 제조방법
KR20100031843A (ko) * 2008-09-16 2010-03-25 (주)창성 전도성 금속 전극 형성용 잉크조성물 및 그 제조방법
JP5157799B2 (ja) * 2008-10-02 2013-03-06 住友金属鉱山株式会社 導電性ペースト、並びにこの導電性ペーストを用いた乾燥膜及び積層セラミックコンデンサ
JP5574154B2 (ja) * 2010-01-25 2014-08-20 住友金属鉱山株式会社 ニッケル粉末およびその製造方法
CN103534049B (zh) 2011-05-18 2016-11-02 户田工业株式会社 铜粉末、铜膏、导电性涂膜的制造方法和导电性涂膜
KR101565631B1 (ko) 2012-06-04 2015-11-03 삼성전기주식회사 내부 전극용 도전성 페이스트 조성물, 적층 세라믹 커패시터 및 이의 제조방법
KR20140024584A (ko) * 2012-08-20 2014-03-03 삼성전기주식회사 내부전극용 도전성 페이스트 조성물 및 이를 포함하는 적층 세라믹 전자부품
KR102248526B1 (ko) * 2013-07-23 2021-05-06 삼성전기주식회사 내부 전극용 니켈 분말, 이를 포함하는 적층 세라믹 커패시터 및 전자부품이 실장된 회로기판
JP2015086465A (ja) * 2013-10-30 2015-05-07 サムソン エレクトロ−メカニックス カンパニーリミテッド. ニッケルナノ粉末及びその製造方法
JP5668879B1 (ja) * 2014-03-07 2015-02-12 住友金属鉱山株式会社 ニッケル粉末
CN107745120B (zh) * 2014-06-20 2019-08-20 昭荣化学工业株式会社 碳被覆金属粉末、导电性糊剂及层叠电子部件、以及碳被覆金属粉末的制造方法
JP2016115448A (ja) * 2014-12-11 2016-06-23 株式会社村田製作所 導電性ペーストおよびセラミック電子部品
KR102193956B1 (ko) * 2015-12-04 2020-12-22 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
TWI716526B (zh) * 2016-01-12 2021-01-21 日商東邦鈦股份有限公司 鎳粉末
EP3702330A4 (de) * 2017-10-26 2020-12-23 Sumitomo Metal Mining Co., Ltd. Nickelverbundoxid und verfahren zur herstellung von lithium-nickel-verbundoxid
CN115206678A (zh) * 2018-01-30 2022-10-18 泰科纳等离子系统有限公司 用作多层陶瓷电容器中的电极材料的金属粉末及其制造和使用方法
KR102140622B1 (ko) * 2018-08-23 2020-08-03 삼성전기주식회사 적층 세라믹 전자부품 및 그 제조방법
US11581823B2 (en) * 2020-02-20 2023-02-14 Toyota Jidosha Kabushiki Kaisha Actuator and actuator manufacturing method
US20220277897A1 (en) * 2021-03-01 2022-09-01 Taiyo Yuden Co., Ltd. Ceramic electronic device, powder material, paste material, and manufacturing method of ceramic electronic device
KR20230008405A (ko) * 2021-07-07 2023-01-16 삼성전기주식회사 커패시터 부품 및 커패시터 부품의 제조 방법
CN116004079A (zh) * 2022-12-15 2023-04-25 洛阳科博思新材料科技有限公司 一种钢轨涂层用耐磨高阻抗涂料及钢轨和喷涂方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10106351A (ja) 1996-09-30 1998-04-24 Kyocera Corp 導電性ペースト
JPH1180816A (ja) * 1997-09-10 1999-03-26 Sumitomo Metal Mining Co Ltd 導電ペースト用ニッケル粉末とその製造方法
JP3984712B2 (ja) 1998-07-27 2007-10-03 東邦チタニウム株式会社 導電ペースト用ニッケル粉末
CN101284312B (zh) * 2000-02-18 2012-06-13 加拿大电子学粉末公司 一种通过传递电弧等离子系统生产镍粉末的方法
JP4552260B2 (ja) 2000-03-30 2010-09-29 Tdk株式会社 ニッケル粉末、電極用ペーストおよび電子部品の製造方法
JP4168773B2 (ja) * 2003-02-12 2008-10-22 住友金属鉱山株式会社 焼結性に優れたニッケル粉末の製造方法
KR100682884B1 (ko) 2003-04-08 2007-02-15 삼성전자주식회사 니켈금속분말 및 그 제조 방법
JP2005154904A (ja) * 2003-11-25 2005-06-16 Samsung Electronics Co Ltd 炭素含有ニッケル粒子粉末およびその製造方法
EP1785207A4 (de) * 2004-06-16 2009-05-20 Toho Titanium Co Ltd Nickelpulver und herstellungsverfahren dafür

Also Published As

Publication number Publication date
TWI400719B (zh) 2013-07-01
CN1979694A (zh) 2007-06-13
MY148386A (en) 2013-04-15
CA2568811C (en) 2010-11-09
CN100565713C (zh) 2009-12-02
ATE448039T1 (de) 2009-11-15
JP2007157563A (ja) 2007-06-21
JP4697539B2 (ja) 2011-06-08
EP1800773A1 (de) 2007-06-27
KR100853599B1 (ko) 2008-08-22
US7618474B2 (en) 2009-11-17
CA2568811A1 (en) 2007-06-07
US20070125195A1 (en) 2007-06-07
TW200729235A (en) 2007-08-01
KR20070060036A (ko) 2007-06-12
EP1800773B1 (de) 2009-11-11

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